Patent application number | Description | Published |
20130094684 | MICROMECHANICAL FUNCTIONAL APPARATUS, PARTICULARLY A LOUDSPEAKER APPARATUS, AND APPROPRIATE METHOD OF MANUFACTURE - A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus. | 04-18-2013 |
20130100774 | SYSTEM FOR DETERMINING THE DISTANCE FROM AND THE DIRECTION TO AN OBJECT - A system for determining the distance from and the direction to an object includes an emitter and at least two receiver elements for receiving a signal which is transmitted by the emitter and reflected by the object. The receiver elements are arranged as a linear array, as two linear arrays situated at an angle to one another, as an array which surrounds the emitter and forms a circle, or as a two-dimensional array. The diameter of the array may be greater than one-half the wavelength of the signal, and the receiver elements each have an individual surface area whose height or diameter corresponds at most to one-half the wavelength of the signal, and the emitter has a height or a diameter which is greater than one-half the wavelength of the signal. | 04-25-2013 |
20130126991 | MICROMECHANICAL FUNCTIONAL APPARATUS, PARTICULARLY A LOUDSPEAKER APPARATUS, AND APPROPRIATE METHOD OF MANUFACTURE - A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate having a top and an underside and at least one circuit chip mounted on the underside in a first cavity. The apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement, having a plurality of micromechanical loudspeakers mounted on the top in a second cavity. A covering device is mounted above the micromechanical functional arrangement on the top. An appropriate method is implemented to manufacture the micromechanical functional apparatus. | 05-23-2013 |
20130126992 | MEMS Chip Package and Method for Manufacturing an MEMS Chip Package - A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate. | 05-23-2013 |
20130228937 | Micromechanical Sound Transducer Arrangement and a Corresponding Production Method - A micromechanical sound transducer arrangement includes an electrical printed circuit board having a front side and a rear side. A micromechanical sound transducer structure is applied to the front side using the flip-chip method. The printed circuit board defines an opening for emitting soundwaves in the region of the micromechanical sound transducer structure. | 09-05-2013 |
20130287232 | PIEZOELECTRIC PARTIAL-SURFACE SOUND TRANSDUCER - A piezoelectric sound transducer using a piezoelectric plastic material is developed from a substrate layer and a layer of a piezoelectric plastic material deposited thereon, the piezoelectric plastic layer covering the substrate layer not completely but having openings. | 10-31-2013 |
20150146895 | ELECTROACTIVE SOUND TRANSDUCER FOIL HAVING A STRUCTURED SURFACE - An electroactive sound transducer foil includes a composite foil made up of at least one carrier foil, at least one first and one second electrode, and at least one piezoelectric layer including an electroactive polymer, the surface of the sound transducer foil including a structuring having different slopes, and the slope of the sound transducer foil surface changing the sign at least twice. | 05-28-2015 |
20150226844 | METHOD FOR CHECKING A SURROUNDINGS SENSOR DEVICE, REFERENCE SOUND SOURCE, AND CORRESPONDING SURROUNDINGS SENSOR DEVICE - A method for checking a surroundings sensor device including the following: transmitting a reference sound signal by a reference sound source; detecting the reference sound signal by a receiving device of the surroundings sensor device; and calibrating the surroundings sensor device by a computer unit of the surroundings sensor device based on the detected reference sound signal for checking the surroundings sensor device. | 08-13-2015 |