Patent application number | Description | Published |
20140374783 | Optical Device Integrated with Driving Circuit and Power Supply Circuit, Method for Manufacturing Optical Device Substrate Used Therein, and Substrate Thereof - The present invention relates to an optical device integrated with a driving circuit and a power supply circuit, a method for manufacturing an optical device substrate used therein, and a substrate thereof, which are capable of reducing the overall size and facilitating the handling and management thereof by mounting a plurality of optical elements, driving circuits thereof, and power supply circuits thereof on a single substrate for an optical device having a vertical insulating layer. The objective of the present invention is to provide the optical device integrated with the driving circuit and the power supply circuit, the method for manufacturing the optical device substrate used therein, and the substrate thereof which are capable of reducing the overall size and facilitating the handling and the management thereof by mounting the plurality of optical elements, the driving circuits thereof, and the power supply circuits thereof on the single substrate for the optical device having the vertical insulating layer. | 12-25-2014 |
20150049447 | Base Substrate Which Prevents Burrs Generated During the Cutting Process and Method for Manufacturing the Same - A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole. | 02-19-2015 |
20150098209 | Method for Manufacturing Optical Element for Backlight Unit and Optical Element and Optical Element Array Manufactured by Method - The present invention relates to a method of manufacturing an optical device for a back light unit, and an optical device and an optical device array manufactured by the method, in which optical device chips constituting the optical device array are each laid the sides thereof on a printed circuit board in such a manner that light can be emitted from the optical device chips in a lateral direction, thus reducing the overall thickness of the back light unit. | 04-09-2015 |
20150102486 | Method for Mounting a Chip and Chip Package - Provided is a method of mounting a chip. The method includes: forming a bump at one surface of a cavity formed concavely in an inner direction of a substrate; performing a coining process to flatten a surface of the bump; coating a solder material on the bump subjected to the coining process; and bonding a chip and the bump by melting the solder material, wherein an electrode portion or a metal portion is formed on a bottom of the chip. For a metal substrate according to the present invention, wherein a vertical insulating layer is included, since the electrode portion of the chip and the electrode portion of the substrate have to be electrically connected, the metal substrate is bonded to the electrode portion of the chip using the bump additionally formed on the metal substrate, so the heat generated in the chip can be rapidly transferred to the substrate, and the junction temperature of the chip can be decreased, thereby enhancing the light efficiency and the. In addition, cracking due to the difference of thermal expansion coefficient between solder materials can be prevented by sealing the bonding portion of the chip using the solder materials. Further, since oxidation of the bonding portion is prevented by blocking the contact with the outside, the chip packaging process can be performed without an additional process of filling an inert gas into the internal space wherein the chip is mounted. | 04-16-2015 |
20150103541 | Light Emitting Device Substrate and Method for Manufacturing the Same - This invention relates to an optical device, more particularly, to a method for manufacturing an optical device substrate in which an optical device can be arranged in a various manner. The method includes manufacturing a plurality of unit block substrates by stacking n (n>1) number of flat panel metal substrates and cutting a first metal substrate-bonded body made by forming insulating members between stacked surfaces of the flat panel metal substrates such that each unit block substrate is partitioned into n number of optical device attachment areas by (n−1) number of the insulating members; manufacturing a second metal substrate-bonded body by stacking at least m (m>1) number of the unit block substrates in a manner that the insulating members are oriented in a vertical direction, inserting at least one of the insulating members and metal electrode substrates between the stacked surfaces, and bonding the metal electrode substrates onto a top and a bottom of the second metal substrate-bonded body; and manufacturing the optical device substrate by cutting the second metal substrate-bonded body from the top to the bottom such that each cut surface has m×n number of the optical device attachment areas. | 04-16-2015 |
20150117035 | Heat Sink for Chip Mounting Substrate and Method for Manufacturing the Same - Provided is a heat sink for a chip mounting substrate in which a heat dissipation material is embedded. The heat sink includes: an accommodation portion configured to accommodate a substrate whereon a chip is mounted or to be mounted, and support or fix the accommodated substrate; and a heat dissipation portion configured to insulate the accommodated substrate, and dissipate heat generated from the substrate or the chip mounted on the substrate to an outside through a heat dissipation material contained in the heat dissipation portion. Accordingly, since the heat sink for a chip mounting substrate in which a heat dissipation material is embedded is manufactured by injection molding, a manufacturing process can be simplified. Further, since the heat sink of a single structure is used, a TIM bonding layer for bonding the substrate and the heat sink is not required, and an electrical insulating layer formed by anodizing an upper surface of the heat sink for electrical insulation between the substrate and the heat sink is not required, and thus the structure can be simplified. | 04-30-2015 |
20150138656 | Chip Substrate Having a Lens Insert - A chip substrate includes: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. Since the space for inserting a lens can be formed to have a shape comprising straight lines, and a lens to be inserted can also be manufactured in a shape comprising straight lines, therefore the manufacturing process for a lens to be inserted into the chip substrate can be further simplified. | 05-21-2015 |
20150138659 | Substrate for Preventing Burr Generation - A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove. | 05-21-2015 |