Cheng-Tao
Cheng-Tao Hsu, New Taipei City TW
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20160004866 | ENCRYPTION AND DECRYPTION METHODS APPLIED ON OPERATING SYSTEM - An encryption and decryption methods applied on an operating system kernel are disclosed, where a hash result is obtained from a computation between a booting program and the operating system kernel by using a definition table, the computation result is combined with the operating system kernel for encryption of the operating system kernel, and the operating system kernel may not be decrypted and thus booted whenever the booting program, the operating system kernel or the two combined are falsified or replaced, whereby the technical efficacy which the booting program and the operating system kernel are authenticated bilaterally for safety booting may be achieved. | 01-07-2016 |
Cheng-Tao Li, Hsinchu TW
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20160064981 | CHARGING CIRCUIT, CONTROL CHIP AND CONTROL METHOD THEREOF - A charging circuit including a transformer, a storage element, a switch element, a first resistor, and a current detection unit is provided. The transformer includes a primary coil and a secondary coil. The storage element is coupled to the secondary coil. The switch element is coupled to the primary coil. The first resistor is coupled to the primary coil. The current detection unit detects current flowing through the first resistor. When the current reaches a set current, the current detection unit sends a full signal to de-activate the switch unit. | 03-03-2016 |
Cheng-Tao Lin, Kaohsiung City TW
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20140035082 | Elevated Photodiodes with Crosstalk Isolation - A device includes a plurality of isolation spacers, and a plurality of bottom electrodes, wherein adjacent ones of the plurality of bottom electrodes are insulated from each other by respective ones of the plurality of isolation spacers. A plurality of photoelectrical conversion regions overlaps the plurality of bottom electrodes, wherein adjacent ones of the plurality of photoelectrical conversion regions are insulated from each other by respective ones of the plurality of isolation spacers. A top electrode overlies the plurality of photoelectrical conversion regions and the plurality of isolation spacers. | 02-06-2014 |
20150118787 | Elevated Photodiodes with Crosstalk Isolation - A device includes a plurality of isolation spacers, and a plurality of bottom electrodes, wherein adjacent ones of the plurality of bottom electrodes are insulated from each other by respective ones of the plurality of isolation spacers. A plurality of photoelectrical conversion regions overlaps the plurality of bottom electrodes, wherein adjacent ones of the plurality of photoelectrical conversion regions are insulated from each other by respective ones of the plurality of isolation spacers. A top electrode overlies the plurality of photoelectrical conversion regions and the plurality of isolation spacers. | 04-30-2015 |
Cheng-Tao Lin, Hsin-Chu TW
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20110317121 | FLAT DISPLAY DEVICE INTEGRATED WITH PHOTOVOLTAIC CELL - A flat display device integrated with a photovoltaic cell is disclosed. The flat display device includes a first substrate, a second substrate, a display medium layer, a first photovoltaic cell, a connecting layer and a conductive structure. The display medium layer is sealed between the first and second substrates. The first photovoltaic cell is disposed on the first substrate. The connecting layer is disposed on the second substrate and is capable of electrically connecting the first photovoltaic cell to an external circuit. The conductive structure is disposed between the first and second substrates, and is electrically connected with the first photovoltaic cell and the connecting layer. | 12-29-2011 |
Cheng-Tao Wu, Xindian City TW
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20110288150 | Oligonucleotides for Suppressing Cancer Cell Invasion and Migration - Provided herein is a method for detection of migratory and invasive cancer cells based on a number of marker nucleic acids differentially expressed in migratory/invasive cancer cells relative to nonmigratory/noninvasive cancer cells. Also disclosed are antisense oligonucleotides of the marker nucleic acids and uses thereof for suppressing cancer cell migration and invasion. | 11-24-2011 |
Cheng-Tao Wu, New Taipei City TW
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20130288239 | BIOMARKER FOR HUMAN LIVER CANCER - The disclosure relates to a method for determining incidence of liver cancer in a subject, including detecting methylation level or expression level of one microRNA miR-129-2 in a bio-sample from the subject. In the case that the methylation level of the microRNA in the bio-sample is higher or the expression level of the microRNA in the bio-sample is lower relative to that of the corresponding microRNA in a control sample, indicates that the subject is predisposed to or afflicted with liver cancer. | 10-31-2013 |
Cheng-Tao Wu, Tu-Cheng TW
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20120238133 | CONNECTOR MOUNTING APPARATUS WITH EMI SHIELDING CLIP - A connector mounting apparatus includes a mounting bracket and a receiving member. A receiving space is defined in the mounting bracket. The receiving member includes a main body, a first resilient resisting tab extending outward from a base panel of the main body, and a first resilient contacting tab extending inward from the base panel to resiliently abut a connector interface received inside the main body. The main body is received in the receiving space and the first resisting tab resiliently abuts an inner surface of the receiving space. | 09-20-2012 |
Cheng-Tao Wu, Taipei TW
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20120025257 | LED ASSEMBLY AND MANUFACTURING METHOD THEREOF - An LED assembly including a heat sink, a surface treatment dielectric layer, an electrically conductive layer, a thermally conductive layer and an LED chip. The surface treatment dielectric layer is disposed on an upper surface of the heat sink and defines at least one first through hole to expose a portion of the upper surface. The electrically conductive layer is formed on the surface treatment dielectric layer, includes a plurality of electrical traces and defines at least one second through hole corresponding to the first through hole. The thermally conductive layer is formed in the first and the second through holes and directly contacted with a portion of the upper surface exposed from the overlapped region of the first through hole and the second through hole. The LED chip includes a plurality of electrodes electrically connected to the electrical traces and is directly contacted with the thermally conductive layer. | 02-02-2012 |
Cheng-Tao Yang, Zhongli City TW
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20130200402 | LIGHT-EMITTING MODULE - A light-emitting module includes a plate substrate, two circuit substrates, at least one LED chip, a plurality of wires and a molding component. The plate substrate includes a plurality of chip carriers protrudingly arranged from an upper surface and a lower surface of the plate substrate. The two circuit substrates directly stack on the upper and lower surface of the plate substrate, respectively, wherein a plurality of openings are arranged corresponding to the chip carriers penetrating therethrough and the upper surface of each chip carrier is at a higher or the same horizontal of the surface of the corresponding circuit substrate. The LED chip is arranged on each chip carrier. Each LED chip and the corresponding circuit substrates are electrically connected with a plurality of wires. Each of LED chips, each of chip carriers, wires and a portion of the circuit substrates are covered with the molding component. | 08-08-2013 |
20150342058 | METHOD FOR MANUFACTURING HEAT CONDUCTING SUBSTRATE - A method for manufacturing a heat conducting substrate includes providing a metal plate with a first surface and an opposed second surface; forming a plurality of micro bumps on the first surface; disposing an adhesive layer on the first surface among the micro bumps; providing a circuit layer with a plurality of first openings formed thereon, positions of the first openings corresponding to positions of the micro bumps; fixing the circuit layer onto the adhesive layer, wherein the micro bumps are exposed through the first openings respectively; manufacturing circuits on the circuit layer; and finally, thinning a thickness of the metal plate. The method for manufacturing a heat conducting substrate has the manufactured heat conducting substrate to meet the requirements of being thin-shaped and having high heat conducting electronic elements, and has the advantage of an improved yield. | 11-26-2015 |