Patent application number | Description | Published |
20140373011 | GENERATING A DEPLOYMENT PATTERN FOR REUSE IN A NETWORKED COMPUTING ENVIRONMENT - An approach for generating a deployment pattern for reuse after the deployment of a set of virtual machines and related application artifacts in a networked computing environment (e.g., a cloud computing environment) is provided. In a typical embodiment, information associated with one or more previously provisioned application environments is derived and, after analyzing the information, a deployment pattern is created in the form of tangible artifacts which may be reuse for further deployments without the need to trace back the original procedures used to deploy the previously previsioned application environment. | 12-18-2014 |
20150040125 | ALLOWING MANAGEMENT OF A VIRTUAL MACHINE BY MULTIPLE CLOUD PROVIDERS - Embodiments of the present invention provide approaches for allowing management of a virtual machine (VM) by multiple cloud providers in a networked computing environment (e.g., a cloud computing environment). Specifically, in a typical embodiment, a system identifies a set of provisioned resources of a VM managed by a first cloud provider, generates a set of artifacts containing information for a second cloud provider to allow co-management of the VM by the first cloud provider and the second cloud provider, and provides access to the set of provisioned resources of the VM to the second cloud provider. As such, a single virtual machine may be managed by multiple (e.g., geographically distinct) cloud providers to cooperatively and selectively execute VM operations because the end product (i.e., VM) from the first and second cloud providers is the same. | 02-05-2015 |
Patent application number | Description | Published |
20110284505 | APPARATUS AND METHOD FOR TEMPERATURE CONTROL OF A SEMICONDUCTOR SUBSTRATE SUPPORT - A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T | 11-24-2011 |
20150138687 | CONTROL SYSTEMS EMPLOYING DEFLECTION SENSORS TO CONTROL CLAMPING FORCES APPLIED BY ELECTROSTATIC CHUCKS, AND RELATED METHODS - A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force. | 05-21-2015 |
20150187614 | EDGE SEAL FOR LOWER ELECTRODE ASSEMBLY - A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising a ring compressed in the groove. A gas source supplies inert gas to the groove and maintains the inert gas at a pressure of 100 mTorr to 100 Torr in the groove. | 07-02-2015 |
20150357228 | SUBSTRATE TEMPERATURE CONTROL APPARATUS INCLUDING OPTICAL FIBER HEATING, SUBSTRATE TEMPERATURE CONTROL SYSTEMS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND METHODS - Substrate temperature control apparatus including optical fiber temperature control are described. Substrate temperature control apparatus includes a base, a thermal contact member proximate to the base, and a plurality of optical fibers adapted to provide light-based heating extending laterally between the base and thermal contact member. Substrate temperature control systems and electronic device processing systems and methods including optical fiber temperature control are described, as are numerous other aspects. | 12-10-2015 |
20160007411 | TEMPERATURE CONTROL APPARATUS INCLUDING GROOVE-ROUTED OPTICAL FIBER HEATING, SUBSTRATE TEMPERATURE CONTROL SYSTEMS, ELECTRONIC DEVICE PROCESSING SYSTEMS, AND PROCESSING METHODS - Substrate temperature control apparatus including groove-routed optical fibers. Substrate temperature control apparatus includes upper and lower members including grooves in one or both, and a plurality of optical fibers routed in the grooves. In one embodiment, the optical fibers are adapted to provide light-based pixelated heating. In another embodiment, embedded optical temperature sensors are adapted to provide temperature measurement. Substrate temperature control systems, electronic device processing systems, and methods including groove-routed optical fiber temperature control and measurement are described, as are numerous other aspects. | 01-07-2016 |
20160007412 | APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS - Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects. | 01-07-2016 |
Patent application number | Description | Published |
20150187625 | ELECTROSTATIC CHUCK WITH EXTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION - An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones. | 07-02-2015 |
20150187626 | ELECTROSTATIC CHUCK WITH INTERNAL FLOW ADJUSTMENTS FOR IMPROVED TEMPERATURE DISTRIBUTION - An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones. | 07-02-2015 |
20150226611 | APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK - An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus has a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated. | 08-13-2015 |