Bonkohara
Manabu Bonkohara, Tokyo JP
Patent application number | Description | Published |
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20110122303 | SOLID-STATE IMAGING DEVICE, METHOD OF FABRICATING THE SAME, AND CAMERA MODULE - Image quality degradation due to external light irradiated to an edge section of a transparent cover of a solid-state imaging device and external light propagating in the cover is prevented with a simple structure. | 05-26-2011 |
20110127652 | THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME - A three-dimensional semiconductor integrated circuit device is provided. A first semiconductor chip includes a solid-state circuit and is smaller than a base, and is stacked on the base. The first chip is buried by a first filling material having approximately the same contour as the base. Buried electrodes that penetrate through the first chip along its thickness direction are formed in the first chip. A second semiconductor chip includes a solid-state circuit and is smaller than the base, and is stacked on the first chip. The second chip is buried by a second filling material having approximately the same contour as the base. Buried electrodes that penetrate through the second chip along its thickness direction are formed in the second chip. The first and second filling materials have processibilities required for forming the buried electrodes and thermal expansion coefficients equivalent to those of the first and second chips, respectively. | 06-02-2011 |
Manabu Bonkohara, Kangawa JP
Patent application number | Description | Published |
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20140015119 | SEMICONDUCTOR DEVICE/ELECTRONIC COMPONENT MOUNTING STRUCTURE - To provide a mounting structure of a semiconductor device/electronic component that suppresses temperature rise of a semiconductor device and/or an electronic component having large power consumption due to heat generation thereof, resulting in stable operation. | 01-16-2014 |
Manabu Bonkohara, Kanagawa JP
Patent application number | Description | Published |
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20130313687 | Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing method - [Aim of Invention] | 11-28-2013 |
20140016270 | INTERPOSER AND SEMICONDUCTOR MODULE USING THE SAME - An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources. | 01-16-2014 |
20140034354 | ELECTRODE, ELECTRODE MATERIAL, AND ELECTRODE FORMATION METHOD - A method of forming a low-resistance, high-reliability through/embedded electrode is provided, where the electrode can be arranged in a higher density according to the miniaturization of the semiconductor manufacturing technology. This method includes the step of filling an opening | 02-06-2014 |