Alur
Amruthavalli P. Alur, Chandler, AZ US
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20090053466 | Heat resistant halogen free substrate core material - In one embodiment, a substrate includes a core material formed from a filler including aluminum trihydrate and a secondary filler material. The secondary filler material has a secondary decomposition reaction that occurs at a temperature higher than a reflow temperature reached during processing of the substrate, or the secondary filler traps water released at reflow temperature by aluminum trihydrate. Other embodiments are described and claimed. | 02-26-2009 |
20090246462 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 10-01-2009 |
20100078805 | METHOD AND CORE MATERIALS FOR SEMICONDUCTOR PACKAGING - A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element. | 04-01-2010 |
20110135883 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 06-09-2011 |
Amruthavalli P. Alur, Tempe, AZ US
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20140376195 | Methods of forming dual sided coreless package structures with land side capacitor - Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates. | 12-25-2014 |
20150255411 | DIE-TO-DIE BONDING AND ASSOCIATED PACKAGE CONFIGURATIONS - Embodiments of the present disclosure are directed towards die-to-die bonding and associated integrated circuit (IC) package configurations. In one embodiment, a package assembly includes a package substrate having a solder resist layer disposed on a first side and a second side disposed opposite to the first side, a first die mounted on the first side and having an active side that is electrically coupled with the package substrate by one or more first die-level interconnects and a second die bonded with the active side of the first die using one or more second die-level interconnects, wherein at least a portion of the second die is disposed in a cavity that extends into the solder resist layer. Other embodiments may be described and/or claimed. | 09-10-2015 |
Amruthavalli Pallavi Alur, Tempe, AZ US
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20160044786 | ELECTRONIC PACKAGE WITH NARROW-FACTOR VIA INCLUDING FINISH LAYER - This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a substantially non-conductive material, the package insulator layer being substantially planar, and a via. The via may be formed within the package insulator layer and electrically coupled to the electrically conductive pad. The via may include a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer secured to the second end of the conductor, the finish layer including a gold compound. | 02-11-2016 |
Amruthavalll P. Alur, Chandler, AZ US
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20100289154 | METHOD AND CORE MATERIALS FOR SEMICONDUCTOR PACKAGING - A semiconductor package comprises a semiconductor substrate that may comprise a core. The core may comprise one or more materials selected from a group comprising ceramics and glass dielectrics. The package further comprises a set of one or more inner conductive elements that is provided on the core, a set of one or more outer conductive elements that is provided on an outer side of the substrate, and a semiconductor die to couple to the substrate via one or more of the outer conductive elements. Example materials for the core may comprise one or more from alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. A laser may be used to drill one or more plated through holes to couple an inner conductive element to an outer conductive element. A dielectric layer may be formed in the substrate to insulate an outer conductive element from the core or an inner conductive element. | 11-18-2010 |
Deepak Alur, Fremont, CA US
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20140351233 | SYSTEM AND METHOD FOR CONTINUOUS ANALYTICS RUN AGAINST A COMBINATION OF STATIC AND REAL-TIME DATA - A system for continuous analytics comprises an in-memory storage and a processor. The processor receives a query that indicates an analytic function to be performed on a combination of static data and real-time data. The processor loads the in-memory storage from a first source external to the processor with data that was stored as the static data. At the same time that the in-memory storage is already loaded with the static data, the processor continuously receives ephemeral real-time data as it is being generated by a second source external to the processor. The processor runs the analytic function from the query against the in-memory storage loaded with the first data and the real-time data that is being continuously received, in combination, to produce a result of the analytic function. The result is stored and time-stamped in the in-memory storage as an analytic cube. | 11-27-2014 |
20150066930 | GENERATION OF METADATA AND COMPUTATIONAL MODEL FOR VISUAL EXPLORATION SYSTEM - Various mechanisms are described for generating metadata describing relationships among data sets. Quantitative data can be analyzed to determine relationships, and metadata representing the determined relationships can then be stored. Visualizations can then be generated from the metadata, and a navigational model can be defined based on the generated set of visualizations. The navigational models can provide robust visual mechanics for implementing intuitive navigational schemes that facilitate interaction with data on any suitable output device, include small screens as found on smartphones and/or tablets. | 03-05-2015 |
20150067556 | MULTI-FACETED NAVIGATION OF HIERARCHICAL DATA - Various mechanisms are provided for navigating among visualizations of quantitative data. At least one relationship is defined among a plurality of visualizations. A virtual multi-faceted shape is constructed, having a plurality of surfaces, some or all of which may correspond to visualizations. Visualizations may be presented, for example, by projecting or texture mapping the visualizations on corresponding surfaces of the shape. In at least one embodiment, surfaces are spatially oriented with one another in a manner that represents a relationship between the corresponding two visualizations. The user can interact with the virtual shape, for example by causing it to rotate, zoom, move, or the like. Such interactions cause different visualizations to be displayed. | 03-05-2015 |
Hemant H. Alur, Parsippany, NJ US
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20090170955 | Fast Release Paracetamol Tablets - A pharmaceutical composition such as a swallow tablet or capsule formulation is described comprising paracetamol, calcium carbonate, at least one binding agent and at least one disintegrating agent in the form of a granulate, optionally combined with one or more pharmaceutically acceptable extragranular components. | 07-02-2009 |
Hemant H. Alur, Haskell, NJ US
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20100324110 | Self Solidifying Bioerodible Barrier Implant - Provided are bioerodible compositions that can be implanted into cavities of mammalian tissue as a liquid or semi-liquid and which solidify upon exposure to body temperature of the mammal. The implants erode over a prescribed period of time and elute a drug. The implants also form a seal with the skin or mucosa surrounding the cavity to prevent the entry of bacterial pathogens. | 12-23-2010 |
20130338088 | SELF SOLIDIFYING BIOERODIBLE BARRIER IMPLANT - Provided are bioerodible compositions that can be implanted into cavities or mammalian tissue as a liquid or semi-liquid and which solidify upon exposure of the body temperature of the mammal. The implants erode over a prescribed period of time and elute a drug. The implants also form a seal with the skin or mucosa surrounding the cavity to prevent the entry of bacterial pathogens. | 12-19-2013 |
Hemant H. Alur, Basking Ridge, NJ US
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20130131166 | BIOADHESIVE COMPOSITIONS FOR EPITHELIAL DRUG DELIVERY - Disclosed are compositions and methods for treating a disease, such as infection, pain, or inflammation, by using the compositions. Particularly, disclosed is a method of treating oral pain, wherein, the above-described compositions are applied to the oral mucosa; the compositions undergo in-situ gelation, optimal adhesion to the oral mucosa, controlled erosion and controlled release of the active ingredient, i.e., benzocaine, which provides a superior degree of pain relief or analgesia for an extended period of time. | 05-23-2013 |
Pallavi Alur, Chandler, AZ US
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20090321932 | Coreless substrate package with symmetric external dielectric layers - A thin die Package Substrate is described that may be produced using existing chemistry. In one example, a package substrate is built over a support material. A dry film photoresist layer is formed over the package substrate. The support material is removed from the package substrate. The dry film photoresist layer is removed from the substrate and the substrate is finished for use with a package. | 12-31-2009 |