42nd week of 2013 patent applcation highlights part 17 |
Patent application number | Title | Published |
20130270678 | INTEGRATED CIRCUIT INCLUDING THERMAL GATE, RELATED METHOD AND DESIGN STRUCTURE - An integrated circuit (IC) and a method of making the same. In one embodiment, the IC includes: a substrate; an insulation layer over the substrate; a resistor over the insulation layer; a thermal gate over the resistor; and a heat sink connected to the thermal gate via a substrate contact, the heat sink adapted to receive thermal energy from the resistor via the thermal gate. | 2013-10-17 |
20130270679 | SEMICONDUCTOR FILM, METHOD FOR MANUFACTURING THE SAME, AND POWER STORAGE DEVICE - Provided are a semiconductor film including silicon microstructures formed at high density, and a manufacturing method thereof. Further, provided are a semiconductor film including silicon microstructures whose density is controlled, and a manufacturing method thereof. Furthermore, a power storage device with improved charge-discharge capacity is provided. A manufacturing method in which a semiconductor film with a silicon layer including silicon structures is formed over a substrate with a metal surface is used. The thickness of a silicide layer formed by reaction between the metal and the silicon is controlled, so that the grain sizes of silicide grains formed at an interface between the silicide layer and the silicon layer are controlled and the shapes of the silicon structures are controlled. Such a semiconductor film can be applied to an electrode of a power storage device. | 2013-10-17 |
20130270680 | METHOD FOR FORMING SEMICONDUCTOR DEVICES WITH ACTIVE SILICON HEIGHT VARIATION - A method for forming different active thicknesses on the same silicon layer includes masking the silicon layer and exposing selected regions of the silicon layer. The thickness of the silicon layer at the exposed regions is changed, either by adding silicon or subtracting silicon from the layer at the exposed regions. Once the mask is removed, the silicon layer has regions of different active thicknesses, respectively suitable for use in different types of devices, such as diodes and transistors. | 2013-10-17 |
20130270681 | SILICON WAFER AND FABRICATION METHOD THEREOF - A silicon wafer and fabrication method thereof are provided. The silicon wafer includes a first denuded zone formed with a predetermined depth from a top surface of the silicon wafer, the first denuded zone being formed with a depth ranging from approximately 20 μm to approximately 80 μm from the top surface, and a bulk area formed between the first denuded zone and a backside of the silicon wafer, the bulk area having a concentration of oxygen uniformly distributed within a variation of 10% over the bulk area. | 2013-10-17 |
20130270682 | Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections - Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed. | 2013-10-17 |
20130270683 | SEMICONDUCTOR PACKAGES WITH HEAT DISSIPATION STRUCTURES AND RELATED METHODS - Semiconductor packages including a die pad, at least one connecting bar, at least one supporting portion, a plurality of leads, a semiconductor chip, a heat sink and a molding compound. The connecting bar connects the die pad and the supporting portion. The leads are electrically isolated from each other and the die pad. The semiconductor chip is disposed on the die pad and electrically connected to the leads. The heat sink is supported by the supporting portion. The molding compound encapsulates the semiconductor chip and the heat sink. Heat from the semiconductor chip is efficiently dissipated from the die pad through the connecting bar, through the supporting portion, and through the heat sink. | 2013-10-17 |
20130270684 | POWER MODULE AND LEAD FRAME FOR POWER MODULE - The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween. | 2013-10-17 |
20130270685 | PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND RELATED METHODS OF FORMING THE SAME - A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer. | 2013-10-17 |
20130270686 | METHODS AND APPARATUS FOR HEAT SPREADER ON SILICON - Apparatus and methods for forming a heat spreader on a substrate to release heat for a semi-conductor package are disclosed. The apparatus comprises a substrate. A dielectric layer is formed next to the substrate and in contact with a surface of the substrate. A heat spreader is formed next to the substrate and in contact with another surface of the substrate. A passivation layer is formed next to the dielectric layer. A connection pad is placed on top of the passivation layer. The substrate may comprise additional through-silicon-vias. The contact surface between the substrate and the heat spreader may be a scraggy surface. The packaging method further proceeds to connect a chip to the connection pad by way of a connection device such as a solder ball or a bump. | 2013-10-17 |
20130270687 | DOUBLE SIDE COOLING POWER SEMICONDUCTOR MODULE AND MULTI-STACKED POWER SEMICONDUCTOR MODULE PACKAGE USING THE SAME - Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other. | 2013-10-17 |
20130270688 | POWER MODULE - A power module according to the present invention is a power module configured such that a power device chip is arranged within an outer casing and an electrode of the power device chip is connected to an external electrode that is integrated with the outer casing. The power module includes: a heat spreader fixed inside the outer casing; the power device chip solder-bonded on the heat spreader; an insulating dam formed on the heat spreader so as to surround the power device chip; and an internal main electrode having one end thereof solder-bonded to the electrode of the power device chip and the other end thereof fixed to an upper surface of the dam. The external electrode and the other end of the internal main electrode are electrically connected to each other by wire bonding. | 2013-10-17 |
20130270689 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF - Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device. | 2013-10-17 |
20130270690 | Methods for Forming Silicon-Based Hermetic Thermal Solutions - A method includes forming a first oxide layer on a surface of an integrated heat spreader, and forming a second oxide layer on top surfaces of fins, wherein the fins are parts of a heat sink. The integrated heat spreader is bonded to the heat sink through the bonding of the first oxide layer to the second oxide layer. | 2013-10-17 |
20130270691 | PACKAGE FOR A MICROELECTRONIC DIE, MICROELECTRONIC ASSEMBLY CONTAINING SAME, MICROELECTRONIC SYSTEM, AND METHOD OF REDUCING DIE STRESS IN A MICROELECTRONIC PACKAGE - A package for a microelectronic die ( | 2013-10-17 |
20130270692 | Method for Creating Semiconductor Junctions with Reduced Contact Resistance - Embodiments of the invention relate generally to creating semiconductor junctions with reduced contact resistance. In one embodiment, the invention provides a method of forming a composition of material, the method comprising: providing at least two populations of semiconducting materials; layering the at least two populations of semiconducting materials to form at least two layers; and consolidating the at least two populations of semiconducting materials, wherein the consolidating creates an electrical connection between the at least two layers. | 2013-10-17 |
20130270693 | Trace Layout Method in Bump-on-Trace Structures - A method and device for preventing the bridging of adjacent metal traces in a bump-on-trace structure. An embodiment comprises determining the coefficient of thermal expansion (CTE) and process parameters of the package components. The design parameters are then analyzed and the design parameters may be modified based on the CTE and process parameters of the package components. | 2013-10-17 |
20130270694 | SUBSTRATES HAVING BUMPS WITH HOLES, SEMICONDUCTOR CHIPS HAVING BUMPS WITH HOLES, SEMICONDUCTOR PACKAGES FORMED USING THE SAME, AND METHODS OF FABRICATING THE SAME - Substrates and semiconductor chips are provided. The substrate or the semiconductor chip includes a body and a substantially pillar-shaped bump disposed on a first surface of the body. The pillar-shaped bump has a hole penetrating a portion thereof. Related semiconductor packages are also provided. Further, related methods are provided. | 2013-10-17 |
20130270695 | Second Level Interconnect Structures and Methods of Making the Same - The various embodiments of the present invention provide a stress-relieving, second-level interconnect structure that is low-cost and accommodates TCE mismatch between low-TCE packages and PCBs. The various embodiments of the interconnect structure are reworkable and can be scaled to pitches from about 1 millimeter (mm) to about 150 micrometers (μm). The interconnect structure comprises at least a first pad, a supporting pillar, and a solder bump, wherein the first pad and supporting pillar are operative to absorb substantially all plastic strain, therefore enhancing compliance between the two electronic components. The versatility, scalability, and stress-relieving properties of the interconnect structure of the present invention make it a desirable structure to utilize in current two-dimensional and ever-evolving three-dimensional IC structures. | 2013-10-17 |
20130270696 | SEMICONDUCTOR MEMORY MODULES AND METHODS OF FABRICATING THE SAME - The inventive concept provides semiconductor memory modules and methods of fabricating the same. The semiconductor memory module may include a module board having a first surface and a second surface opposite to the first surface, and memory chips mounted directly on the module board by a flip-chip bonding method. Each of the memory chips may include a passivation layer disposed on a rear surface of each of the memory chips, and the passivation layer may have a color different from a natural color of single-crystalline silicon. | 2013-10-17 |
20130270697 | DEVICE WITH PILLAR-SHAPED COMPONENTS - A device with pillar-shaped components, includes a substrate; a wiring layer disposed on the substrate; and pillar-shaped components disposed on any of the substrate and the wiring layer, each of the pillar-shaped components having a bottom part connected to any of the substrate and the wiring layer, a top part opposed to the bottom part, and a lateral face part extending from the bottom part to the top part to connect the bottom part and the top part; wherein each of the pillar-shaped components includes a first pillar-shaped part formed by plating, a second pillar-shaped part formed on the first pillar-shaped part by plating, and a ring-like projection part formed on the lateral face part to project outward and extend in a circumferential direction, the ring-like projection part being formed in a position higher than a joint position between the first pillar-shaped part and the second pillar-shaped part. | 2013-10-17 |
20130270698 | STRAIN REDUCED STRUCTURE FOR IC PACKAGING - A semiconductor device includes a semiconductor die having first and second conductive pads, and a substrate having third and fourth bonding pads. A width ratio of the first conductive pad over the third bonding pad at an inner region is different from a width ratio of the second conductive pad over the fourth bonding pad at an outer region. | 2013-10-17 |
20130270699 | Conical-Shaped or Tier-Shaped Pillar Connections - A pillar structure for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical shape or a spherical shape. In an embodiment, the pillar structure is used in a bump-on-trace (BOT) configuration. The pillar structures may have circular shape or an elongated shape in a plan view. The substrate may be coupled to another substrate. In an embodiment, the another substrate may have raised conductive traces onto which the pillar structure may be coupled. | 2013-10-17 |
20130270700 | PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME - The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small. | 2013-10-17 |
20130270701 | SYSTEM AND METHODS FOR WIRE BONDING - A semiconductor package comprises a bond pad formed on a first semiconductor die, a surface of the bond pad exposed through an opening in a passivation layer on the first semiconductor die; a raised conductive area formed on top of a passivation layer on a second semiconductor die; and a bond wire having a first end coupled to the bond pad via a ball bond and a second end coupled directly to a surface of the raised conductive area via a stitch bond. The raised conductive area is comprised of a plurality of metal layers, each of the metal layers comprised of a respective material and having a respective thickness. The thickness and material of at least one of the plurality of metal layers is selected such that a hardness of the raised conductive area is at least as hard as a hardness of the bond wire. | 2013-10-17 |
20130270702 | COPPER INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME - A copper interconnect structure in a semiconductor device including an opening formed in a dielectric layer of the semiconductor device, the opening having sidewalls and a bottom. A first barrier layer is conformally deposited on the sidewalls and the bottom of the opening. A first seed layer is conformally deposited on the first barrier layer. A second barrier layer is conformally deposited on the first seed layer. A second seed layer is conformally deposited on the second barrier layer and a conductive plug is deposited in the opening of the dielectric layer. | 2013-10-17 |
20130270703 | ELECTROLESS FILLED CONDUCTIVE STRUCTURES - Techniques are disclosed that enable interconnects, vias, metal gates, and other conductive features that can be formed through electroless material deposition techniques. In some embodiments, the techniques employ electroless fill in conjunction with high growth rate selectivity between an electroless nucleation material (ENM) and electroless suppression material (ESM) to generate bottom-up or otherwise desired fill pattern of such features. Suitable ENM may be present in the underlying or otherwise existing structure, or may be provided. The ESM is provisioned so as to prevent or otherwise inhibit nucleation at the ESM covered areas of the feature which in turn prevents or otherwise slows down the rate of electroless growth on those areas. As such, the electroless growth rate on the ENM sites is higher than the electroless growth rate on the ESM sites. | 2013-10-17 |
20130270704 | Semiconductor Device with Self-Aligned Interconnects - A multilayer device and method for fabricating a multilayer device is disclosed. An exemplary multilayer device includes a substrate, a first interlayer dielectric (ILD) layer disposed over the substrate, and a first conductive layer including a first plurality of conductive lines formed in the first ILD layer. The device further includes a second ILD layer disposed over the first ILD layer, and a second conductive layer including a second plurality of conductive lines formed in the second ILD layer. At least one conductive line of the second plurality of conductive lines is formed adjacent to at least one conductive line of the first plurality of conductive lines. The at least one conductive line of the second plurality of conductive lines contacts the at least one conductive line of the first plurality of conductive lines at an interface. | 2013-10-17 |
20130270705 | Semiconductor Device Packages and Methods - Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate. | 2013-10-17 |
20130270706 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment includes: first and second semiconductor chips, each including a first electrode and a second electrode opposite to each other in a predetermined direction; a chip-mount substrate on which the first and second semiconductor chips are mounted; and a first wiring terminal to which the second electrodes of the first and second semiconductor chips are connected. The second semiconductor chip lies over the first semiconductor chip in the predetermined direction such that the second electrode of the first semiconductor chip and the second electrode of the second semiconductor chip face each other across the first wiring terminal, and the chip-mount substrate is bent such that the first electrode of the first semiconductor chip is connected to the first electrode of the second semiconductor chip. | 2013-10-17 |
20130270707 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS - A semiconductor device includes a base substrate and first and second semiconductor wires which are arranged side by side on the base substrate, and the base substrate is provided with an opening (inter-wire grove, slit) in an extending direction of the first and second semiconductor wires between the first semiconductor wire and the second semiconductor wire. | 2013-10-17 |
20130270708 | METHOD FOR FORMING BURIED CONDUCTIVE LINE AND STRUCTURE OF BURIED CONDUCTIVE LINE - A method for forming a buried conductive line is described. A substrate having a trench therein and a contact area thereon is provided, wherein the trench has an end portion in the contact area and a conductive layer is filled in the trench. A mask layer is formed covering the conductive layer in the contact area. The conductive layer is etched back using the mask layer as a mask. | 2013-10-17 |
20130270709 | NON-BRIDGING CONTACT VIA STRUCTURES IN PROXIMITY - A first photoresist layer is patterned with a first pattern that includes an opening in a region between areas of two adjacent via holes to be formed. The opening in the first photoresist is transferred into a template layer to form a line trench therein. The lateral dimension of the trench is reduced by depositing a contiguous spacer layer that does not fill the trench completely. An etch-resistant material layer is conformally deposited and fills the trench, and is subsequently recessed to form an etch-resistant material portion filling the trench. A second photoresist layer is applied and patterned with a second pattern, which includes an opening that includes areas of two via holes and an area therebetween. A composite pattern of an intersection of the second pattern and the complement of the pattern of the etch-resistant material portion is transferred through the template layer. | 2013-10-17 |
20130270710 | GUARD RING DESIGN STRUCTURE FOR SEMICONDUCTOR DEVICES - A customized seal ring for a semiconductor device is formed of multiple seal ring cells that are selected and arranged to produce a seal ring design. The cells include first cells that are coupled to ground and second cells that are not coupled to ground. The second cells that are not coupled to ground, include a higher density of metal features in an inner portion thereof, than the first seal ring cells. Dummy metal vias and other metal features that may be present in the inner portion of the second seal ring cells are absent from the inner portion of the first seal ring cells that are coupled to ground. The seal ring design may include various arrangements, including alternating and repeating sequences of the different seal ring cells. | 2013-10-17 |
20130270711 | APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS - An apparatus and method are provided for integrating TSVs into devices prior to device contacts processing. The apparatus includes a semiconducting layer; one or more CMOS devices mounted on a top surface of the semiconducting layer; one or more TSVs integrated into the semiconducting layer of the device wafer; at least one metal layer applied over the TSVs; and one or more bond pads mounted onto a top layer of the at least one metal layer, wherein the at least one metal layer is arranged to enable placement of the one or more bond pads at a specified location for bonding to a second device wafer. The method includes obtaining a wafer of semiconducting material, performing front end of line processing on the wafer; providing one or more TSVs in the wafer; performing middle of line processing on the wafer; and performing back end of line processing on the wafer. | 2013-10-17 |
20130270712 | Through silicon via structure and method of fabricating the same - A through silicon via structure and a method of fabricating the through silicon via structure are disclosed. After an interlayer dielectric is formed, a via hole is then formed to pass through the interlayer dielectric; thereafter, a dielectric liner is formed within the via hole and extends onto the interlayer dielectric; thereafter, the via hole is filled with a conductive material; and a chemical-mechanical polishing process is performed to planarize the conductive material, using the dielectric liner on the interlayer dielectric as a stop layer of the chemical-mechanical polishing process. | 2013-10-17 |
20130270713 | DUAL DAMASCENE STRUCTURE HAVING THROUGH SILICON VIA AND MANUFACTURING METHOD THEREOF - A dual damascene structure having a through silicon via and a manufacturing method thereof are provided. The method includes forming a first, a second, and a third dielectric layers a on a substrate having a conductive structure. A trench is formed in the third dielectric layer. A hard mask layer is formed on the third dielectric layer and a surface of the trench. A first opening having a tapered sidewall is formed in the hard mask layer. A second opening is formed in the second and the third dielectric layers. The substrate exposed by the second opening and the first opening is etched to form a through hole so as to form a dual damascene opening. A liner layer is formed on a surface of the dual damascene opening and the conductive structure is exposed. The dual damascene opening is filled with a conductive material. | 2013-10-17 |
20130270714 | CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor memory device includes conductive patterns vertically stacked on the substrate and having pad regions extended further at edge portions of the conductive patterns as the conductive patterns descend from an uppermost conductive pattern to a lowermost conductive pattern, a first contact plug disposed on a first pad region of the lowermost conductive pattern, a buffer conductive pattern disposed on a second pad region positioned above the first pad region, and a second contact plug formed on the buffer conductive pattern. | 2013-10-17 |
20130270715 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES - A packaged semiconductor die with a bumpless die-package interface and methods of fabrication are described. For example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines, one of which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate. In another example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines with a layer of conductive vias disposed thereon. At least one of the conductive lines is coupled directly to a conductive via of the semiconductor die which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate. | 2013-10-17 |
20130270716 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including conductive lines configured to include first lines extending generally in parallel in a first direction and second lines extending generally in parallel in a second direction to intersect the first direction from the respective ends of the first lines and each second line having a width wider than the first line, and dummy patterns formed between the second lines. | 2013-10-17 |
20130270717 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package includes a circuit board comprising a first surface and a second surface opposite the first surface. A first semiconductor chip is stacked on the first surface and a second semiconductor chip stacked on the first semiconductor chip. A region of the second chip protrudes beyond a side of the first semiconductor chip. A support underpins the protruding region of the second chip. The support may be, for example, dry film solder resist dam. | 2013-10-17 |
20130270718 | PRINTED CIRCUIT BOARD HAVING EMBEDDED DIES AND METHOD OF FORMING SAME - A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die. | 2013-10-17 |
20130270719 | MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND COMPUTING SYSTEM CONTAINING SAME - A microelectronic package comprises a die ( | 2013-10-17 |
20130270720 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A separation layer and a semiconductor element layer including a thin film transistor are formed. A conductive resin electrically connected to the semiconductor element layer is formed. A first sealing layer including a fiber and an organic resin layer is formed over the semiconductor element layer and the conductive resin. A groove is formed in the first sealing layer, the semiconductor element layer, and the separation layer. A liquid is dropped into the groove to separate the separation layer and the semiconductor element layer. The first sealing layer over the conductive resin is removed to form an opening. A set of the first sealing layer and the semiconductor element layer is divided into a chip. The chip is bonded to an antenna formed over a base material. A second sealing layer including a fiber and an organic resin layer is formed so as to cover the antenna and the chip. | 2013-10-17 |
20130270721 | ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAPACITIVE THERMAL MATERIAL - An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device. | 2013-10-17 |
20130270722 | ADJUSTABLE IN-LINE ON DEMAND CARBONATION CHAMBER FOR BEVERAGE APPLICATIONS - Apparatus, including a carbonation chamber, is provided that includes a mixing and metering member and a gas adjustment member. The mixing and metering member is configured to respond to a fluid, including water, and an adjustable amount of gas, including CO | 2013-10-17 |
20130270723 | Device For A Cleaning Unit For Hydraulic Oil And Lubricating Oil - A device for a cleaning unit for hydraulic oil or lubricating oil circulating in connection with a drive unit, wherein the cleaning unit comprises a cleaning tank provided with an oil inlet for untreated oil, means arranged to spread the untreated oil over a substantial portion of the cleaning tank cross-section, an inlet for introducing gas into the untreated oil, and an outlet for evacuation of gas and water vapour, and also a means having a large surface area arranged downstream of the spreader means, wherein the means having a large surface area is provided as a plurality of bodies arranged to be able to float on the treated oil. | 2013-10-17 |
20130270724 | Systems And Methods For Humidifying Gas Streams - Systems and methods are provided for humidifying a gas stream. Methods for providing a humidified gas stream comprise providing a dry gas, directing the dry gas to a humidification device, humidifying the dry gas to provide a humidified gas stream having an amount of moisture in excess of a predetermined amount, directing the humidified gas stream to a cooling device, cooling the humidified gas to a predetermined temperature, and directing the cooled humidified gas to a point of usage. Systems for providing a humidified gas stream comprise a dry gas stream, a humidification device configured to receive and humidify the dry gas stream to form a humidified gas stream having an amount of moisture in excess of a predetermined amount, and a cooling device configured to receive and cool the humidified gas stream to a predetermined temperature to form a cooled humidified gas stream. | 2013-10-17 |
20130270725 | METHOD OF MAKING LENS - A method of making lenses includes the following steps: A. Provide a photo-curing material into a cavity between a first die and a second die. B. Expose the photo-curing material under predetermined light, whereby the photo-curing material is solidified, and a transmittance of the solidified photo-curing material is greater than 75%. C. Remove the first die and the second die to obtain a lens material; and D. Cut the lens material to obtain a plurality of lenses. | 2013-10-17 |
20130270726 | Encapsulation Of Active Agents For On-Demand Release - The present disclosure relates to a method of forming microcapsules. The method may include combining an active agent in a first solvent S | 2013-10-17 |
20130270727 | PROCESS OF FORMING A CONCRETE COLUMN - A process of forming a concrete column using a concrete column forming tube lined with a flexible and compressible elastomer sleeve having a randomly dispersed rigid granular material encapsulated therein to form a concrete column having a textured surface. The flexible and compressible elastomer sleeve is formed by mixing a liquid elastomer with a rigid granular material and applying the mixture over a textured generally cylindrical form and curing the liquid elastomer. A colorant may be applied to the inside surface of the flexible and compressible elastomer sleeve to form a concrete column having a colored and textured surface. | 2013-10-17 |
20130270728 | Method for Regulating An injection Molding Process - A method for regulating an injection molding process in which process setting variables of an injection molding machine are controlled via a regulating module, which receives data from a process-internal sensor system of the injection molding machine, data on the fabricating sequence of the injection molding component parts from an external sensor system and/or data on the quality of a fabricated injection molded component part from an online component part control, evaluates these data in a quality prognosis module and, as a function of the data evaluation, performs a change in the process setting variables of the injection molding machine, because of the change in the process setting values, the working point of the injection molding machine being changed so that the quality features of the injection molded component parts fabricated using the changed working point lie within the specified tolerances of the quality of the injection molded component parts. | 2013-10-17 |
20130270729 | RESIN FLOW CONTROL IN VARTM PROCESS - A method for controlling a resin flow in a closed mould cavity during a vacuum assisted resin transfer moulding process is disclosed. The used closed mould cavity includes at least one resin inlet and a number of resin outlets. Each resin outlet is operatively connected to an inlet of a container. Each container includes an outlet which is operatively connected to a vacuum pump. The method includes evacuating the closed mould cavity through the resin outlets by the vacuum pump, injecting liquid resin into the closed mould cavity, measuring the resin fill level in each container during the injection of liquid resin into the closed mould cavity and adjusting the applied pressure at each container outlet depending on the measured resin fill level in the particular container. | 2013-10-17 |
20130270730 | COMPRESSION MOLDING APPARATUS AND COMPRESSION MOLDING METHOD OF RESIN MOLDED PRODUCT COMPRISING FIBER - A material heating mechanism for melting the material into a molten state, an upper plate to which the upper mold is attached and a lower plate to which the lower mold is attached, at least three position sensors for detecting a distance between the upper mold and the lower mold or the upper plate and the lower plate, and at least three compression hydraulic cylinders installed to any one of the upper plate and the lower plate and individually controlled according to information of the position sensors. | 2013-10-17 |
20130270731 | SHAPED EXPANDABLE MATERIAL - An expandable material is shaped to form a part that can provide functional attributes such as reinforcement to a structure of article of manufacture such as an automotive vehicle. | 2013-10-17 |
20130270732 | METHOD TO CREATE VACUUM INSULATED CABINETS FOR REFRIGERATORS - A method of forming a vacuum insulated refrigerator cabinet, the method comprising providing first and second sheets of material. The first sheet of material is thermoformed over a first forming tool forming a first intermediate structure. The first intermediate structure is then thermoformed over a second forming mold to create a second intermediate structure. The second sheet of material is then sealing connected with the second intermediate structure forming an annular space. A vacuum is created in the annular space creating a vacuum insulated cabinet. | 2013-10-17 |
20130270733 | POWDER APPLICATION DEVICE AND METHOD FOR PRODUCING THERMOPLASTIC MOLDABLE SEMI-PLASTIC FINISHED GOODS - There is proposed a powder application device P for producing blanks of thermoplastically deformable semifinished products for use as reinforcement elements, starting from a powder mixture containing a meltable plastics powder, comprising a downwardly open powder container B and a perforated stencil L, arranged beneath the latter and spaced apart therefrom, having one or more hole cutouts, said device being characterized in that the powder container B is rigidly connected to the perforated stencil L and is vertically lowerable as far as an auxiliary support or a distance of at most 5 mm therefrom, and is closable at its lower end by means of a horizontal closing plate S having a thickness slightly less than the distance between the powder container B and the perforated stencil L, wherein the closing plate S is movable in a horizontal plane such that it alternately closes and reopens the lower end of the powder container B. | 2013-10-17 |
20130270734 | Treatment Method for Mold Tool Surface - The average roughness Ra of a mold tool surface that comes into contact with a material to be molded measured for a measurement area 10 μm square or smaller is equal to or lower than 5 nm, and fine granular projection structures having diameters ranging from 10 to 80 nm and heights ranging from 10 to 40 nm are formed on the mold tool surface with a density of 400 /μm | 2013-10-17 |
20130270735 | SYSTEMS AND METHODS FOR MAKING A LAMINAR VENTRICULAR PARTITIONING DEVICE - Described herein are systems and methods for securing a polymeric sheet to rib components of a frame structure, wherein the rib components are jointed at a hub to form an expandable and collapsible implant. In general, the method may include the steps of decreasing a diameter of the frame structure; placing the frame structure into an assembly fixture, wherein the assembly fixture is configured to hold the frame structure in a loaded configuration with a decreased diameter; placing a polymeric sheet into the assembly fixture; and heating the assembly under pressure to fuse the sheet to the frame structure. In general, a fixture may include a first and second platen having a shaping portion and a rim portion positioned around the periphery of the platen, wherein the shaping portions are configured to hold the rib components of the frame structure in a loaded configuration with a decreased diameter. | 2013-10-17 |
20130270736 | APPARATUS FOR MANUFACTURING A HIGH-STRENGTH COMPOSITE SHEET HAVING SUPERIOR EMBEDDABILITY, AND METHOD FOR MANUFACTURING A HIGH-STRENGTH COMPOSITE SHEET USING THE SAME - Disclosed is a method for manufacturing a high-strength composite sheet, in which a peroxide-containing polymer film is used to allow uniform molecular weight distribution and improved embeddability. The method includes: attaching a peroxide-containing polymer film to one or both sides of a reinforcement material; pressing the peroxide-containing polymer film using a heating press such that the peroxide-containing polymer film is embedded into the reinforcement material, to thereby form a composite film; and cooling the pressed composite film using a cooling press. | 2013-10-17 |
20130270737 | WEIGHTED GAMING CHIP AND METHOD OF PRODUCING A CHIP OF THIS TYPE - The invention relates in particular to a gaming chip comprising a weighting disc ( | 2013-10-17 |
20130270738 | PROCESS AND APPARATUS FOR MOULDING A GLAZING PROFILE ONTO A GLAZING - A process for manufacturing at least two different discrete edge encapsulated glazings comprising panes of glass of different configuration, the process comprising moulding a glazing profile onto at least part of the periphery of each pane of glass in a composite mould. This composite mould comprises multiple different interchangeable mould modules, each mould module comprising at least one mould cavity, and the composite mould therefore has two or more mould cavities configured differently to receive different panes of glass. Fluid elastomeric material is injected into the mould cavities at the same time, so that a glazing profile is moulded onto each of the panes of glass concurrently. An injection moulding apparatus comprising the composite mould may have multiple injection systems for the different mould cavities, allowing different moulding materials to be used. The apparatus also includes a clamp unit having platens to which the multiple mould modules are attached. | 2013-10-17 |
20130270739 | METHOD AND APPARATUS FOR CONTROLLED SHRINKING OF PLASTIC SHEET MATERIAL - Apparatus for controlled shrinking of molten plastic sheet material comprises a series of parallel cylindrical rollers for moving the plastic sheet material from a first position to a second position. At least one heater is aligned with the rollers for maintaining the plastic sheet material in a molten state while the rollers move the plastic sheet material, and a drive mechanism rotates the rollers so that the tangential speed of the rollers progressively decreases from the first position toward the second position. As a result of the progressive decrease in tangential speed of the rollers, the speed of the plastic sheet material is progressively reduced as the plastic sheet material approaches the second position, so that portions of the plastic sheet material closer to the second position move toward the second position more slowly than portions of the plastic sheet material further from the second position. | 2013-10-17 |
20130270740 | PROCESS FOR PROCESSING SURFACE OF ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER AND PROCESS FOR PRODUCING ELECTROPHOTOGRAPHIC PHOTOSENSITIVE MEMBER - In the cross-section perpendicular to the axis of rotation of the electrophotographic photosensitive member, when an arc which is a line at the intersection of the cross-section with a contacting face (face where the electrophotographic photosensitive member and the molding member contact), is represented by an arc AB, the center of a circle of the cross-section of the electrophotographic photosensitive member is represented by a center O, and the point at the intersection of a straight line via the center O among straight lines of a direction of the pressure contact of the molding member with the arc AB is represented by an intersection C, the uneven structure on the surface of the molding member transfers to the surface of the electrophotographic photosensitive member so that ∠AOC and ∠BOC satisfy the following formulas (1) and (2), respectively: | 2013-10-17 |
20130270741 | IMPRINT PROCESS, AND TRANSFER SUBSTRATE AND ADHESIVE USED THEREWITH - The imprint process of the invention includes at least an adhesion layer-formation step, a filling step, a curing step, and a releasing step. In the adhesion layer-formation step, an adhesive including a compound including in one molecule a tetravalent atom having one hydrolysable group and two inert group, and a reactive functional group bonded to the atom is brought into contact with a substrate blank that is then scrubbed thereby forming an adhesion layer on the substrate blank to prepare a transfer substrate. In the filling step, a mold is located in proximity to the transfer substrate with a work-material interleaved between the mold and the adhesion layer to fill the work-material up in a transfer shape area of the mold; in the curing step, the work-material is cured; and in the releasing step, the mold is released off from the work-material. | 2013-10-17 |
20130270742 | MOISTENING SYSTEM FOR PRESSES - The invention relates to a moistening system ( | 2013-10-17 |
20130270743 | METHOD FOR MANUFACTURING MICROSCOPIC STRUCTURAL BODY - The present invention is widely applicable to an injection molding method, an injection compression molding method, a blow molding method, a film sheet molding method using a roller and a thermoplastic molten polymer, and the like. | 2013-10-17 |
20130270744 | SYSTEM AND METHOD FOR REMOVING COATING FROM AN EDGE OF A SUBSTRATE - A coating-removal apparatus may include a source positioned on a mounting plate, and operable to emit a laser beam at a first path, where the mounting plate is configured to receive an edge of a photovoltaic module in a designated region substantially proximate to the mounting plate, such that the first path intersects the designated region, and where the mounting plate is further configured to reposition the source to create an additional path that intersects with the designated region, where the additional path is distinct from the first path. | 2013-10-17 |
20130270745 | GOLF BALL WITH SINGLE THERMOPLASTIC COVER LAYER OF HETEROGENEOUS COMPOSITION - The present invention relates to a method of manufacturing a golf ball having a single cover layer of heterogeneous composition. One embodiment of the invention describes a method wherein a core, comprising one or more layers, has pre-molded hemispherical cover cups placed about the core and each cover cup has at least two layers of distinct resinous materials, and the cover cups are heated and compressed such that the resinous materials in the cover cups intermingle with each other to form a single heterogeneous cover layer. | 2013-10-17 |
20130270746 | APPARATUS AND METHOD FOR MAKING AN OBJECT - An apparatus ( | 2013-10-17 |
20130270747 | METHOD AND APPARATUS FOR PRODUCING FORMABLE PRODUCTS - Described are methods for processing material, material processing systems, and processable materials. Preferred embodiments relate to a method of and apparatus for producing formable products such as polymer products and thermoplastic materials. | 2013-10-17 |
20130270748 | ACTIVE-ENERGY-RAY-CURABLE COMPOSITION, AND PROCESS FOR PRODUCING TRANSPARENT FILM HAVING FINE UNEVEN STRUCTURE ON SURFACE THEREOF - Described are: an active-energy-ray-curable composition ( | 2013-10-17 |
20130270749 | EMBEDDED OPTICS IN MODULAR ASSEMBLIES - An enhanced multiobject potting fixture for exposure to a curing modality that sets an adhesive includes a fixture housing supporting a plurality of objects, the fixture housing having a wall defining a plurality of bonding wells with each the bonding well receiving a first portion of one of the objects, each the bonding well including an aperture in the wall proximate the first portion wherein each bonding well includes a target zone for selective cure of the adhesive to inhibit the adhesive from exiting the aperture; and a fixture enhancement structure integrated into the wall concentrating the curing modality in each the target zone. | 2013-10-17 |
20130270750 | APPARATUS AND METHODS FOR ADDITIVE-LAYER MANUFACTURING OF AN ARTICLE - Apparatus is for additive layer manufacturing of an article from a material which can be rendered solid locally by application of a focused beam of laser radiation at a planar focal plane. The apparatus includes at least two laser beams, respective scanners for each laser beam for scanning the respective laser beams over a planar field, and a support movable stepwise to allow successive manufacturing layer cycles and for supporting material within the field. The entire planar field is common to each scanner and at least one scanner is tilted with respect to the planar field, and the at least one scanner is provided with a lens arranged to generate a focal plane tilted with respect to that scanner. | 2013-10-17 |
20130270751 | Process for decreasing the mold residence time in extrusion blow molding - A process for decreasing the mold residence time in extrusion blow molding, wherein pressurized air is used to expand a plastic into a blow molded article. The process comprises providing an extrusion blow molding mold having a mold cavity, with an air inlet into the mold cavity. Then, providing pressurized air to the mold cavity through the air inlet during the blow molding of the article such that the plastic expands to the mold walls, then, providing a pressurized liquefied gas, such that the expanded plastic is cooled by the liquefied gas, whereby the residence time in the mold cavity is decreased. | 2013-10-17 |
20130270752 | PROCESS FOR OPERATING A BLAST FURNACE INSTALLATION WITH TOP GAS RECYCLING - Blast furnace installation having top gas recycling and process for operating same, in which the oxygen concentration of the oxidizing gas injected into the blast furnace is regulated as a function of the flow rate of the recycled top gas | 2013-10-17 |
20130270753 | AIR SPRING FOR A COMMERCIAL VEHICLE INCLUDING A ROLLING-LOBE FLEXIBLE MEMBER OF ELASTOMERIC MATERIAL HAVING ENDS PROVIDED WITH RESPECTIVE FASTENING BEADS - An air spring for commercial vehicles includes a rolling-lobe flexible member which is made of an elastomeric material and which at one end thereof is fastened to a first attachment part and at the other end thereof is fastened to a second attachment part in the form of a roll-off piston. The ends of the rolling-lobe flexible member each have a fastening bead which is reinforced in each case by a bead core. At least one of the two bead cores consists of plastic material. In order to achieve greater strength of the fastening bead, the bead core or the bead cores include a multiply-wound, flat profile strand made of glass-fiber-reinforced plastic material. | 2013-10-17 |
20130270754 | SAFETY PROTECTION APPARATUS OF ELASTIC-PLASTIC STEEL STRUCTURE - A safety protection apparatus of elastic-plastic steel structure is disclosed. The apparatus includes an outer protecting layer ( | 2013-10-17 |
20130270755 | MICROALLOYED SPRING - The systems and methods described herein include innerspring assemblies or innerspring cores for use with cushioning articles such as mattresses. The innerspring core may have one or more coil springs formed from a high-carbon steel wire alloyed with one or more suitable alloying elements such as titanium and copper and capable of imparting greater strength and durability to the innerspring core. | 2013-10-17 |
20130270756 | RETAINING SYSTEM FOR RETAINING AND HOLDING A WAFER - This invention relates to a retaining system for retaining and holding a wafer for processing the wafer with a holding surface for placing the wafer on a support surface of the wafer and holding means for holding the wafer, whereby because of the holding means holding extremely thin wafers on the holding surface of the wafer, the smallest possible local distortions of the wafer are achieved. | 2013-10-17 |
20130270757 | DEVICE FORMING A WORKPIECE CLAMP - A device forming a clamping pad includes a body ( | 2013-10-17 |
20130270758 | Wire Holding Device - A wire holding device configured to hold two wires together to establishing a connection. The connection may be made through soldering the two wires together. The wire holding device is also configured to be adjustable so that the wires can be held at different angles. The wire holding device can also be used to isolate a wire from a wire loom. | 2013-10-17 |
20130270759 | DEVICE FOR BLOCKING EYEGLASS LENSES - A device for blocking eyeglass lenses onto blocks using a bonding mass, by which the eyeglass lens is connected to the block in a form-fit and/or force-closed manner, having several stations, between which the eyeglass lens and/or the block is transported, at least one blocking station, in which the block is connected to the eyeglass lens using the bonding mass, a transport arm having a retaining head arranged thereon for positioning the eyeglass lens in the blocking station, wherein the transport arm is designed as a pivot arm and has at least one pivot axis (S | 2013-10-17 |
20130270760 | Cantilevered Stop Pin Vise Stop - A device for laterally positioning a work piece in a milling machine vise includes a clamp configured to engage a top longitudinal lip of a vise jaw via at least one clamp screw. The clamp defines a notch configured to receive a work piece facing inner lip edge and an outer lip edge. The notch comprises a top lip resting face, an outer lip clamping face and an inner lip clamping face adjacent the inner lip edge. The device may also include a stop pin. A protrusion extends from the inner lip clamping face to receive the stop pin parallel to the work piece facing inner lip edge. The protrusion is configured to cantilever the stop pin substantially to below the top lip resting face from the inner lip edge of the vise jaw and enable a milling clearance from the clamp to the work piece via the stop pin. | 2013-10-17 |
20130270761 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus includes: a stapling unit that staples a sheet member; a moving unit that linearly moves the stapling unit; a rotating unit that rotates the stapling unit by abutment of an abutting member against an abutted member when the stapling unit is moved; a holding unit that holds the stapling unit rotated; and a restricting member that restricts rotation of the stapling unit by abutting against the abutting member. | 2013-10-17 |
20130270762 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A sheet processing apparatus includes a conveyance unit to transport a sheet bundle including multiple sheets in a sheet conveyance direction and a binding device including a clamping unit. The clamping unit includes multiple projections and multiple recesses to engage the respective projections to clamp the sheet bundle inserted therebetween. At least one of the multiple projections includes an inclined portion facing a sheet conveyance direction, and an inclination of the inclined portion is 45 degrees or smaller relative to a face parallel to the sheet conveyance direction. | 2013-10-17 |
20130270763 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - According to an embodiment, there is provided a sheet processing apparatus includes a stacking unit that stacks a sheet conveyed thereto; a first alignment unit that aligns the sheet or a bundle of sheets stacked in the stacking unit in a sheet conveying direction; a second alignment unit that aligns the sheet or the bundle of sheets stacked in the stacking unit in a direction orthogonal to the sheet conveying direction; a pressing unit that presses the bundle of sheets at an end portion thereof on a predetermined one side; and a control unit that causes at least one of the first and second alignment units to execute an alignment operation during a press operation of the sheet or the bundle of sheets performed by the pressing unit. | 2013-10-17 |
20130270764 | SHEET CONVEYING DEVICE, SHEET FEED DEVICE AND IMAGE FORMING APPARATUS HAVING THE SAME - A sheet sender | 2013-10-17 |
20130270765 | IMAGE FORMING APPARATUS AND SHEET POSITIONING DEVICE USING METHOD OF SHEET POSITIONING - An image forming apparatus to which a sheet positioning device can be provided to perform a sheet positioning includes an image forming device and a sheet positioning device that includes a sheet setting plate, a pair of side fence units disposed facing each other along opposite sides of the sheet setting plate to move in a lateral direction of the sheet, a moving mechanism to move the pair of side fence units, a contact member to contact and press the sheet, a position detector to detect the position of the contact member, and a controller moving the pair of side fence units when the sheet is placed on the sheet setting plate, halting movement of the pair of side fence units after the contact member has contacted and pressed the sheet, and moving the pair of side fence units again based on detection results obtained by the position detector. | 2013-10-17 |
20130270766 | SHEET FEEDING MACHINE - A sheet feeding machine comprises a housing | 2013-10-17 |
20130270767 | JUNGLE BOCCE GAME - A game combines knowledge cards and exercise in rolling painted animal coconuts on a playing surface. The animal coconuts move in an unpredictable way with painted marks that identify jungle animals. A weight can be disposed inside the animal coconut to make it waddle as it rolls. A sound box can be placed inside the animal coconut so that it makes the sound of the animal that the coconut represents as it waddles down the playing surface. The playing surface can be a rug marked by a vine with starting lines for various ages, handicap, and/or skill of players. A fact or question/answer card can be read before a player can roll their animal coconut. A shag rug is used to slow down the animal coconut as it is heading to score. The game allows a person to affirmatively answer the question, “Have you rolled a coconut?” | 2013-10-17 |
20130270768 | DEVICE WITH MULTI-DIRECTIONAL MOVING MEMBERS - A game piece, comprising members that are associated with one another with pivot axes, where a member provides a pivot support that allows independent rotation and or translation motions of a next member in different directions. | 2013-10-17 |
20130270769 | THREE DIMENSIONAL CUBIC STRATEGY GAME - Embodiments relate to a three-dimensional (3D) strategy game in which various-shaped pieces are stacked upon a playing surface according to certain rules. The game pieces are 3D shapes formed by a combination of cubic units. Each cubic unit is a standard six-faced cube. Embodiments of the strategy game require at least two players, but these players need not all be human players. As players take turns placing pieces on the grid according to certain rules, the square cells become occupied by pieces and the players begin to place pieces on top of previously placed pieces, thus building a vertical “tower” out of the game pieces over the course of the game. After a certain condition is met, such as a player not being able to make another move according to the rules, the game is over and a winner and/or a loser are declared. | 2013-10-17 |
20130270770 | GAME AND METHOD OF PLAYING THE GAME - A game having: a plurality of game pieces; a plurality of game cards, the plurality of game cards having a plurality of first cards, a plurality of second cards and a plurality of third cards, the plurality of first cards when played require an action to be performed and the plurality of second cards when played allow for one of the plurality of pieces to be possessed; and wherein when each one of the game pieces when possessed provides immunity to the action to be performed when one of the plurality of second cards is played. | 2013-10-17 |
20130270771 | Blackjack Side-Bet - A game of Blackjack may include a mid-game side-bet that the dealer will go bust. The side-bet offered may be placed against any dealer face-up card—Ace, 2, 3, 4, 5, 6, 7, 8, 9, 10, Jack, Queen, or King. The payoff may vary depending upon the dealer face-up card and paid in accordance with a pay table. The bet may be paid when the dealer hits their hand and exceeds the total of 21, therefore going bust. The bet may lose when the dealer receives a standing hand of 17, 18, 19, 20 or 21. The side-bet may be made once the dealer's face-up card has been determined. The side-bet may be asked for at one time similar to an insurance bet or as each player acts on their individual hands. | 2013-10-17 |
20130270772 | ARCHERY TARGET WITH REPOSITIONABLE TARGET SECTION - The present disclosure relates to an archery target. The archery target includes a main target body defining an aperture and a target insert configured to fit within the aperture. The target insert has a first target surface and a second target surface. The first target surface defines a first target zone and a second target zone. The second target surface defines a third target zone and a fourth target zone. The target insert is configured to be selectively repositionable by a user to allow any one of the first target zone, the second target zone, the third target zone and the fourth target zone to be positioned in a primary target area of the archery target. | 2013-10-17 |
20130270773 | SHOOTING TARGETS WITH REACTIVE ZONES - Embodiments of the invention include printed shooting targets having reactive zones and methods related to the same. In an embodiment, the invention includes a shooting target comprising a substrate. In some embodiments, a first ink layer can be disposed on the substrate. An adhesion modifying layer disposed over the substrate and/or on the first ink layer. The adhesion modifying layer can cover less than the entire surface area of the substrate and/or first ink layer. A second ink layer disposed on the adhesion modifying layer. In an embodiment, a method of making a shooting target comprising applying discrete segments of a material over a substrate to form an adhesion modifying layer, wherein the adhesion modifying layer covers less than the entire surface area of the substrate; and applying a second ink layer over the adhesion modifying layer. Other embodiments are also included herein. | 2013-10-17 |
20130270774 | LIFTING DEVICE FOR HAMMER GAME MACHINE - A lifting device for hammer game machine includes frame, a motor laterally mounted to a lower portion of the frame, a seat longitudinally mounted to an upper portion of the frame, a lifting unit partially received in and extending through the seat, a first bracket is secured on a lower end of the lifting device, a linkage assembly connected to the motor and a second bracket laterally mounted onto the linkage assembly through the frame. The first bracket and the second bracket are slidably relative to the frame and selectively connected to each other before being operated. | 2013-10-17 |
20130270775 | SHAFT SEALING SYSTEM FOR STEAM TURBINES - A shaft sealing system and method are disclosed for a low pressure turbine section having a rotating member including a shaft and a stationary member surrounding the rotating member and defining a steam flow path. The shaft sealing system comprises at least one seal disposed about each of a first end and a second end of the shaft; and a connection line for conducting steam from the first turbine section to a downstream portion of the turbine. The downstream portion of the turbine has a lower pressure than both of the first turbine section and ambient pressure conditions. | 2013-10-17 |
20130270776 | GASKET - A gasket is provided that forms a sealing connection between a pair of tubular members. The gasket comprises a first section shaped to fit within a recess of one of a pair of tubular members. The first section includes an anchor portion comprising first and second sides. The gasket further comprises a second section extending from the first section and is configured to make a sealing contact with the other of the tubular members. The gasket also includes at least one self-locating arm in a sealing contact within the recess and extending from one of the first or second sides of the anchor portion of the first section. The self-locating arm biases the first section such that the other of the first or second sides is in contact with the recess to form a sealing connection. | 2013-10-17 |
20130270777 | Duplex Finger Seal for Joints with High Relative Displacement - The sealing apparatus and method of assembling the same is disclosed. The sealing apparatus may comprise a resilient member and a sealing member. The resilient member may define a cavity having a closed end and an open end. The resilient member may include a first wall having a first inner sealing surface and a second wall having a second inner sealing surface. The first and second walls may be joined at the closed end. The sealing member may be disposed at least partially in the cavity in sealing engagement with the first and second inner sealing surfaces. The sealing member may comprise an upper plurality of layered finger seals and a lower plurality of layered finger seals. | 2013-10-17 |