Patent application number | Description | Published |
20130151143 | METHOD AND APPARATUS FOR REMINDING CALENDAR SCHEDULE AND RECORDING MEDIUM - A method and an apparatus for reminding a calendar schedule and a recording medium are provided. First, a schedule and a location of an event are set in a calendar, and first positioning information of the location is obtained. Then, second positioning information of a current location of a mobile device is obtained. Next, the current location is determining whether to be within a signal range of a signal source. Once the current location is within the signal range, the time for moving from the location with the second positioning information to the location with the first positioning information is calculated. Finally, a reminding time is set according to the transferring time, and a reminding action is taken at the reminding time. Thereby, the reminding time of the event can be dynamically adjusted to avoid delay caused when the mobile device is too far from the event location. | 06-13-2013 |
20130218452 | METHOD AND APPARATUS FOR ESTIMATING AND DISPLAYING DESTINATION AND RECORDING MEDIUM USING THE SAME - A method, an apparatus, and a recording medium for estimating and displaying a destination are provided. In the method, a plurality of places frequently visited by a user is set first. Then, a current location of the electronic apparatus is continuously detected by using a positioning module, and a distance between the current location and each of the places is calculated. Whether the distance between the current location and each of the places increases is determined. When the distance increases, the corresponding place is removed and the remaining places are displayed. | 08-22-2013 |
20130226401 | METHOD FOR ACTIVATING APPLICATION, HANDHELD ELECTRONIC APPARATUS AND CAR SYSTEM - A method, a handheld electronic apparatus, and a car system for activating an application are provided. The handheld electronic apparatus obtains identification information from a car apparatus when the handheld electronic apparatus is connected to the car apparatus. Herein, the car apparatus is coupled to a power connection unit of a vehicle. The handheld electronic apparatus activates an application corresponding to the identification information after obtaining the identification information. | 08-29-2013 |
Patent application number | Description | Published |
20090023246 | EMBEDDED CHIP PACKAGE PROCESS - An embedded chip package process is disclosed. First, a first substrate having a first patterned circuit layer thereon is provided. Then, a first chip is disposed on the first patterned circuit layer and electrically connected to the first patterned circuit layer. A second substrate having a second patterned circuit layer thereon is provided. A second chip is disposed on the second patterned circuit layer and electrically connected to the second patterned circuit layer. Afterwards, a dielectric material layer is formed and covers the first chip and the first patterned circuit layer. Then, a compression process is performed to cover the second substrate over the dielectric material layer so that the second patterned circuit layer and the second chip on the second substrate are embedded into the dielectric material layer. | 01-22-2009 |
20090144972 | CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME - A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad. | 06-11-2009 |
20090166059 | CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, a main circuit, and two shielding circuits. The dielectric layer has an active surface. The main circuit is embedded in the dielectric layer and the shielding circuits are disposed at the dielectric layer. The shielding circuits are respectively located at two sides of the main circuit. The thickness of the shielding circuits is larger than the thickness of the main circuit. | 07-02-2009 |
20090273907 | CIRCUIT BOARD AND PROCESS THEREOF - A circuit board and process thereof are provided. The circuit board includes a dielectric layer, an active circuit, and two shielding circuits. The dielectric layer has an active surface. The active circuit is disposed on the active surface, and the shielding circuits are respectively disposed on two sides of the active circuit. The height of the shielding circuits is larger than the height of the active circuit. | 11-05-2009 |
20090282674 | ELECTRICAL INTERCONNECT STRUCTURE AND PROCESS THEREOF AND CIRCUIT BOARD STRUCTURE - An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core, an ultra fine pattern, and a patterned conductive layer. The core has a surface, and the ultra fine pattern is inlaid in the surface of the core. The patterned conductive layer is disposed on the surface of the core and is partially connected to the ultra fine pattern. Since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core. | 11-19-2009 |
20090284935 | STRUCTURE AND MANUFACTURING PROCESS FOR CIRCUIT BOARD - A circuit board structure comprising a composite layer, a fine circuit pattern and a patterned conductive layer is provided. The fine circuit pattern is inlaid in the composite layer, and the patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the composite layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density. | 11-19-2009 |
20110076802 | EMBEDDED CHIP PACKAGE PROCESS - An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is performed to cover the second substrate over the dielectric material layer and the second patterned circuit layer is embed into the dielectric material layer. A curing process is performed to cure the dielectric material layer after the step of performing the compression process. At least a conductive plug through the dielectric material layer is formed to electrically connect the first patterned circuit layer to the second patterned circuit layer after the step of performing the curing process. The first substrate, the second substrate and a portion of the at least a conductive plug are removed after the step of forming the conductive through hole. | 03-31-2011 |
20120124830 | PROCESS FOR FABRICATING CIRCUIT BOARD - A process for fabricating a circuit board is provided. In the process, first, a circuit substrate including an insulation layer and at least a pad contacting the insulation layer is provided. Next, a barrier material layer is formed on the circuit substrate. The barrier material layer completely covers the insulation layer and the pad. Then, at least one conductive bump is formed on the barrier material layer. The conductive bump is opposite to the pad, and the material of the barrier material layer is different from the material of the conductive bump. Next, a portion of the barrier material layer is removed by using the conductive bump as a mask, so as to expose the surface of the insulation layer and to form a barrier connected between the conductive bump and the pad. | 05-24-2012 |
20130105202 | CIRCUIT BOARD STRUCTURE | 05-02-2013 |
Patent application number | Description | Published |
20130235536 | ELECTRONIC CARD - An electronic card including a substrate and a display panel is provided. The substrate has a first surface, a second surface opposite to the first surface, a first side, a second side opposite to the first side, a third side and a fourth side opposite to the third side, wherein the first surface and the second surface are surrounded by the first side, the second side, the third side and the fourth side. The display panel is disposed on the first surface and is roughly near the first side, the third side and the fourth side. Therefore, a disposition area of the display panel is wider. | 09-12-2013 |
20140118912 | DISPLAY DEVICE - A display device includes an upper substrate, a lower substrate, and a display medium layer. A displaying region, a first bonding region, and a second bonding region are defined in the upper substrate. The first and second boding regions are positioned at two sides of the displaying region. First upper bonding pads and second upper bonding pads are disposed in the first boding region and the second boding region respectively on the bottom surface of the upper substrate. Each first upper boding pad and each second upper boding pad connect with a corresponding odd strip-shaped electrode and a corresponding even strip-shaped electrode in the displaying region respectively. First and second lower bonding pads are disposed on the top surface of the lower substrate, each of which is electrically connected to one corresponding first upper bonding pads or one corresponding second upper bonding pads. | 05-01-2014 |
20140204012 | ELECTROPHORETIC DISPLAY AND METHOD FOR DRIVING PANEL THEREOF - An electrophoretic display and method for driving panel using the same are provided. The electrophoretic display includes a display panel and a driving circuit. The display panel includes a plurality of column data lines and a plurality of row scan lines. The driving circuit provides a plurality of data driving signals to the column data lines, and provides a plurality of scan signals to row scan lines. Each of the scan signals has a plurality of scan enable periods, and each of the scan enable periods includes a plurality of scan interval periods. Each of the scan signals is floating or grounding during the scan interval periods. Each of the data driving signals includes a plurality of data driving periods, and each of the data driving periods includes a plurality of driving interval period. Each of the data driving signals is floating or grounding during the driving interval period. | 07-24-2014 |
20140210701 | ELECTROPHORETIC DISPLAY - An electrophoretic display includes an electrophoretic panel and a plurality of first scan lines. The electrophoretic panel has a first axis direction. The plurality of first scan lines are installed on the first axis direction. A coupled line parallel to the first axis direction is installed between each two adjacent first scan lines, and the coupled line is coupled to ground. | 07-31-2014 |
20140218277 | ELECTROPHORETIC DISPLAY AND METHOD OF OPERATING AN ELECTROPHORETIC DISPLAY - An electrophoretic display includes an electrophoretic panel, a substrate, and a processor. The electrophoretic panel includes a plurality of charged particles. A conductive layer is deposed on the substrate, and the conductive layer is coupled to the electrophoretic panel. The processor is coupled to the conductive layer for generating a background signal to drive the plurality of charged particles to display a background and a foreground signal to drive the plurality of charged particles to display a foreground. The background signal is longer than a period for the foreground signal displaying the foreground. | 08-07-2014 |
20140232628 | ELECTROPHORETIC DISPLAY CAPABLE OF REDUCING PASSIVE MATRIX COUPLING EFFECT - An electrophoretic display capable of reducing passive matrix coupling effect includes an electrophoretic panel, a coupling capacitor group, a plurality of first scan lines, and a plurality of second scan lines. The electrophoretic panel includes a plurality of pixels. The coupling capacitor group includes a plurality of coupling capacitors. Each pixel of the plurality of pixels is coupled to a storage capacitor and corresponds to a coupling capacitor, the storage capacitor is coupled to a first scan line and a second scan line, the coupling capacitor is coupled to another first scan line and the second scan line, and the coupling capacitor is not coupled to any pixel. | 08-21-2014 |
20140240210 | ELECTROPHORETIC DISPLAY AND METHOD OF DRIVING AN ELECTROPHORETIC DISPLAY - An electrophoretic display includes a data driving circuit, a plurality of first electrodes, a gate driving circuit, a plurality of second electrodes and an electrophoretic layer. The data driving circuit is used for generating data signals. The first electrodes are used for receiving the data signals transmitted from the data driving circuit. The gate driving circuit is used for generating gate signals. The second electrodes are used for receiving the gate signals transmitted from the gate driving circuit. The electrophoretic layer is disposed between the plurality of first electrodes and the plurality of second electrodes. The gate driving circuit drives the second electrodes with a non-adjacent sequence. | 08-28-2014 |
20140267450 | ELECTROPHORETIC DISPLAY CAPABLE OF REDUCING PASSIVE MATRIX COUPLING EFFECT AND METHOD THEREOF - An electrophoretic display capable of reducing passive matrix coupling effect includes an electrophoretic panel, a plurality of first scan lines, and a plurality of second scan lines. The electrophoretic panel includes a plurality of pixels. Each pixel of the plurality of pixels corresponds to a storage capacitor, and the storage capacitor is coupled to a first scan line and a second scan line. When the pixel is used for displaying a first color, the first scan line receives a first driving voltage, the second scan line is coupled to ground, and other first scan lines and other second scan lines receive a first voltage. A voltage difference between the first driving voltage and the first voltage and a voltage difference between the ground and the first voltage are smaller than a first threshold value corresponding to the first color. | 09-18-2014 |
20140368753 | TOUCH-CONTROL DISPLAY AND FABRICATION METHOD THEREOF - A touch-control display includes a first substrate having a first surface and a second surface opposite to the first surface, a display panel disposed on a side of the first surface of the first substrate, and a touch control panel disposed on a side of the second surface of the first substrate. The display panel includes a first transparent conductive layer disposed on the first surface of the first substrate, and the first transparent conductive layer is in contact with the first substrate. The touch control panel has a second transparent conductive layer disposed on the second surface of the first substrate, and the second transparent conductive layer is in contact with the first substrate. | 12-18-2014 |
Patent application number | Description | Published |
20110128266 | MULTIPLEX ELECTROPHORETIC DISPLAY DRIVER CIRCUIT - A multiplex electrophoretic display driver circuit comprises a memory unit, a display controller and a voltage driving unit. The memory unit has two registers respectively storing the current and former gray-level matrix signals. The gray-level matrix signal contains gray-level data corresponding to electrophoretic pixels. The display controller has an encoding circuit and a counting circuit. The encoding circuit generates a difference-value matrix signal containing difference values according to a difference between the current and former gray-level matrix signals and then generates a voltage-difference matrix signal containing voltage-difference signals corresponding to the electrophoretic pixels. The counting circuit receives the difference-value matrix signal and counts to generate refreshing values corresponding to the difference values. The encoding circuit adds the refreshing values to a next-cycled difference-value matrix signal to generate a new voltage-difference matrix signal. The voltage driving unit drives the electrophoretic pixels according to the voltage-difference matrix signal. | 06-02-2011 |
20110221740 | DRIVING METHOD OF ELECTROPHORETIC DISPLAY - A driving method of an electrophoretic display having at least a display particle is provided. The driving method includes the following steps. A first voltage difference is applied to a data line in a first period, in which the data line corresponds to one of the display particles. At least a particle restore period is inserted in the first period, and a second voltage difference is applied to the data line in the particle restore periods, in which the second voltage difference is different from the first voltage difference. With this method disclosed here, the maxima brightness, maxima darkness, contrast ratio, color saturation, bistability, and image updating time can be largely improved. | 09-15-2011 |
20120098740 | ELECTRO-PHORETIC DISPLAY APPARATUS - An electro-phoretic display apparatus is disclosed. The electro-phoretic display apparatus has a plurality of pixel units and is coupled to an alternating current (AC) common voltage. The electro-phoretic display apparatus includes a switching unit coupled between a path of a plurality of storage capacitors in the pixel units and the common voltage. The switching unit is turned off according to a control signal before the common voltage carries out a transition action. The switching unit is turned on according to the control signal after the common voltage carries out the transition action. | 04-26-2012 |
20120098817 | ELECTRO-PHORETIC DISPLAY APPARATUS AND DRIVING METHOD THEREOF - A driving method for an electro-phoretic display apparatus is disclosed. The method includes generating a common voltage by a common voltage generator held at a first voltage level before a polarity transfer, generating the common voltage held at a second voltage level when the polarity transfer starts during a first timing period, and generating the common voltage transfers held at a third voltage level during a second timing period after the first timing period, in which the second voltage level is between the first and the third voltage levels. | 04-26-2012 |
20120099180 | ELECTRO-PHORETIC DISPLAY APPARATUS - An electro-phoretic display apparatus is disclosed. The electro-phoretic display apparatus mentioned above includes a plurality of pixel unit lines, a plurality of common voltage transferring lines, and a common voltage generator. The common voltage transferring lines extend and connect to a common line segment directly along a layout direction. The common voltage generator generates a common voltage and provides the common voltage for directly electrically connecting to a connection point on the common line segment. Moreover, the transfer timing delays of transferring the common voltage from the connection point to the first common voltage transferring line and the last common voltage transferring line are the same. | 04-26-2012 |
Patent application number | Description | Published |
20120312584 | PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes a core board, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core board. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded bump pads are located on an upper surface of the insulating layer. | 12-13-2012 |
20120313240 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes a substrate having a flip chip bonding area. A plurality of recessed bump pads are disposed in the flip chip bonding area. The substrate further includes a solder mask that covers a circuit area. A chip having a plurality of metal bumps is mounted in the flip chip bonding area. The metal bumps are respectively connected to the recessed bump pads. An underfill is filled into the gap between the substrate and the chip. | 12-13-2012 |
20140053400 | METHOD FOR FABRICATING PACKAGE SUBSTRATE - A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer. | 02-27-2014 |
20140174804 | ELECTRICAL DEVICE PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is formed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed. Moreover, the electrical device package structure is also provided. | 06-26-2014 |
20160007472 | METHOD OF FABRICATING AN ELECTRICAL DEVICE PACKAGE STRUCTURE - A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is foamed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed. | 01-07-2016 |
Patent application number | Description | Published |
20110122074 | ELECTRONIC SYSTEM APPLIED TO A TRANSPORT AND RELATED CONTROL METHOD - An electronic system includes a portable device, a display device, an input device, and a control device, wherein the display device, the input device and the control device are disposed in a transport. The input device is used for receiving an input signal. The control device is used for communicating with the display device, the input device, and the portable device. When the portable device is coupled to the transport, the portable device switches to a specific operating mode from a normal operating mode; and when the portable device switches to the specific operating mode, the electronic system makes use of the input device to control the portable device or the electronic system makes use of the portable device to control the input device. Herein the transport may be a motor vehicle, and the control device may be an on board unit. | 05-26-2011 |
20140113216 | TREATMENT METHOD FOR SOLID OXIDE FUEL CELLS AND APPARATUS THEREOF - A treatment method for solid oxide fuel cells includes: measuring a radius of curvature of a cell; measuring a surface resistance of cathode current collecting layer of a cell; performing an alcohol permeating test of a cell; performing simultaneously several stages of compression and heating or cooling to a cell; an apparatus for completing above stages is also disclosed. | 04-24-2014 |
20150357664 | Plate type fuel reformer of fuel cell - A plate type fuel reformer of fuel cells includes a reformer module stacked by multiple sheet components, and an engaging surface formed on a surface of the reformer module and adhered to a surface of the default fuel cell module in order to form a great thermally-conductive combination. Detachable connections are formed between each of the sheet components and between the sheet components and the fuel cells module. The edge of the reformer module is non-protruding from the side of the fuel cell module after connection. Multiple containing spaces are respectively formed between each of the sheet components for containing default catalyst units. Also, an independent air channel is formed for guiding outside air to into the fuel cell module and a fuel channel is formed for containing the default catalyst units and guiding outside fuel to react with the catalyst units to generate hydrogen gas and carbon monoxide. | 12-10-2015 |
20160036069 | TREATMENT METHOD FOR SOLID OXIDE FUEL CELLS AND APPARATUS THEREOF - A treatment method for solid oxide fuel cells includes: measuring a radius of curvature of a cell; measuring a surface resistance of cathode current collecting layer of a cell; performing an alcohol permeating test of a cell; performing simultaneously several stages of compression and heating or cooling to a cell; an apparatus for completing above stages is also disclosed. | 02-04-2016 |
Patent application number | Description | Published |
20110139700 | Collection can for precipitated powder substance and the use thereof - A collection process for precipitated powder substance is mainly for storing toxic or highly radioactive powder or dust in air and involves collection operation in water or other liquid to collect powder insoluble to the liquid and heavier than the liquid. To be suitable for underwater operation, a powder precipitation bag is provided with an innovative powder collection can at its bottom. New powder collection can has a mesh filter in its bottom and two-stage structure. After completion of powder collection, the collection can is pulled up from the water and dried to reduce powder volume and form powder lumps. Then, the top half is removed, so the collection can is fully filled with powder lumps. The newly designed powder can increases storage efficiency and reduces waste of space by accommodating more powder lumps than traditional powder can. With the same total amount of powder, the new powder can enables fewer number of storage cans. The cover for the new can improves safety for further transportation and storage. | 06-16-2011 |
20110296932 | APPARATUS AND METHOD FOR SAMPLING UNDERWATER RADIOACTIVE SOLUTION - The present disclosure provides an apparatus and a method for sampling underwater radioactive solution. The apparatus and method are used for sampling underwater radioactive waste stored in the radioactive reservoir of nuclear facilities or in the container of said reservoir, in order to determine the nuclides and the radiation dosage at different depths in the radioactive solution. | 12-08-2011 |
20130167668 | APPARATUS AND METHOD FOR SAMPLING UNDERWATER RADIOACTIVE SOLUTION - An apparatus and a method for sampling underwater radioactive solution. The apparatus includes a main unit, a connecting rod inserted into the main unit, a connecting ring connected to one side of the connecting rod, a container unit connected to the opposite side of the connecting ring, a solution access channel, an air motor for changing air pressure in the container unit to draw or extract the radioactive solution in or out of the container unit, a holder for fixing the air motor on the main unit, a synchronizing connector for connecting the connecting rod to the air motor, so as to synchronize the back-and-forth movement of the connecting rod with the air pressure of the air motor, a control unit for controlling the operation of the air motor, a flexible pipe connecting the air motor to the control unit, and a depth-setting unit. | 07-04-2013 |
Patent application number | Description | Published |
20110084296 | Light Emitting Diode and Manufacturing Method Thereof - A light emitting diode manufacturing method introduces a transparent enclosure to improve the uniformity of coating phosphor, so as to achieve the purposes of enhancing the uniform color temperature and the light emitting efficiency. The manufacturing method is used extensively for packaging various types of light emitting diode chips and mass production. | 04-14-2011 |
20110291114 | LED PACKAGE STRUCTURE - A light-emitting diode (LED) package structure includes a substrate, a first LED, a second LED, and a resin material. At least one enclosure made of a transparent material forms on a surface of the substrate, and encloses and forms at least one area on the substrate. The first LED and the second LED are disposed in the area and adjacent to each other, and the resin material is disposed in the area, and covers the first LED and the second LED. The LED package structure obtains desired illuminating lights by mixing lights respectively emitted by the first LED and the second LED. | 12-01-2011 |
20120098001 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode (LED) package structure includes a substrate, at least one enclosure made of a transparent material, an LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material. | 04-26-2012 |
20140362568 | LIGHT EMITTING DIODE BULB - A LED bulb includes a circuit board, a lighting module, a conductive connector, and a lamp shade. The circuit board includes a slot. The lighting module is arranged on the circuit board and includes a transmissive substrate. The lighting module includes a circuit layer attached to the transmissive substrate, an electrode component arranged on one end of the transmissive substrate and inserted into the slot and electrically connected to the circuit layer, and a plurality of LED dies placed on the transmissive substrate and electrically connected to the circuit layer. The conductive connector is arranged on the other side of the circuit board and electrically connected to the circuit. The lamp shade is assembled with the conductive connector such that the circuit board and the lighting module are arranged between the conductive connector and the lamp shade. | 12-11-2014 |
20150070871 | LED ASSEMBLY - Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell. | 03-12-2015 |
Patent application number | Description | Published |
20130175572 | LIGHT-EMITTING DIODE CHIP - A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation. | 07-11-2013 |
20130214693 | LIGHT EMITTING COMPONENT AND LIGHT EMITTING DEVICE USING SAME - A light emitting device including a light emitting component is provided, wherein said light emitting comprising an integrated light emitting diode and a semiconductor field effect transistor. The semiconductor field effect transistor may prevent situations such as overheating and voltage instability by controlling a current passing through the light emitting diode as well as enhancing the ability to withstand electrostatic discharge and reducing cost of the light emitting device in multiple aspects. | 08-22-2013 |
20140153239 | LIGHT EMITTING DIODE AND ILLUMINATION DEVICE USING SAME - The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively. | 06-05-2014 |
20150061526 | LIGHT EMITTING COMPONENT AND LIGHT EMITTING DEVICE USING SAME - A light emitting device including a light emitting component is provided, wherein said light emitting comprising an integrated light emitting diode and a semiconductor field effect transistor. The semiconductor field effect transistor may prevent situations such as overheating and voltage instability by controlling a current passing through the light emitting diode as well as enhancing the ability to withstand electrostatic discharge and reducing cost of the light emitting device in multiple aspects. | 03-05-2015 |
20150069573 | CAPACITOR STRUCTURE AND STACK-TYPE CAPACITOR STRUCTURE - A capacitor structure is provided, which includes a conductive substrate, a first dielectric layer, and a first metal layer. The conductive substrate includes a first surface and at least one first concave located on the first surface. The first dielectric layer covers the first surface and the first concave. The first metal layer covers the first dielectric layer, wherein the first dielectric layer and the first metal layer respectively have concave structures corresponding to the first concave. A stack-type capacitor structure is also provided. | 03-12-2015 |
20150097202 | LIGHT-EMITTING DIODE - A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads. | 04-09-2015 |
20150116980 | ILLUMINATION SYSTEM - The invention is an illumination system comprising a semiconductor light source module. The illumination system comprises a reflector comprising a curved reflective surface, a holder coupled to the reflector, and a semiconductor light source module comprising a first light-emitting unit and a second light-emitting unit. The holder comprises a second holding section and a first holding section disposed between the reflector and the second holding section. The semiconductor light-source module is disposed on the second holding section to face the curved reflective surface. An angle between at least a light-emitting unit and at least a part of the first holding section is formed and ranges from 145 to 175 degrees. | 04-30-2015 |
20160043063 | LIGHT EMITTING DEVICE - The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. | 02-11-2016 |
Patent application number | Description | Published |
20100096607 | DEVICE FOR TRANSPORTING PLANAR SOFC STACK - A device, adapted for transporting a planar solid oxide fuel cell stack while the SOFC stack is sandwiched between a top plate and a bottom plate, which comprises: a plurality of load units, a lifting unit and a mobile seat. Each of the plural load devices is adapted for exerting a pressure on the SOFC stack. The lifting unit is composed of a joint portion and a plurality of cantilevers. In an exemplary, there is a fixing part arranged at the end of each cantilever while being enabled to connect to the SOFC stack by the bottom thereof. With the aforesaid device, the SOFC stack can be moved out of a high temperature furnace and then into a fuel cell control system smoothly while keeping one's balance without worrying the SOFC stack being damaged or tipping over by collision or losing balance. | 04-22-2010 |
20100098984 | LOAD DEVICE FOR SOFC STACK AND A HIGH-TEMPERATURE FURNACE USING THE SAME - A load device for planar solid oxide fuel cell stack comprises: a balance plate, a high-temperature compressed column, a load cell, an elastic member, an equalizing ring, and an actuator. The balance plate is disposed abutted against the fuel cell stack, and the high-temperature compressed column is disposed on the balance plate, and the load cell and the elastic member are arranged at a top portion of the high-temperature compressed column. The actuator, being placed on the equalizing ring, is used for providing a load to the equalizing ring, the load cell, the elastic member and the high-temperature compressed column Thereby, the load exerted by the actuator can be detected from the measurement of the load cell while the relationship between the load variation and performance of the SOFC stack can be read directly or transmitted to an external device for display. | 04-22-2010 |
20100099007 | Fuel cell assembly structure - A fuel cell assembly structure mainly comprises a housing in which there is an accommodating space; a plurality of unit cell stacks that are stacked in the same direction in the accommodating space of the housing and made by stacking in sequence a cathode layer, a power generation electrode, an anode layer and a connection disk; a connection disk connecting is series each unit cell stack, a sealing disk and a cover in sequence to cover the opening of the accommodating space of the housing. On the outer side of the cover there is a connection base, at least one surface of which has a plurality of conduits and the other end connects to a plurality of cell stack bypass manifolds that further connect to a plurality of side bypass manifolds. | 04-22-2010 |
20100136375 | In line height measurement system for planar fuel cell - An in-line planar fuel cell height measurement system is mainly composed of a main stand, at least a top platform above a high temperature furnace, a displacement detection unit on the top platform with a central axis connecting to an extension rod that goes downward into the high temperature furnace and contacts the top surface of the cell stack inside the high temperature furnace, a displacement display unit connecting to the displacement detection unit through signal transmission cables, and a data processing unit connecting to the displacement display unit through signal transmission cables, so the displacement detection unit can sense the height change for the cell stack in the high temperature furnace during temperature rise and operation and send out a signal, which can be directly displayed by the displacement display unit and received by a data processing unit for further analysis and storage. | 06-03-2010 |
20100216053 | Stack flow path of planar solid oxide fuel cell - Through protrusion on channel area, a fuel flows higher to have a better reaction with a power generating plate of an SOFC. A material is selected for stacks to reduce the number of stacks and to simplify an assembling process of the stacks. | 08-26-2010 |
20100228535 | Simulator of SOFC for electric characteristics - A simulator is used for developing a solid oxide fuel cell (SOFC). Through the simulator, electrical characteristics of the SOFC are examined. Thus, with the simulator, cost for developing the SOFC is saved. | 09-09-2010 |
20110110754 | SYSTEM FOR TRANSPORTING PLANAR SOFC STACK - A system for transporting planar SOFC stack is disclosed, which comprises: a frame, for carrying a cell stack; a robotic arm, for grabbing and holding the cell stack; and a driver, coupled to the frame and the robotic arm and being used for driving the robotic arm. With the aforesaid system, the cell stack can be moved in and out a high-temperature furnace smoothly and rapidly, and then into a fuel cell control system while keeping one's balance without worrying the cell stack being damaged or tipping over by collision or losing of balance. | 05-12-2011 |
20110129744 | Thermal management system for high-temperature fuel cell - A thermal management system for high-temperature fuel cell mainly comprises a first mixer to introduce external fuel to a reformer, a reformer to adjust the gaseous fuel to a proper composition ratio and output the fuel to the anode input of the fuel cell, a second mixer to introduce external ambient air to the cathode input of the fuel cell, a cathode thermal cycle pipeline to deliver the high-temperature air from the cathode output of the fuel cell to pass through the second mixer and the reformer and also heat the second mixer and the reformer to recover the heat, an anode thermal cycle pipeline to introduce the water steam from the anode output of fuel cell, remaining fuel and thermal energy to the first mixer to mix with incoming fuel, and provide sufficient water-to-carbon ratio and the inlet temperature required for the reformer. | 06-02-2011 |
20110129746 | Thermal management system for high-temperature fuel cell - A thermal management system for high-temperature fuel cell mainly comprises a first mixer to introduce external fuel to a reformer, a reformer to adjust the gaseous fuel to a proper composition ratio and output the fuel to the anode input of the fuel cell, a second mixer to introduce external ambient air to the cathode input of the fuel cell, a cathode thermal cycle pipeline to deliver the high-temperature air from the cathode output of the fuel cell to pass through the second mixer and the reformer and also heat the second mixer and the reformer to recover the heat, an anode thermal cycle pipeline to introduce the water steam from the anode output of fuel cell, remaining fuel and thermal energy to the first mixer to mix with incoming fuel, and provide sufficient water-to-carbon ratio and the inlet temperature required for the reformer. | 06-02-2011 |
20110221450 | MEASUREMENT PROCESS FOR DETERMINATION OF THE OPTIMUM CONTACT PRESSURE AMONG COMPONENTS OF A SOLID OXIDE FUEL CELL STACK IN THE PACKAGING PROCESS AND ITS MEASUREMENT APPARATUS - The present invention provides a measurement process for determination of the optimum contact pressure among components of a solid oxide fuel cell stack in the packaging process in order that the reduction in performance caused by the packaging process can be reduced. The present invention also provides a measurement apparatus which can carry the measurement process out. | 09-15-2011 |
20120100453 | Planar SOFC Stack - A solid oxide fuel cell (“SOFC”) stack device is disclosed. The SOFC stack includes SOFC units that can easily be stacked and electrically connected to one another. Furthermore, each of the SOFC units can easily be removed from the others and replaced with a new one. The fuel cell stack includes a supporting mechanism and two conducting and pressing units. The supporting mechanism includes three parts. Each part of the supporting mechanism includes slots defined therein for receiving the SOFC units. Each of the conducting and pressing units is located between two adjacent ones of the parts of the supporting mechanism. | 04-26-2012 |
20130093456 | TESTING DEVICE FOR SOLID OXIDE FUEL CELL - A testing device for solid oxide fuel cell (SOFC) is disclosed. The testing device which combines the original cell housing with a four-point probe equipment is set for measuring SOFC MEA. The current collectors on anode and cathode in the original cell housing are respectively replaced by four independent probe units. They are not only to collect current but also to become measuring probes. Therefore, the lateral impedance of anode and cathode can be measured. Furthermore, the local characteristics are examined by open circuit voltage (OCV), I-V curve, and electrochemical impedance spectroscopy (EIS) measurements. The results show that the lateral impedance is substantially varied with temperatures. The distributions of OCV, current density, EIS and cell voltage in long-term test at the center of the cell are different from the edge. | 04-18-2013 |
20130101912 | Burner Reformer for Fuel Cell Power Generating System - A burner reformer is provided for a power generating system using fuel cell. A burner is contained inside the reformer. The reformer absorbs heat from the burner and other heat source to reduce heat loss and save connecting wires. The present invention avoids flashing back of hydrogen. When fuel is lean, flame would not easily die and the system can thus work stably. | 04-25-2013 |
20150101777 | HEAT RECOVERY STORAGE DEVICE - The present invention is to provide a heat recovery storage device, which includes a major container, a heat transfer machine mounted in the major container, and a thermostatic valve mounted on the heat transfer machine. And the heat transfer machine is used for conducting heat transfer directly to the water in the major container, thus the efficiency of recovery increases, and loss of heat decreases. Also, the water is not easily boiled during the heat recovery, and the maximum of water temperature can increases. In extended use of more than one device of the present invention, each of the major containers can be installed with or without a heat transfer machine as required. The bypass outgassing control is not needed during the heat recovery, and is performed when the water temperature in the containers reaches to the highest. | 04-16-2015 |
20150357664 | Plate type fuel reformer of fuel cell - A plate type fuel reformer of fuel cells includes a reformer module stacked by multiple sheet components, and an engaging surface formed on a surface of the reformer module and adhered to a surface of the default fuel cell module in order to form a great thermally-conductive combination. Detachable connections are formed between each of the sheet components and between the sheet components and the fuel cells module. The edge of the reformer module is non-protruding from the side of the fuel cell module after connection. Multiple containing spaces are respectively formed between each of the sheet components for containing default catalyst units. Also, an independent air channel is formed for guiding outside air to into the fuel cell module and a fuel channel is formed for containing the default catalyst units and guiding outside fuel to react with the catalyst units to generate hydrogen gas and carbon monoxide. | 12-10-2015 |
20160111738 | FLAT PLATE TYPE SOLID OXIDE FUEL CELL STACK UNIT AND FLAT PLATE TYPE SOLID OXIDE FUEL CELL STACK MODULE - A flat plate type solid oxide fuel cell stack module is obtained by stacking a plurality of flat plate type solid oxide fuel cell stack units. Each of the cell stack unit comprises an anode plate, a cell unit and a cathode plate. The anode plate has a first flow channel, four corner first fuel input holes and a central first fuel output hole. The cathode plate has a second flow channel, a plurality of lateral second air input grooves and a plurality of lateral second air output grooves. The cell unit includes an anode layer, a cathode plate, four corner third fuel input holes and a central third fuel output hole. An anode mental net and an anode sealing material are disposed between the anode plate and the cell unit, a cathode mental net and a cathode sealing material are disposed between the cathode plate and the cell unit. | 04-21-2016 |