Patent application number | Description | Published |
20080266421 | IMAGE CAPTURE DEVICE AND IMAGE PROCESSING DEVICE - An image capture device includes: an imager for imaging an object and generating image data; an image file generator for generating an image file by adding, to the image data generated by the imager, a header portion which stores at least one type of information concerning shooting circumstances; a timer for outputting information indicating a current time; and a manipulation section which is used to set period information specifying a period. The image file generator changes the type of information to be stored in the header portion depending on whether a time of imaging as indicated by the information which is output from the timer at the time of the imaging falls within the period specified by the period information. | 10-30-2008 |
20090011676 | Component Bonding Method and Component Bonding Device - Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information. | 01-08-2009 |
20090038698 | Coupling apparatus for passage blocks - A passage block coupling apparatus is provided with a bolt insertion hole | 02-12-2009 |
20090244351 | IMAGE CAPTURE DEVICE - An image capture device includes a viewfinder for viewing a subject. The viewfinder either forms an integral part of the device or is an external member that is attachable to, and removable from, the device. The device includes: an optical system; a generating section for capturing an image of the subject through the optical system and generating image data; a detecting section for detecting the degree of focusing of the subject's image represented by the image data; a display section on which the subject's image is presentable based on the image data; and a controller for accepting a decision to use either the display section or the viewfinder for viewing the subject to shoot. If the controller accepts the decision to use the viewfinder, the display section displays no subject's image, and displays information about the degree of focusing of the subject's image for at least a certain period of time. The information has been obtained based on a result of detection done by the detecting section. | 10-01-2009 |
20100318941 | ELECTRONIC DEVICE - A user-friendly electronic device is provided by getting icons shown on a display section. | 12-16-2010 |
20110122293 | IMAGE PROCESSING UNIT - An image processor that can get a number of image files resized collectively is provided in order to realize a more user-friendly resizing function. | 05-26-2011 |
20120062598 | IMAGE DISPLAYING APPARATUS - The image displaying apparatus of the present invention provides a first display mode in which a first display region for one screen image is formed in a display screen, with the short side direction of the display screen aligned with the vertical direction; and a second display mode in which a first display region and a second display region for two screen images are formed in the display screen, with the long side direction of the display screen aligned with the vertical direction, and the first display region and the second display region formed such that they are arranged up and down. According to this configuration, when images are displayed in a double screen, each image can be displayed as large as possible. | 03-15-2012 |
Patent application number | Description | Published |
20100292138 | Peptide Derived from Hepatitis C Virus - Disclosed is a pharmaceutical composition for the treatment of an HCV-related disease in a patient having HLA-A24 or -A3 supertype, wherein the pharmaceutical composition comprises a peptide having an amino acid sequence represented by the formula: YLLPRRGPRL (SEQ ID NO:1) as an active ingredient. Also disclosed is a composition for use in the detection of the induction of an HLA-A24 or -A3 supertype-restricted cytotoxic T cell in a patient having HLA-A24 or -A3 supertype, wherein the composition comprises a peptide having an amino acid sequence depicted in SEQ ED NO:1 as an active ingredient. | 11-18-2010 |
20150216958 | CANCER PEPTIDE VACCINE - A composition for treating cancer, comprising 6 to 13 peptides derived from tumor antigens, wherein the composition is used in the manner that antibodies to the respective peptides in the peripheral blood of a patient are measured and peptides to which antibodies are positive are selected and administered to the patient, and a peptide selection method. | 08-06-2015 |
20150343041 | CTL INDUCER COMPOSITION - The present invention provides a CTL inducer composition which comprises one or more peptides selected from the group consisting of the peptides of SEQ ID NOS: 1 to 27 in the Sequence Listing, and can be used for the treatment or prevention of cancer or a hepatitis C virus-related disease in two or more patient groups selected from the group consisting of an HLA-A2 positive patient group, an HLA-A24 positive patient group, an HLA-A26 positive patient group, and an HLA-A3 supertype positive patient group. | 12-03-2015 |
Patent application number | Description | Published |
20080293202 | Method for manufacturing semiconductor device - A semiconductor device includes: a semiconductor substrate with a principal plane; a base region disposed on the principal plane; a source region disposed on the principal plane in the base region to be shallower than the base region; a drain region disposed on the principal plane, and spaced to the base region; a trench disposed on the principal plane; a trench gate electrode disposed in the trench through a trench gate insulation film; a planer gate electrode disposed on the principal plane of the semiconductor substrate through a planer gate insulation film; and an impurity diffusion region having high concentration of impurities and disposed in a portion of the base region to be a channel region facing the planer gate electrode. | 11-27-2008 |
20090121290 | Semiconductor device with high-breakdown-voltage transistor - A semiconductor device includes a high-breakdown-voltage transistor having a semiconductor layer. The semiconductor layer has an element portion and a wiring portion. The element portion has a first wiring on a front side of the semiconductor layer and a backside electrode on a back side of the semiconductor layer. The element portion is configured as a vertical transistor that causes an electric current to flow in a thickness direction of the semiconductor layer between the first wiring and the backside electrode. The backside electrode is elongated to the wiring portion. The wiring portion has a second wiring on the front side of the semiconductor layer. The wiring portion and the backside electrode provide a pulling wire that allows the electric current to flow to the second wiring. | 05-14-2009 |
20090127605 | Semiconductor device and method for manufacturing the same - A semiconductor device includes: n transistor elements; n resistive elements; and n capacitive elements, each kind of elements coupled in series between the first and second terminals. The gate of each transistor element has a gate pad, and each transistor element includes transistor pads disposed on both sides. Each resistive element includes resistive pads disposed on both sides. Each capacitive element includes capacitive pads disposed on both sides. The gate pad other than the first stage transistor element, a corresponding resistive pad, and a corresponding capacitive pad are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the first stage are electrically coupled. One transistor pad, one resistive pad, and one capacitive pad in the n-th stage are electrically coupled. | 05-21-2009 |
20090152668 | Semiconductor apparatus - A semiconductor apparatus is disclosed. The semiconductor apparatus includes an SOI substrate including an active layer, a buried insulation film and a support substrate; a low potential reference circuit part located in the active layer and operable at a first reference potential; a high potential reference circuit part located in the active layer and operable at a second reference potential; a level-shifting element forming part located in the active layer and for providing a level-shift between the first and second reference potentials; and an insulation member insulating first and second portions of the support substrate from each other, wherein locations of the first and second portions respectively correspond to the low and high potential reference circuit parts. | 06-18-2009 |
20100099225 | Method for manufacturing semiconductor device having LDMOS transistor - A semiconductor device includes: a semiconductor substrate having a first semiconductor layer, an insulation layer and a second semiconductor layer, which are stacked in this order; a LDMOS transistor disposed on the first semiconductor layer; and a region having a dielectric constant, which is lower than that of the first or second semiconductor layer. The region contacts the insulation layer, and the region is disposed between a source and a drain of the LDMOS transistor. The device has high withstand voltage in a direction perpendicular to the substrate. | 04-22-2010 |
20100238632 | Load driving device - A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode substrate. The output power device and the driving IC are mounted on the first electrode substrate. In this case, the output power device is controlled with high speed, and a mounting area of the output power device and the driving IC is reduced. | 09-23-2010 |
20110298446 | CURRENT SENSOR, INVERTER CIRCUIT, AND SEMICONDUCTOR DEVICE HAVING THE SAME - A semiconductor device having a lateral semiconductor element includes a semiconductor substrate, a first electrode on the substrate, a second electrode on the substrate, and an isolation structure located in the substrate to divide the substrate into a first island and a second island electrically insulated from the first island. The lateral semiconductor element includes a main cell located in the first island and a sense cell located in the second island. The main cell causes a first current to flow between the first electrode and the second electrode so that the first current flows in a lateral direction along the surface of the substrate. The first current is detected by detecting a second current flowing though the sense cell. | 12-08-2011 |
20130009272 | Semiconductor device - A semiconductor device includes a semiconductor substrate, a semiconductor element disposed in the semiconductor substrate, a guard ring surrounding at least a part of a periphery of the semiconductor element, a guard ring terminal coupled with the guard ring, a power supply line divided from a line coupled with a power source and applying a first constant voltage to the semiconductor element based on a voltage generated by the power source, a guard ring terminal fixation line divided from the line coupled with the power source and applying a second constant voltage to the guard ring terminal, a bypass capacitor disposed on the guard ring terminal fixation line so as to be coupled in parallel with the guard ring, and a resistor disposed on the guard ring terminal fixation line between the power source and the bypass capacitor. | 01-10-2013 |
20130075877 | SEMICONDUCTOR DEVICE HAVING LATERAL ELEMENT - A semiconductor device with a lateral element includes a semiconductor substrate, first and second electrodes on the substrate, and a resistive field plate extending from the first electrode to the second electrode. The lateral element passes a current between the first and second electrodes. A voltage applied to the second electrode is less than a voltage applied to the first electrode. The resistive field plate has a first end portion and a second end portion opposite to the first end portion. The second end portion is located closer to the second electrode than the first end portion. An impurity concentration in the second end portion is equal to or greater than 1×10 | 03-28-2013 |
20140048911 | LATERAL SEMICONDUCTOR DEVICE - A lateral semiconductor device includes a semiconductor layer, an insulating layer, and a resistive field plate. The semiconductor layer includes a first semiconductor region and a second semiconductor region at a surface portion, and the second semiconductor region makes a circuit around the first semiconductor region. The insulating layer is formed on a surface of the semiconductor layer and is disposed between the first and second semiconductor regions. The resistive field plate is formed on a surface of the insulating layer. Between the first and second semiconductor regions, a first section and a second section are adjacent to each other along a circumferential direction around the first semiconductor region. The resistive field plate includes first and second resistive field plate sections respectively formed in the first and second sections, and the first and second resistive field plate sections are separated from each other. | 02-20-2014 |
Patent application number | Description | Published |
20100055404 | METHOD FOR PRODUCING FILM AND OPTICAL FILM - A method for producing a film comprises the steps of melting a thermoplastic resin in an extruder having a hopper cooling zone, a feed zone, a compression zone, and a metering zone; discharging a melted resin from the extruder and supplying the same to a die; extruding the melted resin through the die in a sheet-like form; and cooling and solidifying the sheet-like melted resin to produce a film; wherein a relationship between a temperature, T | 03-04-2010 |
20120028019 | METHOD OF PRODUCING POLYESTER SHEET, POLYESTER FILM AND METHOD OF PRODUCING POLYESTER FILM - The present invention provides a method for producing a polyester sheet, including melt-extruding a polyester having a half-value width of a crystallization temperature on cooling of 25° C. to 50° C.; and cooling the melt-extruded polyester such that a surface temperature of the polyester is lowered at a rate of 350° C./min to 590° C./min, wherein the polyester sheet has a thickness of 3 mm to 5 mm. | 02-02-2012 |
20120070615 | POLYESTER FILM, METHOD FOR PRODUCING THE SAME, BACK SHEET FOR SOLAR CELLS, AND SOLAR CELL MODULE - Provided is a method for producing a polyester film, including: subjecting a polyester raw material resin, which contains a titanium compound and has an intrinsic viscosity of from 0.71 to 1.00, to melt extrusion using a twin-screw extruder which includes a cylinder; two screws disposed inside the cylinder; and a kneading disk unit disposed in at least a portion of a region extending from a 10%-position to a 65%-position of screw length with respect to an upstream end of the screws in a resin extrusion direction as a starting point, at a maximum shear rate generated inside the twin-screw extruder of from 10 sec | 03-22-2012 |
Patent application number | Description | Published |
20080295770 | Liquid substance supply device for vaporizing system, vaporizer, vaporization performance appraisal method - In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance. | 12-04-2008 |
20090045531 | Liquid substance supply device for vaporizing system, vaporizer, vaporization performance appraisal method - In a liquid substance supply device, a three port two valve directional control valve is provided in a transfer line, and a substance container and the transfer line are connected together by a four port three valve directional control valve in such a way that the four port three valve directional control valve and the substance container can be removed from the transfer line as a unit. Furthermore, in a vaporizer, an orifice member is provided to surround the end portion of an internal conduit in which flows a mixture substance consisting of a gas and a liquid substance mixed therewith, and gas for atomization is spouted into a vaporization chamber through a gap defined between the internal conduit and the orifice member. Yet further, the temperature of a vaporization surface in the vaporization chamber can be controlled independently in correspondence with the nature of the liquid substance. | 02-19-2009 |
Patent application number | Description | Published |
20120110841 | COMPONENT MOUNTING APPARATUS AND METHOD THEREOF - A challenge to be met by the present invention is to feed a carrier tape with superior positional accuracy by means of a simple, inexpensive configuration, thereby enhancing punching accuracy of a component and implementing highly reliable component mounting. A carrier tape feeder that feeds a carrier tape ( | 05-10-2012 |
20130269179 | INVERTING HEAD - A nozzle holder | 10-17-2013 |
20140068928 | COMPONENT MOUNTING APPARATUS - A inverting head | 03-13-2014 |
20150082621 | COMPONENT MOUNTING APPARATUS - A component mounting apparatus that compresses a component to a transparent substrate on which the component is placed with a photocurable resin interposed therebetween. The component mounting apparatus includes: a receiving unit that includes a base member and a transparent member provided on an upper surface of the base member and receives a surface of the substrate, which is positioned below the component, on an upper surface of the transparent member; a pressing unit that presses the component against the substrate received by the receiving unit; and a light irradiation unit that irradiates the photocurable resin with light through the transparent member. | 03-26-2015 |
20150096687 | BONDING APPARATUS - A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface. | 04-09-2015 |
20160052196 | COMPONENT CRIMPING APPARATUS - A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part having a base part with an optical path and a transparent member on the base part and connected to the optical path, and supports, by the transparent member, a region under a targeted electrode in the substrate; a crimping tool arranged over the transparent member and presses the component to the substrate; a light irradiating part that irradiates the adhesive member attached to the targeted electrode with light through the optical path; and a light shielding member that covers a portion in which the transparent member is not installed in an opening part of the optical path in the base part. | 02-25-2016 |
20160052197 | COMPONENT CRIMPING APPARATUS - A component crimping apparatus includes: a substrate holding part that holds a substrate of a transparent material, a component previously attached to each electrode of electrodes juxtaposed in an edge of the substrate through a photo-curable adhesive member; a supporting part that supports, by a transparent member, a region under the electrodes in the substrate; crimping tools that are juxtaposed over the transparent member and press the components to the substrate; and a light irradiating part that irradiates the adhesive member with light through the transparent member when the crimping tools press the components to the substrate. The crimping tools are configured movably in an arrangement direction of the crimping tools, the transparent member has a dimension capable of covering a whole region of a movable range of the crimping tools, and the light irradiating part irradiates a whole region of the transparent member with the light. | 02-25-2016 |
Patent application number | Description | Published |
20130122892 | MOBILE COMMUNICATION METHOD AND RELAY NODE - A mobile communication method according to the present invention includes a step in which, when a relay node RN, which is subordinate to a radio base station DeNB and is in an “RRC_CONNECTED state”, received an “RRC connection release message” from the radio base station DeNB, the relay node RN is transitioned to an “RRC_IDLE state” after transmitting an “RRC connection release message” to a mobile station UE, which is subordinate to the relay node RN and is in the “RRC_CONNECTED state”, and a predetermined time T2 elapses. | 05-16-2013 |
20130124677 | BROADCAST SUPPLEMENTAL DATA TRANSMISSION DEVICE AND BROADCAST SUPPLEMENTAL DATA TRANSMISSION METHOD, AND BROADCAST SYSTEM - Provided is a broadcast supplemental data transmission device, a broadcast supplemental data transmission method, and a broadcast system that can reduce the traffic of a communication network as much as possible at the time of supplementing missing data in broadcasted content data. When “GET HTTP/1.1 If Unmodified Since Time Information”, which is a request for retransmission of missing data containing time information, is received from a receiving device, an HTTP response module determines whether there is rebroadcast of contents containing missing data based on the time information contained in the request for retransmission. When it is determined by the HTTP response module that there is rebroadcast, “412 Precondition Failed”, which is one of error notifications, is transmitted as a response to the receiving device, and the transmission of the contents through a communication network is not performed. | 05-16-2013 |
20130170428 | MOBILE COMMUNICATION METHOD, RADIO BASE STATION, AND RELAY NODE - A mobile communication method according to the present invention includes a step of transmitting, by a radio base station DeNB, “RA Response” to a mobile station UE within a “RA Response window” for the mobile station UE when “RA Preamble” is received from the mobile station UE, a step of transmitting, by a relay node RN, a signal to the mobile station UE in a subframe other than an MBSFN subframe, and a step of transmitting, by the radio base station DeNB, “RA Response” to the relay node RN in an MBSFN subframe of a “RA Response window” for the relay node RN when “RA Preamble” is received from the relay node RN. | 07-04-2013 |
20130201897 | BASE STATION, RELAY STATION AND METHOD IN MOBILE COMMUNICATION SYSTEM - A base station generates first setting information commonly used for establishing a logical path for communication with a user apparatus and for establishing a logical path for communication with a relay station, and second setting information used only for establishing the logical path for communication with the relay station, and transmits a second RRC message including the second setting information to the relay station after transmitting a first RRC message including the first setting information to the relay station. The first setting information includes information indicating a priority of a radio bearer in the logical path, information indicating usage of resources in SPS, information indicating resources of SRS, configuration information in a MAC sublayer, and information on change of a security encryption key in handover, and the second setting information includes at least system information and MBSFN information. | 08-08-2013 |
20130203342 | RELAY STATION FOR RELAYING COMMUNICATION BETWEEN USER APPARATUS AND BASE STATION, AND RELAY METHOD - A relay station includes a signal generation unit configured to generate a signal in the relay station and a receiving unit configured to receive a signal from a first communication station. The relay station further includes a signal generating node identifying unit configured to identify whether a signal to be transmitted to a second communication station is a received signal received from the first communication station or a generated signal generated by the signal generation unit. The relay station further includes a signal transmission unit configured to transmit both or one of the received signal and the generated signal associated with a radio bearer to the second communication station. | 08-08-2013 |
20130208652 | RELAY STATION, BASE STATION, RADIO COMMUNICATION SYSTEM, AND METHOD - A relay station for relaying a radio signal between a mobile station and a base station includes a relay station information generating unit configured to generate relay station information used by the base station to select a switching center to be connected to the relay station. The relay station also includes a message generating unit configured to generate a message including the relay station information generated by the relay station information generating unit, and a transmitting unit configured to transmit the message generated by the message generating unit to the base station. | 08-15-2013 |
20130208653 | RELAY NODE AND RECONNECTION METHOD - A relay node of a communication system includes a communication unit that initiates a session by executing an initial connection procedure for retrieving a cell list indicating one or more donor base station candidates from a maintenance node after establishment of an initial communication link among the relay node, a base station, and a switching center, and for establishing a communication link to a donor base station in the cell list and a switching center connected to the donor base station; a storing unit that stores the cell list; and a reconnection control unit that selects, when a radio link with the donor base station is lost, a donor base station satisfying a predetermined criterion in the cell list, and that causes the communication unit to establish a communication link to the selected donor base station and a switching center connected to the selected donor base station. | 08-15-2013 |
20140312361 | SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT - The semiconductor element has an electrode including: a Ni-inclusion metal layer containing nickel formed on a side of at least one surface of the semiconductor-element constituting part; a Ni-barrier metal layer formed outwardly on a side of the Ni-inclusion metal layer opposite to the side toward the semiconductor-element constituting part; and a surface metal layer outwardly formed on a side of the Ni-barrier metal layer opposite to the side toward the semiconductor-element constituting part, to be connected to the metal nanoparticles sintered layer; wherein the Ni-barrier metal layer contains a metal for suppressing diffusion of nickel toward the surface metal layer. | 10-23-2014 |