Patent application number | Description | Published |
20080263577 | Disc cartridge - The invention provides a structure of a disc cartridge which can correspond to a two-head system while keeping an advantage relating to a light shielding effect and a dust proofing effect of a double cartridge. The invention provides a disc cartridge used in a hologram information recording and reproducing apparatus independently provided with a head for detecting a tracking area and a head for recording and reproducing, in which the disc cartridge is provided with an outer cartridge, an inner cartridge accommodated in an inner side of the outer cartridge and rotatably accommodating a hologram recording medium in an inner portion thereof, and a shutter arranged between the outer cartridge and the inner cartridge and provided for opening and closing an opening portion of the disc cartridge. Further, the opening portion includes a recording and reproducing head and spindle insertion hole, and a tracking area detecting window provided independently therefrom. Further, the tracking area detecting window is provided near a center of the cartridge in the spindle insertion hole, and comes to an exposed state only at a time when the shutter is open. Preferably, the tracking area detecting window is provided at an angle between 40 to 50 degree from a center line of the recording and reproducing head and spindle insertion hole. | 10-23-2008 |
20100320084 | Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material - Provided is a sputtering target of nonmagnetic-particle-dispersed ferromagnetic material comprising a phase (A) such that nonmagnetic particles are dispersed in a ferromagnetic material formed from a Co—Cr alloy containing 5 at % or more and 20 at % or less of Cr and Co as the remainder thereof, and schistose textures (B) with a short side of 30 to 100 μm and a long side of 50 to 300 μm formed from a Co—Cr alloy phase in the phase (A); wherein each of the foregoing nonmagnetic particles has such a shape and size that the particle is smaller than all hypothetical circles with a radius of 1 μm around an arbitrary point within the nonmagnetic particle, or a shape and size with at least two contact points or intersection points between the respective hypothetical circles and the interface of the ferromagnetic material and the nonmagnetic material. Consequently, obtained is a high-density sputtering target of nonmagnetic-particle-dispersed ferromagnetic material whose crystal grains are fine, which realizes improvement of PTF (pass through flux) of the target, high-speed deposition with a magnetron DC sputtering system, reduction in the particles (dust) and nodules generated during the sputtering process, minimal variation in quality, and improvement of mass productivity. | 12-23-2010 |
20110114879 | Method of Producing Mixed Powder Comprising Noble Metal Powder and Oxide Powder, and Mixed Powder Comprising Noble Metal Powder and Oxide Powder - Provided are a method of producing mixed powder comprising noble metal powder and oxide powder, wherein powder of ammonium chloride salt of noble metal and oxide powder are mixed, the mixed powder is subsequently roasted, and ammonium chloride is desorbed by the roasting process in order to obtain mixed powder comprising noble metal powder and oxide powder, and mixed powder comprising noble metal powder and oxide powder, wherein chlorine is less than 1000 ppm, nitrogen is less than 1000 ppm, 90% or more of the grain size of the noble metal powder is 20 μm or less, and 90% or more of the grain size of the oxide powder is 12 μm or less. Redundant processes in the production of noble metal powder are eliminated, and processes are omitted so that the inclusion of chlorine contained in the royal water and nitrogen responsible for hydrazine reduction reaction is eliminated as much as possible. Consequently, the present invention aims to omit the drying process at a high temperature and thereby prevent grain growth and aggregation, and further eliminate the pulverization and classification processes in order to considerably reduce the production cost. | 05-19-2011 |
20110247930 | Nonmagnetic Material Particle-Dispersed Ferromagnetic Material Sputtering Target - A nonmagnetic material particle-dispersed ferromagnetic material sputtering target comprising a mixture of an alloy containing 5 mol % or more and 20 mol % or less of Cr, 5 mol % or more and 30 mol % or less of Pt, and Co as the remainder thereof, and nonmagnetic material particles, wherein the structure of the target includes a phase (A) in which the nonmagnetic material particles are uniformly micro-dispersed in the alloy, and a spherical alloy phase (B) dispersed in the phase (A) in which the ratio of its volume in the target is 4% or more and 40% or less. Obtained is a nonmagnetic material particle-dispersed ferromagnetic material sputtering target capable of improving the leakage magnetic flux to obtain a stable electrical discharge with a magnetron sputtering device, and which has high density and generates few particles during sputtering. | 10-13-2011 |
20110284373 | Inorganic-Particle-Dispersed Sputtering Target - Provided is an inorganic-particle-dispersed sputtering target in which inorganic particles are dispersed in a Co base material, wherein the inorganic particles have an electric resistivity of 1×10 | 11-24-2011 |
20120097535 | Sputtering Target of Ferromagnetic Material with Low Generation of Particles - A ferromagnetic sputtering target comprising metal having a composition containing 20 mol % or less of Cr, and Co as the remainder; wherein the target structure includes a basis metal (A), and flat phases (B), containing 90 wt % or more of Co, within the basis metal (A), the average grain size of the phases (B) is 10 μm or more and 150 μm or less, and the average aspect ratio of the phases (B) is 1:2 to 1:10. Provided is a ferromagnetic sputtering target capable of inhibiting the generation of particles during sputtering, and improving the pass-through flux to achieve a stable electrical discharge with a magnetron sputtering device. | 04-26-2012 |
20120118734 | Ferromagnetic Material Sputtering Target - A ferromagnetic material sputtering target made of metal having a composition containing 20 mol % or less of Cr, and Co as the remainder thereof, wherein the structure of the target includes a metallic substrate (A), and, in the metallic substrate (A), a spherical phase (B) containing 90 wt % or more of Co in which the difference between the longest diameter and the shortest diameter is 0 to 50%. Provided is a ferromagnetic material sputtering target capable of improving the leakage magnetic flux to obtain a stable electrical discharge with a magnetron sputtering device. | 05-17-2012 |
20130001079 | Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material - A sputtering target of nonmagnetic-particle-dispersed ferromagnetic material is provided having a phase (A) such that nonmagnetic particles are dispersed in a ferromagnetic material formed from a Co—Cr alloy containing 5 at % or more and 20 at % or less of Cr and Co as the remainder thereof, and schistose textures (B) with a short side of 30 to 100 μm and a long side of 50 to 300 μm formed from a Co—Cr alloy phase in the phase (A); wherein each of the foregoing nonmagnetic particles has such a shape and size that the particle is smaller than all hypothetical circles with a radius of 1 μm around an arbitrary point within the nonmagnetic particle, or a shape and size with at least two contact points or intersection points between the respective hypothetical circles and the interface of the ferromagnetic material and the nonmagnetic material. | 01-03-2013 |
20130015061 | Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic Material - A sputtering target of nonmagnetic-particle-dispersed ferromagnetic material is provided having a phase (A) such that nonmagnetic particles are dispersed in a ferromagnetic material formed from a Co—Cr alloy containing 5 at % or more and 20 at % or less of Cr and Co as the remainder thereof, and schistose textures (B) with a short side of 30 to 100 μm and a long side of 50 to 300 μm formed from a Co—Cr alloy phase in the phase (A); wherein each of the foregoing nonmagnetic particles has such a shape and size that the particle is smaller than all hypothetical circles with a radius of 1 μm around an arbitrary point within the nonmagnetic particle, or a shape and size with at least two contact points or intersection points between the respective hypothetical circles and the interface of the ferromagnetic material and the nonmagnetic material. | 01-17-2013 |
20130087454 | Magnetic Material Sputtering Target Provided with Groove in Rear Face of Target - Provided is a disk-shaped magnetic material sputtering target having a thickness of 1 to 10 mm, wherein the magnetic material sputtering target includes, on a rear surface thereof, at least one circular groove having a width of 5 to 20 mm and a depth of 0.1 to 3.0 mm centered around a center of the disk-shaped target, spacing of the respective grooves is 10 mm or more, and a non-magnetic material having a thermal conductivity of 20 W/m·K or more is embedded in the groove. The pass through flux density is increased in order to eliminate the defects that occur in the target of a magnetic material, the sputtering efficiency is improved by increasing the spread of plasma and improving the deposition rate, and the usage efficiency of the magnetic material target is additionally improved by inhibiting local erosion and causing the erosion on the target surface to be uniform. | 04-11-2013 |
20130112555 | Sputtering Target of Ferromagnetic Material with Low Generation of Particles - Provided is a sputtering target of ferromagnetic material comprising a metal having a composition containing 20 mol % or less of Cr, and Co as the remainder; wherein the target structure includes a phase (A) which is a basis metal, and metal phases (B) having a component composition different from the peripheral texture within the phase (A), the area ratio occupied by oxides within 1 μm from the most outer periphery of metal phases (B) is 80% or less, and the average grain size of the metal phases (B) is 10 μm or more and 150 μm or less. Provided is a sputtering target of ferromagnetic material capable of inhibiting the generation of particles during sputtering, and improving the pass-through flux to achieve a stable electrical discharge with a magnetron sputtering device. | 05-09-2013 |
20130134038 | Ferromagnetic Material Sputtering Target - A ferromagnetic material sputtering target which is a sintered compact sputtering target made of a metal having Co as its main component, and nonmetallic inorganic material particles, wherein a plurality of metal phases having different saturated magnetization exist, and the nonmetallic inorganic material particles are dispersed in the respective metal phases. By increasing the pass-through flux of the sputtering target, it is possible to obtain a stable discharge. Moreover, it is also possible to obtain a ferromagnetic material sputtering target capable of obtaining a stable discharge in a magnetron sputtering device and which has a low generation of particles during sputtering. Thus, this invention aims to provide a ferromagnetic material sputtering target for use in the deposition of a magnetic thin film of a magnetic recording medium, and particularly of a magnetic recording layer of a hard disk adopting the perpendicular magnetic recording system. | 05-30-2013 |
20130213802 | Sintered Compact Sputtering Target - A sintered compact sputtering target is provided and contains Co and Cr as metal components and includes oxides dispersed in the structure formed of the metal components. The structure of the sputtering target has a region (A) containing Co oxides dispersed in Co and a region (D) containing Cr oxides in a periphery of the region (A). In addition a method of producing the above referenced sintered compact sputtering target is provided and includes the steps of mixing a powder prepared by pulverizing a sintered compact containing Co oxide dispersed in Co, a Co powder, and a Cr power and pressure-sintering the resulting powder mixture to provide a sputtering target. | 08-22-2013 |
20130213803 | Fe-Pt-Based Sputtering Target with Dispersed C Grains - A sintered compact sputtering target in which a composition ratio based on atomicity is represented by a formula of (Fe | 08-22-2013 |
20140001038 | Ferromagnetic Sputtering Target with Less Particle Generation | 01-02-2014 |
20140083847 | Fe-Pt-C Based Sputtering Target - Provided is a sintered sputtering target having a composition by atomic ratio represented by the formula: (Fe | 03-27-2014 |
20140231250 | C PARTICLE DISPERSED FE-PT-BASED SPUTTERING TARGET - Provided is a sputtering target for a magnetic recording film, the sputtering target comprising 5 mol % or more and 60 mol % or less of Pt, 0.1 mol % or more and 40 mol % or less of C, 0.05 mol % or more and 20 mol % or less of titanium oxide, and the remainder being Fe. It is an object of the present invention to provide a high-density sputtering target that can produce a granular magnetic thin film without using any high-cost co-sputtering apparatuses and can also reduce the amount of particles generated during sputtering. | 08-21-2014 |
20140360871 | Fe-Pt-Ag-C-Based Sputtering Target Having C Grains Dispersed Therein, and Method for Producing Same - An Fe—Pt—Ag—C-based sintered compact sputtering target having a composition represented by a formula (Fe | 12-11-2014 |
20140367254 | Co-Cr-Pt-Based Sputtering Target and Method for Producing Same - A sputtering target containing, as metal components, 0.5 to 45 mol % of Cr and remainder being Co, and containing, as non-metal components, two or more types of oxides including Ti oxide, wherein a structure of the sputtering target is configured from regions where oxides including at least Ti oxide are dispersed in Co (non-Cr-based regions), and a region where oxides other than Ti oxide are dispersed in Cr or Co—Cr (Cr-based region), and the non-Cr-based regions are scattered in the Cr-based region. An object of this invention is to provide a sputtering target for forming a granular film which suppresses the formation of coarse complex oxide grains and generates fewer particles during sputtering. | 12-18-2014 |