Patent application number | Description | Published |
20110245363 | PHOTO-SENSITIVE RESIN COMPOSITION AND A PROTECTIVE FILM FOR PRINTED CIRCUIT BOARD HAVING SUPERIOR HEAT RESISTANT AND MECHANICAL PROPERTY - The present invention relates to a photo-sensitive resin composition having superior heat-resistant and mechanical property, and a protective film for printed circuit board, and particularly provides a photo-sensitive resin composition including an acid-modified oligomer, a photo-polymerizable monomer, a photo-initiator, an epoxy resin, and a butadiene-modified epoxy resin including epoxy group and at least one double bond in the main chain, and a protective film for printed circuit board prepared by using the composition. | 10-06-2011 |
20110269866 | PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION, AND A DRY FILM SOLDER RESIST - The present invention relates to a photo-curable and thermo-curable resin composition and a dry film solder resist make it possible to provide the dry film solder resist having superior heat-resistance and dimensional stability while exhibiting more improved alkali developing property. The resin composition may comprises an acid-modified oligomer having carboxyl group (—COOH) and photo-curable functional group; a photo-polymerizable monomer comprising a compound having a structure of that 3- or more functional epoxy acrylate groups are bonded to a heterocyclic structure containing nitrogen, and a functional group having carboxyl group is bonded to at least one epoxy acrylate group; a thermo-curable binder having thermo-curable functional group; and a photo-initiator. | 11-03-2011 |
20120070780 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM SOLDER RESIST, AND CIRCUIT BOARD - The present invention relates to a photosensitive resin composition including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, and a thioxanthone compound, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist. | 03-22-2012 |
20130063917 | PRINTED CIRCUIT BOARD INCLUDING UNDER-FILL DAM AND FABRICATION METHOD THEREOF - The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device. | 03-14-2013 |
20140221519 | PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSTION, AND DRY FILM SOLDER RESIST - The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator. | 08-07-2014 |
20150044611 | PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSTION, AND DRY FILM SOLDER RESIST - The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator. | 02-12-2015 |
20150191588 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM SOLDER RESIST MANUFACTURED THEREFROM, AND CIRCUIT BOARD INCLUDING THE SOLDER RESIST - The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist. | 07-09-2015 |
20150205202 | PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST - The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COON) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator. | 07-23-2015 |