Patent application number | Description | Published |
20090078958 | Assembly of a heat dissipating base and a lead frame for a light emitting diode packaging device and method for making the same - A light emitting diode packaging device includes: a heat dissipating base; a light emitting dice mounted on the heat dissipating base; a lead frame coupled electrically to the light emitting dice and having a protruding wall defining a confining space for extension of a protruding part of the heat dissipating base therethrough; at least one retaining member provided on one of the protruding part of the heat dissipating base and the protruding wall of the lead frame to retain the lead frame to the heat dissipating base; and a molding material molded on the heat dissipating base and the lead frame. | 03-26-2009 |
20090242915 | Semiconductor light-emitting device - A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant. | 10-01-2009 |
20100072507 | Lead frame, and light emitting diode module having the same - A light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N≧3, and at least one LED die mounted on one of any two neighbor conducting arms. Any two neighbor conducting arms are electrically coupled each other. | 03-25-2010 |
20100072509 | Lead frame assembly, lead frame and insulating housing combination, and led module having the same - A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween. | 03-25-2010 |
20100102348 | Lead frame unit, package structure and light emitting diode device having the same - A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing, and a lead frame unit including two spaced-apart conductive bodies. Each of the conductive bodies has opposite first and second conductive terminals spaced-apart from each other along an axial direction. The first conductive terminals extend into the insulating housing. The second conductive terminals are exposed outwardly of the insulating housing. Each of the conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and a concave-convex structure disposed at the side edges and surrounded by the insulating housing. | 04-29-2010 |
20100213484 | Lead frame assembly, package structure and LED package structure - A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire. | 08-26-2010 |
20130037845 | LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME - A light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N≧3, and at least one LED die mounted on one of any two neighbor conducting arms. Any two neighbor conducting arms are electrically coupled each other. | 02-14-2013 |
20130105835 | LIGHT-EMITTING DIODE DEVICE | 05-02-2013 |
20130270588 | LEAD FRAME ASSEMBLY, LED PACKAGE AND LED LIGHT BAR - A lead frame assembly includes a surrounding frame and a plurality of lead frame sets arranged in a matrix. Each lead frame set includes spaced-apart first and second lead frames and a connecting structure interconnecting one of the lead frame sets to an adjacent lead frame set. Each lead frame set is further connected to the surrounding frame through the connecting structure thereof. A plurality of insulated bars are spacedly formed on a lead frame panel. Each insulated bar covers a corresponding row of the lead frame sets and exposes bottom surfaces of the first and second lead frames. Each insulated bar further covers portions of the surrounding frame that are adjacent to two opposite outermost ones of the lead frame sets. | 10-17-2013 |
20140217446 | LED PACKAGE AND METALLIC FRAME THEREOF - A light emitting diode package includes a metallic frame, and an LED chip disposed on the metallic frame. The metallic frame includes first and second metal plates arranged side by side with a space therebetween, and two support arms extending integrally and respectively from two opposite ends of the second metal plate to a level higher than the second top surface and that further extend toward the first metal plate at a level higher than the first top surface crossing the space. The support arms are not in contact with the first metal plate. An encapsulant encapsulates the metallic frame and the LED chip. At least a region of the encapsulant that covers the LED chip is transparent. | 08-07-2014 |
20140284641 | LED PACKAGES AND MANUFACTURING METHOD THEREOF - A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages. | 09-25-2014 |
20140291706 | LIGHT EMITTING DIODE DEVICE - A light emitting diode (LED) device includes: a substrate having a central portion; an LED chip unit formed on the central portion of the substrate; a circuit pattern having a positive electrode and a negative electrode that are formed on the substrate, each of the positive electrode and the negative electrode including an arc portion and at least one extending portion that extends from the arc portion toward the central portion; a wire unit connecting the LED chip unit to the extending portions; a glass layer disposed on the substrate, covering the arc portions and including an opening unit that is aligned with the central portion of the substrate; a dam structure formed on the glass layer and extending along the arc portions; and an encapsulated body disposed substantially within the dam structure to cover the extending portions, the wire unit and the LED chip unit. | 10-02-2014 |
20150034986 | LED PACKAGE - An LED package includes a chip carrier, an adhesive layer, one high-voltage LED die, and an encapsulating member. The chip carrier defines a receiving space. The adhesive layer is disposed in the receiving space and has a thermal conductivity of larger than or equal to 1 W/mK. The high-voltage LED die is attached to the adhesive layer to be received in the reflective space and has a top surface formed with a trench. The trench of the high-voltage LED die is disposed at an optical center of the receiving space. The encapsulating member encapsulates the high-voltage LED die and includes a plurality of diffusers. The trench is embedded with the encapsulating member and has a width ranging from 1 μm to 10 μm and a depth of less than or equal to 50 μm. | 02-05-2015 |