Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed LaminateAANM Chamberlin; Bruce JohnAACI VestalAAST NYAACO USAAGP Chamberlin; Bruce John Vestal NY USAANM Chu; Chang-MinAACI TaipeiAACO TWAAGP Chu; Chang-Min Taipei TWAANM Hu; Gao-BinAACI ShenZhenAACO CNAAGP Hu; Gao-Bin ShenZhen CNAANM Kuczynski; JosephAACI RochesterAAST MNAACO USAAGP Kuczynski; Joseph Rochester MN USAANM Tsang; Kaspar Ka ChungAACI Tung ChungAACO HKAAGP Tsang; Kaspar Ka Chung Tung Chung HK - diagram, schematic, and image 03
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