Patent application number | Description | Published |
20090120670 | BENDABLE AREA DESIGN FOR FLEXIBLE PRINTED CIRCUITBOARD - A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized. | 05-14-2009 |
20090277669 | FLEXIBLE PRINTED CIRCUITBOARD WITH ANTI-SOLDER CRACK STRUCTURE - A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved. | 11-12-2009 |
20100021680 | ANTI-DUST APPARATUS FOR LIQUID CRYSTAL DISPLAY (LCD) PANEL - An anti-dust apparatus for a liquid crystal display (LCD) panel, comprising: a protective film comprising a main portion, a foldable portion extending from the main portion, and a fold line between the main portion and the foldable portion, wherein the main portion has a first attachment surface and an exposed surface on both sides, the foldable portion has a second attachment surface adjacent to the first attachment surface, and the foldable portion is folded along the fold line to be parallel with the LCD panel; an adhesive layer disposed on the first attachment surface and the second attachment surface of the protective film, wherein the adhesive layer on the first attachment surface is attached onto the LCD panel; a twin adhesive layer disposed on the other surface different from the second attachment surface of the foldable portion, wherein the twin adhesive layer is attached onto the exposed surface of the protective film; and an anti-dust portion disposed on the adhesive layer on the second attachment surface of the foldable portion. Thereby, the present invention prevents the protective film from being mal-functional due to exposure of the adhesive layer when the foldable portion is folded. | 01-28-2010 |
20100032191 | FLEXIBLE PRINTED CIRCUITBOARD STRUCTURE - A flexible printed circuitboard structure is disclosed, which comprises: a flexible printed circuitboard (FPC), having at least a soldering pad and at least a solder pasted pad area formed thereon; wherein, by using the extending of a side of the at least one solder pasted pad area as the base line, a bending line is formed on the FPC in a manner that it is prevented from passing through the at least one soldering pad and is disposed at a specific distance away from the periphery of the same. By the configuration of the solder pasted pad area to defined the bending line on the FPC, the bending stress problems caused when the FPC is being bended, such as solder crack and broken circuit, etc., can be prevented. | 02-11-2010 |
20100035446 | PIN LAYOUT OF A GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD - A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective. | 02-11-2010 |
20100096165 | GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD - A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically. | 04-22-2010 |
20100326704 | SOLDERING PAD LAYOUT FOR FLEXIBLE PRINTED CIRCUIT BOARD - A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced. | 12-30-2010 |
20140063361 | TOUCH PANEL - A touch panel, having a touch sensing region and a peripheral region adjacent to at least one edge of the touch sensing region, includes a cover substrate and a decoration border. The cover substrate has a touch surface and an inner surface opposite to the touch surface. The decoration border is disposed on the inner surface of the cover substrate within the peripheral region. The decoration border includes a first non-black decoration layer and a second non-black decoration layer. The second non-black decoration layer is disposed on the first decoration layer. The first non-black decoration layer is disposed between the cover substrate and the second non-black decoration layer. The second non-black decoration layer covers the first non-black decoration layer along a vertical projective direction. A pattern size of the second non-black decoration layer is larger than a pattern size of the first non-black decoration layer. | 03-06-2014 |