Patent application number | Description | Published |
20100032193 | ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT - Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted. | 02-11-2010 |
20100091427 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies. | 04-15-2010 |
20120138350 | ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD. - There is provided a device for electronic components including: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which the magnetic field and magnetic resistance are reduced. | 06-07-2012 |
Patent application number | Description | Published |
20130250190 | BACK LIGHT UNIT INTEGRATED DIGITIZER - Disclosed herein is a back light unit integrated digitizer. The back light unit integrated digitizer includes a cover disposed on one surface of the back light unit to protect the back light unit; and a loop coil formed on the cover, wherein the loop coil is directly formed on the cover of the back light unit to integrally form the digitizer in the back light unit, thereby reducing the overall thickness to implement slimness and saving manufacturing costs to secure price competitiveness. | 09-26-2013 |
20140035841 | SENSOR FOR DIGITIZER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a sensor for a digitizer and a method for manufacturing the same. The sensor for a digitizer includes a magnetic layer having insulation property, a first coil formed on one surface of the magnetic layer, an insulating layer formed on one surface of the magnetic layer while covering the first coil, and a second coil formed on one surface of the insulating layer. By this configuration, the coil is directly formed on the magnetic layer to simplify a structure and improve stability of a signal transmitted and received from and to a coil by the magnetic layer. | 02-06-2014 |
20140062921 | DIGITIZER - Disclosed herein is a digitizer, including: a transparent substrate that is partitioned into an active area and an inactive area at an outside of the active area; an electrode that is formed in the active area on one surface of the transparent substrate; a coil that is formed in the active area on one surface of the transparent substrate; and a magnetic sheet that is formed in the inactive area on the other surface of the transparent substrate corresponding to the coil. | 03-06-2014 |
20140071083 | DIGITIZER - Disclosed herein is a digitizer including: a transparent substrate; an electrode formed on the transparent substrate to sense a change in capacitance; and a coil formed on the transparent substrate to receive a signal transmitted from the outside. As the touch input unit, various units such as an electronic pen and user's finger, and the like, can be used. | 03-13-2014 |
20140176486 | TOUCH SCREEN AND METHOD FOR DRIVING THE SAME - Disclosed herein are a touch screen and a method for driving the same. The touch screen includes: a switching unit including a plurality of switches connected to traces of driving lines and sensing lines of the touch screen, respectively; a sensing unit sensing capacitance and electromagnetic resonance (EMR) according to a switching operation of the switching unit; and a main controlling unit controlling the switching operation of the switching unit according to an operation mode of the touch screen. Therefore, it is possible to improve sensitivity of sensing without increasing a bezel region of the touch screen. In addition, the EMR and the capacitance may be sensed using the same trace structure, and an antenna pattern may be formed and operated as an antenna. | 06-26-2014 |
20140253822 | DISPLAY DEVICE INCLUDING TOUCH PANEL - Disclosed herein is a display device including a touch panel including: a touch panel including a window substrate and an electrode pattern formed on one surface of the window substrate and a display unit bonded to one surface of the touch panel, wherein a stopper is formed in a spaced space between the display unit and the electrode pattern facing each other. | 09-11-2014 |
Patent application number | Description | Published |
20120306461 | POWER SUPPLY DEVICE, CONTROL INTEGRATED CIRCUIT THEREOF, AND METHOD OF CONTROLLING POWER SUPPLY DEVICE - There is provided a power supply device including: a first controller operating a pulse width modulation (PWM) control integrated circuit (IC) when a load is connected to an output terminal thereof; a second controller determining whether to operate the PWM control IC according to a change in voltage of an auxiliary capacitor connected to the first controller when a load is not connected to the output terminal; and a constant voltage circuit unit supplying a constant voltage to the first controller and the second controller when the PWM control IC operates. Power consumption can be considerably reduced when a load is not connected to the output terminal of the power supply device. Also, since elements for controlling the power supply device are implemented as a single integrated circuit (IC), a leakage current can be reduced to thus minimize power consumption. In addition, voltage can be supplied to the IC while reducing switching noise. | 12-06-2012 |
20140085942 | SHUNT REGULATOR HAVING PROTECTION FUNCTION AND POWER SUPPLY DEVICE HAVING THE SAME - There are provided a shunt regulator having a protection function to detect an abnormal state, and a power supply device having the same. The shunt regulator of a power supply device in which a primary side and a secondary side have grounds having different electrical characteristics and are electrically insulated from one another, and power switched from the primary side is induced to the secondary side so as to be output, includes: a comparator positioned on the secondary side and comparing a voltage output from the power supply device with a preset reference voltage; and a first switch performing a control to stop supply of driving power required for a power switching operation of the primary side according to a comparison result from the comparator. | 03-27-2014 |
20140176089 | PHASE SHIFT CIRCUIT AND POWER FACTOR CORRECTION CIRCUIT INCLUDING THE SAME - There are provided a phase shift circuit and a power factor correction circuit including the same. The phase shift circuit includes a ramp generation unit charging or discharging a capacitor connected to a switch device to generate a ramp signal, a reference signal generation unit generating a predetermined reference signal from the ramp signal, and a comparison unit comparing the ramp signal with the reference signal to generate a clock signal, wherein at least one of the reference signal generation unit and the comparison unit changes a negative or positive value of offset components included in the reference signal or the ramp signal within every operating period of the switch device. | 06-26-2014 |
20140177287 | SWITCHING MODE POWER SUPPLY AND SWITCHING CONTROL CIRCUIT THEREOF - There are provided a switching-mode power supply (SMPS) and a switching control circuit thereof. The switching-mode power supply includes: a power supply circuit switching input power generated by rectifying AC power with a switching transistor to generate output power having a pre-set voltage level; and a switching control circuit having a charging and discharging unit generating a charge current to be charged in the switching transistor or a discharge current to be discharged from the switching transistor and a charging and discharging controller determining whether to charge or discharge the switching transistor according to a voltage level of the output power, wherein an amount of the charge current and an amount of the discharge current are linearly varied according to a voltage level of the input power. | 06-26-2014 |
20140177295 | PHASE SHIFT CIRCUIT AND POWER FACTOR CORRECTION CIRCUIT INCLUDING THE SAME - There are provided a phase shift circuit and a power factor correction circuit including the same. The phase shift circuit includes a switching circuit unit charging power in or discharging power from a capacitor through a plurality of switching devices and comparing a voltage of the capacitor with a predetermined reference voltage, and a clock generating unit generating a reference clock signal based on an output of the switching circuit unit, wherein the switching circuit unit turns the plurality of switching devices on or off, based on currents from inductors respectively included in a main circuit and a sub-circuit of a power factor correction circuit to determine a polarity of the voltage of the capacitor. | 06-26-2014 |
20140185339 | POWER FACTOR CORRECTION CIRCUIT - There is provided a power factor correction circuit including: a power conversion circuit unit controlling an inductor current according to a switching signal applied to a main switch to convert an external input voltage into an output voltage having a predetermined range; an imbalance detection circuit outputting an imbalance state signal when the external input voltage is in an unbalanced state by using the inductor current; and a soft start circuit unit performing soft starting by adjusting the switching signal when the imbalance state signal is output by the imbalance detection circuit unit. | 07-03-2014 |
Patent application number | Description | Published |
20100209619 | Printed wiring board and method for manufacturing the same - A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process. | 08-19-2010 |
20140106278 | DRY FILM RESIST SHEET AND METHOD OF MANUFACTURING THE SAME - There is provided a dry film resist sheet, including: a base film; a first dry film resist layer formed on the base film, the first dry film resist layer containing a binder polymer, a multi-functional monomer, and a photoinitiator; and a second dry film resist layer formed on the first dry film resist layer, the second dry film resist layer containing a binder polymer, a multi-functional monomer, a photoinitiator, and a thermal initiator. | 04-17-2014 |
20140131081 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam. | 05-15-2014 |
20140178814 | DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANUFACTURING METHOD THEREOF - There is provided a dry film photoresist including: a base film having an oxygen permeable barrier layer formed thereon; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protective film formed on the photosensitive resin layer. According to the present invention, the dry film photoresist includes the oxygen permeable barrier layer formed on the base film to prevent a curing reaction from being deteriorated by oxygen permeation in the dry film photoresist, such that residue that is not peeled off may be decreased, thereby significantly decreasing process defects. | 06-26-2014 |
Patent application number | Description | Published |
20120111618 | FLAME RETARDANT RESIN COMPOSITION FOR MULTILAYER WIRING BOARD AND MULTILAYER WIRING BOARD INCLUDING THE SAME - There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength. | 05-10-2012 |
20120125667 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board includes a first circuit pattern formed on a core substrate; an insulating layer stacked on the core substrate to cover the first circuit pattern and having a uniform surface roughness on a nano scale; a second circuit pattern formed on the insulating layer; and a via pattern electrically connecting the first circuit pattern to the second circuit pattern and penetrating through the insulating layer. | 05-24-2012 |
20140014402 | EPOXY RESIN COMPOSITION FOR BUILD-UP INSULATING FILM, INSULATING FILM FORMED THEREFROM, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING THE SAME - This invention relates to an epoxy resin composition, an insulating film formed therefrom, and a printed circuit board, and more particularly to an epoxy resin composition including an epoxy resin, an acid anhydride curing agent, etc., which exhibits improved dielectric properties by decreasing permittivity, dielectric tangent, etc. in a build-up type multilayer printed circuit board, and to an insulating film manufactured using the epoxy resin composition, and to a multilayer printed circuit board in which inner circuits formed of copper (Cu) are insulated by virtue of the insulating film to thus form multiple layers. | 01-16-2014 |
20140017487 | INSULATION FILM HAVING METAL LAYER - Disclosed herein is an insulation film having a metal layer, including: a carrier; a metal layer formed on the carrier; and an insulation layer formed on the metal layer. | 01-16-2014 |
20140041445 | APPARATUS FOR MEASURING DRYING RATE AND METHOD FOR MEASURING DRYING RATE USING THE SAME - There are provided an apparatus for measuring a drying rate and a method for measuring a drying rate using the same in order to measure the drying rate of a substrate material for manufacturing an electronic apparatus, the apparatus for measuring a drying rate, including a support part having a substrate seated thereon, and a marking part disposed above the substrate while being vertically and horizontally movable, and forming a marking on the substrate while being in contact with the substrate. | 02-13-2014 |
Patent application number | Description | Published |
20120148921 | ELECTRODE FOR ENERGY STORAGE DEVICE, METHOD OF MANUFACTURING THE SAME, AND ENERGY STORAGE DEVICE USING THE SAME - Disclosed are an electrode for a low-resistance energy storage device, a method of manufacturing the same, and an energy storage device using the same. In detail, the electrode for an energy storage device is manufactured by forming electrode materials on a metal layer having a dendrite formed thereon. The energy storage device using the electrode for an energy storage device has low resistance characteristics. | 06-14-2012 |
20130114183 | ELECTRODE ACTIVE MATERIAL COMPOSITION, METHOD FOR PREPARING THE SAME, AND ELECTROCHEMICAL CAPACITOR USING THE SAME - Disclosed herein are an electrode active material composition, a method for preparing the same, and an electrochemical capacitor using the same, the electrode active material composition including: an electrode active material; and a conductive material agglomerate having a size of 1/7 to 1/10 times the average particle size of the electrode active material, the conductive material agglomerate containing two or more kinds of conductive materials agglomerated therein, thereby providing electron moving paths through which electrons can move well and increasing packing density of an electrode active material layer, resulting in increasing capacity. | 05-09-2013 |
20130194721 | ACTIVATED CARBON FOR LITHIUM ION CAPACITOR, ELECTRODE INCLUDING THE ACTIVATED CARBON AS ACTIVE MATERIAL, AND LITHIUM ION CAPACITOR USING THE ELECTRODE - Disclosed herein are an activated carbon for a lithium ion capacitor, including mesopores with a pore size of 2˜50 nm in a content of 20˜30% based on all pores therein, an electrode including the activated carbon as an active material, and a lithium ion capacitor using the electrode. Accordingly, there can be provided an activated carbon having appropriate mesopores for allowing an increase in capacitance by free adsorption and desorption of the lithium ions, and a lithium ion capacitor storage device having a long lifespan and high input and output characteristics and further having reliability on high-rate charging and discharging cycles by including the activated carbon as an active material. | 08-01-2013 |
Patent application number | Description | Published |
20090232065 | Methods of assigning resources for the uplink control channel in LTE - A method of a slot-level remapping physical uplink control channels into two resource blocks respectively located at two slots of a subframe, is generally adapted to a complex 3GPP LTE physical uplink where ACK/NAK recourse blocks may be applied by the extended cyclic prefix, mixed resource blocks (where the ACK/NAK and CQI channels coexist) may be applied by the normal cyclic prefix, or mixed recourse blocks (where the ACK/NAK and CQI channels coexist) may be applied by the extended cyclic prefix. | 09-17-2009 |
20100281323 | CONTROL AND DATA CHANNELS FOR ADVANCED RELAY OPERATION - A relay station in a wireless communication system is configured to relay communications between the base station and a plurality of subscriber stations. The relay station includes at least one antenna configured to transmit and receive data and control information. The relay station also includes a controller coupled to the antenna. The controller is configured to transmit control information to a subscriber station during a first set of symbols in a relay station to subscriber station (RS-to-SS) subframe. The controller also switches the antenna to a receive mode; and receives control information during a second set of symbols in the RS-to-SS subframe. | 11-04-2010 |
20110243059 | APPARATUS AND METHOD FOR INTERLEAVING DATA IN A RELAY PHYSICAL DOWNLINK CONTROL CHANNEL (R-PDCCH) - A wireless network comprising a first base station operable to communicate with mobile stations and a plurality of relay stations for providing bi-directional communication between the first base station and a plurality of mobile stations. The first base station transmits a relay physical downlink control channel (R-PDCCH) in the downlink to the plurality of relay stations. The R-PDCCH comprises: i) a first search space comprising downlink (DL) grants associated with the plurality of relay stations; and ii) a second search space comprising uplink (UL) grants associated with the plurality of relay stations. | 10-06-2011 |
20120188967 | METHODS OF ASSIGNING RESOURCES FOR THE UPLINK CONTROL CHANNEL IN LTE - A method of a slot-level remapping physical uplink control channels into two resource blocks respectively located at two slots of a subframe, is generally adapted to a complex 3GPP LTE physical uplink where ACK/NAK recourse blocks may be applied by the extended cyclic prefix, mixed resource blocks (where the ACK/NAK and CQI channels coexist) may be applied by the normal cyclic prefix, or mixed recourse blocks (where the ACK/NAK and CQI channels coexist) may be applied by the extended cyclic prefix. | 07-26-2012 |
Patent application number | Description | Published |
20110227688 | PLANAR TRANSFORMER - There is provided a planar transformer having improved performance through a reduction in heat generation by removing part of a conductor from a substrate. The planar transformer includes a core part having a pair of cores being electromagnetically coupled to each other; a substrate part having at least one substrate disposed between the pair of cores; a pattern part formed on the at least one substrate and including a conductor having an adjustable width; and an opening part including a non-conductor allowing for variations in the width of the conductor of the pattern part. | 09-22-2011 |
20110241816 | PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - There are is a planar transformer and a method of manufacturing the same that can prevent resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board. A planar transformer according to an aspect of the invention may include: a core part having a pair of cores electromagneticaliy coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon. | 10-06-2011 |
20130321117 | PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME - A planar transformer for preventing resin being coated from being separated from a conductor during the manufacturing of a transformer by forming a dummy pattern on a board includes: a core part having a pair of cores electromagnetically coupled to each other; a board part having a plurality of boards disposed between the pair of cores and stacked upon one another; a pattern part having a power transmission pattern provided on at least one board of the plurality of boards of the board part and transmitting power being input, and a dummy pattern provided on the same board having the power transmission pattern thereon and separated from the power transmission pattern by a predetermined interval; and a resin part being coated over the at least one board of the plurality of boards, the at least one board having the pattern part thereon. | 12-05-2013 |
20140001976 | COIL COMPONENT AND DISPLAY DEVICE INCLUDING THE SAME | 01-02-2014 |
Patent application number | Description | Published |
20100073928 | Lens for LED outdoor lamp, and its applied road lamp, security lamp, tunnel lamp, park lamp, guard lamp, industrial flood lamp, and outdoor lamp - Disclosed is a lens for an LED outdoor lamp, and a road lamp, a security lamp, a tunnel lamp, a park lamp, a guard lamp, an industrial flood lamp, and an outdoor lamp using the lens. There is an advantage in that the shape of a light field can be a square shape by controlling light distribution. Brightness is very uniform within a available illumination range, and stray light is hardly generated outside of the range. | 03-25-2010 |
20120155077 | LIGHT EMITTING DIODE FLOODLIGHT - A light emitting diode floodlight includes a hollow housing, a lens, a cover, a light source, an illumination reflector, an intermediate portion, and a power source. The cover is coupled to the end of the housing and configured to hold and support the lens. The light source has a pyramidal frustum-shaped portion installed at an opposite end of the housing. The illumination reflector is installed within the housing so as to surround a periphery of the pyramidal frustum-shaped portion of the light source. The intermediate portion is connected to a first heat sink of the light source and has a second heat sink on an outer peripheral surface thereof. The power source has a power supply electrically connected to the light source. | 06-21-2012 |
Patent application number | Description | Published |
20130098097 | REFRIGERATOR WITH ICEMAKER COMPARTMENT HAVING AN IMPROVED AIR FLOW - A refrigerator with an ice making device. The refrigerator includes a body defined with a refrigerating compartment, a freezing compartment, and an ice making compartment, the ice making compartment arranged in the refrigerating compartment while being thermally insulated from the refrigerating compartment, a first evaporator arranged in the refrigerating compartment, a second evaporator arranged in the freezing compartment, a refrigerating duct for circulating cold air from the first evaporator to the refrigerating compartment, a freezing duct for circulating cold air from the second evaporator to the freezing compartment, and an ice making flow passage for communicating the second evaporator and the ice making compartment. The second evaporator, ice making compartment, and ice making flow passage form a closed circuit such that the cold air in the ice making compartment does not enter the refrigerating compartment. | 04-25-2013 |
20140305156 | REFRIGERATOR WITH ICEMAKER COMPARTMENT HAVING AN IMPROVED AIR FLOW - A refrigerator includes body having a refrigerating compartment, a freezing compartment, and an ice making compartment disposed outside the freezing compartment. The ice making compartment is in communication with an evaporator space via a supply duct to supply cold air from the evaporator to the ice making compartment, a blowing fan to introduce cold air from the evaporator into the ice making compartment, and a return duct configured so that circulated air inside the ice making compartment is discharged through an outlet of the return duct and mixed together with circulated air from inside the freezing compartment at a lower region of the evaporator space, the mixed air flowing through the evaporator in an upward direction as the mixed air is heat exchanged by the evaporator before being discharged to the freezing compartment or the supply duct. | 10-16-2014 |
Patent application number | Description | Published |
20140069694 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A circuit board includes a circuit pattern formed on a substrate, a first solder resist layer formed on the circuit pattern, an electroless plating layer formed on the circuit pattern on which the first solder resist layer is opened, and a second solder resist layer formed on the first solder resist layer, and a method for manufacturing the same. According to certain embodiments, it is possible to cover a portion which has vulnerable plating quality due to solder resist residue or insufficient wetting around an edge of an existing solder resist layer by including an additional solder resist layer on a surface-treated plating layer. Further, it is possible to protect an undercut portion under the solder resist layer by forming the additional solder resist layer. | 03-13-2014 |
20140087205 | ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer. | 03-27-2014 |
20150027760 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board includes an insulating layer; a metal pad formed on the insulating layer; a surface treatment layer formed on the metal pad; a solder layer formed on the surface treatment layer and the insulating layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. Further, a printed circuit board may include an insulating layer; a metal seed layer formed on the insulating layer; a metal pad formed on the metal seed layer; a surface treatment layer formed on the metal pad and the metal seed layer; a solder layer formed on the surface treatment layer of the metal pad and the surface treatment layer of the metal seed layer; and an intermetallic compound layer formed between the solder layer and the surface treatment layer. | 01-29-2015 |
Patent application number | Description | Published |
20130299081 | APPARATUS AND METHOD FOR MANUFACTURING CAMERA MODULE - An apparatus and a method for manufacturing a camera module. The method for manufacturing a camera module includes: picking up an image sensor by the bonding head and mounting the image sensor on a PCB; compensating for a tilt deviation between the PCB and the image sensor by the gyro unit of the PCB support unit simultaneously when the image sensor is mounted on the PCB; applying heat by the heating unit of the bonding head to cure an adhesive applied between the image sensor and the PCB; and after the image sensor is mounted and the adhesive is cured, picking up a lens housing module by a lens housing module pickup unit and mounting the lens housing module on the PCB and attaching contact portions of the PCB to the lens housing module to complete the manufacture of a camera module. | 11-14-2013 |
20130333207 | APPARATUS FOR MANUFACTURING CAMERA MODULE - Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB. | 12-19-2013 |
20130333843 | APPARATUS FOR MANUFACTURING CAMERA MODULE - Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a rim tool picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein a PCB holding unit is formed integrally with an image sensor pickup part of the rim tool outside the image sensor pickup part, the PCB holding unit being contacted with the PCB to hold the PCB when the image sensor is picked up by the image sensor pickup part and attached onto the PCB. | 12-19-2013 |
Patent application number | Description | Published |
20140326493 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - A multilayer ceramic electronic component includes: a ceramic body including a recess portion formed in a length direction of at least one main surface thereof so as to be inwardly concave and satisfying T (thickness)/W (width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to the at least one main surface, wherein when the ceramic body is divided into an upper region At, corresponding to 70% to 90% of an overall thickness of the ceramic body, and a lower region Ab, corresponding to 10% to 30% of the overall thickness of the ceramic body, a ratio of an average particle size of Ab materials to an average particle size of At materials is less than 0.5. | 11-06-2014 |
20140376150 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 μm or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal. | 12-25-2014 |
20150022941 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98. | 01-22-2015 |
Patent application number | Description | Published |
20140027047 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided. | 01-30-2014 |
20140027163 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a core reinforcement having stiffness; insulating layers formed on both surfaces of the core reinforcement; a through hole formed by penetrating through the insulating layer and the core reinforcement; and a circuit layer formed on the insulating layer and a plating layer formed in the through hole for implementing inter-layer connection of the circuit layers. | 01-30-2014 |
20140151095 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet. | 06-05-2014 |
20140166348 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board capable of suppressing warpage due to a difference in thermal expansion coefficients with circuit patterns in the same layer by way of forming a filling material having a thermal expansion coefficient similar to that of the circuit pattern between the circuit patterns and on the surface. Further, on a surface of the filling material, a laminate having a thermal expansion amount lower than that of the filling material so that overall thermal expansion coefficients of the printed circuit board is lowered, and an insulation material having a lower thermal expansion coefficient and thus rarely flowing is easily attached. | 06-19-2014 |
Patent application number | Description | Published |
20130148198 | MULTILAYER OPTICAL SHEET MODULE - There is disclosed a multilayer optical sheet module including an upper optical sheet comprising a first structural pattern projected upward; a lower optical sheet disposed under the upper optical sheet, the lower optical sheet comprising a second structural pattern projected toward the upper optical sheet; and an adhesion layer provided between the upper optical sheet and the lower optical sheet, wherein the second structural pattern includes a light transmitting part having a traverse cross section getting smaller along an upward direction; and an embedded part continuously connected to an upper portion of the light transmitting part, with a predetermined portion embedded in the adhesion layer, and a circumference of a cross section possessed by the embedded part, contacting with the adhesion layer, is larger than a circumference of a virtual cross section locus formed by extending the light transmitting part upward, with a continuous slope. | 06-13-2013 |
20150070903 | OPTICAL MEMBER, LIGHT SOURCE DEVICE, AND DISPLAY DEVICE INCLUDING SAME - Provided are an optical member having adhesion and elastic restoring force, and a light source device and a display device including the same, the optical member including: a base film; an optical pattern layer provided on the base film and having adhesion; and an upper film partially adhering onto the optical pattern layer, in which at least a partial region of the optical pattern layer has a characteristic in which the partial region is deformed when external force is applied and restored when the external force is removed, and it is easy to assemble a product to improve productivity, and the elastic restoring force is excellent to suppress damage due to the external force. | 03-12-2015 |
Patent application number | Description | Published |
20090296141 | PRINTING APPARATUS AND METHOD FOR PROCESSING REAL-TIME COMMAND USING THE PRINTING APPARATUS - There are provided a printing apparatus and a method for processing real-time commands using the same. The printing apparatus is able to be stably operated without any mechanical troubles such as degraded performance of the printing apparatus, which are caused when real-time commands are analyzed and processed on a receive interrupt routine, by detecting real-time commands from data transmitted from the host computer, separately storing the detected real-time commands in a real-time command buffer and processing the stored real-time commands in preference to the other data. | 12-03-2009 |
20100011131 | PRINTING APPARATUS FOR ESTABLISHING PRIORITY IDENTIFIER - Disclosed is a printing apparatus including a priority identifier establishment unit. More particularly, the printing apparatus, processing an instruction designated by a priority identifier before another instruction, includes the priority identifier establishment unit that allows a priority identifier to be designated in various forms and methods. Since the priority identifier can be established in various forms and methods, the printing apparatus can achieve enhanced flexibility and effect in priority processing. | 01-14-2010 |
20100315679 | PRINTER AND PRINTING METHOD USING THE SAME - There is provided a printing method including: receiving at least one of print data and control commands from a host device; storing print image data on the basis of the received print data when there is no previously stored print image data before the receiving of the print data, and storing print image data on the basis of the received print data after deleting previously stored print image data when there is the previously stored print image data before the receiving of the print data; and printing the stored print image data according to a preset control command among the control commands received from the host device. | 12-16-2010 |