CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKSAANM Liao; Chih-ChinAACI Changhua CountyAACO TWAAGP Liao; Chih-Chin Changhua County TWAANM Chiu; Chin-TienAACI Taichung CityAACO TWAAGP Chiu; Chin-Tien Taichung City TWAANM Yu; CheemanAACI FremontAAST CAAACO USAAGP Yu; Cheeman Fremont CA USAANM Upadhyayula; Suresh KumarAACI San JoseAAST CAAACO USAAGP Upadhyayula; Suresh Kumar San Jose CA USAANM Li; Wen ChengAACI Taichung CityAACO TWAAGP Li; Wen Cheng Taichung City TWAANM Lu; ZhongAACI ShanghaiAACO CNAAGP Lu; Zhong Shanghai CN - diagram, schematic, and image 06
Back to CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKSAANM Liao; Chih-ChinAACI Changhua CountyAACO TWAAGP Liao; Chih-Chin Changhua County TWAANM Chiu; Chin-TienAACI Taichung CityAACO TWAAGP Chiu; Chin-Tien Taichung City TWAANM Yu; CheemanAACI FremontAAST CAAACO USAAGP Yu; Cheeman Fremont CA USAANM Upadhyayula; Suresh KumarAACI San JoseAAST CAAACO USAAGP Upadhyayula; Suresh Kumar San Jose CA USAANM Li; Wen ChengAACI Taichung CityAACO TWAAGP Li; Wen Cheng Taichung City TWAANM Lu; ZhongAACI ShanghaiAACO CNAAGP Lu; Zhong Shanghai CN , All Patents .