Patent application number | Description | Published |
20140173367 | SYSTEMS AND METHODS FOR DIFFERENTIAL PAIR IN-PAIR SKEW DETERMINATION AND COMPENSATION - In accordance with embodiments of the present disclosure, an information handling system may include a processor, a first information handling resource communicatively coupled to the processor, and a second information handling resource communicatively coupled to the processor and the first information handling resource. The first information handling resource and the second information handling resource may be configured to, in concert determine an optimum delay between opposite polarity signals for differential signals communicated from the first information handling resource to the second information handling resource via a path comprising a differential pair and transmit data from the first information handling resource to the second information handling resource via the path by inserting a delay into one of the opposite polarity signals equal to the optimum delay. | 06-19-2014 |
20140233165 | FLEX CIRCUIT - A flex circuit including a plurality of layers folded on a first fold line and folded on a second fold line is disclosed. The plurality of layers may include a first conductive layer, an insulating layer adjacent the first conductive layer, and a second conductive layer adjacent the insulating layer. The flex circuit may include a plurality of slits extending through each layer of the plurality of layers, the plurality of slits disposed on the first fold line and the second fold line. | 08-21-2014 |
20140238733 | SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD - In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location. | 08-28-2014 |
20140244883 | SYSTEMS AND METHODS FOR IMPEDANCE MATCHING FOR MULTI-DROP TOPOLOGIES - In accordance with embodiments of the present disclosure, a system may include a driver, a plurality of drops, and a plurality of transmission lines, including one transmission line between the driver and one of the plurality of drops and one transmission line between successive adjacent drops. Each particular transmission line of the plurality of transmission lines may be manufactured to have a desired impedance based on a corresponding effective impedance as seen at a drop located on an end of the particular transmission line furthest from the driver in a direction away from the driver. | 08-28-2014 |
20140269971 | SYSTEM AND METHOD OF ENHANCING SIGNAL INTEGRITY - A signal processing method is disclosed. The method includes identifying a preferred loss profile for a plurality of signal transmission channels and generating a filter transfer function corresponding to each of the plurality of signal transmission channels, where each filter transfer function is configured to produce a filtered signal with a loss profile approximately equal to the preferred loss profile. The method further includes generating a plurality of filtered signals by filtering a plurality of signals using the filter transfer function corresponding to each of the plurality of signal transmission channels. and transmitting the plurality of filtered signals to a plurality of receivers via the plurality of signal transmission channels. | 09-18-2014 |
20140326489 | SYSTEMS AND METHODS FOR DECREASING STUB RESONANCE OF PLATING FOR CIRCUIT BOARDS - In accordance with embodiments of the present disclosure, a circuit board may include a stub corresponding to a portion of a trace running proximate to an edge of the circuit board, wherein the stub is configured to electrically couple to a plating bar for plating electrical paths of the circuit board with a conductive metal and a termination pad electrically coupled to the stub and configured to electrically couple to a termination resistor for resistively terminating the stub. | 11-06-2014 |
20150103873 | SYSTEMS AND METHODS FOR MEASUREMENT OF ELECTRICAL CHANNEL LOSS - In accordance with embodiments of the present disclosure, a method for characterizing electrical characteristics of a communication channel between a transmitter of a first information handling resource and a receiver of a second information handling resource may include receiving a test signal at the receiver from the transmitter during an in-situ characterization mode of the second information handling resource, converting the test signal into a discrete-time digital signal representing the test signal, generating a discrete-time finite difference function comprising a first derivative of the discrete-time digital signal, transforming the discrete-time finite difference function into a frequency-domain transform of the discrete-time finite difference function. | 04-16-2015 |
20150211837 | SYSTEMS AND METHODS FOR FREQUENCY SHIFTING RESONANCE OF AN UNUSED VIA IN A PRINTED CIRCUIT BOARD - In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location. | 07-30-2015 |
20150216046 | Structure to Dampen Barrel Resonance of Unused Portion of Printed Circuit Board Via - A printed circuit board includes a first trace, a second trace, and a first via. The first trace is in a first conductive layer. The second trace is in a second conductive layer. The first via interconnects the first trace and the second trace, and communicates a first signal from the first trace to the second trace through a third conductive layer. The third conductive layer has a higher impedance than the first conductive layer and the second conductive layer. | 07-30-2015 |