Patent application number | Description | Published |
20080314320 | Chamber Mount for High Temperature Application of AIN Heaters - A susceptor for high temperature semiconductor processing is provided. The susceptor includes a substrate support joined to a hollow shaft having a pair of ports to allow an inert gas to be purged through an internal volume of the shaft. Some embodiments of the susceptor include a chamber mount to support the shaft within a processing chamber and a chamber mount insert disposed within the chamber mount. In these embodiments the chamber mount insert includes the ports. The chamber mount insert can also include a thermocouple tube with a fitting to seal around the thermocouple and to impart an upward pressure to the thermocouple to keep the thermocouple properly seated within the substrate support. The chamber mount insert can also include electrical connectors with glass-to-metal seals. | 12-25-2008 |
20100177454 | Electrostatic chuck with dielectric inserts - An electrostatic chuck with dielectric inserts provides conveyance of cooling gas while eliminating arc path to a workpiece surface. The electrostatic chuck includes the workpiece surface configured to support a substrate such as a semiconductor wafer, a plenum configured to carry a cooling gas, and a plurality of dielectric inserts configured to provide communication of the cooling gas between the plenum and the workpiece surface. The dielectric inserts may comprise a passage to provide the communication of the cooling gas. The dielectric inserts may be further configured to prevent line-of-sight between the workpiece surface of the electrostatic chuck and a conducting surface within the electrostatic chuck. | 07-15-2010 |
20130136878 | High Speed Low Temperature Method For Manufacturing And Repairing Semiconductor Processing Equipment And Equipment Produced Using Same - A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired. | 05-30-2013 |
20130180976 | Multi-Layer Plate Device - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-18-2013 |
20130181038 | Method For Hermetically Joining Plate And Shaft Devices Including Ceramic Materials Used In Semiconductor Processing - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-18-2013 |
20130186940 | Hermetically Joined Ceramic Assemblies And Low Temperature Method For Hermetically Joining Ceramic Materials - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-25-2013 |
20130189022 | Hermetically Joined Plate And Shaft Devices - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-25-2013 |
20140014642 | Multiple Zone Heater - A multi-zone heater with a plurality of thermocouples such that different heater zones can be monitored for temperature independently. The independent thermocouples may have their leads routed out from the shaft of the heater in a channel that is closed with a joining process that results in hermetic seal adapted to withstand both the interior atmosphere of the shaft and the process chemicals in the process chamber. The thermocouple and its leads may be enclosed with a joining process in which a channel cover is brazed to the heater plate with aluminum. | 01-16-2014 |
20140014710 | Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized Regions - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The ceramic pieces may be pre-metallized using a thin film sputtering technique which deposits aluminum, or an aluminum alloy, onto the joint interface areas. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 01-16-2014 |
20140197227 | Method For Manufacture Of A Multi-Layer Plate Device - A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. | 07-17-2014 |