Patent application number | Description | Published |
20080196930 | Method for Manufacturing a Circuit Board Structure, and a Circuit Board Structure - This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern ( | 08-21-2008 |
20080202801 | Circuit Board Structure and Method for Manufacturing a Circuit Board Structure - The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil ( | 08-28-2008 |
20090014872 | METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE, AND A CIRCUIT BOARD STRUCTURE - This publication discloses a method for manufacturing a circuit-board structure. | 01-15-2009 |
20090133251 | MANUFACTURE OF A CIRCUIT BOARD AND CIRCUIT BOARD CONTAINING A COMPONENT - A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line. | 05-28-2009 |
20100052129 | MULTI-CHIP PACKAGE AND MANUFACTURING METHOD - Manufacturing method and a multi-chip package, which comprises a conductor pattern ( | 03-04-2010 |
20100170703 | RIGID-FLEX MODULE AND MANUFACTURING METHOD - Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane ( | 07-08-2010 |
20100188823 | Method for Manufacturing an Electronic Module - This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet ( | 07-29-2010 |
20100214750 | ELECTRONICS MODULE COMPRISING AN EMBEDDED MICROCIRCUIT - This publication discloses an electronics module comprising an insulating-material layer having two opposite surfaces, and at least one microcircuit embedded to the insulating-material layer. The microcircuit has a first contact surface comprising first contact terminals, from which the microcircuit is electrically connected to first conductor structures in the form of a patterned first conductor layer contained on first surface of the insulating-material layer, and a second contact surface opposite to the first contact surface, in which there is at least one second contact terminal, from which the microcircuit is electrically connected to second conductor structures contained in the form of a patterned second conductor layer on second surface of the insulating-material layer. According to the invention there is provided a local adhesive layer between the component and the first contact surface and first conductor layer, the adhesive layer filling the space between the component and the first conductor layer. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art. | 08-26-2010 |
20100308452 | ELECTRONIC MODULE WITH FEED THROUGH CONDUCTOR BETWEEN WIRING PATTERNS - The electronic module comprises a dielectric | 12-09-2010 |
20110061909 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME - Manufacturing method and circuit module, which comprises an insulator layer ( | 03-17-2011 |
20120018203 | ELECTRONIC MODULE WITH EMBEDDED JUMPER CONDUCTOR - The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation. | 01-26-2012 |
20120020044 | ELECTRONIC MODULE WITH VERTICAL CONNECTOR BETWEEN CONDUCTOR PATTERNS - The present invention generally relates to a new structure to be used with electronic modules such as printed circuit boards and semiconductor package substrates. Furthermore there are presented herein methods for manufacturing the same. According to an aspect of the invention, the aspect ratio of through holes is significantly improved. Aspect ratio measures a relationship of a through hole or a micro via conductor in the direction of height divided width. According to the aspect of the invention, the aspect ratio can be increased over that of the prior art solution by a factor of ten or more. | 01-26-2012 |
20140131870 | Multi-chip package and manufacturing method - Manufacturing method and a multi-chip package, which comprises a conductor pattern and insulation, and, inside the insulation, a first component, the contact terminals of which face towards the conductor pattern and are conductively connected to the conductor pattern. The multi-chip package also comprises inside the insulation a second semiconductor chip, the contact terminals of which face towards the same conductor pattern and are conductively connected through contact elements to this conductor pattern. The semiconductor chips are located in such a way that the first semiconductor chip is located between the second semiconductor chip and the conductor pattern. | 05-15-2014 |
20140208588 | Method for manufacturing an electronic module and an electronic module - This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component is glued to the surface of a conductive layer, from which conductive layer conductive patterns are later formed. After gluing the component, an insulating-material layer, which surrounds the component attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component, feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones of the component. After this, conductive patterns are made from the conductive layer, to the surface of which the component is glued. | 07-31-2014 |
20140210090 | Circuit module and method of manufacturing the same - Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A | 07-31-2014 |
20140254107 | Electronic module with embedded jumper conductor - The present invention generally provides a novel method for manufacturing an electronic module with crossed conducting lines and a novel electronic module with crossed conducting lines. In particular, an aspect of the present invention is to provide a thin, single layer electronic module. It is also an object of the present invention to provide an electronic module with an embedded jumper element having reliable high quality connections and contacts. To achieve at least some of the aspects of the present invention, an embedded pre-fabricated jumper module is placed inside a printed circuit board which allows the crossing of conducting lines within the module without manufacturing additional layers over the whole PCB board. The resultant PCB will have improved contacts and will not have surface deformation. | 09-11-2014 |
20140339963 | MICROELECTROMECHANICAL RESONATOR - A method for manufacturing microelectromechanical flexural resonators with a deforming element that has an elongate body extending along a spring axis. A deforming element is positioned on the semiconductor wafer with a defined nominal n-type doping concentration such that a crystal orientation angle is formed between the spring axis of the deforming element and a crystal axis of the silicon semiconductor wafer. The combination of the crystal orientation angle and the nominal n-type doping concentration is adjusted to a specific range, based on total frequency error of the deforming element in a broad temperature range. The combination is optimized to a range where also sensitivity to variations in the material properties is minimized. | 11-20-2014 |