Patent application number | Description | Published |
20090126174 | METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CONDENSER - There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser. | 05-21-2009 |
20090294297 | METHOD OF FORMING PLATING LAYER - There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a thermoplastic resin and including openings; forming a plating layer on portions of the seed layer corresponding to the openings; and removing the pattern layer. This method ensures that the plating layer is formed with a sufficient thickness and the substrate, particularly, a ceramic substrate suffers minimal chemical damage during a plating process. Moreover, the plating layer is formed with a more uniform thickness. | 12-03-2009 |
20100032407 | METHOD OF MANUFACTURING CERAMIC PROBE CARD - Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets. | 02-11-2010 |
20100039129 | PROBE CARD - Provided is a probe card. The probe card includes a ceramic substrate including a signal line, and a plurality of probe pins formed on the ceramic substrate, and including probe bodies having one end connected to the signal line and probe tips formed at other end of the probe body. The probe body is divided into a first section adjacent to the signal line and second section adjacent the probe tips. The first section is united by an insulating support, and the second sections are divergently arranged to position the probe tips at different measurement regions, respectively. | 02-18-2010 |
20100040984 | METHOD OF FABRICATING MICRO ELECTRO-MECHANICAL COMPONENT - A method of manufacturing a micro electro-mechanical component having a three-dimensional structure includes preparing a conductive substrate, selectively insulating or removing the conductive substrate to form a functional structure for performing a desired electro-mechanical function, forming a plated structure serving as an electrical connection portion on at least one surface of the functional structure, and mounting the functional structure on a circuit substrate so that the electrical connection portion is connected to a circuit pattern of the circuit substrate. | 02-18-2010 |
20100051172 | METHOD FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CIRCUIT BOARD - A method for manufacturing a ceramic green sheet includes providing a stamp having an imprinting surface on which a raised structure corresponding to a circuit pattern is formed, imprinting the stamp on the ceramic green sheet to form a depressed pattern in the ceramic green sheet, the depressed pattern being transferred from the raised structure, curing the ceramic green sheet with the stamp imprinted on the ceramic green sheet, separating the stamp from the ceramic green sheet, and providing the depressed pattern of the ceramic green sheet with the conductive material. | 03-04-2010 |
20100051173 | MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE - There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed. | 03-04-2010 |
20100059266 | CERAMIC MULTI-LAYER CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF - Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired. | 03-11-2010 |
20100116676 | METHOD OF FABRICATING PROBE PIN FOR PROBE CARD - Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused. | 05-13-2010 |
20110148447 | MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME - There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided. | 06-23-2011 |
20120037610 | CERAMIC FIRING FURNACE - A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case. | 02-16-2012 |