Boyi
Boyi Fu, San Jose, CA US
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20160107287 | POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS - Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. | 04-21-2016 |
20160107295 | POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS - Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. | 04-21-2016 |
Boyi Ni, Jiangsu CN
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20160055494 | BOOKING BASED DEMAND FORECAST - A computer-implemented method for a booking based demand forecast problem includes converting time series data into a multivariate time series, training a multivariate time series model using the converted multivariate time series, forecasting results using the multivariate time series model and aggregating the results. | 02-25-2016 |
Boyi Shi, Jiangsu CN
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20130222083 | SOFT-COLLISION ELECTROMAGNETIC DRIVING MECHANISM - A soft-collision electromagnetic driving mechanism comprises a movable shaft driven by an electromagnetic mechanism, wherein the movable shaft is fixed to a movable iron core, an upper part of the movable shaft is connected to a movable damping mechanism, the movable damping mechanism comprises a first cylinder, the first cylinder has a movable damping piston therein, the movable damping piston is formed by a damping piston head and damping piston rods disposed at two sides of the damping piston head, first and second sealing chambers are at the two sides of the damping piston head respectively, a damping liquid is filled in the first and second sealing chambers, and a two-way discharge channel is arranged between the first and second sealing chambers. The driving mechanism is a permanent magnetic linear driving mechanism having a simple structure, a strong driving force and smooth contact, which can be used to drive electrical switches or devices requiring smooth contact, strong driving force and high speed. | 08-29-2013 |
Boyi Wu, Wuhai City CN
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20110239775 | PIN SOLDERING FOR PRINTED CIRCUIT BOARD FAILURE TESTING - Systems and methods for performing pin-pull testing of a printed circuit board (PCB) are presented. The pin-pull testing generally involves the use of a standard tensile tester that is useful for performing other tests aside from pin-pull testing. In this regard, a non-specific pin may be used in conjunction with the tensile tester without the need to purchase or manufacture pins specially adapted for use with a specially designed tensile tester. Additionally, the pin-pull testing may include application of heat to the pin by way of an external heat supply such that the need of a heater integrated into the testing device to heat a pin during the testing may be eliminated. As such, a common heating element (e.g., a standard soldering iron) may be employed by applying heat to a pin directly with the external heat supply. Additionally, a dying process is presented that may be performed on a PCB prior to the pin-pull test that allows for evaluation of the presence of cracks in the PCB adjacent to a contact pad prior to the execution of the pin-pull test. | 10-06-2011 |
Boyi Yang, Melbourne, FL US
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20120012982 | CAPACITORS AND METHODS OF FORMING - Capacitors and methods of forming semiconductor device capacitors are disclosed. Trenches are formed to define a capacitor bottom plate in a doped upper region of a semiconductor substrate, a dielectric layer is formed conformally over the substrate within the trenches, and a polysilicon layer is formed over the dielectric layer to define a capacitor top plate. A guard ring region of opposite conductivity and peripheral recessed areas may be added to avoid electric field crowding. A central substrate of lower doping concentration may be provided to provide a resistor in series below the capacitor bottom plate. A series resistor may also be provided in a resistivity region of the polysilicon layer laterally extending from the trenched area region. Contact for the capacitor bottom plate may be made through a contact layer formed on a bottom of the substrate. A top contact may be formed laterally spaced from the trenched area by patterning laterally extended portions of one or more of the dielectric, polysilicon and top metal contact layers. | 01-19-2012 |