Autumn
Carole Autumn, Fort Worth, TX US
Patent application number | Description | Published |
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20150021332 | Pet Waste Station - This invention relates to a container for pet waste. The container includes an inner member that is removable from an outer member. The container has a lid composed of an inner section surrounded by an outer section. The inner section is hingedly connected independently of the outer section. | 01-22-2015 |
Hua Autumn, Santa Clara, CA US
Patent application number | Description | Published |
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20110205885 | Optimized Fast Re-Route In MPLS Ring Topologies - A method performed on a network element employing Multi-protocol Label Switching (MPLS) to optimize bandwidth in a ring topology network including a back-up Label Switch Path (LSP) for a protected LSP by re-routing traffic onto the back-up LSP to avoid shared links between the protected LSP and back-up LSP, including receiving a first labeled packet from another label switch router (LSR) in the back-up LSP, the first labeled packet indicating that a protection switch of data is to be performed from the protected LSP to the back-up LSP, determining whether a shared link in the ring topology network exists between the protected LSP and the back-up LSP, rerouting traffic for the protected LSP onto an optimized back-up LSP to remove the shared link, receiving a second labeled packet indicating that a protection switch of data is to be performed, and restoring routing of the traffic onto the protected LSP in response to receiving the second labeled packet. | 08-25-2011 |
Kellar Autumn, Portland, OR US
Patent application number | Description | Published |
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20080308953 | FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION - An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package. | 12-18-2008 |
20100204830 | SELF-CLEANING ADHESIVE STRUCTURE AND METHODS - A method and apparatus for transporting an object from one workstation to another, or for manipulating an object within a workstation, where the object or workstations may be contaminated with unwanted dirt or dust particles, are disclosed. The object is gripped at one work station with a movable transfer arm a movable transfer arm having an end effector composed of an array of nano-scale projections, where each projection provides one or more distal contact ends, the density of contact ends is such as to grip a surface of the object with an intermolecular force sufficient to hold the object for movement, where the relative sizes of the object and particles are such that the object makes contact with severalfold times of the number of contact ends than contacted by such particles. After moving the gripped object to the other workstation, the end effector is manipulated to release the gripped object at the other workstation. Before, during or after transport of the object, the arm's end effector is brought into contact with a cleaning surface having a surface energy interaction with particles carried on said effector as great or greater than the surface energy interaction between particles and effector, thereby to transfer such particles to the cleaning surface. Also disclosed is an apparatus for transporting small elements or objects in a nano- or micro-fabrication assembly or in printing, and a self-cleaning adhesive tape. | 08-12-2010 |
Kellar Autumn, Portlad, OR US
Patent application number | Description | Published |
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20090146320 | FABRICATED ADHESIVE MICROSTRUCTURES FOR MAKING AN ELECTRICAL CONNECTION - An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package. | 06-11-2009 |