Bohlinger
Michael J. Bohlinger, Minnetonka, MN US
Patent application number | Description | Published |
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20110012213 | VERTICAL SENSOR ASSEMBLY METHOD - A method to vertically bond a chip to a substrate is provided. The method includes forming a metal bar having a linear aspect on the substrate, forming a solder paste layer over the metal bar to form a solder bar, forming a plurality of metal pads on the substrate, and forming a solder paste layer over the plurality of metal pads to form a plurality of solder pads on the substrate. Each of the plurality of solder pads is offset from a long edge the solder bar by an offset-spacing. The chip to be vertically bonded to the substrate has a vertical-chip thickness fractionally less than the offset-spacing. The chip to be vertically bonded fits between the plurality of solder pads and the solder bar. The solder bar enables alignment of the chip to be vertically bonded. | 01-20-2011 |
Michael J. Bohlinger, Minetonka, MN US
Patent application number | Description | Published |
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20090072823 | 3D INTEGRATED COMPASS PACKAGE - A 3-axis sensor package with on-board sensor support chip on a single chip. In one aspect of the invention, a sensor package includes an X-axis sensor circuit component, a Y-axis sensor circuit component, or alternatively a combined X/Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate, or alternatively to a printed circuit board (PCB). The pads may be arranged in variety of designs, including a leadless chip carrier (LCC) design and a ball grid array (BGA) design. An application-specific integrated circuit (ASIC), or sensor support chip, is additionally mounted to the top surface of the rigid substrate. The sensor components and ASIC may be ball bonded or wire bonded to the substrate. | 03-19-2009 |
William Bohlinger, Buffalo City, WI US
Patent application number | Description | Published |
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20140341563 | PROCESS CONTROLLER WITH INTEGRATED OPTICAL SENSING - The present disclosure relates generally to a process controller and more specifically to a process controller with integrated optical sensing. | 11-20-2014 |
William C. Bohlinger, Buffalo City, WI US
Patent application number | Description | Published |
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20120061369 | MULTIPLE HEATER CONTROL SYSTEM WITH EXPANDABLE MODULAR FUNCTIONALITY - A multiple heater control system includes cables, connectors, and junction boxes for user-friendly daisy chain connections of heater controllers and heaters in various configurations or combinations of individually controlled heater series and/or master and slave heater series. The heater controllers include process control of AC power to the heaters and upper-limit safety shutoff that is substantially independent from the process control. The heater controllers also have variable levels of control, adjustment, display, and communications functionality in a base module that is expandable to various levels with expansion modules that are attachable to and detachable from the base module. Connector, cable, and junction configurations, adapters, and latch features enhance user friendliness. | 03-15-2012 |