Patent application number | Description | Published |
20110031513 | WATERPROOF SMD LED MODULE AND METHOD OF MANUFACTURING THE SAME - A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided. | 02-10-2011 |
20110181182 | TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF - A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field. | 07-28-2011 |
20110266570 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together. | 11-03-2011 |
20110278601 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip. | 11-17-2011 |
20110291135 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip. | 12-01-2011 |
20120043576 | LED PACKAGE STRUCTURE - An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other. | 02-23-2012 |
20120280639 | PLANAR LIGHTING MODULE - A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service. | 11-08-2012 |
20130161673 | LIGHT EMITTING DIODE PACKAGE HAVING FLUORESCENT FILM DIRECTLY COATED ON LIGHT EMITTING DIODE DIE AND METHOD FOR MANUFACTURING THE SAME - A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die. | 06-27-2013 |
20130178003 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages. | 07-11-2013 |
20130217159 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages. | 08-22-2013 |
20130217160 | METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM - A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted. | 08-22-2013 |
20130244355 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer. | 09-19-2013 |
20130330854 | METIOD OF MAKING LED WITH BAT-WING EMITTING FIELD LENS - A method for manufacturing an LED (light emitting diode) with bat-wing emitting field lens is disclosed. Firstly, a substrate is provided. The substrate includes a plurality of depressions each corresponding to a pair of electrodes. A plurality of LED chips are fastened in the depressions and electrically connected to the pairs of electrodes. A plurality of unsolidified lenses are formed in the depressions to cover the LED chips. A pressing mold including a plurality of protrusions is provided. The pressing mold is moved towards the substrate to force the protrusions of the pressing mold to insert into the unsolidified lenses. The lenses are solidified and the pressing mold is removed and concavities are defined at the lenses. The substrate is cut to obtain a plurality of separated and finished LEDs. | 12-12-2013 |
20130337594 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; | 12-19-2013 |
20140049955 | LED ILLUMINATION DEVICE - An exemplary LED illumination device includes a lighting member and a supporting member. The lighting member includes a base plate allowing light passing therethrough and LEDs mounted on a top surface of the base plate. The supporting member includes a bottom wall allowing light passing therethrough and side walls extending upwardly from edges of the bottom wall. The side walls and the bottom plate cooperatively define a receiving chamber therebetween to receive the base plate therein. Light generated by the LEDs radiates upwardly, downwardly and laterally from the LED illumination device. | 02-20-2014 |
20140061697 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140061698 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140071675 | LED LAMP HAVING A LARGE ILLUMINATION ANGLE - An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range. | 03-13-2014 |
20140084312 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package. | 03-27-2014 |
20140084313 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate. | 03-27-2014 |
20140153236 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a connecting body having a first end and a second end opposite to the first end, a mounting base located at a second end of the connecting body and a plurality of LED units mounted on the mounting base. The mounting base has a top face distant from the second end of the connecting body and an inclined lateral face located between the top face of the mounting base and the second end of the connecting body. The inclined lateral face of the mounting base extends downwardly and inwardly from a periphery of the top face of the mounting base towards the second end of the connecting body. The plurality of LED units mounted on the first top face and the inclined lateral face of the mounting base, respectively. | 06-05-2014 |
20140175483 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion. The second electrode includes an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion. The LED chip is received in reflecting cup. The first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup. | 06-26-2014 |
20140175484 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup. | 06-26-2014 |
20140291713 | FLIP-CHIP LIGHT EMITTING DIODE PACKAGE WITH MOISTURE BARRIER LAYER - An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate. | 10-02-2014 |
20140291720 | LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME - An LED device includes a substrate having a top surface and a bottom surface. The substrate defines a through hole at a center thereof. The LED device also includes an electrode board. The electrode board defines a concave portion at a center thereof, and a convex portion connected to and surrounding two sides of the concave portion. The concave portion includes a first electrode and a second electrode isolated from each other, and is located in the through hole of the substrate. A bottommost surface of the concave portion is substantially coplanar with the bottom surface of the substrate, and a top surface of the convex portion is substantially coplanar with the top surface of the substrate. An LED chip is arranged on the concave portion, and is electrically connected to the first electrode and the second electrode. A method for manufacturing plural such LED devices is also provided. | 10-02-2014 |
20140306240 | LIGHT EMITTING DIODE PACKAGE - An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented. | 10-16-2014 |
20140319564 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUCFACTURING SAME - A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided. | 10-30-2014 |
20150036321 | OPTICAL LENS AND BACKLIGHT MODULE INCORPORATING THE SAME - An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided. | 02-05-2015 |
20150054009 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein. | 02-26-2015 |
20150060912 | LIGHT EMITTING DIODE PACKAGE HAVING ZENER DIODE COVERED BY REFLECTIVE MATERIAL - An exemplary light emitting diode package includes a substrate comprising a first electrode, a second electrode and an insulation layer electrically insulating the first electrode from the second electrode; a light emitting diode is located on the substrate, and electrically connects with the first and second electrodes; a zener diode is located on the substrate, and electrically connects with the first and second electrodes; and a reflecting layer is formed on the zener diode to reflect light emitted from the light emitting diode and toward the zener diode. The disclosure also relates to a method for manufacturing the light emitting diode package. | 03-05-2015 |
20150069441 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode. | 03-12-2015 |
Patent application number | Description | Published |
20120187436 | LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) device includes a substrate, a supporting member, an electrode layer, an LED chip and an encapsulant. The substrate has a first surface and a second surface. The substrate defines a hole extending through the first surface and the second surface. The supporting member is attached to the second surface of the substrate and covers the hole. The supporting member and the substrate cooperatively define a cavity. The electrode layer is arranged on the first surface of the substrate and an inner surface of the cavity. The encapsulant is arranged on the electrode layer and covers the LED chip. | 07-26-2012 |
20120211786 | LED PACKAGE STRUCTURE WITH A WIDE OPTICAL FIELD - An LED package structure with a wide optical field comprises a substrate, an LED chip, and an encapsulation. The substrate has at least two electrodes and a carrier. The carrier has a carrier surface. The carrier surface is higher than a top surface of the substrate and higher than the electrodes. The LED chip is mounted on the carrier surface. The LED chip electrically connects with the electrodes via wires. The encapsulation covers the LED chip. The LED chip has a wide light emitting angle. | 08-23-2012 |
20120235194 | LIGHT EMITTING DIODE PACKAGE - An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame. | 09-20-2012 |
20120244651 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages. | 09-27-2012 |
20120273820 | LED PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate, an LED die, electrodes, a reflective cup, a barrier portion and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The electrodes are formed on the substrate and spaced from each other. The barrier portion is formed on the electrodes and covered by the reflective cup, wherein a bonding force between the barrier portion and the electrodes is larger than that between the reflective cup and the electrodes. The LED die is mounted on one of the electrodes, received in the reflective cup and electrically connected to the electrodes via wire bonding. The disclosure also provides a method for making an LED package. | 11-01-2012 |
20120322179 | METHOD FOR PACKAGING LIGHT EMITTING DIODES - A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer. | 12-20-2012 |
20130001613 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME - A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed. | 01-03-2013 |
20130015479 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAMEAANM LIN; HSIN-CHIANGAACI HukouAACO TWAAGP LIN; HSIN-CHIANG Hukou TWAANM CHEN; PIN-CHUANAACI HukouAACO TWAAGP CHEN; PIN-CHUAN Hukou TW - An LED package includes a base, an LED chip, and an electrode layer. The base has thereon a first electrical connecting layer and a separated second electrical connecting layer. The LED chip is placed on the base and electrically connected with the first electrical connecting layer and the second electrical connecting layer by flip chip bonding. The electrode layer comprises a first electrode and a separated second electrode, and a receiving groove being defined between the first electrode and the second electrode. The base is received in the receiving groove of the electrode layer with the first electrical connecting layer being electrically connected to the first electrode, and the second electrical connecting layer being electrically connected to the second electrode. | 01-17-2013 |
20130017632 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODEAANM CHEN; PIN-CHUANAACI HukouAACO TWAAGP CHEN; PIN-CHUAN Hukou TW - A method for manufacturing LEDs (light emitting diodes) includes steps: providing a substrate; attaching an adhesive layer on the substrate; forming a blocking layer on the adhesive layer, the blocking layer having a plurality of first holes and second holes alternating with and spaced from the first holes; forming a conductive layer including first leads and second leads in the first holes and the second holes; removing the blocking layer; forming a housing layer on the adhesive layer, the housing layer having a plurality of cavities to expose the first leads and second leads; fixing chips on the first leads and electrically connecting the chips with the first and second leads; forming encapsulants in the cavities to seal the chips; and removing the substrate and adhesive layer from the housing layer and the conductive layer. | 01-17-2013 |
20130052764 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element. | 02-28-2013 |
20130161673 | LIGHT EMITTING DIODE PACKAGE HAVING FLUORESCENT FILM DIRECTLY COATED ON LIGHT EMITTING DIODE DIE AND METHOD FOR MANUFACTURING THE SAME - A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die. | 06-27-2013 |
20130164868 | METHOD FOR PACKAGING LIGHT EMITTING DIODE HAVING FLUORESCENT MATERIAL DIRECTLY COATED ON LED DIE THEREOF - A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material. | 06-27-2013 |
20130178003 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages. | 07-11-2013 |
20130217159 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages. | 08-22-2013 |
20130217160 | METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM - A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted. | 08-22-2013 |
20130234184 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package includes a substrate, an LED chip mounted on the substrate. The LED chip has a side surface and an upper surface. A fluorescent layer is evenly distributed over the LED chip. An encapsulant covers the LED chip and the fluorescent layer. A method of manufacturing the LED package is also provided. | 09-12-2013 |
20130277708 | LED - An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. | 10-24-2013 |
20140030828 | METHOD FOR MANUFACTURING LED - An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed. | 01-30-2014 |
20140061697 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140061698 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140071675 | LED LAMP HAVING A LARGE ILLUMINATION ANGLE - An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range. | 03-13-2014 |
20140084312 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package. | 03-27-2014 |
20140084313 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate. | 03-27-2014 |
20140153236 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a connecting body having a first end and a second end opposite to the first end, a mounting base located at a second end of the connecting body and a plurality of LED units mounted on the mounting base. The mounting base has a top face distant from the second end of the connecting body and an inclined lateral face located between the top face of the mounting base and the second end of the connecting body. The inclined lateral face of the mounting base extends downwardly and inwardly from a periphery of the top face of the mounting base towards the second end of the connecting body. The plurality of LED units mounted on the first top face and the inclined lateral face of the mounting base, respectively. | 06-05-2014 |
20140175483 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion. The second electrode includes an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion. The LED chip is received in reflecting cup. The first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup. | 06-26-2014 |
20140175484 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup. | 06-26-2014 |
20140291713 | FLIP-CHIP LIGHT EMITTING DIODE PACKAGE WITH MOISTURE BARRIER LAYER - An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate. | 10-02-2014 |
20140306240 | LIGHT EMITTING DIODE PACKAGE - An exemplary light emitting diode package includes a substrate, a first electrode and a second electrode embedded in the substrate, and a light emitting chip fixed onto the first electrode by first glue. The first electrode has a first barrier member at a periphery of the first glue and below the light emitting chip. The first barrier member obstructs the first glue from spreading toward a side of the first barrier member away from the first glue and the light emitting chip, whereby a contamination by the first glue to an area of the top surface beside the side of the first barrier of the first electrode away from the first glue and the light emitting chip is prevented. | 10-16-2014 |
20140319564 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUCFACTURING SAME - A light emitting diode package for mounting to a printed circuit board by surface mounting technology includes a substrate, first and second electrodes and a light emitting diode. The first electrode and the second electrode each have a first end and a second end. The second end of the first electrode is adjacent to the first end of the second electrode and a distance therebetween is increased along a top-to-bottom direction of the light emitting diode package. The first end of the first electrode extends out of the substrate and forms a tapered structure. The second end of the second electrode extends out of the substrate and forms a tapered structure. The light emitting diode chip is electrically connected with the first and second electrodes. A method for manufacturing the light emitting diode package is also provided. | 10-30-2014 |
20140321127 | LIGHT EMITTING DIODE MODULE FOR DIRECT-TYPE BACKLIGHT MODULE - An LED module for use in a direct-type backlight module includes a printed circuit board, an LED arrange on the printed circuit board and electrically connected to the printed circuit board, and a lens covering the LED and fixed on the printed circuit board. A reflective layer is arranged on the printed circuit board. A semi-transparent surface is recessed and tampered from a top of a column-shaped protrusion at a center of the lens towards the LED. Part of light beams emitted from a center of the LED is refracted and diffused by the semi-transparent surface to an outside, and another part of the light beams emitted from a center of the LED is reflected by the semi-transparent surface to the reflective layer, and then reflected by the reflective layer to the outside. | 10-30-2014 |
20150036321 | OPTICAL LENS AND BACKLIGHT MODULE INCORPORATING THE SAME - An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided. | 02-05-2015 |
20150054009 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME - An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein. | 02-26-2015 |
20150060912 | LIGHT EMITTING DIODE PACKAGE HAVING ZENER DIODE COVERED BY REFLECTIVE MATERIAL - An exemplary light emitting diode package includes a substrate comprising a first electrode, a second electrode and an insulation layer electrically insulating the first electrode from the second electrode; a light emitting diode is located on the substrate, and electrically connects with the first and second electrodes; a zener diode is located on the substrate, and electrically connects with the first and second electrodes; and a reflecting layer is formed on the zener diode to reflect light emitted from the light emitting diode and toward the zener diode. The disclosure also relates to a method for manufacturing the light emitting diode package. | 03-05-2015 |
20150069441 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an LED chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode. | 03-12-2015 |