Patent application number | Description | Published |
20130149183 | HIGH-STRENGTH TITANIUM ALLOY MEMBER AND PRODUCTION METHOD FOR SAME - A production method for a titanium alloy member includes preparing a titanium alloy material for sintering as a raw material of a sintered body; nitriding the titanium alloy material for sintering, thereby forming a nitrogen compound layer and/or a nitrogen solid solution layer in a surface layer of the titanium alloy material for sintering and yielding a nitrogen-containing titanium alloy material for sintering; mixing the titanium alloy material for sintering and the nitrogen-containing titanium alloy material for sintering, thereby yielding a titanium alloy material for sintering mixed with nitrogen-containing titanium alloy material; sintering the titanium alloy material for sintering mixed with nitrogen-containing titanium alloy material, thereby bonding the material each other and dispersing nitrogen contained in the nitrogen-containing titanium alloy material for sintering in a condition in which nitrogen is uniformly dispersed into an entire inner portion of the sintered body by solid solution. | 06-13-2013 |
20130195711 | HIGH-STRENGTH MAGNESIUM ALLOY WIRE ROD, PRODUCTION METHOD THEREFOR, HIGH-STRENGTH MAGNESIUM ALLOY PART, AND HIGH-STRENGTH MAGNESIUM ALLOY SPRING - A high-strength magnesium alloy wire rod suitable for products in which at least one of bending stress and twisting stress primarily acts is provided. The wire rod has required elongation and 0.2% proof stress, whereby strength and formability are superior, and has higher strength in the vicinity of the surface. In the wire rod, the surface portion has the highest hardness in a cross section of the wire rod, the highest hardness is 170 HV or more, and the inner portion has a 0.2% proof stress of 550 MPa or more and an elongation of 5% or more. | 08-01-2013 |
20140112819 | TITANIUM ALLOY MEMBER AND PRODUCTION METHOD THEREFOR - A titanium alloy member with high strength and high proof stress not only in the surface but also inside, using a general and inexpensive α-β type titanium alloy, and a production method therefor, are provided. The production method includes preparing a raw material made of titanium alloy, nitriding the raw material to form a nitrogen-containing raw material by generating a nitrogen compound layer and/or a nitrogen solid solution layer in a surface layer of the raw material, mixing the raw material and the nitrogen-containing raw material to yield a nitrogen-containing mixed material, sintering the nitrogen-containing mixed material to obtain a sintered titanium alloy member by bonding the material together and uniformly diffusing nitrogen in solid solution from the nitrogen-containing raw material to the entire interior portion of the sintered titanium alloy member, and hot plastic forming the sintered titanium alloy member. | 04-24-2014 |
20140212319 | TITANIUM ALLOY MEMBER AND PRODUCTION METHOD THEREFOR - A high strength titanium alloy member with superior fatigue resistance, and a production method therefor, are provided. The production method includes preparing a raw material made of titanium alloy, nitriding the raw material to form a nitrogen-containing raw material by generating a nitrogen compound layer and/or a nitrogen solid solution layer in a surface layer of the raw material, mixing the raw material and the nitrogen-containing raw material to yield a nitrogen-containing mixed material, sintering the nitrogen-containing mixed material to obtain a sintered titanium alloy member by bonding the material together and uniformly diffusing nitrogen in solid solution from the nitrogen-containing raw material to the entire interior portion of the sintered titanium alloy member, hot plastic forming and/or heat treating the sintered titanium alloy member to obtain a processed member, and surface treating the processed member to provide compressive residual stress. | 07-31-2014 |
20150104669 | MAGNESIUM ALLOY MEMBER AND PRODUCTION METHOD THEREFOR - A high-strength magnesium alloy member is suitable for products in which at least one of bending stress and twisting stress primarily acts. The member has required elongation and 0.2% proof stress, whereby strength and formability are superior, and has higher strength and large compressive residual stress in the vicinity of the surface of a wire rod. In the magnesium alloy member formed as a wire rod in which at least one of bending stress and twisting stress primarily acts, the wire rod includes a surface portion having the highest hardness of 170 HV or more in the vicinity of the surface and an inner portion having a 0.2% proof stress of 550 MPa or more and an elongation of 5% or more, and the wire rod has the highest compressive residue stress in the vicinity of the surface of 50 MPa or more. | 04-16-2015 |
Patent application number | Description | Published |
20110234552 | IMAGE DISPLAY APPARATUS - An image display apparatus comprises: a display panel; a row wiring drive circuit; and a column wiring drive circuit, wherein, the row wiring drive circuit includes: a selection signal output circuit which outputs a selection signal to a row wiring to be set to a selected state; a non-selection signal output circuit which outputs a non-selection signal to a row wiring to be set to a non-selected state; and an adjustment circuit which decreases an output impedance of the non-selection signal output circuit by feeding back a potential corresponding to a potential of the row wiring in the non-selected state. | 09-29-2011 |
20120307097 | SOLID-STATE IMAGE SENSOR - A solid-state image sensor comprising a pixel array having a plurality of pixels, and a plurality of signal processing circuits each of which amplifies a signal of the pixel array, wherein each of the plurality of signal processing circuits comprises an operation amplifier having an input terminal and an output terminal, an input capacitance arranged between the input terminal and the column signal line, and a feedback circuit which connects the input terminal with the output terminal, wherein the feedback circuit is configured to form a feedback path in which a first and a second capacitance elements are arranged in series in a path connecting the input terminal to the output terminal, and a third capacitance element is arranged between a reference potential and a path connecting the first capacitance element to the second capacitance element. | 12-06-2012 |
20140197302 | SOLID-STATE IMAGE SENSOR - A solid-state image sensor comprising a pixel array having a plurality of pixels, and a plurality of signal processing circuits each of which amplifies a signal of the pixel array, wherein each of the plurality of signal processing circuits comprises an operation amplifier having an input terminal and an output terminal, an input capacitance arranged between the input terminal and the column signal line, and a feedback circuit which connects the input terminal with the output terminal, wherein the feedback circuit is configured to form a feedback path in which a first and a second capacitance elements are arranged in series in a path connecting the input terminal to the output terminal, and a third capacitance element is arranged between a reference potential and a path connecting the first capacitance element to the second capacitance element. | 07-17-2014 |
20140375859 | SOLID-STATE IMAGE SENSOR - Each of pixels in a pixel array includes a photoelectric converter and a readout circuit which outputs a signal in accordance with charges generated in the photoelectric converter. The readout circuit includes a group of transistors which are disposed so as to form a current path fed by a current source. The readout circuit of a pixel in a first line in the array and the readout circuit of a pixel in a second line in the array are disposed between the photoelectric converter of the pixel in the first line and the photoelectric converter of the pixel in the second line. Directions of currents respectively flowing through the group of transistors in the readout circuit of the pixel in the first line and the plurality of transistors in the readout circuit of the pixel in the second line are the same. | 12-25-2014 |
20150189203 | SOLID STATE IMAGING DEVICE AND METHOD OF DRIVING SOLID STATE IMAGING DEVICE - A solid state imaging device includes a pixel circuit | 07-02-2015 |
20150244959 | SOLID-STATE IMAGING DEVICE AND IMAGING SYSTEM - A solid-state imaging device includes a plurality of pixels arranged in a matrix, wherein one pixel of the plurality of pixels is arranged in one unit pixel region of a plurality of unit pixel regions, a plurality of sub vertical output lines, each of which outputs pixel signals from the plurality of pixels in the same pixel column, and a plurality of block select circuits provided in one-to-one correspondence with the plurality of sub vertical output lines. A load capacitance connected to a main vertical output line is reduced by connecting the plurality of sub vertical output lines and the main vertical output line via the plurality of block select circuits. This makes high-speed pixel signal readout possible. | 08-27-2015 |