Patent application number | Description | Published |
20120228011 | Semiconductor Load Board - Disclosed is a semiconductor load board, including a substrate, a plurality of connection pads, a patterned circuit layer, a dielectric layer, a plurality of solder pads, and a plurality of solders. The connection pads and the patterned circuit layer are located on the substrate. The dielectric layer is formed on the substrate, the connection pads and the patterned circuit layer, and has a plurality of openings corresponding to the plurality of connection pads. The solder pads are formed in the openings, and the width of the solder pads is smaller than or equals to the maximum width of the openings of the dielectric layer, and a protruding portion which has a width smaller than the minimum width of the openings of the dielectric layer can also be formed, such that the problems of short-circuit failure and electrical interference can be reduced. | 09-13-2012 |
20120231621 | Manufacturing Method Of A Semiconductor Load Board - A manufacturing method of a semiconductor load board is disclosed. The manufacturing method includes a first conductive layer forming step, a first patterning step, a dielectric layer forming step, a drilling step, a second conductive layer forming step, a second patterning step or a two-times patterning step, and a solder connecting step. In a second patterning step or a two-times patterning step, a solder pads is formed in the opening of the dielectric layer, wherein each solder pad has a height higher than the height of the dielectric, and the width of each solder pad is equal to or smaller than the maximum width of the opening, such that wider intervals are provided in the same area and the problems of short circuit failure and electrical interference can be reduced. | 09-13-2012 |
20130255858 | METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD - A method of manufacturing a laminate circuit board is disclosed. The method includes forming a metal layer on a substrate, patterning the metal layer to form a circuit metal layer, forming a nanometer plating layer with a thickness of 5 to 40 nm over the circuit metal layer, and forming a cover layer covering the substrate and the nanometer plating layer with improved adhesion by chemical bonding to form the laminate circuit board. Another method includes forming the circuit metal layer and the nanometer plating layer on a preforming substrate, pressing the preforming substrate against a substrate to push the circuit metal layer and the nanometer plating layer into the substrate, and removing the preforming substrate. By the present invention, the density of circuit is increased and much denser circuit can be implemented on the substrate with the same area. | 10-03-2013 |
20130284500 | LAMINATE CIRCUIT BOARD STRUCTURE - A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area. | 10-31-2013 |
Patent application number | Description | Published |
20080278831 | Focus Driving Apparatus With Impact Resistance - A focus driving apparatus with impact resistance is provided, including a lens carrier seat, a fixed base, a hanging element set, and a shake-resistant element set. The lens carrier seat is for carrying a lens. The hanging element set further includes a plurality of metal wires. The shake-resistant element set includes at least a soft resilient plate. One end of the metal wires of hanging element set is fixed to the lens carrier seat, and the other end penetrates the holes on the soft and resilient plate on the fixed base and is fixed to the shake-resistant element set. The shake-resistant element set can absorb the external impact force by deformation to provide protection to the hanging element set and lens carrier seat. | 11-13-2008 |
20100290777 | Apparatus For Driving Micro Shutter And Aperture - An apparatus for driving micro shutter and aperture is provided, including a permanent magnet, a coil set, an aperture blade, a curve handle, and a base. The coil set is fixed to the base. The permanent magnet is located between the coils of the coil set. The curve handle is installed with the permanent magnet. The curve handle is linked to the aperture blade. When the current runs through the coil set, the generated magnetic force will exert a reaction force on the permanent magnet. The reaction force will generate a torque to rotate the magnet. With the curve handle linked to the aperture blade, the linkage movement can achieve the object of driving the shutter and the aperture | 11-18-2010 |
20120120509 | Apparatus Of Auto-Focus Module And Assembly Method Thereof - An apparatus of auto-focus module and the related assembly method are provided. The module includes a focus-driving module and a photo-sensor module. The focus-driving module includes a lens set and a focus-driving device. The outer circumference of the lens is a smooth surface and the inner circumference of the lens holder is also a smooth surface. The assembly method includes the steps of: sheathing the lens into the lens holder of the focus-driving device and fastening the lens to the lens holder to form a focus-driving module; maintaining a gap as the space for adjusting the locations of the focus-driving module and the photo-sensor module, and after adjustment, fastening the focus-driving module and the photo-sensor module. | 05-17-2012 |