Chang-Suk
Chang-Suk Cho, Hwaseong-Si KR
Patent application number | Description | Published |
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20150187081 | THREE-DIMENSIONAL MEASUREMENT SYSTEM AND METHOD THEREFOR - A 3D measurement system and method therefor having improved precision can be provided by projecting a pattern using a grid pattern or a chessboard grid pattern and performing interpolation based on a method for measuring differences in illuminance. A 3D measurement system includes a coordinate value calculation unit for calculating 3D coordinate values from pattern image information captured using a predetermined pattern, and a depth value calculation unit for calculating a depth value at a first position from N pieces of illuminance image information captured using lighting devices installed at N different locations. | 07-02-2015 |
Chang-Suk Han, Paju KR
Patent application number | Description | Published |
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20100084749 | Package and fabricating method thereof - A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant. | 04-08-2010 |
Chang-Suk Han, Kyunggi-Do KR
Patent application number | Description | Published |
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20120028459 | MANUFACTURING PROCESS OF CIRCUIT SUBSTRATE - A manufacturing process of a circuit substrate is provided. A conductive structure including a first patterned conductive layer, a first dielectric layer, a second dielectric layer, a first conductive layer, and a second conductive layer is provided. The first dielectric layer and the second dielectric layer are respectively disposed on two opposite surfaces of the first patterned conductive layer. The first conductive layer and the second conductive layer are respectively disposed on the first dielectric layer and the second dielectric layer. The first dielectric layer is between the first patterned conductive layer and the first conductive layer. The second dielectric layer is between the first patterned conductive layer and the second conductive layer. A conductive via is formed at the conductive structure. The first conductive layer and the second conductive layer are patterned to respectively form a second patterned conductive layer and a third patterned conductive layer. | 02-02-2012 |
Chang-Suk Oh, Chungnam KR
Patent application number | Description | Published |
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20090014431 | PLATE, APPARATUS FOR ADJUSTING TEMPERATURE OF SUBSTRATE HAVING THE PLATE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE PLATE - In a plate for adjusting a temperature of a substrate, a body of the plate supports the substrate. A first channel and a second channel are disposed within the body of the plate. The first channel has a first inlet and a first outlet and passes therethrough a first fluid to adjust the temperature of the substrate. The second channel has a second inlet adjacent to the first outlet and a second outlet adjacent to the first inlet and passes therethrough a second fluid to adjust the temperature of the substrate. Further, the first and second channels are disposed side by side. Thus, the temperature of the substrate may be adjusted uniformly as a whole. | 01-15-2009 |