Patent application number | Description | Published |
20080293334 | METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT - Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided. | 11-27-2008 |
20080293335 | METHODS AND APPARATUS FOR SUBSTRATE EDGE POLISHING USING A POLISHING ARM - Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of a substrate. The polishing arm includes i) a polishing head adapted to contact the second surface of the polishing tape, ii) a rocker arm coupled to the polishing head and adapted to rotate the polishing head around the longitudinal axis of the polishing arm and iii) a load arm extending adjacent to the rocker arm and adapted to move the polishing head in a direction perpendicular to the longitudinal axis of the polishing arm. Numerous other aspects are provided. | 11-27-2008 |
20080293340 | METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS - Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided. | 11-27-2008 |
20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING - An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided. | 11-27-2008 |
20080293344 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD - Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided. | 11-27-2008 |
20090061617 | EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY - A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate. | 03-05-2009 |
20090255911 | LASER SCRIBING PLATFORM AND HYBRID WRITING STRATEGY - Laser scribing can be performed on a workpiece ( | 10-15-2009 |
20090264053 | APPARATUS AND METHODS FOR USING A POLISHING TAPE CASSETTE - Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided. | 10-22-2009 |
20090280580 | CMP PAD THICKNESS AND PROFILE MONITORING SYSTEM - In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison. | 11-12-2009 |
20090314751 | LASER SCRIBE INSPECTION METHODS AND SYSTEMS - Methods and systems for use during laser-scribing of a workpiece are provided. Some of the methods and systems provided use an imaging device to control the formation of a laser-scribed feature so as to more closely align with a previously-formed feature. Some of the methods and systems provided use an imaging device for inspection of a laser-scribed feature and/or process control. Some of the methods and systems provided use an imaging device to detect and avoid a workpiece defect during the formation of a laser-scribed feature. | 12-24-2009 |
20090314752 | IN-SITU MONITORING FOR LASER ABLATION - In a system where scribe lines are formed by a series of partially-overlapping ablation spots, discontinuities can be detected by capturing an intensity of light generated during each instance of ablation for a respective spot. In any instance where the intensity of light given off falls below a desired threshold, such that the ablation spot might not sufficiently overlap any adjacent spot, the position of that instance can be captured such that another attempt at ablation can be carried out at that location. | 12-24-2009 |
20100105291 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided. | 04-29-2010 |
20100105294 | METHODS AND APPARATUS TO MINIMIZE THE EFFECT OF TAPE TENSION IN ELECTRONIC DEVICE POLISHING - Methods and apparatus are provided for reducing tension on a polishing roller. In some aspects, a polishing head may be provided that is adapted to contact a substrate. The polishing head includes: a polishing unit having a polisher and at least one pair of tension distributors adapted to reduce tension on the polisher; and one or more pairs feed guides. Numerous other aspects are provided. | 04-29-2010 |
20100105299 | METHODS AND APPARATUS FOR POLISHING AN EDGE AND/OR NOTCH OF A SUBSTRATE - Apparatus and methods are provided to polish a substrate. In some aspects, the invention includes a polishing head adapted to apply a polishing tape against at least one of a substrate edge and a notch in the substrate edge. The polishing head includes a polisher coupled to the polishing head, wherein the polisher has a hollow portion and is adapted to conform to a shape of at least one of the substrate edge and the notch. Numerous other aspects are provided. | 04-29-2010 |
20100267318 | POLISHING PAD WITH PROJECTING PORTION - A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer. | 10-21-2010 |
20110132884 | LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING - Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface. | 06-09-2011 |
20110139755 | MULTI-WAVELENGTH LASER-SCRIBING TOOL - Multi-wavelength laser-scribing systems are disclosed. A system for scribing a workpiece includes a frame, a translation stage coupled with the frame to support the workpiece and translate the supported workpiece relative to the frame in a longitudinal direction, at least one laser operable to generate a first output having a first wavelength and generate a second output having a second wavelength, and at least one scanning device coupled with the frame and operable to control a position of the first and second outputs. Each of the first and second outputs are able to remove material from at least a portion of the workpiece. Laser assemblies that each include a laser and at least one scanning device can be arranged in rows to enhance the rate at which latitudinal scribe lines are formed. | 06-16-2011 |
20110139758 | LATITUDINAL ISO-LINE SCRIBE, STITCHING, AND SIMPLIFIED LASER AND SCANNER CONTROLS - The stitch points of segments formed into a workpiece by laser scribing can be improved by controlling aspects such as the velocity of the scanner and the switching points of the laser, such as to allow for lead-in, lead-out, and overlap periods. The locations of the stitch points also can be selected to coincide with existing lines such that the existing lines will function to connect the segments in the event of an offset. | 06-16-2011 |
20110253685 | LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE - Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander. | 10-20-2011 |