Patent application number | Description | Published |
20080272484 | Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips - A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects. | 11-06-2008 |
20080272485 | Liquid cooled power electronic circuit comprising stacked direct die cooled packages - A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads. | 11-06-2008 |
20080290378 | Transistor package with wafer level dielectric isolation - A low cost transistor package is provided for high power applications. The package provides high thermal conductivity and dissipation for a silicon transistor die, high current carrying capability and isolation, and high power and thermal cycle life performance and reliability. A dielectric layer is fixed to a silicon transistor die, for coupling to a heat conducting buffer and attachment to a substrate. The dielectric layer is fixed to the die by growing the dielectric layer, depositing the dielectric layer, or applying the dielectric layer using a plasma spray. In an aspect, a conductive layer is formed to the silicon transistor die by a thermal or kinetic spray process, and the dielectric layer is applied to the conductive layer. The dielectric layer may also be established either before or after the transistor fabrication. Electrical and thermal interconnects are advantageously positioned from opposite sides of the silicon transistor die. | 11-27-2008 |
20110080665 | VISUAL GAP MITIGATION APPARATUS FOR A SEGMENTED DISPLAY PANEL - A transparent bevel apparatus overlays marginal portions of juxtaposed display devices of a segmented display panel to obscure the visual gap between the display devices. The bevel apparatus at least partially overlaps only marginal pixels of the adjacent display devices, so that light from a given display device that passes through the bevel apparatus is bent toward from the respective display device at an angle with respect to the remainder of the emitted light. Consequently, light emitted from the marginal portions of the juxtaposed display devices is seen by the viewer in the place where the visual gap would otherwise be seen. The bevel apparatus may be constructed in the form of a sheet that overlays an entire display device, or all or a portion of the entire display panel, or a narrow strip that is aligned with the seams and affixed to juxtaposed faces of the display devices. | 04-07-2011 |
20110094725 | THERMALLY-PROTECTED CHAMBER FOR A TEMPERATURE-SENSITIVE CONSUMER ELECTRONIC DEVICE - A thermal-protection apparatus disposed in a vehicle cabin or storage compartment includes a housing enveloping a chamber in which a thermally-sensitive consumer electronic device is received, a thermoelectric module mounted in a wall of the housing, and a remote electronic controller and power source coupled to the housing via an electrical cable for activating the thermoelectric module, and optionally the consumer electronic device, in a manner to prevent the temperature in the chamber from exceeding a prescribed maximum operating temperature of the consumer electronic device or falling below a prescribed minimum operating temperature of the consumer electronic device. | 04-28-2011 |
20130186075 | HEAT EXCHANGER EQUIPPED WITH THERMAL ELECTRIC DEVICE FOR ENGINE EXHAUST CARBON DIOXIDE COLLECTION SYSTEM - A system for separating carbon dioxide gas from internal combustion engine exhaust and an electricity generating heat exchanger for the system. The system includes a scrubber tank containing a carbon dioxide absorbent fluid and configured to bubble exhaust gas from the heat exchanger through the carbon dioxide absorbent fluid, whereby carbon dioxide gas is absorbed by the carbon dioxide absorbent fluid. A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween. | 07-25-2013 |
20130220130 | CARBON DIOXIDE ABSORBENT FLUID FOR A CARBON DIOXIDE SEQUESTERING SYSTEM ON A VEHICLE - A carbon dioxide storage means stores the carbon dioxide released in a heat exchanger. The heat exchanger cools the exhaust gas emitted by the internal combustion engine, and includes a thermal electric generator (TEG) configured to couple thermally the exhaust gas chamber to the absorber fluid chamber in a manner effective to heat the CO2 absorbent fluid by heat from the engine exhaust to release CO2 gas from the CO2 absorbent fluid and generate electricity in response to a temperature difference therebetween. The CO2 absorbent fluid is one of: a) an aliphatic di-functional nitrile (e.g. pimelonitrile); and b) an oligomeric poly-acrylonitrile (PAN). | 08-29-2013 |
20140305480 | THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY - An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger configured to couple thermally heat from exhaust gas to an outer surface of the first heat exchanger. The outer surface is preferably formed of stainless steel. A first dielectric layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger. A first conductor layer is formed by firing a conductive thick-film onto the first dielectric layer. A first paste layer of silver (Ag) based sintering paste is interposed between the first conductor layer and a first contact of the TEG. The first contact is sintered to the first conductor layer when the assembly is suitably arranged and suitably heated. | 10-16-2014 |
20140305481 | THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY - An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The assembly includes a first heat exchanger configured to guide exhaust gas of an internal combustion engine past an opening defined by the first heat exchanger, and a heat sink configured to couple thermally the TEG to the exhaust gas and fluidicly seal the opening. The assembly is configured so the heat sink is directly exposed to the exhaust gas so that heat is efficiently transferred from the exhaust gas to the TEG. | 10-16-2014 |