Patent application number | Description | Published |
20090081765 | CELL ELECTROPHYSIOLOGICAL SENSOR AND METHOD FOR MANUFACTURING THE SAME - In a cell electrophysiological sensor having a thin plate with a through hole, a support plate with a through hole and a container plate with a through hole stuck to an upper portion of this support plate, the support plate and the container plate are stuck to each other through fusion with a portion of the outer shape of a first electrode in a ring shape intervening in a portion of the interface. In this configuration, a cell electrophysiological sensor which allows for measurement with high precision can be attained, and a manufacturing method which is excellent in terms of mass production can be provided. | 03-26-2009 |
20090152110 | Chip For Cell Electrophysiological Sensor, Cell Electrophysiological Sensor Using The Same, and Manufacturing Method of Chip for Cell Electrophysiological Sensor - A chip for a cell electrophysiological sensor has a substrate. The substrate has a through-hole formed from the upside to the downside, and the opening of the through-hole is formed in a curved surface curved from the upside and downside of the substrate toward the inner side of the through-hole. In this configuration, the electrolyte solution (first electrolyte solution and second electrolyte solution) flows more smoothly, and the sample cell can be sucked accurately, and the trapping rate of the sample cells is improved. | 06-18-2009 |
20090239033 | DIAPHRAGM AND DEVICE FOR MEASURING CELLULAR POTENTIAL USING THE SAME, MANUFACTURING METHOD OF THE DIAPHRAGM - A diaphragm is formed by etching a substrate. This substrate has a first surface provided with a depression by isotropic dry etching, and a second surface opposite the first surface. Furthermore, a through-hole is formed from the depression to the second surface by anisotropic dry etching. The depression and the through-hole are formed by using one resist mask. The depression has a hemispherical shape or a semi-elliptical spherical shape. | 09-24-2009 |
20090281410 | DEVICE FOR CELLULAR ELECTROPHYSIOLOGY SENSOR, CELLULAR ELECTROPHYSIOLOGY SENSOR USING THE DEVICE, AND METHOD FOR MANUFACTURING THE CELLULAR ELECTROPHYSIOLOGY SENSOR DEVICE - A leakage current on a side surface of a sensor chip of a cell electrophysiological sensor is reduced. In order to do so, a sensor chip having a continuity hole and a chip holding part covering the side surface of the sensor chip are provided. The sensor chip includes silicon as a main component, and the chip holding part is made of glass. The chip holding part is adhesively bonded to the side surface of the sensor chip by glass welding. Thus, in the cell electrophysiological sensor device of the present invention, the airtightness between the side surface of the sensor chip and the chip holding part is improved, so that a leakage current can be reduced. | 11-12-2009 |
20100126922 | COMPONENT SEPARATION DEVICE - A component separating device includes a flow channel, an acoustic wave generator for generating an acoustic wave in the flow channel, a first inlet channel for introducing a fist solution containing solid particles into the flow channel, a second inlet channel for introducing a second solution, and outlet channels for discharging a solution from the flow channel. A density grade generator is provided at the first inlet channel for forming a density grade of the solid particles. This component separating device extracts the solid particles into a high-purity solution at a high collecting rate. | 05-27-2010 |
20100219488 | SILICON STRUCTURE, METHOD FOR MANUFACTURING THE SAME, AND SENSOR CHIP - A silicon structure of the present invention is provided with a silicon substrate ( | 09-02-2010 |
20110002088 | ELECTRODE FOIL FOR CAPACITOR, ELECTROLYTIC CAPACITOR USING THE SAME, AND METHOD FOR MANUFACTURING ELECTRODE FOIL FOR CAPACITOR - An electrode foil includes a base made of foil of valve metal, and a rough surface layer made of valve metal provided on a surface of the base. The rough surface layer includes plural tree structures extending d from the base. Each of the tree structures includes plural particles of valve metal linked together, and is branched into plural twigs. This electrode foil provides an electrolytic capacitor with a small size and a large capacitance. | 01-06-2011 |
20110182003 | ELECTRODE FOIL FOR CAPACITOR, MANUFACTURING METHOD THEREFOR, AND SOLID ELECTROLYTIC CAPACITOR USING THE ELECTRODE FOIL - An electrode foil for capacitor includes a substrate made of a valve metal foil, a first rough surface layer made of a valve metal formed on the first surface of the substrate by vapor deposition, and a second rough surface layer made of a valve metal formed on the second surface of the substrate by vapor deposition. The mode of diameters of pores of the first and second rough surface layers ranges from 0.02 μm to 0.10 μm. The thickness of the first rough surface layer is larger than the thickness of the second rough surface layer. The electrode foil has the rough surface layers formed by vapor deposition fabricated stably so that a solid electrolytic capacitor with high capacitance can be obtained using the foil. | 07-28-2011 |
20110216470 | ELECTRODE FOIL AND CAPACITOR USING THE SAME - An electrode foil includes a substrate made of metal and a rough layer disposed on a surface of the substrate and including plural fine metallic particles. The rough layer includes a lower layer, an intermediate layer which is disposed on the lower layer and is more distanced from the substrate than the lower layer is, and an upper layer which is disposed on the intermediate layer and is more distanced from the substrate than the intermediate layer is. The mode of diameters of fine particles in the intermediate layer is greater than the mode of diameters of the fine particles in the upper and lower layers. This electrode foil provides a capacitor having a small leakage current. | 09-08-2011 |
20110216478 | ELECTRODE FOIL FOR CAPACITOR AND ELECTROLYTIC CAPACITOR USING THE ELECTRODE FOIL - An electrode foil for capacitor includes a substrate made of valve metal and a rough-surface layer on the substrate. The rough-surface layer includes a base layer on the substrate and a cover layer on the base layer. The base layer includes first fine particles made of valve metal. The cover layer includes second fine particles made of valve metal. The first fine particles have an average particle diameter larger than that of the second fine particles. This electrode foil has the rough-surface layer that can be produced stably by vapor deposition and provides an electrolytic capacitor having a large capacitance. | 09-08-2011 |
20120170173 | ELECTRODE FOIL AND CAPACITOR USING SAME - An electrode foil includes a substrate and a coarse film layer having a void therein and formed on the substrate. The coarse film layer includes at least a first coarse film layer formed on the substrate. The first coarse film layer is composed of arrayed first columnar bodies. Each of the first columnar bodies is composed of metallic microparticles stacked on a surface of the substrate and extending in a curve from the surface of the substrate. | 07-05-2012 |
20130040094 | FIBROUS PROJECTIONS STRUCTURE - A silicon structure of the present invention is provided with a silicon substrate ( | 02-14-2013 |
20140133068 | CAPACITOR - A capacitor comprising a capacitor element including a substrate having first and second faces, a porous first rough surface layer formed on the first face and having pores, a first inner conductive polymer layer formed in the pores, a first outer conductive polymer layer formed on the inner conductive polymer layer, a porous second rough surface layer formed on the second face and having pores, a second inner conductive polymer layer formed in the pores, a second outer conductive polymer layer formed on the second inner conductive polymer layer, and a dielectric layer formed on surfaces of the first and the second rough surface layer. A surface area of the second rough surface layer is smaller than that of the first rough surface layer. The second outer conductive polymer layer is thicker than the first outer conductive polymer layer. This structure enables to eliminate warpage of a capacitor element. | 05-15-2014 |