Patent application number | Description | Published |
20100030227 | MEDICAL LEAD IMPLANTATION - A medical lead introducer comprises a shank, a carrier structure on the shank configured to engage a mating carrier structure of a medical lead during a lead introduction procedure, and a blunt dissection element located on a distal end of the shank. The blunt dissection element is configured to shield at least a distal portion of the medical lead when the medical lead is engaged by the carrier structure during the lead introduction procedure. In some embodiments, the medical lead introducer may be part of a kit including the medical lead. | 02-04-2010 |
20100304592 | Connector Assemblies and Contacts for Implantable Medical Electrical Systems - A connector assembly of a medical electrical device includes a plurality of electrical contacts, wherein at least one contact of the plurality of electrical contacts includes an electrical coupling receptacle. The electrical coupling receptacle of the at least one contact includes a first portion, which is adapted to receive a connector element of a medical electrical lead, and a second portion, in which a part of a feedthrough member extends, and to which the part of the feedthrough member is fixedly coupled. | 12-02-2010 |
20110029028 | MACHINING OF ENCLOSURES FOR IMPLANTABLE MEDICAL DEVICES - Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances. | 02-03-2011 |
20120065503 | RADIOPAQUE MARKERS FOR IMPLANTABLE MEDICAL DEVICES - A radiopaque marker for inclusion within an implantable medical device (IMD) may comprise one or more radiopaque articles selected from a predetermined set of radiopaque articles. The one or more radiopaque articles may be carried by an object formed of or including, a desiccant. The predetermined set of radiopaque articles may undergo a single qualification process that approves the use of any combination of one or more of the articles as a radiopaque marker within an IMD. This allows a potentially-limitless number of markers to be made available based on a single qualification process. The radiopaque marker may serve to provide information such as the make, model, and feature set of the device. | 03-15-2012 |
20120149254 | CONNECTOR ASSEMBLIES AND CONTACTS FOR IMPLANTABLE MEDICAL ELECTRICAL SYSTEMS - A connector assembly of a medical electrical device includes a plurality of electrical contacts and an insulative base that supports the plurality of electrical contacts and extends between the plurality of electrical contacts and a housing of the device, and, wherein at least one contact of the plurality includes an elongate electrical coupling receptacle in which a first part of a feedthrough member extends, being fixedly coupled thereto. The feedthrough member further includes a second part and a bend, which is located between the first and second parts. The second part of the feedthrough member extends away from the contact and through a port formed in the insulative base adjacent to the contact. | 06-14-2012 |
20120203292 | CONNECTOR ENCLOSURE ASSEMBLIES OF MEDICAL DEVICES INCLUDING AN ANGLED LEAD PASSAGEWAY - Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway. | 08-09-2012 |
20120203314 | CONNECTOR ENCLOSURE ASSEMBLIES OF MEDICAL DEVICES INCLUDING AN ANGLED LEAD PASSAGEWAY - Connector enclosure assemblies for medical devices provide an angled lead passageway. The lead passageway which is defined by electrical connectors and intervening seals within the connector enclosure assembly establishes the angle relative to a base plane of the connector enclosure assembly. Various other aspects may be included in conjunction with the angled lead passageway, including an angled housing of the connector enclosure assembly, feedthrough pins that extend to the electrical connectors where the feedthrough pins may include angled sections, and a set screw passageway set at an angle relative to the lead passageway to provide fixation of a lead within the lead passageway. | 08-09-2012 |
20140043739 | Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins - Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed. | 02-13-2014 |
20140049924 | Implantable Medical Devices and Related Connector Enclosure Assemblies Utilizing Conductors Electrically Coupled to Feedthrough Pins - Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed. | 02-20-2014 |
20140052225 | Connector Assemblies for Implantable Medical Electrical Systems - A device connector assembly includes a plurality of electrical contacts and a sealing member including a corresponding plurality of apertures; each electrical contact extends within a corresponding aperture of the plurality of apertures such that each contact is accessible for coupling with a corresponding connector element of a lead connector. The lead connector elements protrude from a first side of an insulative substrate of the lead connector, and may be coupled to the contacts of the device connector assembly by aligning each connector element with the corresponding aperture of the sealing member, and applying a force to a second side of the insulative substrate, opposite the first side, in order to press each connector element into engagement with the corresponding contact. | 02-20-2014 |
Patent application number | Description | Published |
20110266571 | Semiconductor Arrangement - According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof. | 11-03-2011 |
20130193469 | OPTOELECTRONIC COMPONENT - An optoelectronic component includes a semiconductor chip, and a phosphor at least partly surrounding the semiconductor chip, wherein 1) the semiconductor chip emits a primary radiation in a short-wave blue spectral range at a dominant wavelength of less than approximately 465 nm, and wherein the phosphor converts at least part of the primary radiation into a longer-wave secondary radiation in a green spectral range at a dominant wavelength of approximately 490 nm to approximately 550 nm, and 2) a mixed light composed of primary radiation and secondary radiation has a dominant wavelength at wavelengths of approximately 460 nm to approximately 480 nm such that luminous flux of the mixed light is up to 130% greater than luminous flux of an optoelectronic component without a phosphor having the same dominant wavelength of 460 nm to 460 nm. | 08-01-2013 |
20140117396 | OPTOELECTRONIC SEMICONDUCTOR CHIP, OPTOELECTRONIC SEMICONDUCTOR COMPONENT, AND A METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT - An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaves free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is designed to be absorbent and/or reflective and/or scattering for the primary radiation. | 05-01-2014 |