Patent application number | Description | Published |
20090027977 | Low read current architecture for memory - A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured. | 01-29-2009 |
20100073990 | Contemporaneous margin verification and memory access fr memory cells in cross point memory arrays - Circuitry and methods for restoring data values in non-volatile memory are disclosed. An integrated circuit includes a memory access circuit and a sensing circuit configured to sense a data signal during a read operation to at least one two-terminal non-volatile cross-point memory array. Each memory array includes a plurality of two-terminal memory cells. A plurality of the memory arrays can be fabricated over the substrate and vertically stacked on one another. Further, the integrated circuit can include a margin manager circuit configured to manage a read margin for the two-terminal memory cells substantially during the read operation, thereby providing for contemporaneous read and margin determination operations. Stored data read from the two-terminal memory cells may have a value of the stored data restored (e.g., re-written to the same cell or another cell) if the value is not associated with a read margin (e.g., a hard programmed or hard erased state). | 03-25-2010 |
20100157647 | Memory access circuits and layout of the same for cross-point memory arrays - An integrated circuit includes a substrate including active circuitry fabricated on the substrate and a cross-point memory array formed above the substrate. The cross-point memory array can include conductive array lines arranged in different directions, and re-writable memory cells. Further, the integrated circuit can also include a memory access circuit configured to perform data operations on the cross-point memory array. The integrated circuit can include a cross-point memory array interface layer positioned between the substrate and the cross-point array and including conductive paths configured to electrically couple portions of the memory access circuit with a subset of the conductive array lines. At least one layer of cross-point memory arrays can be formed over the substrate. The memory cells can be two-terminal memory cells that store data as a plurality of conductivity profiles (e.g., resistive states) that can be non-destructively determined by applying a read voltage across the terminals. | 06-24-2010 |
20100157670 | High voltage switching circuitry for a cross-point array - Circuitry for generating voltage levels operative to perform data operations on non-volatile re-writeable memory arrays are disclosed. In some embodiments an integrated circuit includes a substrate and a base layer formed on the substrate to include active devices configured to operate within a first voltage range. Further, the integrated circuit can include a cross-point memory array formed above the base layer and including re-writable two-terminal memory cells that are configured to operate, for example, within a second voltage range that is greater than the first voltage range. Conductive array lines in the cross-point memory array are electrically coupled with the active devices in the base layer. The integrated circuit also can include X-line decoders and Y-line decoders that include devices that operate in the first voltage range. The active devices can include other active circuitry such as sense amps for reading data from the memory cells, for example. | 06-24-2010 |
20100195409 | Fuse elemetns based on two-terminal re-writeable non-volatile memory - A margin restore fuse element is described, including a latch configured to store data, a first memory element coupled to the latch and configured to store a first resistive value, a second memory element coupled to the latch and configured to store a second resistive value, a restore circuit coupled to the latch, the first memory element, and the second memory element, the restore circuit being configured to perform a restore data operation to substantially restore the first and second memory elements to the first and second resistive values, respectively. The latch, restore circuit, and other circuitry can be formed FEOL on a substrate (e.g., a semiconductor wafer) as part of a microelectronics fabrication process and the fuse element and memory elements can be formed BEOL over the substrate as part of another microelectronics fabrication process. The fuse and memory elements can be included in a two-terminal non-volatile memory cell. | 08-05-2010 |
20100290294 | Signal margin improvement for read operations in a cross-point memory array - A configuration for biasing conductive array lines in a two-terminal cross-point memory array is disclosed. The configuration includes applying a read voltage to a selected X-conductive array line while applying an un-select voltage thru a biasing element to a remaining plurality of un-selected X-conductive array lines. A plurality of Y-conductive array lines are initially biased to some voltage (e.g., 0V) and then allowed to float unbiased after a predetermined amount of time has passed, some event has occurred, or both. As one example the event that triggers the floating of the plurality of Y-conductive array lines can be the read voltage reaching a predetermined magnitude. The array can be formed BEOL and include a plurality of two-terminal memory cells with each memory cell including a memory element and optionally a non-ohmic device (NOD) that are electrically in series with each other and with the two terminals of the memory cell. | 11-18-2010 |
20110188281 | Local bit lines and methods of selecting the same to access memory elements in cross-point arrays - Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements. | 08-04-2011 |
20110188282 | Memory architectures and techniques to enhance throughput for cross-point arrays - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement memory architectures configured to enhance throughput for cross point arrays including memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes arrays that include memory elements being formed BEOL above a FEOL logic layer within a boundary in a plane parallel to a substrate, and array lines. Further, the integrated circuit includes array line decoders disposed in the logic layer within a region located coextensive with the boundary and between the substrate and the arrays. In some embodiments, the disposition of peripheral circuitry, such as the array line decoders, under the arrays can preserve or optimize die efficiency for throughput enhancement. | 08-04-2011 |
20110188289 | Access signal adjustment circuits and methods for memory cells in a cross-point array - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array. | 08-04-2011 |
20120307542 | LOCAL BIT LINES AND METHODS OF SELECTING THE SAME TO ACCESS MEMORY ELEMENTS IN CROSS-POINT ARRAYS - Embodiments relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement a memory architecture that includes local bit lines for accessing subsets of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point memory array formed above a logic layer. The cross-point memory array includes X-lines and Y-lines, of which at least one Y-line includes groups of Y-line portions. Each of the Y-line portions can be arranged in parallel with other Y-line portions within a group of the Y-line portions. Also included are memory elements disposed between a subset of the X-lines and the group of the Y-line portions. In some embodiments, a decoder is configured to select a Y-line portion from the group of Y-line portions to access a subset of the memory elements. | 12-06-2012 |