Chen, Kaohsiung
Bo-Wei Chen, Kaohsiung TW
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20120071547 | COMPOUNDS FROM SOFT CORAL, METHOD OF PREPARATION AND PHARMACEUTICAL USES THEREOF - The invention relates to compounds from the soft coral and the generation thereof. The invention also relates to the uses of the compounds from the soft coral in inhibiting inducible nitric oxide synthase and/or cyclooxygenase-2 and in treating the diseases associated with inducible nitric oxide synthase and/or cyclooxygenase-2. | 03-22-2012 |
Chang-Pen Chen, Kaohsiung TW
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20110117695 | FABRICATION METHOD OF ORGANIC THIN-FILM TRANSISTORS - This invention discloses a fabrication method of organic thin-film transistors (OTFTs) using the micro-contact printing. The OTFT can be of the bottom-gate or top-gate configuration. The micro-contact printing operation of this fabrication method does not require clean-room environment and high processing temperature, and does not have the problem of 2D shrinkage of the printed patterns either. Furthermore, the pre-wetting technique employed in the micro-contact printing results in improved fidelity in the pattern transfer and solves the problems of pairing and cross-talking between neighboring patterns. | 05-19-2011 |
Chao-Lieh Chen, Kaohsiung TW
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20110170745 | Body Gesture Control System for Operating Electrical and Electronic Devices - A body gesture control system for operating electrical and electronic devices includes an image sensor device and an image processor device to process body gesture images captured by the image sensor device for recognizing the body gesture. The image processor device includes an image calculation unit and a gesture change detection unit electrically connected therewith. The image calculation unit is used to calculate gesture regions of the captured body gesture images and the gesture change detection unit is operated to detect changes of the captured body gesture images and to thereby determine a body gesture recognition signal. | 07-14-2011 |
Chia-Hui Chen, Kaohsiung TW
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20090262888 | AIMING METHOD AND DEVICE FOR AN EXTRAORAL RADIOGRAPHIC TECHNIQUE - An aiming method and a device for an extraoral radiographic technique using a pair of length-adjustable indicator rods. Install a circular locator on each to the indicator rod. While keeping at an appropriate angle, hold the two locators closely beside the cheeks of the patient, and then along the hypothetical axis, secure a radioactive-rays emission head onto one of the circular locator. Following this hypothetical axis to the other locator, and secure a film or a sensor. Aim the radioactive-rays emission head along the hypothetical axis while taking the radiographic shots. | 10-22-2009 |
Chien-Ching Chen, Kaohsiung TW
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20090170742 | AQUEOUS CLEANING COMPOSITION - An aqueous cleaning composition for cleaning wafer contaminants after a chemical mechanical planarization process, includes: 0.1-20 wt % of an alkanolamine selected from the group consisting of 2-amino-1,3-propanediol, 2-amino-2-(hydroxymethyl)-1,3-propanediol, and combinations thereof; 0.05-20 wt % of a quaternary amine; and water. The cleaning composition is capable of removing efficiently residual contaminants from a polished surface of a wafer and imparting the wafer with a better surface roughness. | 07-02-2009 |
Chien-Fan Chen, Kaohsiung TW
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20110084381 | Chip Having A Metal Pillar Structure - The present invention relates to a chip having a metal pillar structure. The chip includes a chip body, at least one chip pad, a first passivation layer, an under ball metal layer and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer, and includes a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer. The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar. Therefore, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved. | 04-14-2011 |
20110084389 | Semiconductor Device - The present invention relates to a semiconductor device. The semiconductor device includes a substrate and a chip. The chip is electrically connected to the substrate. The chip includes a chip body, at least one chip pad, a first passivation, an under ball metal layer and at least one metal pillar structure. The chip pad is disposed adjacent to an active surface of the chip body. The first passivation is disposed adjacent to the active surface, and exposes part of the chip pad. The under ball metal layer is disposed adjacent to the chip pad. The metal pillar structure contacts the under ball metal layer to form a first contact surface having a first diameter. The metal pillar structure is electrically connected to a substrate pad of the substrate to form a second contact surface having a second diameter. The ratio of the first diameter to the second diameter is between 0.7 and 1.0. As a result, the first contact surface and the second contact surface have an equivalent bonding force, which prevents the metal pillar structure from cracking due to a shear stress. Thus, the structure strength of the semiconductor device is enhanced and the semiconductor device can pass the reliability test. | 04-14-2011 |
Chien-Jung Chen, Kaohsiung TW
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20080250810 | Cooling module applied for liquid containers - A cooling module applied for liquid containers comprises: A cooling pipeline forms with an inlet and an outlet for refrigerant to flow through. The liquid pipeline conducts liquids to flow through a thermal-exchanging matrix. The thermal-exchanging matrix is made from metals such as copper or aluminum. The cooling pipeline and liquid pipeline are both installed inside the thermal-exchanging matrix. The thermal-exchanging matrix is pre-cooled and therefore being kept at a predetermined temperature by the thermal controller. Consequently, through flown in and out of the thermal-exchanging matrix, the liquid is cooled down in short time and therefore kept at the predetermined temperature. | 10-16-2008 |
Chi-Han Chen, Kaohsiung TW
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20100276690 | Silicon Wafer Having Testing Pad(s) and Method for Testing The Same - The present invention relates to a silicon wafer having testing pad(s) and a method for testing the same. The silicon wafer includes a silicon substrate, an insulation layer, at least one testing pad and a dielectric layer. The testing pad includes a first metal layer, a second metal layer and at least one first interconnection metal. The first metal layer is disposed on the insulation layer, and has a first area and a second area. The first area and the second area are electrically insulated with each other. The second metal layer is disposed above the first metal layer. The first interconnection metal connects the second area of the first metal layer and the second metal layer. Therefore, when a through hole and a seed layer are formed in the following processes, the through hole is estimated whether it is qualified by probing the testing pad to know whether the seed layer connects the second area of the first metal layer of the testing pad, thus the yield rate of the following processes is increased. | 11-04-2010 |
Chih-Hsing Chen, Kaohsiung TW
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20090091036 | Wafer structure with a buffer layer - A wafer structure with a buffer layer is provided. The wafer structure comprises a wafer which has at least one pad formed thereon, a passivation layer formed on the wafer for partially exposing the at least one pad, a buffer layer formed on the passivation layer and the pad, and an under bump metallurgy (UBM) formed on the buffer layer. The buffer layer comprises a thickness-increased inner buffering member made from aluminum and located between the UBM and the pad to enhance the shock-absorbing ability of the wafer in a drop test to avoid the conductive bump bonded to a substrate coming off or cracking. The invention can also enhance the bonding between the conductive bump and the UBM. The buffer layer may further comprise an outer buffering member made of polyimide, coated on the passivation layer and partially arranged between the UBM and the passivation layer. | 04-09-2009 |
Chih-Kang Chen, Kaohsiung TW
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20110265321 | Manufacturing Method of Identifiable Print Circuit Board - A manufacturing method of identifiable print circuit board comprises a step of “disposing identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board. | 11-03-2011 |
Ching-Ching Chen, Kaohsiung TW
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20080225508 | Light-emitting device and electronic device using the same - A light-emitting device and an electronic device using the same are provided. The light-emitting device includes a light-guiding plate, a circuit board, at lease one light source unit and a reflective layer. The circuit board is disposed under the light-guiding plate. The reflective layer is disposed above the light-guiding plate. The light-guiding plate has at lease one hole. The light source unit is disposed on the circuit board and within the hole. The reflective layer is disposed above the hole. The light-emitting device is disposed on one side of a part, such as a keypad, of the electronic device for providing light to the keypad. | 09-18-2008 |
20100265106 | Light-Emitting Device and Electronic Device Using The Same - A light-emitting device and an electronic device using the same are provided. The light-emitting device includes a light-guiding plate, a circuit board, at lease one light source unit and a reflective layer. The circuit board is disposed under the light-guiding plate. The reflective layer is disposed above the light-guiding plate. The light-guiding plate has at lease one hole. The light source unit is disposed on the circuit board and within the hole. The reflective layer is disposed above the hole. The light-emitting device is disposed on one side of a part, such as a keypad, of the electronic device for providing light to the keypad. | 10-21-2010 |
Ching-Hsuan Chen, Kaohsiung TW
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20110253996 | COMPOSITE DIELECTRIC MATERIAL DOPED WITH RARE EARTH METAL OXIDE AND MANUFACTURING METHOD THEREOF - A composite dielectric material doped with rare earth metal oxide and a manufacturing method thereof are provided. The composite dielectric material is doped with nano-crystalline rare metal oxide which is embedded in silicon dioxide glass matrix, and the composite dielectric material of the nano-crystalline rare metal oxide and the silicon dioxide glass matrix is synthesized by the manufacturing method using sol-gel route. The dielectric value of the glass composite dielectric material is greater than that of pure rare metal oxide or that of silicon dioxide. In presence of magnetic field, the dielectric value of the composite dielectric material is substantially enhanced compared with that of the composite dielectric material at zero field. | 10-20-2011 |
Chung-Hwan Chen, Kaohsiung TW
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20100150997 | TREATMENT OF ARTHRITIS - A method for treating and/or inhibiting arthritis is provided. The method includes administering an effective amount of a composition including a parathyroid hormone and a pharmaceutically acceptable carrier or salt to a subject with arthritis. Additionally, a method for inhibiting and/or rescuing terminal differentiation of cells is also provided. | 06-17-2010 |
20100160229 | TREATMENT OF EARLY-STAGE OSTEOARTHRITIS - A method for treating early-stage osteoarthritis in an animal is provided. The method comprises delivery of a therapeutically effective amount of a parathyroid hormone (PTH) or a PTH derived substance to an affected joint cavity of the patient. Methods for inhibiting articular chondrocytes apoptosis and for inhibiting a degenerative process of articular chondrocytes in an afflicted animal are also provided. | 06-24-2010 |
Chun-Han Chen, Kaohsiung TW
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20100254170 | DC to AC inverter - A DC to AC inverter has a DC power input port, a buck converter, a buck/boost converter, an output filter and an AC output port. The DC power input port has a positive input terminal and a negative input terminal, both connected to a DC source. The AC output port is connected to a single-phase utility system. When the single-phase utility system is in positive half cycle, the buck converter generates a positive half-cycle signal of sinusoidal current. When the single-phase utility system is in negative half cycle, the buck/boost converter generates a negative half-cycle signal of sinusoidal current. In either the positive or negative half cycles, only one power electronic switch is switched in high frequency to reduce switching loss. Further, the negative input terminal of the DC power input port of the invention can be connected to a neutral line of the single-phase utility system. | 10-07-2010 |
Chun-Hsiung Chen, Kaohsiung TW
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20120029796 | ENGINE IDLE SPEED CONTROL SYSTEM AND METHOD FOR VEHICULAR GEAR - An engine idle speed control system and a method for a vehicular gear are provided. The system includes an electronic controller, an engine connected to an ignition unit and a fuel supply unit, a battery, a starter switch connected to the battery, and a starter motor connected to the starter switch. The engine has a gear mechanism and a clutch which is connected to a clutch lever. The electronic controller is connected to a vehicle speed sensor, a throttle position sensor, and an engine revolution speed sensor. The clutch lever with a node switch provides a lever node control signal, the gear mechanism with a gear node switch provides a gear node control signal, and the electronic controller is connected to the node switch of the clutch lever and the gear node switch of the gear mechanism, so as to control automatic idle speed stop and start of the engine. | 02-02-2012 |
David C. P. Chen, Kaohsiung TW
Fu-Tzao Chen, Kaohsiung TW
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20090317280 | METHOD FOR MANUFACTURING METAL-BASED CERAMIC COMPOSITE TARGET CONTAINING NOBLE METAL - A method for manufacturing a metal-based ceramic composite target containing noble metal is provided, which includes firstly applying a ceramic powder uniformly onto a surface of a magnetic metal powder by using a wet powder mixing process, and drying it to obtain a ceramic-metal composite powder, and then uniformly mixing a noble metal powder with the ceramic-metal powder by using a dry powder mixing process, and finally making the ceramic-metal composite powder into a compact target by using a molding and compacting process. The manufacturing method of the present invention can uniformly mix the powders of the magnetic metal, the ceramic, and the noble metal, and reduce the loss of the noble metal powder in the production process of the target, so as to improve the quality of the target and decrease the production cost thereof. | 12-24-2009 |
Guan-Ming Chen, Kaohsiung TW
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20100231097 | Micro-Motor - A micro-motor includes a base, a rotor and a retaining member. The base includes an axle tube. The rotor includes a rotary member and a support member arranged between the rotary member and the base. The rotary member has a central hole where the axle tube of the base extends. The retaining member is mounted on the base and surrounds the rotor. One end of the retaining member, which doesn't couple to the base, extends towards the axle tube to form a retaining portion. The retaining portion is within a rotational area of the rotor in an axial direction of the axle tube. The rotor is arranged between the retaining portion and the base. Accordingly, the retaining member can retain the rotor to prevent departure of the rotor from the axle tube of the base and the central structure of the micro-motor is effectively simplified. | 09-16-2010 |
Hao-Yu Chen, Kaohsiung TW
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20080237717 | Fully Depleted SOI Multiple Threshold Voltage Application - An integrated circuit comprises a substrate and a buried dielectric formed in the substrate. The buried dielectric has a first thickness in a first region, a second buried dielectric thickness in a second region, and a step between the first and second regions. A semiconductor layer overlies the buried dielectric. | 10-02-2008 |
20100176424 | Doping of Semiconductor Fin Devices - A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface. | 07-15-2010 |
20100200923 | MULTIPLE-GATE TRANSISTOR STRUCTURE AND METHOD FOR FABRICATING - A multiple-gate transistor structure which includes a substrate, source and drain islands formed in a portion of the substrate, a fin formed of a semi-conducting material that has a top surface and two sidewall surfaces, a gate dielectric layer overlying the fin, and a gate electrode wrapping around the fin on the top surface and the two sidewall surfaces separating source and drain islands. In an alternate embodiment, a substrate that has a depression of an undercut or a notch in a top surface of the substrate is utilized. | 08-12-2010 |
Hsin-Pao Chen, Kaohsiung TW
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20100126290 | TRANSMISSION MECHANISM WITH INTERMITTENT OUTPUT MOVEMENT - A transmission mechanism with intermittent output movement includes an output shaft rotatably mounted to first and second cams and a sun gear mounted to the output shaft. A first rocker includes a first planet gear meshed with the sun gear and first and second rollers rotatably mounted on opposite sides of the first planet gear and respectively in contact with the first and second cams. A second rocker includes a second planet gear meshed with the sun gear. An end of a first connecting rod is mounted to the first rocker. An end of a second connecting rod is mounted to the second rocker. Two ends of a link are rotatably mounted to the other ends of the first and second connecting rods. A planet gear carrier is mounted to an input shaft coaxial to the input shaft and includes an end rotatably mounted to the first rocker. | 05-27-2010 |
20110287121 | MULTI-ROD MECHANISM FOR OPENING AND CLOSING MOLDS - A multi-rod mechanism for opening and closing molds is provided and includes a single cam, a first side connection rod assembly located on a first side of the cam, a first mold actuated by the first side connection rod assembly, a linkage connection rod, a second side connection rod assembly located on a second side of the cam and actuated by the linkage connection rod, and a second mold actuated by the second side connection rod assembly. The multi-rod mechanism only uses the single cam to simultaneously actuate the first and second molds, so that the structure of the multi-rod mechanism can be simplified, while the vibration, loading, noise and abrasion of components during operation can be relatively reduced. | 11-24-2011 |
20110287130 | MULTI-ROD STRUCTURE FOR OPENING AND CLOSING MOLDS - A multi-rod structure for opening and closing molds is provided and includes a single cam, a first side connection rod assembly located on a first side of the cam and having a first side triple connection rod, a first mold actuated by the first side triple connection rod, a linkage connection rod, a second side connection rod assembly located on a second side of the cam and having a second side triple connection rod actuated by the linkage connection rod, and a second mold actuated by the second side triple connection rod. The multi-rod structure only uses the single cam to simultaneously actuate the first and second molds, so that the structure can be simplified, while the vibration, loading, noise and abrasion of components during operation can be relatively reduced. | 11-24-2011 |
Hua-Ping Chen, Kaohsiung TW
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20090103787 | Sliding type thin fingerprint sensor package - A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion. | 04-23-2009 |
I-Yen Chen, Kaohsiung TW
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20090106335 | Speed-Level Calculator And Calculating Method For Dynamic Voltage Scaling - Disclosed is directed to a speed-level calculator and calculating method for dynamic voltage scaling. The speed-level calculator comprises a deadline counter, a shifter, and a fixed-point multiplier. The deadline counter calculates the residual time D from current time through to each task deadline for completing an episode. The shifter generates a D′ value by shifting the D value to the right for e−m bits, and takes the decimal fraction part of the D′ value for m bits. The speed-level calculator further comprises a saturation control circuit to detect if an overflow occurs on the D′ value. According to a pre-calculated parameter a | 04-23-2009 |
Jia-Hong Chen, Kaohsiung TW
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20100168444 | DIINDENOTHIOPHENE DERIVATIVES AND USE THEREOF - A diindenothiophene derivative of the following formula (1) is disclosed: | 07-01-2010 |
20130177759 | COATING COMPOSITION AND USES THEREOF - A coating composition is provided. The coating composition comprises (a) an aluminum oxide precursor and (b) a solvent, wherein the aluminum oxide precursor (a) comprises aluminum elements and the following groups bound thereon: | 07-11-2013 |
20130255762 | PASSIVATION LAYER FOR SOLAR CELLS AND METHOD FOR MANUFACTURING THE SAME - The present invention pertains to a passivation layer disposed on a surface of a substrate for use in solar cells, including a first passivation layer formed on the substrate by screen printing. The present invention also pertains to a method for preparing the passivation layer structure. The method according to the present invention can prepare a passivation layer on a surface of a semiconductor substrate by screen printing, and during the screen printing, a patterning step can be performed simultaneously. Therefore, the present invention is able to produce the passivation layer in a more economic and faster manner. | 10-03-2013 |
Jian-Cheng Chen, Kaohsiung TW
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20110090659 | Package Having An Inner Shield And Method For Making The Same - The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield. Therefore, the inner shield enables the electrical elements to have low electromagnetic interference and high electromagnetic compatibility. | 04-21-2011 |
Jung-Chih Chen, Kaohsiung TW
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20090317280 | METHOD FOR MANUFACTURING METAL-BASED CERAMIC COMPOSITE TARGET CONTAINING NOBLE METAL - A method for manufacturing a metal-based ceramic composite target containing noble metal is provided, which includes firstly applying a ceramic powder uniformly onto a surface of a magnetic metal powder by using a wet powder mixing process, and drying it to obtain a ceramic-metal composite powder, and then uniformly mixing a noble metal powder with the ceramic-metal powder by using a dry powder mixing process, and finally making the ceramic-metal composite powder into a compact target by using a molding and compacting process. The manufacturing method of the present invention can uniformly mix the powders of the magnetic metal, the ceramic, and the noble metal, and reduce the loss of the noble metal powder in the production process of the target, so as to improve the quality of the target and decrease the production cost thereof. | 12-24-2009 |
Kai-Chuan Chen, Kaohsiung TW
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20100129367 | HUMAN BETA-GLUCURONIDASE MUTANTS WITH ELEVATED ENZYMATIC ACTIVITY UNDER PHYSIOLOGICAL CONDITIONS AND METHOD FOR IDENTIFYING SUCH - A number of human beta-glucuronidase variants having higher enzymatic activity at physiological pH as compared with wild-type beta-glucuronidase and uses thereof in prodrug therapy. Also disclosed herein is a method for identifying enzyme variants having elevated enzymatic activity using a mammalian surface display system. | 05-27-2010 |
Ke-Hung Chen, Kaohsiung TW
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20090057895 | POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING PROCESS FOR SAME - A post passivation rerouting support structure comprises a relatively thin support layer above the passivation layer to support the RDL, and a relatively thick support layer for fine pitch interconnects extending from the RDL and terminating as contact structures at the surface of the thick support layer, for a next level packaging structure. The thick support layer is planarized before defining the contact structures. The thick support layer may be formed after the conducting posts have been formed, or the thick support layer is formed before forming the conducting posts in vias formed in the thick support layer. An encapsulating layer may be provided above the thick support layer, which top surface is planarized before defining the contact structures. The encapsulating layer and the further support layer may be the same layer. | 03-05-2009 |
Ko-Chun Chen, Kaohsiung TW
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20110214851 | USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER - The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed. | 09-08-2011 |
20120132404 | USE OF A GRAPHITE HEAT-DISSIPATION DEVICE INCLUDING A PLATING METAL LAYER - The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed. | 05-31-2012 |
20140069622 | HEAT DISSIPATION COMPOSITE AND THE USE THEREOF - A multi-layer heat dissipation composite for reducing the external surface temperature of an electronic device is disclosed. The heat dissipation composite comprises a reflective component and a component with anisotropic property. The heat dissipation composite further comprises an adhesive. Some embodiments also provide methods for reducing the external surface temperature of an electronic device. | 03-13-2014 |
Liang-Tsuen Chen, Kaohsiung TW
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20080277579 | MASS ANALYZING APPARATUS - The present invention relates to a mass analyzing apparatus, comprising a first metal electrode plate, a second metal electrode plate, an RF power supply, a reactant gas and a mass spectrometry. The second metal electrode plate is grounded. There is a gap between the first metal electrode plate and the second metal electrode plate. The RF power supply is electrically connected to the first metal electrode plate. Electric discharge is caused between the first metal electrode plate and the second metal electrode plate, so that the reactant gas becomes dissociation plasma. The dissociation plasma reacts with a gas analyte from a sample and then enters the mass spectrometry for a mass analysis. In addition, since the dissociation plasma is generated under low temperature and atmospheric pressure, the mass analyzing apparatus of the present invention is applicable for biological samples that need to be analyzed at a low temperature. | 11-13-2008 |
Lin-Hsin Chen, Kaohsiung TW
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20090103787 | Sliding type thin fingerprint sensor package - A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion. | 04-23-2009 |
Li-Su Chen, Kaohsiung TW
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20100261893 | Method for producing cross-linked hyaluronic acid - A method for producing cross-linked hyaluronic acid has cross-linking one or more polymers at a low temperature from 10 to 30° C. for a reaction time greater than 48 hours under basic condition with a cross-linking agent to form a cross-linked hyaluronic acid, wherein the polymer is selected from the group consisting of hyaluronic acid, hyaluronate, derivatives thereof and a mixture thereof. Whereby, a cross-linking agent content in a product of the method is decreased so the product does not require purification. | 10-14-2010 |
20120095206 | METHOD FOR PRODUCING CROSS-LINKED HYALURONIC ACID - A method for producing a cross-linked hyaluronic acid in accordance with the present invention comprises: (a) cross-linking at least one polymer at a temperature, from about 35° C. to about 60° C., for a reaction time of from about 0.1 hour to about 72 hours with a cross-linking agent; and (b) lowering the temperature in step (a) to form about 10° C. to about 30° C. for a reaction time of from about 48 hours to about 28 days to obtain the cross-linked hyaluronic acid, whereby, a cross-linking agent content in a product of the method can be decreased so the product does not require purification. | 04-19-2012 |
Lung-Tai Chen, Kaohsiung TW
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20110018075 | STRUCTURE AND FABRICATION METHOD OF A SENSING DEVICE - A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire. | 01-27-2011 |
Mingkun Chen, Kaohsiung TW
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20090085589 | WAFER LEVEL TESTING METHOD FOR RFID TAGS - A wafer level testing method for RFID tags is disclosed. The method comprises: providing a semiconductor wafer having a plurality of RFID tag chips, wherein each of the RFID tag chips includes at least one detachable inductance and an embedded capacitance to form a resonant circuit; exposing the RFID tag chips to microwave energy, wherein the RFID tag chips send a plurality of wireless signals after a wireless power conversion; receiving the wireless signals and calculating a power level thereof; and comparing the power level to a predetermined power level to obtain the wafer yield. | 04-02-2009 |
Ming-Kun Chen, Kaohsiung TW
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20110278739 | Semiconductor Package - The present invention relates to a semiconductor package. The semiconductor package includes a substrate, a first chip and an interposer. The first chip is mechanically and electrically connected to the substrate. Some signal pads of the interposer are capacitively coupled to some signal pads of the first chip, so as to provide proximity communication between the first chip and the interposer. Whereby, the capacitively coupled signal pads can be made in fine pitch, and therefore the size of the semiconductor package is reduced and the density of the signal pads is increased. | 11-17-2011 |
20110291690 | Apparatus and Method for Testing Non-Contact Pads of a Semiconductor Device to be Tested - The present invention relates to an apparatus and a method for testing non-contact pads of a semiconductor device to be tested. The apparatus includes an insulating body, at least one testing module and a plurality of probes. The insulating body includes an accommodating cavity, a lower opening and at least one side opening. The side opening communicates with the accommodating cavity and the lower opening. The testing module is disposed in the side opening, and each testing module includes a circuit board and an active chip. The active chip is disposed on to and electrically connected to the circuit board. The active chip has a plurality of testing pads exposed to the accommodating cavity. The probes are disposed in the lower opening. Whereby, the non-contact pads of the semiconductor device to be tested face but not in physically contact with the testing pads of the active chip, so as to test the proximity communication between the non-contact pads of the semiconductor device and the testing pads of the active chip. | 12-01-2011 |
20110298139 | Semiconductor Package - The present invention relates to a semiconductor package. The semiconductor package includes a substrate, a first chip and a second chip. The substrate has a first surface, a second surface and at least one through hole. The first chip is disposed adjacent to the first surface of the substrate. The first chip includes a first active surface and a plurality of first signal pads. Part of the first active surface is exposed to the through hole. The position of the first signal pads corresponds to the through hole. The second chip is disposed adjacent to the second surface. The second chip includes a second active surface and a plurality of second signal pads. Part of the second active surface is exposed to the through hole. The position of the second signal pads corresponds to the through hole, and the second signal pads are capacitively coupled to the first signal pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the strength of the first chip and the second chip is increased after being mounted to the substrate, so the yield of the semiconductor package is increased. | 12-08-2011 |
20110309516 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a first chip and a second chip. The first chip comprises a first active surface, at least one first non-top metal layer and a plurality of first signal coupling pads. The first non-top metal layer is disposed adjacent to and spaced apart from the first active surface by a second distance. The first signal coupling pads are disposed on the first non-top metal layer. The second chip is electrically connected to the first chip. The second chip comprises a second active surface, at least one second non-top metal layer and a plurality of third signal coupling pads. The second active surface faces the first active surface of the first chip. The second non-top metal layer is disposed adjacent to and spaced apart from the second active surface by a fourth distance. The third signal coupling pads are disposed on the second non-top metal layer and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the gap variation between the first signal coupling pads of the first chip and the third signal coupling pads of the second chip is under stringent control of the second distance and the fourth distance. Therefore, the mass-production yield of the semiconductor package is increased. | 12-22-2011 |
20120091575 | Semiconductor Package And Method For Making The Same - The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, at least one first chip, a dielectric layer and at least one second chip. The first chip is attached and electrically connected to the substrate. The first chip includes a first active surface and a plurality of first signal coupling pads. The first signal coupling pads are disposed adjacent to the first active surface. The dielectric layer is disposed on the first active surface. The second chip is attached and electrically connected to the substrate by metal bumps. The second chip includes a second active surface and a plurality of second signal coupling pads. The second active surface contacts the dielectric layer. The second signal coupling pads are disposed adjacent to the second active surface, and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip. Whereby, the gap between the first signal coupling pads of the first chip and the second signal coupling pads of the second chip is controlled by the thickness of the dielectric layer. Therefore, the mass-production yield of the semiconductor package is increased. | 04-19-2012 |
Min Sheng Chen, Kaohsiung TW
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20120038264 | Novel Carbazole Derivatives and Organic Light-Emitting Diode Device Using the Same - The present invention relates to novel carbazole derivatives and an organic light-emitting diode device using the same. These carbazole derivatives can simultaneously or singly be used as a hole transporting layer, a host or guest of an emitting layer or an electron transporting layer of an organic light-emitting diode device. | 02-16-2012 |
20140175400 | Novel Carbazole Derivatives and Organic Light-Emitting Diode Device Using the Same - The present invention relates to novel carbazole derivatives and an organic light-emitting diode device using the same. These carbazole derivatives can simultaneously or singly be used as a hole transporting layer, a host or guest of an emitting layer or an electron transporting layer of an organic light-emitting diode device. | 06-26-2014 |
Pei-Chun Chen, Kaohsiung TW
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20100230759 | Silicon Chip Having Through Via and Method for Making the Same - The present invention relates to a silicon chip having a through via and a method for making the same. The silicon chip includes a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. Therefore, a lower resolution process can be used, which results in low manufacturing cost and simple manufacturing process. | 09-16-2010 |
20130032889 | Silicon Chip Having Through Via and Method for Making the Same - The present invention relates to a silicon chip including a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit. | 02-07-2013 |
Pei-Hsin Chen, Kaohsiung TW
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20100086743 | COMPOSITE OPTICAL FILM - The present invention relates to a composite optical film, which comprises a substrate having diffusion micro-structures and a structured surface on one side of the substrate wherein said composite optical film has an internal diffusion haze of no less than 5% as measured according to JIS K7136 standard method. The composite optical film of the present invention has both light-diffusion and light-converging properties. The composite optical film of the present invention, when utilized in a liquid crystal display (LCD), can not only effectively enhance the luminance of the LCD panel but also avoid light dispersion and Moiré phenomena that may occur when said composite optical film is stacked with other material films. | 04-08-2010 |
20110058257 | OPTICAL ELEMENT - The present invention provides an optical element, which comprises: | 03-10-2011 |
20110096402 | OPTICAL FILM COMPOSITE - The present invention relates to an optical film composite, which comprises a brightness enhancement element and a light diffusion element, wherein the light diffusion element comprises a substrate with a light diffusion layer on at least one side thereof, wherein the light diffusion element has a haze of no less than 98% as measured according to JIS K7136 standard method. | 04-28-2011 |
Po-Zen Chen, Kaohsiung TW
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20080227288 | Dual damascene process - A dual damascene process. A first photoresist layer with a first opening corresponding to a trench pattern is formed on a dielectric layer. A second photoresist layer with a second opening corresponding to a via pattern smaller then the trench pattern is formed on the first photoresist layer and extends to a portion of the dielectric layer. The second photoresist layer has a material character different from the first photoresist layer. A via etching process using the second photoresist as a mask is performed to form a via hole passing through the dielectric layer. A photoresist ashing process is performed to remove the second photoresist layer. A trench etching process using the first photoresist layer as a mask is performed to form a trench in the upper portion of the dielectric layer. The via etching process, the photoresist ashing process and the trench etching process are performed as a continuous process in one chamber. | 09-18-2008 |
Sheng-Hua Chen, Kaohsiung TW
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20080231336 | SCAN FLIP-FLOP CIRCUIT WITH EXTRA HOLD TIME MARGIN - The present invention is a scan flip-flop circuit with extra hold time margin. The scan flip-flop circuit includes a multiplexer, a sense amplifier and a latch. The latch includes a generation unit for generating an output signal in response to a first signal and a second signal outputted from the sense amplifier, and a storage unit receives the second signal and the output signal and maintains the output signal of the latch when the first signal and the second signal are non-activated. | 09-25-2008 |
20090189665 | SCHMITT-TRIGGER-BASED LEVEL DETECTION CIRCUIT - A Schmitt trigger includes A first PMOS transistors having the drains and sources thereof serially connected and coupled between a voltage source and an output end, and having gates thereof coupled to an input end; B first NMOS transistors having the drains and sources thereof serially connected and coupled between the output end and ground, and having gates thereof coupled to the input end; C second PMOS transistors, each being coupled between ground and a node between the drain and the source of the first PMOS transistors and having the gate thereof coupled to the output end; and D second NMOS transistors, each being coupled between the voltage source and a node between the drain and the source of the first NMOS transistors and having the gate thereof coupled to the output end. A is greater than 2 and C, and B is greater than 2 and D. | 07-30-2009 |
20090189670 | LEVEL SHIFTER WITH REDUCED POWER CONSUMPTION AND LOW PROPAGATION DELAY - A level shifter includes a Not gate coupled to a signal input and operable between a first high level and a low level; a first PMOS transistor coupled to a second voltage source and a control end; a first NMOS transistor coupled to the first PMOS transistor, a Not-gate output end and a reference voltage; and a control circuit coupled to the signal input, the Not-gate output end and the second voltage source. When the signal input and the Not-gate output end are at the first high level and the low level, respectively, the first PMOS transistor is turned on so that the signal output is at a second high level; and when the signal input and the Not-gate output end are switched contrarily, the first PMOS transistor is turned off and the signal output is at the low level. | 07-30-2009 |
Shih-Ching Chen, Kaohsiung TW
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20120068142 | RESISTANCE RANDOM ACCESS MEMORY ELEMENT AND METHOD FOR MAKING THE SAME - A resistance random access memory element includes a first electrode, an insulating layer, a diffusing metal layer, and a second electrode superimposed in sequence. The insulating layer includes a plurality of pointed electrodes. A method for making a resistance random access memory element includes growing and forming an insulating layer on a surface of a first electrode. A diffusing metal layer is formed on a surface of the insulating layer. A second electrode is mounted on a surface of the diffusing metal layer. A negative pole and a positive pole of a driving voltage are connected with the first and second electrodes, respectively. The diffusing metal in the diffusing metal layer is oxidized into metal ions by the driving voltage. The metal ions are driven into the insulating layer and form a plurality of pointed electrodes after reduction. | 03-22-2012 |
Shih-Han Chen, Kaohsiung TW
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20110287121 | MULTI-ROD MECHANISM FOR OPENING AND CLOSING MOLDS - A multi-rod mechanism for opening and closing molds is provided and includes a single cam, a first side connection rod assembly located on a first side of the cam, a first mold actuated by the first side connection rod assembly, a linkage connection rod, a second side connection rod assembly located on a second side of the cam and actuated by the linkage connection rod, and a second mold actuated by the second side connection rod assembly. The multi-rod mechanism only uses the single cam to simultaneously actuate the first and second molds, so that the structure of the multi-rod mechanism can be simplified, while the vibration, loading, noise and abrasion of components during operation can be relatively reduced. | 11-24-2011 |
20110287130 | MULTI-ROD STRUCTURE FOR OPENING AND CLOSING MOLDS - A multi-rod structure for opening and closing molds is provided and includes a single cam, a first side connection rod assembly located on a first side of the cam and having a first side triple connection rod, a first mold actuated by the first side triple connection rod, a linkage connection rod, a second side connection rod assembly located on a second side of the cam and having a second side triple connection rod actuated by the linkage connection rod, and a second mold actuated by the second side triple connection rod. The multi-rod structure only uses the single cam to simultaneously actuate the first and second molds, so that the structure can be simplified, while the vibration, loading, noise and abrasion of components during operation can be relatively reduced. | 11-24-2011 |
Shih-Jung Chen, Kaohsiung TW
Patent application number | Description | Published |
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20110058257 | OPTICAL ELEMENT - The present invention provides an optical element, which comprises: | 03-10-2011 |
20110096402 | OPTICAL FILM COMPOSITE - The present invention relates to an optical film composite, which comprises a brightness enhancement element and a light diffusion element, wherein the light diffusion element comprises a substrate with a light diffusion layer on at least one side thereof, wherein the light diffusion element has a haze of no less than 98% as measured according to JIS K7136 standard method. | 04-28-2011 |
Shih-Kuang Chen, Kaohsiung TW
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20090102066 | Chip package structure and method of manufacturing the same - A chip package structure and a method of manufacturing the same are provided. The chip package structure includes a package portion and a plurality of external conductors. The package portion includes a distribution layer, a chip, a plurality internal conductors and a sealant. The distribution layer has a first surface and a second surface, and the chip is disposed on the first surface. Each internal conductor has a first terminal and a second terminal. The first terminal is disposed on the first surface. The sealant is disposed on the first surface for covering the chip and partly encapsulating the internal conductors, so that the first terminal and the second terminal of each internal conductor are exposed from the sealant. The external conductors disposed on the second surface of the distribution layer of the package portion are electrically connected to the internal conductors. | 04-23-2009 |
Shing-Lung Chen, Kaohsiung TW
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20090094017 | Multilingual Translation Database System and An Establishing Method Therefor - A method for building a multilingual translation database system includes the steps of: providing a plurality of multilingual sentence pairs or multilingual sentence-fragment pairs in a translation database, each of the multilingual sentence pairs or the multilingual sentence-fragment pairs formed with a source language and a target language; selecting repeated sentence structures or repeated sentence fragments from the multilingual sentence pairs or the multilingual sentence-fragment pairs; and defining or qualifying at least one repeated key sentence or key sentence fragment of the repeated sentence structures or the repeated key sentence-fragment structures with a predetermined degree of repeat frequency. | 04-09-2009 |
20090234634 | Method for Automatically Modifying A Machine Translation and A System Therefor - A method for automatically modifying a machine translation includes the steps of: providing a source language; generating a target machine translation language according to the source language by means of machine translation; defining at least one of error types of the target machine translation language; designating at least one of correction modes according to the defined error type; generating a revised target language by executing the designated correction mode. A machine-translation-modifying system of a preferred embodiment includes a translation-editing database and a relationship model provided therein. Each of the relationship models is formed with at least one first language structure (source language), at least one second language structure of machine translation (target language), at least one error type, at least one correct second language structure and at least one correction mode. | 09-17-2009 |
20110014594 | Adaptive Foreign-Language-Learning Conversation System Having a Dynamically Adjustable Function - An adaptive foreign-language-learning conversation system includes conversation-graded sets, conversation topic units provided in the conversation-graded sets, and conversation modules provided in the conversation topic units and including predetermined conversation sentences, conversation indexes, and conversation routes. The conversation sentences define conversation simulation files and the conversation module is used to generate the conversation sentence and to receive and identify a user's response sentence. A conversation-evaluating unit is provided in the conversation-graded set to connect with output ends of the conversation topic units, and is used to generate an evaluation result. The system is operated to upgrade or downgrade levels of the conversation-graded sets, or to maintain the same level of the conversation-graded sets according to the evaluation result. | 01-20-2011 |
Shinn-Horng Chen, Kaohsiung TW
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20100168444 | DIINDENOTHIOPHENE DERIVATIVES AND USE THEREOF - A diindenothiophene derivative of the following formula (1) is disclosed: | 07-01-2010 |
20100282313 | DYE-SENSITIZED SOLAR CELL USING COMPOSITE SEMICONDUCTOR MATERIAL - The invention relates to a dye-sensitized solar cell using composite semiconductor materials, said composite semiconductor materials comprising semiconductor material particles and inorganic particulates coated on the surfaces of the semiconductor material particles, wherein the composite semiconductor materials have a surface area in the range from about 15 to about 80 m | 11-11-2010 |
20100295592 | AUTOMATIC HOLD TIME FIXING CIRCUIT UNIT - An automatic hold time fixing circuit unit includes a first switch having first and second ends connected to data input and output ports. An input end of a memory element is connected to the second end of the first switch. A second switch includes a first end connected to an output end of the memory element and a second end connected to the data output port. A control circuit includes first and second output terminals and first and second input terminals. The first and second output terminals are connected to control ends of the first and second switches. The first and second input terminals allow input of two clocks to the control circuit for controlling connection or disconnection of the first and second switches. The data stored in the memory element can be utilized to fix a hold time of the data, so that correct data can be obtained at the data output port. | 11-25-2010 |
20100308254 | ELECTROLYTE COMPOSITION - The invention relates to an electrolyte composition, comprising a polyether polymer, a polyethylene oxide, and a redox pair and optionally nano-particles. | 12-09-2010 |
20120193611 | CURABLE MATERIAL AND ITS APPLICATION - A curable material is provided. The curable material has the structure of formula I or formula II: | 08-02-2012 |
20130010403 | ELECTROLYTIC MATERIAL FORMULATION, ELECTROLYTIC MATERIAL COMPOSITION FORMED THEREFROM AND USE THEREOF - An electrolytic material formulation is provided, which comprises: (a1) a conductive compound, (b1) an oxidant and (c1) a polymerizable component. An electrolytic material composition obtained from the electrolytic material formulation through polymerization is also provided. The electrolytic material composition is applicable to a solid capacitor. Compared to a conventional liquid electrolytic capacitor, the solid electrolyte capacitor according to the present invention has advantages of long life, high voltage resistance, high capacitance, and no occurrence of capacitor rupture, and is especially applicable to electronic products that require high temperature resistance and high frequency resistance. | 01-10-2013 |
20130170103 | ELECTROLYTE MATERIAL FORMULATION, ELECTROLYTE MATERIAL COMPOSITION FORMED THEREFROM AND USE THEREOF - The present invention provides an electrolyte material formulation comprising: | 07-04-2013 |
20140036415 | CONDUCTIVE POLYMER COMPOSITE AND PREPARATION AND USE THEREOF - The invention pertains to a conductive polymer composite comprising: | 02-06-2014 |
20140340820 | CONDUCTIVE MATERIAL FORMULATION AND USE THEREOF - The invention pertains to a conductive material formulation comprising: | 11-20-2014 |
Sung-Lin Chen, Kaohsiung TW
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20090231141 | RFID TAG USING MONOPOLE ANTENNA - A radio frequency identification (RFID) tag using a monopole antenna is provided, in which an antenna structure is disposed on a metal plate, two ends of an RFID chip are electrically connected to the antenna structure, and the antenna structure and the RFID chip form a loop structure. The RFID tag can be disposed on a surface of an object to be measured, or disposed in an inner accommodation space of the object to be measured, so it is widely used in various applications. Additionally, the RFID tag is easily manufactured, so the production cost can be reduced. Furthermore, the RFID tag has a larger readable distance, and an electromagnetic wave emitting direction of the RFID tag is adjustable according to different included angles between the metal plate and the antenna structure, thereby causing signals to be read easily and identification ability to improve, two desirable effects. | 09-17-2009 |
20110290891 | RFID TAG HAVING CAPACITIVE LOAD - The present invention relates to an RFID tag having capacitive load, including: an antenna unit, a capacitive load and an RFID device. The antenna unit includes two metal sheets and a conductive substrate, and the metal sheets are disposed at a corresponding position above the conductive substrate and electrically connected to the conductive substrate. The capacitive load is electrically connected to the metal sheets. The RFID device feeds the antenna unit by electrically connecting to the metal sheets or coupling. This dramatically decreases the operating frequency, so the imaginary part of impedance is higher with the same size of the antenna unit, thereby reducing the size of the RFID tag. As a result, the weight is reduced, the manufacture process is simplified and the subsequent structure can be easily adjusted. | 12-01-2011 |
20120175491 | RFID TAG HOLDER - The present invention relates to an RFID tag holder, which comprises an RFID tag carrier used to carry an RFID tag, and a base having a circular surface, a holding portion and at least one magnetic component disposed therein. The shape of the circular surface matches that of the disposing hole, the magnetic component is used to make the disposing hole magnetically attachable to combine the base with the disposing hole, and two clip arms of a holding unit grip the holding portion and hold the RFID tag carrier after passing through two through holes of a metal substrate. The RFID tag holder has the following advantages: fast installation, low cost and reusability; is suitable for disposing holes with any depth and size; reduced interference and improved reading effect; no extra processing cost; dust-proof, water-proof and oil-resistant; and better composability, extensibility and flexibility. | 07-12-2012 |
20130221106 | RFID TAG HAVING CAPACITIVE LOAD - The present invention relates to an RFID tag having capacitive load, including: an antenna unit, a capacitive load and an RFID device. The antenna unit includes two metal sheets and a conductive substrate, and the metal sheets are disposed at a corresponding position above the conductive substrate and electrically connected to the conductive substrate. The capacitive load is electrically connected to the metal sheets. The RFID device feeds the antenna unit by electrically connecting to the metal sheets or coupling. This dramatically decreases the operating frequency, so the imaginary part of impedance is higher with the same size of the antenna unit, thereby reducing the size of the RFID tag. As a result, the weight is reduced, the manufacture process is simplified and the subsequent structure can be easily adjusted. | 08-29-2013 |
20130228627 | RFID TAG HAVING CAPACITIVE LOAD - The present invention relates to an RFID tag having capacitive load, including: an antenna unit, a capacitive load and an RFID device. The antenna unit includes two metal sheets and a conductive substrate, and the metal sheets are disposed at a corresponding position above the conductive substrate and electrically connected to the conductive substrate. The capacitive load is electrically connected to the metal sheets. The RFID device feeds the antenna unit by electrically connecting to the metal sheets or coupling. This dramatically decreases the operating frequency, so the imaginary part of impedance is higher with the same size of the antenna unit, thereby reducing the size of the RFID tag. As a result, the weight is reduced, the manufacture process is simplified and the subsequent structure can be easily adjusted. | 09-05-2013 |
Tor-Chern Chen, Kaohsiung TW
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20120095206 | METHOD FOR PRODUCING CROSS-LINKED HYALURONIC ACID - A method for producing a cross-linked hyaluronic acid in accordance with the present invention comprises: (a) cross-linking at least one polymer at a temperature, from about 35° C. to about 60° C., for a reaction time of from about 0.1 hour to about 72 hours with a cross-linking agent; and (b) lowering the temperature in step (a) to form about 10° C. to about 30° C. for a reaction time of from about 48 hours to about 28 days to obtain the cross-linked hyaluronic acid, whereby, a cross-linking agent content in a product of the method can be decreased so the product does not require purification. | 04-19-2012 |
Tsai-Hu Chen, Kaohsiung TW
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20100201477 | CHIP RESISTOR AND METHOD FOR MAKING THE SAME - The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance. | 08-12-2010 |
20110089025 | METHOD FOR MANUFACTURING A CHIP RESISTOR HAVING A LOW RESISTANCE - The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down. | 04-21-2011 |
Tsan-Hsien Chen, Kaohsiung TW
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20090096077 | Tenon-and-mortise packaging structure - A tenon-and-mortise packaging structure including a carrier and a chip is provided. The carrier has a top surface and a lower surface opposite to the top surface. The top surface forms at least one tenon projection, and the lower surface forms a mortise slot corresponding to the tenon projection in shape, size, and position, so that two carriers can be stacked on and jointed to each other by coupling the tenon projection to the corresponding mortise slot. The tenon projection and the mortise slot have conduction portions, respectively. When the tenon projection and the mortise slot are engaged with each other, the conduction portions are electrically connected with each other. At least one chip is embedded in the carrier. The chip has an active surface and a back side respectively and electrically connected with the top and the lower surfaces of the carrier. | 04-16-2009 |
Tung-An Chen, Kaohsiung TW
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20110181213 | FAN SYSTEM AND BRAKE CONTROL CIRCUIT THEREOF - A fan system including a motor with a coil, a storage unit, a driver, and a buffer circuit is provided. The coil module has a first connection terminal and a second connection terminal. The storage unit electrically couples with a voltage source, stores electrical energy when the voltage source is available, and releases the stored electrical energy to carry out a brake operation when the voltage source is unavailable. The driver electrically couples with the first and second connection terminals of the coil module to control a direction of an inductor current passing through the coil module. The buffer circuit electrically couples with the coil module. In the brake operation, the buffer circuit operates to form a transient potential between the first and second connection terminals of the coil module and to consume electrical energy of the inductor current, for gradually stopping the motor in a buffering time period. | 07-28-2011 |
20130027192 | MOTOR CONTROL METHOD - A motor control method comprises: inputting a PWM signal into a control unit for the control unit to obtain a direction command and a speed command by an identification rule, and generating a control signal according to the direction and speed commands by the control unit; and generating a driving signal according to the control signal by the driving unit for driving a motor to operate according to the direction and speed commands. | 01-31-2013 |
Tun-Yu Chen, Kaohsiung TW
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20090073632 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor - A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer. | 03-19-2009 |
Wang Chin Chen, Kaohsiung TW
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20100213965 | METHOD AND APPARATUS OF TESTING DIE TO DIE INTERCONNECTION FOR SYSTEM IN PACKAGE - Method and apparatus of testing die to die interconnection for system in package (SiP). For testing a die to die interconnection connected between two pads of two dice, an IO buffer, e.g., a bi-directional IO buffer, in one of the two dice coupled to one of the two pads is arranged. An oscillating feedback is formed between an output port and an input port of the IO buffer, such that a state, e.g., an open state, a short state or a normal state of the die to die interconnection is tested according to a timing characteristic, e.g., a frequency, of a signal of the IO buffer. | 08-26-2010 |
Wei-Hsuan Chen, Kaohsiung TW
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20090109704 | LIGHT GUIDE PLATE - The wedge-shaped light guide plate has a number of reflection structures with gaps therebetween arranged along the light reflection plane. Each reflection structure from a previous gap contains sequentially a slant surface extended away from the light emission surface, a second reflection surface further slanting away from the light emission plane, and a first reflection surface slanting towards the light emission plane to connect to a next gap. The second and first reflection surfaces form a prism element. In one embodiment of the present invention, the reflection structures are more densely arranged as they are more distant from the light source. In an alternative embodiment of the present invention, the reflection structures are arranged uniformly. | 04-30-2009 |
20090116263 | LIGHT GUIDE PLATE WITH COMPENSATED EMISSION LIGHT FIELD - A light guide plate includes a light incidence surface, a light reflection surface, and a light emission surface. The light reflection surface forms a plurality of light-guiding structures extending in a direction substantially parallel to a light source. The light reflection surface has an edge margin section adjacent to the light incidence surface and having opposite end zones each containing auxiliary light-guiding structures that extend in a direction substantially perpendicular to the light source and has an irregular V-shaped cross-section defined by a long inclined side, which faces endwise, and a short inclined side. The auxiliary light-guiding structures are distributed from a densest condition at each end portion toward a sparsest condition at a middle portion of the edge margin section. The long side helps to redirect a greater amount of light to a desired light emission direction thereby enhancing uniformity of light emission of the light guide plate. | 05-07-2009 |
20090129120 | LIGHT GUIDE PLATE WITH COMPENSATED EMISSION LIGHT FIELD - A light guide plate includes a light incidence surface, a light reflection surface, and a light emission surface. The light emission surface forms a plurality of light-guiding structures, which are extended in a direction substantially perpendicular to a lengthwise direction of a light source. The light-guiding structures have a substantially V-shaped cross-section and, among the light-guiding structures, those arranged in opposite endwise zones of the light emission surface in the lengthwise direction have an irregular V-shaped cross-section defined by a long inclined side, which faces endwise, and a short inclined side. The long and short sides respectively form first and second inclined angles with respect to the light emission surface and the first included angle is smaller than the second included angle and the first inclined angle gets smaller with the associated light-guiding structure located closer to the lengthwise end. | 05-21-2009 |
20090161386 | OPTICAL FILM AND BACKLIGHT MODULE USING SAME - An optical film has at least one surface forming a dense and alternate arrangement of light condensation structures. The light condensation structures have a pyramid configuration having a major axis and a minor axis. Each light condensation structure forms four differently oriented light emission faces, so that the light condensation structure simultaneously condenses lights that are in vertical direction and horizontal direction with respect to the optical film and then emits the condensed lights. In this way, when the optical film is applied to a backlight module, the number of the optical film required by the backlight module to realize desired condensation of light can be reduced to thereby lower the manufacturing costs of the backlight module. | 06-25-2009 |
20140133175 | FLAT ILLUMINATION DEVICE - A flat illumination device is provided, and includes a frame, a light guide plate, and at least one light source. The frame includes an inner wall, wherein the inner wall has a reflective surface. The light guide plate is disposed in the frame, and has a first surface, a second surface opposite to the first surface, and at least one light incident surface adjoining the first and second surfaces. The first surface faces the reflective surface, and there is a distance between the first surface and the reflective surface. At least one pattern formed from mesh points or microstructures is disposed on at least one of the first surface and the second surface. The light source is disposed in the frame, and is adjacent to the light incident surface for providing light to the light guide plate. | 05-15-2014 |
20140177274 | LIGHT GUIDE ELEMENT AND LIGHT SOURCE DEVICE USING THE LIGHT GUIDE ELEMENT - A light guide element and a light source device using the same are provided. The light guide element has a main body. The side surface is located between the bottom surface and the light-emitting surface. The bottom surface is opposite to the light-emitting surface. The main body has a hollow portion with a cone shape. The cone-shaped hollow portion has a bottom portion and a top portion. The bottom portion is located on the bottom surface of the main body, and has a first hollow cross section area. The top portion is opposite to the bottom surface, and has a second cross section area smaller than the first cross section area. The light source device includes the light guide element and a light emitting diode (LED). The LED is used to emit light into the cone-shape hollow portion through the bottom portion. | 06-26-2014 |
20150023027 | LIGHT GUIDE ELEMENT AND LAMP FOR CONTROLLING LIGHT BEAM ANGLE - A light guide element and a lamp are described. The light guide element has a length and an angle of total reflection. The light guide element includes a light-incident surface, a light-emitting surface, a first reflecting surface, and a second reflecting surface. The light-incident surface includes a first outer peripheral edge and a first inner peripheral edge. The light-emitting surface includes a second outer peripheral edge and a second inner peripheral edge. The first reflecting surface connects the first outer peripheral edge and the second outer peripheral edge. The second reflecting surface connects the first inner peripheral edge and the second inner peripheral edge. An angle is formed between the first reflecting surface and the second reflecting surface. The angle is smaller than the angle of total reflection, and the length is greater than a predetermined distance divided by tan the angle of total reflection). | 01-22-2015 |
Wen-Jye Chen, Kaohsiung TW
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20110017524 | DUAL-SUBSTRATE CAPACITIVE TOUCH PANEL - A touch panel has a first substrate, a second substrate, a frame adhesive and multiple multi-layer conductive wires. The first substrate has first axis electrode strings and second axis transparent electrodes formed on a surface. The second substrate is disposed opposite to the first substrate and has bridging members and bridging connectors formed on each of the bridging members and connected to the second axis electrodes of the first substrate. The frame adhesive connects the first substrate and the second substrate. The multi-layer conductive wires are electrically connected to the first axis electrode strings and the second axis transparent electrodes and connect to a flexible printed circuit board. With the bridging members and bridging connectors formed on another substrate, a mask process of forming insulating members can be avoided, and a manufacture process is simplified with associated cost reductions. | 01-27-2011 |
Yeh-Feng Chen, Kaohsiung TW
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20120114472 | Fan - A fan comprises a housing having a compartment formed inside, and at least one lateral air inlet and at least one lateral air outlet both penetrating through the inner and outer surfaces of the housing and communicating with the compartment; and a motor mounted inside the compartment of the housing and having a stator and an impeller, with the impeller rotatably coupled to the stator and further containing a hub and a plurality of blades mounted to a top of the hub, with each blade having a first end and a second end in the radial direction of the impeller opposite to each other, with the first end of each blade facing outward, and with the second ends of the plural blades defining an airflow-area. | 05-10-2012 |
20120114511 | Cooling Fan - A cooling fan comprises a housing and a motor. The housing includes a support portion, a cover portion and a lateral wall portion, with the lateral wall portion disposed between the cover portion and the support portion, with the lateral wall portion, support portion and the cover portion defining a compartment, and with the lateral wall portion having at least one lateral air inlet and at least one lateral air outlet penetrating through the lateral wall portion and communicating with the compartment. The motor is mounted inside the compartment of the housing and contains a stator and a impeller, with the impeller rotatably mounting to the stator, and further containing a hub with a top and a plurality of blades, with the top facing the cover portion, with the top and the cover portion delimiting a lateral flow path in the compartment, and with each blade being contained in the lateral flow path. | 05-10-2012 |
Yeh-Long Chen, Kaohsiung TW
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20090298846 | Indolo[3,2-c]quinoline Compounds - Indolo[3,2-c]quinoline compounds of formula (I) shown below. Each variable in this formula is defined herein. These compounds can be used to inhibit both growth of cancer cells and activity of telomerase. | 12-03-2009 |
Yeh-Shun Chen, Kaohsiung TW
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20090073632 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor - A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer. | 03-19-2009 |
20090103787 | Sliding type thin fingerprint sensor package - A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion. | 04-23-2009 |
20100141384 | BOTTLE CAP HAVING ANTI-COUNTERFEIT FUNCTION AND BOTTLE USING THE SAME - A bottle cap having anti-counterfeit function comprises a cap body and an RFID tag. The cap body has a cap portion, a ring neck portion and at least one joint portion, there is an interval between the cap portion and the ring neck portion, and the joint portion crosses through the interval and couples the cap portion and the ring neck portion. The RFID tag is disposed at the cap body and has an antenna and a chip electrically connected with the antenna. The antenna has a first antenna portion, a second antenna portion and a third antenna portion, the first antenna portion and the chip are disposed at the cap portion of the cap body, the second antenna portion is disposed at the ring neck portion of the cap body, and the third antenna portion crosses through the interval and bridge connects the first antenna portion and the second antenna portion. | 06-10-2010 |
Yen-Chun Chen, Kaohsiung TW
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20100300539 | Solar cell structure and manufacturing method thereof - The present invention provides a solar cell structure and the manufacturing method thereof. The solar cell structure includes an active layer having a plurality of first recesses near the edges thereof; and a transparent conductive layer forming on the active layer and having a plurality of second recesses near the edges thereof connecting to the plurality of first recesses. | 12-02-2010 |
Yen-Ming Chen, Kaohsiung TW
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20120068568 | Axial Winding Motor - An axial-winding motor includes a stator and a rotor. The stator has a winding assembly, a first magnetic-conducting plate and a second magnetic-conducting plate. The first and second magnetic-conducting plates are coupled with two ends of the winding assembly in an axial direction of the winding assembly. The first magnetic-conducting plate includes a plurality of first pole pieces on an outer periphery thereof, and the second magnetic-conducting plate includes a plurality of second pole pieces on an outer periphery thereof. The rotor is rotatably coupled with the stator and has a plurality of magnetic pole faces facing the stator. One of the first pole pieces is at least partially overlapped with adjacent one of the second pole pieces in an axial direction of the stator. | 03-22-2012 |
Yi-Liang Chen, Kaohsiung TW
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20100208478 | AUTOMOTIVE HEADLIGHT SYSTEM AND ADAPTIVE AUTOMOTIVE HEADLIGHT SYSTEM WITH INSTANT CONTROL AND COMPENSATION - An automotive headlight system and an adaptive automotive headlight system with instant compensation control are provided. The automotive headlight system includes a light source, a total internal reflection prism, a digital reflecting element, a freeform lens, and a multi-curve-reflector. The total internal reflection prism is used for redirecting and reflecting light beams from the light source. The digital reflecting element is controlled to switch to a plurality of states with regard to reflected light beams from the total internal reflection prism then compensation patterns will be promptly given during different states. The freeform lens is used for controlling directions of the light beams from the digital reflecting element. The multi-curve-reflector has a plurality of radii of curvature for reflecting the light beams from the freeform lens. As the automotive headlight system merely uses optical refractive and reflecting elements so that the number of components and cost is greatly reduced as compared with the prior art. Furthermore, the most important is that this invention proposes a new design and instant and personalized compensation solution to reduce more driver's risks. | 08-19-2010 |
Ying-Li Chen, Kaohsiung TW
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20100240000 | METHOD OF MAKING A SURGICAL TEMPLATE USED FOR A COMPUTER-GUIDED DENTAL IMPLANT SURGERY - A method of making a surgical template used for a computer-guided dental implant surgery includes the steps of: establishing implant planning data of a patient's jaw, producing a digital plaster model of the patient's jaw, allowing the digital plaster model to have the implant planning data, integrating the digital plaster model with the implant planning data to obtain a digital machining data, holding and machining a modeling block at a machining position according to the digital machining data to form a solid jaw model corresponding to the patient's jaw and having teeth, gums, and at least one implant-position indicating structure, mounting a positioning member at the implant-position indicating structure, and producing a negative template body from an assembly of the solid jaw model and the positioning member with a thermoplastic dental material by a molding process or a vacuum forming process. | 09-23-2010 |
Yuk-Kwan Chen, Kaohsiung TW
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20090262888 | AIMING METHOD AND DEVICE FOR AN EXTRAORAL RADIOGRAPHIC TECHNIQUE - An aiming method and a device for an extraoral radiographic technique using a pair of length-adjustable indicator rods. Install a circular locator on each to the indicator rod. While keeping at an appropriate angle, hold the two locators closely beside the cheeks of the patient, and then along the hypothetical axis, secure a radioactive-rays emission head onto one of the circular locator. Following this hypothetical axis to the other locator, and secure a film or a sensor. Aim the radioactive-rays emission head along the hypothetical axis while taking the radiographic shots. | 10-22-2009 |
Yung-Jen Chen, Kaohsiung TW
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20090073632 | Package, packaging method and substrate thereof for sliding type thin fingerprint sensor - A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer. | 03-19-2009 |
20090103787 | Sliding type thin fingerprint sensor package - A sliding type thin fingerprint sensor package defined as a sliding region and a conductive portion comprises a substrate, a fingerprint sensor chip and a metal plate. The fingerprint sensor chip is electrically connected with the substrate and a sensing region of the fingerprint sensor chip is exposed by a window of the dielectric layer. The metal plate is electrically connected with the substrate and a sliding surface of the metal plate is close to the sensing region of the fingerprint sensor chip. The sensing region and the sliding surface are exposed by the window of the dielectric layer. The sensing region of the fingerprint sensor chip and the sliding surface of the metal plate are located at the sliding region, and a plurality of external contact pads on a circuit layer of the substrate are located at the conductive portion. | 04-23-2009 |
20100141384 | BOTTLE CAP HAVING ANTI-COUNTERFEIT FUNCTION AND BOTTLE USING THE SAME - A bottle cap having anti-counterfeit function comprises a cap body and an RFID tag. The cap body has a cap portion, a ring neck portion and at least one joint portion, there is an interval between the cap portion and the ring neck portion, and the joint portion crosses through the interval and couples the cap portion and the ring neck portion. The RFID tag is disposed at the cap body and has an antenna and a chip electrically connected with the antenna. The antenna has a first antenna portion, a second antenna portion and a third antenna portion, the first antenna portion and the chip are disposed at the cap portion of the cap body, the second antenna portion is disposed at the ring neck portion of the cap body, and the third antenna portion crosses through the interval and bridge connects the first antenna portion and the second antenna portion. | 06-10-2010 |
Yun-Yen Chen, Kaohsiung TW
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20110178676 | TIRE AND DETECTION-ALARM MECHANISM THEREOF - A detection-alarm mechanism is provided. The detection-alarm mechanism for a tire includes a sensor, an electronic processing unit, a post-processing unit and a display unit. The sensor includes a substrate disposed in the tire and at least one photoelectronic element fixed to the substrate. If the tire is cracked, light passes through the cracks and reaches the photoelectronic elements to generate signals. The electronic processing unit receives signals from the photoelectronic elements to generate wear information. The post-processing unit is disposed in a vehicle on which the tire is installed and receives wear information from the electronic processing unit. The display unit is disposed in the vehicle for presenting the wear information. | 07-21-2011 |
Zong-Ying Chen, Kaohsiung TW
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20090105514 | Extractive distillation processes using water-soluble extractive solvents - Extractive distillation processes whereby water-soluble extractive distillation (ED) solvents are regenerated and recovered employ improved operations of the extractive distillation column (EDC) so that polar hydrocarbons are recovered and purified from mixtures containing polar and less polar hydrocarbons and measurable amounts of hydrocarbons that are heavier than intended feedstock and/or polymers that are generated in the ED process. The improved process can effectively remove and recover the heavy hydrocarbons and/or remove polymer contaminants from the solvent in a closed solvent circulating loop through mild operating conditions with no additional process energy being expended. With the improved process, the overhead reflux of the EDC may be eliminated to further reduce energy consumption and to enhance the loading and performance within the upper portion of the EDC, especially when two liquid phases exists therein. | 04-23-2009 |