39th week of 2010 patent applcation highlights part 40 |
Patent application number | Title | Published |
20100246049 | COMPUTER HAVING FUNCTION FOR DISPLAYING STATUS OF OPERATION AND FLOPPY MODULE - A floppy module includes a floppy disk controller (FDC), a control circuit, and a display. The FDC has a first control terminal, a second control terminal, and a plurality of third control terminals. Wherein, the first control terminal and the second control terminal may respectively output a first control signal and a second control signal, and the first and second control signals having the same statuses are used for controlling a floppy disk. The display has a fourth control terminal and a plurality of data terminals respectively coupled to a portion of the third control terminals. Additionally, the control circuit may use the first control signal to replace the second control signal for controlling the floppy disk, and transmit the second control signal to the fourth control terminal such that a status information is shown on the display as the floppy disk being idle. | 2010-09-30 |
20100246050 | STORAGE DEVICE - According to one embodiment, a storage device includes a base, a drive section on the base, configured to rotate a disk storage medium, an actuator mounted with a head for processing data in the storage medium and configured to move the head along a surface of the storage medium, a cover laid over the base, and a plate opposed to the surface of the storage medium in a position outside a range of movement of the actuator. The plate includes a distal end portion located adjacent to the actuator and downstream with respect to a direction of rotation of the storage medium, a block extending from the distal end portion, located outside the outer periphery of the storage medium, and supported on the base side, and an elastically deformable plate arm extending from the block toward the cover and configured to abut an inner surface of the cover. | 2010-09-30 |
20100246051 | STOPPING METHOD FOR A SPINDLE MOTOR AND RELATED DEVICE - A method and circuit to stop a spindle motor in the absence of the external supply voltage in which the spindle motor is structured to move a hard disk provided with at least one reading or writing head moved by a voice coil motor, the spindle motor provided with a plurality of coils. The method includes rectifying the backelectromotive force of the spindle motor to produce a braking current, driving the voice coil motor with at least a portion of the braking current until the speed of the spindle motor becomes lower than a predetermined stop speed, and, after the parking of the at least one reading or writing head of the voice coil motor, stopping the spindle motor by short-circuiting the coils of the spindle motor. | 2010-09-30 |
20100246052 | METHOD AND APPARATUS FOR ADAPTIVE GAIN BALANCING OF AT LEAST ONE OF TWO ROTATIONAL SENSORS IN A HARD DISK DRIVE - A hard disk drive and its circuit board and an integrated circuit are disclosed using two piezoelectric devices each having one terminal used to generate signal. The first signal goes to one input of a differential amplifier. The second signal goes to an amplifier whose gain is controlled to create an amplified second signal for the differential amplifier whose output and the first and second signals create a selected signal received by an A/D converter to create a sampled signal used to create a linear disturbance signal and/or a rotational compensation signal, which in turn are used to control the gain of the amplifier to minimize a PES envelope and/or a harmonic PES envelope either in calibration or normal operation of the hard disk drive. | 2010-09-30 |
20100246053 | STORAGE DEVICE AND RAMP MECHANISM - According to one embodiment, a storage device has a head configured to read or write data with respect to a storage medium above the storage medium; a head suspension configured to support the head; a lift tab extending from an end on a head side of the head suspension; and a ramp mechanism configured to hold the lift tab at a retracted position spaced apart from the recording medium. The ramp mechanism has: a rotating shaft; and a disk rotatably supported by the rotating shaft and configured to rotate in a retracting direction by coming into contact with the lift tab that is retracting with the head from above the recording medium, and to guide and retract the lift tab to the retracted position. | 2010-09-30 |
20100246054 | Magnetic Recording And Reading Device - A magnetic recording and reading device includes a perpendicular magnetic recording medium, a perpendicular magnetic head having a recording head width having a heat-generating portion and a reading head, a fine adjustment portion, and a R/W-IC. The perpendicular magnetic head is configured to perform magnetic recording on the recording medium while locally heating the recording medium so as to enable a change of the coercive force of the recording medium during the recording after correcting of the position of the perpendicular magnetic head by the fine adjustment portion is completed, and to perform reading of the magnetic recording information with the aid of the reading head after correcting of the position of the perpendicular magnetic head by the fine adjustment portion is completed. | 2010-09-30 |
20100246055 | STORAGE DEVICE - A magnetic disk device includes a head that reads position information, a position-information correction value for correcting the position information, and an error correcting code for the position-information correction value from a storage medium; an MCU and an ECC circuit for correcting an error in the position-information correction value based on the error correcting code; and an SVC that performs position control based on either one of the position-information correction value read by the head and the position-information correction value with the error corrected by the MCU and the ECC circuit, and the position information read by the head so that the head is located at a target position on the storage medium. | 2010-09-30 |
20100246056 | DETERMINATION OF WEDGE OFFSET CORRECTION VALUES FOR A DISK DRIVE - In a disk drive, a wedge-based scheme is used to determine wedge offset correction values for a track of the disk drive. Correction values for the offset of each servo wedge are calculated wedge-by-wedge, based on the position error signal (PES) of the most recently measured servo wedge in combination with the measured PES of other servo wedges. To minimize transport delay of the servo, the majority of servo-control calculations may be pre-calculated prior to measuring the PES at the current wedge. Wedge offset correction values for a given servo wedge are corrected iteratively with each revolution of the storage disk. | 2010-09-30 |
20100246057 | SERVO WRITER PROVIDING A PRE-WRITING, LONGITUDINAL MAGNETIC BIAS IN A MAGNETICALLY UNORIENTED TAPE SUPPLY - A servo writing method is provided for use with unoriented magnetic tape media. A biasing zone is formed, such as between a pair of permanent block or disk magnets, with a strong DC magnetic field that is substantially free of perpendicular components. The method includes feeding the tape through the magnetic biasing zone to form a longitudinal magnetic bias in the magnetic layer of the tape media. The method includes using a write head to write a servo pattern on the tape media after the forming of the longitudinal magnetic bias in the tape media, and the servo pattern produces an output that is substantially symmetric with high amplitudes. In one embodiment, the biasing zone is formed or defined as the gap between first and second magnetic assemblies oriented with a single direction of magnetization, such as in the same direction as the tape travel through the biasing zone. | 2010-09-30 |
20100246058 | STORAGE SYSTEM CONTROLLING POWER SUPPLY MODULE AND FAN - When a disk device corresponding to a logical volume is started, a disk system determines and starts a disk device and a fan to be started, while comprehensively considering heat quantity generated by the disk device to be started, the cooling capacity of the fan, and the electric power consumption of the fan or the electric power consumption of the disk device. | 2010-09-30 |
20100246059 | STORAGE DEVICE - According to an embodiment, a storage device includes a housing configured to contain a magnetic disk storage medium, a drive section configured to rotate the storage medium to store information into the storage medium, an air passage which is defined along an outer peripheral edge of the storage medium between the outer peripheral edge and a wall portion of the housing which faces the outer peripheral edge, receives air produced as the storage medium rotates, and discharges the received air toward an outer peripheral surface of the storage medium, a filter for dust collection in the air passage, and a spoiler located close to at least an air exhaust side of the air passage and extending from the outer peripheral edge side of the storage medium to a region above a recording surface of the storage medium. | 2010-09-30 |
20100246060 | PERPENDICULAR MAGNETIC RECORDING MEDIUM AND MAGNETIC RECORDING AND REPRODUCING APPARATUS - The present invention relates to a perpendicular magnetic recording medium including a nonmagnetic substrate, and at least a soft magnetic layer (SUL), an alignment control layer, a magnetic recording layer and a protective layer formed on the nonmagnetic substrate, wherein the magnetic recording layer is constituted of two or more layers and includes a first magnetic recording layer and a second magnetic recording layer from the nonmagnetic substrate side and, regarding magnetocrystalline anisotropic energy K | 2010-09-30 |
20100246061 | Shielded Perpendicular Magnetic Recording Head - A magnetic recording head for perpendicular magnetic recording includes energizing means, a recording pole, and a return pole. The recording pole narrows to a tip region with leading and trailing write edges separated by first and second side edges. The tip region provides a low reluctance path for magnetic flux generated by the energizing means. The return pole has a shield flare projecting towards the trailing write edge. A gap separates a leading edge of the shield flare from the trailing write edge. The shield flare diverts magnetic flux from reaching the tip region, thereby shielding the recording medium beneath the shield flare from the magnetic field while the side edges of the tip region and the recording medium beneath the gap are unshielded. A rear flare smoothes the discontinuity at the trailing edge of the return pole, thus reducing the peak magnetic field under the return pole. | 2010-09-30 |
20100246062 | PATTERNED-MEDIA PERPENDICULAR MAGNETIC RECORDING DISK WITH SERVO REGIONS HAVING MAGNETIZED SERVO PILLARS AND OPPOSITELY-MAGNETIZED SERVO TRENCHES - A patterned perpendicular magnetic recording disk has a pre-patterned disk substrate with pillars and trenches arranged in data regions and servo regions. In the data regions, the height of the data pillars is equal to or greater than the spacing between the data pillars, while in the servo regions the height of the servo pillars is less than the spacing between the servo pillars. A magnetic recording material with perpendicular magnetic anisotropy is deposited over the entire disk substrate, which results in magnetic material on the tops of the data pillars and servo pillars and in the servo trenches. The material in the data trenches is either nonmagnetic or discontinuous. After the application of a high DC magnetic field in one perpendicular direction and a low DC magnetic field in the opposite direction, the resulting disk has patterned servo sectors with servo pillars all magnetized in the same perpendicular direction and servo trenches magnetized in the opposite perpendicular direction. | 2010-09-30 |
20100246063 | METHOD OF MANUFACTURING HEXAGONAL FERRITE MAGNETIC POWDER, MAGNETIC RECORDING MEDIUM AND METHOD OF MANUFACTURING THE SAME - An aspect of the present invention relates to a method of manufacturing a hexagonal ferrite magnetic powder comprising preparing a melt by melting a starting material mixture comprising a hexagonal ferrite-forming component and a glass-forming component; rapidly cooling the melt to obtain an amorphous material comprising 0.3 to 2.0 weight percent of carbon atoms; heating the amorphous material to a temperature range of 580 to 700° C. and maintaining the amorphous material within the temperature range to precipitate hexagonal ferrite magnetic particles; and collecting the hexagonal ferrite magnetic particles precipitated. | 2010-09-30 |
20100246064 | LUBRICANT COMPOUND FOR A MAGNETIC DISK, MAGNETIC DISK, AND METHOD OF MANUFACTURING THE SAME - In a magnetic disk has at least a magnetic layer, a carbon-based protective layer, and a lubricating layer formed in this order over a substrate, the lubricating layer contains a lubricant compound including a compound which has a perfluoropolyether main chain in a structure thereof, an aromatic group located at a position except each end of a molecule thereof, and a polar group at each end of the molecule. | 2010-09-30 |
20100246065 | Suspension with additional bonding pads, head gimbal assembly and disk drive unit with the same - A suspension for a head gimbal assembly comprises a flexure having a plurality of electrical traces formed thereon, a plurality of first bonding pads formed on a first surface of the flexure and at least one second bonding pad formed on a second surface of the flexure opposite the first surface. The first bonding pads and the at least one second bonding pad are electrically connected with the electrical traces and adapted to electrically connect to a slider of the head gimbal assembly. The invention also discloses a head gimbal assembly and a disk drive unit with the same. | 2010-09-30 |
20100246066 | HEAD SLIDER, STORAGE DEVICE, AND METHOD OF MANUFACTURING HEAD SLIDER - According to one embodiment, a head slider includes an element unit formed by lamination on a substrate, a cut surface formed by cutting the substrate, an air-bearing surface configured to face a recording medium when in flight, a protective layer configured to protect at least the air-bearing surface of the element unit, and a coating layer configured to cover at least the cut surface exclusive of the air-bearing surface of the element unit. An outermost surface of the air-bearing surface is formed of the protective layer in the element unit at the least. | 2010-09-30 |
20100246067 | Magnetic Head Suspension - In a magnetic head suspension according to the present invention, each of paired right and left connecting beams that are positioned on both sides of an open section, with which paired piezoelectric elements are at least partially overlapped in a plan view, in a suspension width direction and connect a proximal end section that is directly or indirectly connected to a main actuator and a distal end section to which the load bending part is connected includes proximal-side and distal-side beams. The distal-side beam is inclined with respect to the proximal-side beam in a plan view such that a connection point between the proximal-side and distal-side beams is located closer to a suspension longitudinal center line relative to a virtual line connecting the proximal end of the proximal-side beam and the distal end of the distal-side beam. | 2010-09-30 |
20100246068 | HARD DISK DRIVE - In a hard disk drive (HDD), a ratio of the distance R between the axis of rotation of an actuator and a magnetic head to the distance R | 2010-09-30 |
20100246069 | HARD DISK DRIVE - An HDD includes a head stack assembly, a voice coil motor, and a retracting pin unit. The retracting pin unit includes a mobile retracting pin generating a retracting force to maintain the actuator arm at a predetermined position by interacting with the magnet when the read/write head is parked, and coupled to the bobbin to be capable of relatively moving with respect to the bobbin toward the magnet when the bobbin is separated from the magnet due to an external shock. A head on disk phenomenon, in which the parking state of the read/write head is removed when an external shock such as a linear shock or a rotary shock, which may be generated as the HDD is installed in a notebook computer, is applied to the HDD, may be reduced. | 2010-09-30 |
20100246070 | HEAD STACK ASSEMBLY AND HARD DISK DRIVE HAVING THE SAME - A hard disk drive includes a head stack assembly including a read/write head mounted thereon and an actuator arm pivoting over a disk around a pivot shaft installed on a base, a pivot shaft holder rotatably supporting the pivot shaft and to which the actuator arm is coupled, and a bobbin provided at the opposite side of the actuator arm with respect to the pivot shaft holder and having a voice coil motor coil installed on at least one surface thereof, a crash stop coupled to the base and restricting displacement of the actuator arm, and a contact area reduction portion provided on at least one of the bobbin and the crash stop and including at least one non-contact section, in which the bobbin and the crash stop do not contact each other, in a contact section of the bobbin and the crash stop, when the bobbin and crash stop contact each other, to reduce the contact area between the bobbin and the crash stop. | 2010-09-30 |
20100246071 | HEAD SUSPENSION ASSEMBLY AND MAGNETIC DISK DRIVE - According to one embodiment, a head suspension assembly includes a load beam supporting a head, and a microactuator configured to swing the load beam. The microactuator includes two piezoelectric elements configured to undergo shear deformation when supplied with a voltage and juxtaposed in such a manner that respective shear deformations thereof are opposite in direction, a first electrode and a second electrode arranged so as to hold the piezoelectric elements therebetween, and a support plate joined to the first electrode with an insulating layer therebetween and joined to the load beam to support the load beam. | 2010-09-30 |
20100246072 | HARD DISK DRIVE - A hard disk drive having an actuator coupled to a pivot part about which the actuator rotates, including first and second pivot bearings coupled to the actuator and the pivot part, wherein a rotation center of at least one of the first and second pivot bearings is offset from respective longitudinal centers of the first and second pivot bearings. | 2010-09-30 |
20100246073 | Magnetic recording medium, magnetic signal reproduction system and magnetic signal reproduction method - An aspect of the present invention relates to a magnetic recording medium comprising a magnetic layer comprising a ferromagnetic powder and a binder on a nonmagnetic support. A height of protrusions with a protrusion density of 0.002 protrusion/μm | 2010-09-30 |
20100246074 | ESD Protection scheme for designs with positive, negative, and ground rails - Apparatuses and systems for dissipating ESD events are provided. In an embodiment, an integrated circuit (IC) device, includes a ground rail, a positive supply rail, a negative supply rail, a circuit block, a plurality of contact pads, and a coupling system. Each of the ground rail, positive supply rail, negative supply rail, and the circuit block are coupled to a respective contact pad of the plurality of contact pads. The contact pad coupled to the circuit block is configured to swing from a voltage of the negative rail to a voltage of the positive rail. The coupling system couples each contact pad of the plurality of contact pads to all other contact pads of the plurality of contact pads, whereby an electrostatic discharge (ESD) event between two contacts pads of the plurality of contact pads can be dissipated. | 2010-09-30 |
20100246075 | INTERFACE CIRCUIT AND PORTABLE ELECTRONIC DEVICE EMPLOYING THE SAME - An interface circuit for connecting with a universal serial bus (USB) data cable includes a USB connector for connecting with the USB data cable, an over voltage protection (OVP) circuit connected to the USB connector, and a time delay circuit connected to the USB connector and the OVP circuit to control the OVP circuit. The OVP circuit is switched off in a predetermined delay time of the time delay circuit when the USB data cable is connected to the USB connector, and is then switched on after the delay time of the time delay circuit. | 2010-09-30 |
20100246076 | Electrical Overstress Protection Circuit - A semiconductor circuit for electric overstress (EOS) protection is provided. The semiconductor circuit employs an electrostatic discharge (ESD) protection circuit, which has a resistor-capacitor (RC) time-delay network connected to a discharge capacitor. An electronic component that has voltage snapback property or a diodic behavior is connected to alter the logic state of the gate of the discharge transistor under an EOS event. Particularly, the electronic component is configured to turn on the gate of the discharge capacitor throughout the duration of an electrical overstress (EOS) condition as well as throughout the duration of an ESD event. A design structure may be employed to design or manufacture a semiconductor circuit that provides protection against an EOS condition without time limitation, i.e., without being limited by the time constant of the RC time delay network for EOS events that last longer than 1 microsecond. | 2010-09-30 |
20100246077 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE OF OUTPUT DRIVER STAGE - Provided is an electrostatic discharge (ESD) protection device of an output driver stage of a semiconductor chip. The ESD protection device of an output driver stage, which includes a p-channel metal-oxide-semiconductor (PMOS) transistor having a source connected to a first source voltage and an n-channel metal-oxide-semiconductor (NMOS) transistor having a source connected to a second source voltage, the MOS transistors having gates applied with output signals from an internal circuit and drains connected to the output pad, wherein a distance between contacts formed on a drain region and a gate poly of the MOS transistors is relatively greater than a value according to a predetermined design rule. | 2010-09-30 |
20100246078 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device supports maintenance of a signal transfer frequency and waveform quality and electrostatic protection, and also suppresses expansion of a chip area. In order to maintain the signal transfer frequency and the waveform quality as well as to keep an effect of the electrostatic protection, and simultaneously to protect a differential input pair by a single electrostatic protection element and to attain area superiority, the electrostatic protection element that is arbitrarily separable is disposed at a middle point of a terminator. | 2010-09-30 |
20100246079 | POWER SUPPLY CLAMP CIRCUIT - A power supply clamp circuit includes a first transistor including a metal silicide layer that is formed in a substrate between a first electrode coupling part in a first drain region and a first gate electrode, and a second transistor including a first metal silicide layer and a second metal silicide layer each of which is formed in a substrate between a second electrode coupling part in a second drain region and a second gate electrode, wherein the first metal silicide layer and the second metal silicide layer are spaced apart from each other. | 2010-09-30 |
20100246080 | Intelligent fuse-holder - In high-current electrical devices protected by fuses, additional performance data besides whether or not a fuse is blown is useful for diagnostics, repair, and preventing emerging failures from reaching a level that damages the device. An intelligent fuse-holder includes a built-in current sensor. The current sensor signals are passed through an A/D converter and analyzed by a microcontroller. Through an interface, a user can program the fuse-holder to periodically degauss the current sensor coil to improve performance or turn the sensor power off to conserve power. The user may also control various I/O signals carrying information about the fuse, the intelligent electronics, or the host board on which the fuse-holder is mounted. | 2010-09-30 |
20100246081 | GROUND FAULT DETECTING SYSTEM AND ELECTRIC VEHICLE WITH GROUND FAULT DETECTING SYSTEM - When a malfunction of an ungrounded drive electric system including first and second ungrounded power supplies, an inverter, and a motor which is energized by the first and second ungrounded power supplies through the inverter, i.e., an erroneous opening of switches of a battery, is detected, switches of an insulation resistance detector are opened to insolate the insulation resistance detector from the ungrounded drive electric system. | 2010-09-30 |
20100246082 | Communication Circuit for a Digital Electronic Dimming Ballast - A communication circuit for an electronic dimming ballast provides high-voltage miswire protection and improved rise and fall times of a transmitted digital signal. The electronic dimming ballast comprises a control circuit, which is coupled to a digital communication link, for example, a DALI communication link, via the communication circuit. The communication circuit comprises a receiving circuit for detecting when the digital ballast communication link is shorted and for providing a received digital message to the control circuit. The communication circuit also comprises a transmitting circuit for shorting the communication link in response to the control circuit. The communication circuit also includes a high-voltage fault protection circuit for protecting the circuitry of the communication circuit if the communication circuit high-voltage mains voltages. The communication circuit is operable to reliably transmit digital messages having improved rise and fall times. The communication circuit draws acceptable amounts of current when the communication link is alternatively in idle and active states. | 2010-09-30 |
20100246083 | METHOD FOR CONTROLLING ELECTRIC COMPRESSOR - A method for controlling an electric compressor into which an inverter for controlling an electric motor as a drive source is integrally incorporated. The method is characterized by comprising the steps of acquiring the temperature of an accessory of the inverter, when the acquired temperature becomes or is already equal to or higher than the maximum rated temperature of the accessory, calculating the value of a current which can flow at the acquired temperature and restrictively controlling the rotational speed of the electric compressor such that the input current becomes equal to or less than the value of the current which can flow, and when the temperature of the accessory becomes lower than the maximum rated temperature, releasing the restrictive control. The method for controlling the electric compressor can prevent a malfunction of the accessory even in use under a high-temperature environment while preventing increase in the cost and size of the electric compressor by preventing an increase in the size of the accessory of the inverter. | 2010-09-30 |
20100246084 | Control circuit - A control circuit includes a voltage-dividing resistor connected to a voltage input terminal, at least one thermal breaker series-connected between the voltage-dividing resistor and the ground and disposed near one corresponding battery, and an output terminal drawn forth from a connection location of the thermal breaker and the voltage-dividing resistor and adapted to be connected with a protective circuit. The thermal breaker breaks according to the temperature of the corresponding battery, and then the output terminal transmits different protective signals to the protective circuit according to the working state of the thermal breaker so as to make the protective circuit protect the battery based on the protective signals. Therefore, the control circuit of the present invention is relatively simpler and occupies a relatively smaller space so that can meet the demand of both miniaturization and low cost of electronic products. | 2010-09-30 |
20100246085 | HIGH-VOLTAGE DEVICE - A high-voltage device includes a conducting element for conducting a high-voltage current and at least one transient reducing unit for reducing voltage peaks of existing propagating very fast transients (VFTs) by the generation of arcing. The transient reducing unit has at least one arcing occurrence surface. The at least one arcing occurrence surface of the at least one transient reducing unit is positioned in the vicinity of the conducting element such that arcing occurs between the transient reducing unit and the conducting element when the potential difference between the transient reducing unit and the transient conducting element is above a threshold value, such as at the occurrence of a very fast transient. A method is also provided for equipping a high-voltage device with the transient reducing unit. | 2010-09-30 |
20100246086 | SOLENOID DRIVING DEVICE AND ACTIVE VIBRATION ISOLATING SUPPORT DEVICE EQUIPPED WITH THE SAME - A solenoid driving device with excellent electric power efficiency which drives and controls an actuator including a solenoid and an active vibration isolating support device with excellent electric power efficiency which includes the solenoid driving device are disclosed. The solenoid driving device includes a booster circuit | 2010-09-30 |
20100246087 | SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING CIRCUIT FOR DRIVING ELECTROSTATIC ACTUATOR, MICRO-ELECTRO-MECHANICAL SYSTEMS, AND DRIVING METHOD OF ELECTROSTATIC ACTUATOR - A semiconductor integrated circuit comprises an electrostatic actuator, an estimation circuit, a storage circuit and a bias circuit. The electrostatic actuator has a top electrode, a bottom electrode, and an insulating film disposed between the top electrode and the bottom electrode. The estimation circuit estimates the amount of a charge accumulated in the insulating film of the electrostatic actuator. The storage circuit stores a result of the estimation of the charge amount by the estimation circuit. The bias circuit changes, on the basis of the estimation result stored in the storage circuit, a drive voltage to drive the electrostatic actuator. | 2010-09-30 |
20100246088 | Variable capacitor and method of making the same - A capacitor manufacturing method provides variable capacitors whose capacitances remain stable under the influence of temperature change. Such a variable capacitor includes a fixed electrode, a movable electrode film facing the fixed electrode, and an anchor portion that provides partial connection between the fixed electrode and the movable electrode film. For making this variable capacitor, a first electrode is formed to serve as the fixed electrode. Then, an anchor portion is formed on the fixed electrode, and a sacrifice film is formed to cover the fixed electrode but partially expose the anchor portion. A second electrode is formed on the sacrifice film to serve as the movable electrode film, bonded to the anchor portion. Finally, the sacrifice film is removed. | 2010-09-30 |
20100246089 | METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR - A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component. | 2010-09-30 |
20100246090 | THIN FILM CAPACITOR - To provide a thin film capacitor having a device structure for suppressing peeling between an insulating film and a substrate. A thin film capacitor | 2010-09-30 |
20100246091 | THIN FILM CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A thin film capacitor includes a metal foil, dielectric layers and internal electrode layers alternately disposed on the metal foil, and a top electrode layer on the topmost layer among the two or more dielectric layers. These layers have peripheries that define an outer profile flaring toward the metal foil as viewed from the stacking direction of the thin film capacitor, and at least one dielectric layer of two or more dielectric layers satisfies a relationship B>A>0 wherein A is a gap of the periphery of the internal electrode layer directly below the dielectric layer protruding from the periphery of the dielectric layer, and B is a gap of the periphery of the dielectric layer protruding from the periphery of the internal electrode layer or the top electrode layer directly above the dielectric layer. The thin film capacitor has a structure free from short-circuiting and reducing debris of broken dielectric material. | 2010-09-30 |
20100246092 | THIN-FILM DEVICE - A thin-film device comprises a base electrode made of a metal, a first dielectric layer, a first inner electrode, a second dielectric layer, a second inner electrode, and a third dielectric layer. Letting T | 2010-09-30 |
20100246093 | TWO-PHASE MIXED MEDIA DIELECTRIC WITH MACRO DIELECTRIC BEADS FOR ENHANCING RESISTIVITY AND BREAKDOWN STRENGTH - A two-phase mixed media insulator having a dielectric fluid filling the interstices between macro-sized dielectric beads packed into a confined volume, so that the packed dielectric beads inhibit electro-hydrodynamically driven current flows of the dielectric liquid and thereby increase the resistivity and breakdown strength of the two-phase insulator over the dielectric liquid alone. In addition, an electrical apparatus incorporates the two-phase mixed media insulator to insulate between electrical components of different electrical potentials. And a method of electrically insulating between electrical components of different electrical potentials fills a confined volume between the electrical components with the two-phase dielectric composite, so that the macro dielectric beads are packed in the confined volume and interstices formed between the macro dielectric beads are filled with the dielectric liquid. | 2010-09-30 |
20100246094 | METHODS FOR IMPROVING THE DIELECTRIC PROPERTIES OF A POLYMER, AND RELATED ARTICLES AND DEVICES - In one aspect of the present invention, a method for increasing the dielectric breakdown strength of a polymer is described. The method comprises providing the polymer and contacting a surface of the polymer in a reaction chamber with a gas plasma, under specified plasma conditions. The polymer is selected from the group consisting of a polymer having a glass transition temperature of at least about 150° C., and a polymer composite comprising at least one inorganic constituent. The contact with the gas plasma is carried out for a period of time sufficient to incorporate additional chemical functionality into a surface region of the polymer film, to provide a treated polymer. Also provided are an article and method of manufacture. | 2010-09-30 |
20100246095 | ELECTRIC DOUBLE LAYER CAPACITOR - An electric double layer capacitor comprising a plurality of electrode bodies comprising a positive electrode and a negative electrode laminated via a separator and being impregnated with an electrolyte solution, wherein the plurality of electrode bodies are electrically connected in series, the positive electrode and the negative electrode comprise an active material having pores, the electrolyte solution comprises an electrolyte having a cation and a counteranion of the cation, a ratio of an average pore diameter of the active material of the positive electrode to an ion diameter of the counteranion is in the range of 2.5 to 2.8, and a ratio of an average pore diameter of the active material of the negative electrode to an ion diameter of the cation is in the range of 1.65 to 1.85. | 2010-09-30 |
20100246096 | USE OF CONJUGATED OLIGOMER AS ADDITIVE FOR FORMING CONDUCTIVE POLYMERS - A process for forming a capacitor. The process includes providing an anode; providing a dielectric on the anode; exposing the anode to a polymer precursor solution comprising monomer, conjugated oligomer and optionally solvent and polymerizing the polymer precursor. The ratio between monomer and conjugated oligomer ranges from 99.9/0.1 to 75/25 by weight. The solvent content in the polymer precursor solution is from 0 to 99% by weight. | 2010-09-30 |
20100246097 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor comprises: a capacitor element coated with an enclosure resin; and an insulating substrate in which an anode terminal and a cathode terminal are formed. The anode terminal comprises a first anode section formed on a first surface of the insulating substrate, a second anode section formed on a second surface of the insulating substrate, and an anode conductive layer which is formed on a side edge surface of the insulating substrate to electrically connect there anode sections to each other. The cathode terminal comprises a first cathode section formed on the first surface, a second cathode section formed on the second surface, and a cathode conductive layer which is formed on the side edge surface of the insulating substrate to electrically connect there cathode sections to each other. And the anode conductive layer and the cathode conductive layer are exposed from the enclosure resin. | 2010-09-30 |
20100246098 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor comprises an insulating substrate in which an anode terminal and a cathode terminal are formed. A first anode section and a first cathode section are formed on a first surface of the insulating substrate, so as to be spaced from each other in a first predetermined direction. A second anode section and a second cathode section are formed on a second surface of the insulating substrate, so as to be spaced from each other in a second direction generally perpendicular to the first direction. The anode terminal comprises the first and second anode sections, which are electrically connected to each other. The cathode terminal comprises the first and second cathode sections, which are electrically connected to each other. A capacitor element is arranged on the first surface of the insulating substrate with an anode section thereof being oriented in the first direction. | 2010-09-30 |
20100246099 | ELECTROLYTIC CAPACITOR AND METHOD OF MAKING THE SAME - A solid electrolytic capacitor includes a capacitor element, an external conduction member and a fuse conductor. The capacitor element includes a porous sintered body made of valve metal, an anode wire projecting from the porous sintered body, and a dielectric layer and a solid electrolyte layer covering the porous sintered body. The fuse conductor electrically connects the external conduction member and one of the anode wire and the solid electrolyte layer to each other. The fuse conductor is made of a metal containing one of Au—Su-based alloy, Zn—Al-based alloy, Sn—Ag—Cu-based alloy, Sn—Cu—Ni—based alloy and Sn—Sb—based alloy. | 2010-09-30 |
20100246100 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor includes at least one capacitor element in which the other end of an anode lead extends beyond an exposed portion of an electrolyte layer exposed from a cathode layer. The solid electrolytic capacitor further includes: an anode terminal connected to the other end of the anode lead, a cathode terminal connected to the cathode layer, a resin layer and a resin outer package covering the capacitor element and the resin layer. The resin layer covering the exposed portion of the electrolyte layer, the other end of the anode lead, and a connecting part between the other end of the anode lead and the anode terminal. The resin layer includes a first resin layer covering the exposed portion and a second resin layer covering the first resin layer, the first resin layer being softer than the second resin layer. | 2010-09-30 |
20100246101 | SYSTEM AND METHOD FOR ALTERING A USER INTERFACE OF A POWER DEVICE - A system and method for altering a user interface of a power device is provided. The user interface includes an interface structure. The method includes acts of receiving user preference information, determining additional configuration information of the power device, adapting the interface structure based at least in part on the user preference information and the additional configuration information and providing at least a portion of the adapted interface structure to a user via the user interface. | 2010-09-30 |
20100246102 | INSULATION OF A SWITCHGEAR DEVICE OF VACUUM CARTRIDGE TYPE BY INSERT MOULDING - A vacuum cartridge ( | 2010-09-30 |
20100246103 | HYBRID HINGE AND AN ELECTRONIC DEVICE COMPRISING THE HYBRID HINGE - The invention relates to a hybrid hinge. The hybrid hinges | 2010-09-30 |
20100246104 | DISPLAY APPARATUS - A display apparatus is provided. The display apparatus includes a front side that is exposed the outside. A refractor or set of refractors is positioned so as to minimize the appearance of a shield member to a viewer, thus causing a non-display region of the display apparatus to appear to be smaller than its actual size, thus increasing a size of an image display region of the display apparatus. | 2010-09-30 |
20100246105 | FIXING MECHANISM FOR FIXING A BOARD AND RELATED ELECTRONIC DEVICE - A fixing mechanism includes a base whereon a protrusion is formed, an elastic component installed inside the base, and a supporting component wedged inside the base. An end of the supporting component contacts against the elastic component, and the other end of the supporting component is for supporting a board. The fixing mechanism further includes a clamping frame pivoted to the base. A slot is formed on the clamping frame. The clamping frame and the supporting component clamp the board together when the protrusion of the base is inserted inside the slot on the clamping frame. | 2010-09-30 |
20100246106 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, a first pivot, an audio module, a second pivot, a cam, a follower, a latch, and an elastic element. The first pivot pivotally connects the first body with the second body. The second pivot pivotally connects the audio module with the second body. The cam is coupled with the first pivot. The follower contacts the cam. The latch is fastened to the audio module and connected with the follower. The elastic element includes two ends, one is against the second body, and the other one is against the audio module. | 2010-09-30 |
20100246107 | INFORMATION TERMINAL DEVICE - An information terminal device includes a first case; a second case electrically connected to the first case with a cable, the second case being movable relative to the first case; and a cable-containing section that allows movement of an extra-length portion of the cable, the extra-length portion being disposed so as to have a spiral shape, the movement of the extra-length portion being caused by movement of one of the first case and the second case, wherein the cable-containing section is disposed in one of the first case and the second case. | 2010-09-30 |
20100246108 | INFORMATION TERMINAL DEVICE - An information terminal device includes a first case including an operation section, and a second case movably connected to the first case with a connection mechanism, wherein an edge portion is formed around the operation section of the first case, the edge portion being raised toward the second case, and wherein an elastic sheet member is attached to a surface of the second case, the surface facing the first case, and the elastic sheet member includes a protruding portion, the protruding portion protruding toward the first case and having an outer side surface that elastically and slidably contacts an inner side surface of the edge portion. | 2010-09-30 |
20100246109 | Cover Unit, Electronic Device, And Image Forming Apparatus - A cover unit to open and close an opening formed in a main body includes a cover including a hinged first end portion, a second end portion including an engagement portion provided on a side facing the opening, and a deformable portion deformable toward the main body, provided in the second end portion, a rotation stopper disposed between the cover and the opening, to inhibit the cover from rotating excessively, and a push latch unit disposed in the main body to lock and unlock the cover, including an engagement pawl to contact the engagement portion of the cover when the rotation stopper prohibits the cover from rotating further to the main body. When the second end portion is pressed while the rotation stopper prohibits the cover from rotating, the engagement portion of the cover is engaged or disengaged from the engagement pawl of the push latch unit. | 2010-09-30 |
20100246110 | INFORMATION TERMINAL DEVICE - An information terminal device includes a first housing and a second housing slidably connected to each other with a connecting mechanism and that is changeable in state between a closed state in which the two housings overlap each other and an open state in which the two housings overlap each other by an area smaller than in the closed state. The information terminal device includes an elastic sheet component attached to a surface of the second housing that faces the first housing and having a protrusion protruding towards the first housing, and a biasing component that biases the protrusion towards the first housing so as to cause the biased protrusion to be elastically in contact with the first housing when the information terminal device is in the closed state. | 2010-09-30 |
20100246111 | DISPLAY DEVICE - The present invention provides a display device that prevents damage on a display panel even when the display device drops or falls down during handling. The display device includes: a PDP ( | 2010-09-30 |
20100246112 | COVER FOR DEVICE - A cover for a device is disclosed. The cover may include a first portion operable to protect a button of a device from inadvertent actuation, wherein the first portion enables viewing of the button while the cover overlaps the device. The cover may also include an opening operable to afford access to an interface component of the device, wherein the opening is operable to enable a user to reach through and physically interact with the interface component while the cover overlaps the device. The cover may further include a second portion enclosing the opening on all sides. | 2010-09-30 |
20100246113 | ELECTRONIC DEVICE COMPRISING A FLEXIBLE DISPLAY WITH EDGE PROTECTORS - The invention relates to an electronic device | 2010-09-30 |
20100246114 | TOOL-LESS RETENTION SYSTEM FOR AN ELECTRONIC DEVICE - The invention broadly contemplates a tool-less retention system that appropriately distributes load via various distributed load points to prevent damage caused to a computer by heavy adapter cards during shipping. At least one embodiment of the invention includes a tool-less retention system with a balanced distributed load point positioned to contact and transfer force to the computer chassis at a region with great resistance to warping. | 2010-09-30 |
20100246115 | MEMORY CARD ACTUATOR - A portable electronic device comprises a card actuator for ejection and introduction of memory cards and a card holder with a card eject mechanism for ejecting a memory card in a first direction if the card is moved in a second direction, which card actuator is adapted for interaction with the card for moving the card in the second direction, and the card actuator is fixedly connected to the portable electronic device. | 2010-09-30 |
20100246116 | FIXING MECHANISM FOR STORAGE DEVICE - A fixing mechanism is used to fix a storage device to an electronic device. The electronic device includes a bracket. The fixing mechanism includes two latching members fixed to one of the bracket and the storage device, and a limiting member fixed to the other. The limiting member includes two side plates and at least one resilient hook. Each of the side plates defines a holding portion to receive the latching member. The at least one resilient hook engages with the latching members. The storage device may be secured by the fixing mechanism, or detached from the fixing mechanism depending on the resilient deformation or reformation of the resilient hooks. | 2010-09-30 |
20100246117 | VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center. | 2010-09-30 |
20100246118 | CASE AND RACK SYSTEM FOR LIQUID SUBMERSION COOLING OF ELECTRONIC DEVICES CONNECTED IN AN ARRAY - A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices. | 2010-09-30 |
20100246119 | PORTABLE DOCKING STATION FOR A PORTABLE COMPUTING DEVICE - A portable computing device (PCD) docking station is disclosed and may include an upper housing portion and a lower housing portion coupled to the upper housing portion. A PCD docking pocket formed in the lower housing portion of the PCD docking pocket may be configured to removably receive a PCD. The PCD docking station may further include a keyboard incorporated into the lower housing portion, a display incorporated into the upper housing portion and a battery. The PCD docking station may be configured to allow access to a PCD via the keyboard when the PCD is docked with the PCD docking station. | 2010-09-30 |
20100246120 | MOBILE TERMINAL DEVICE - An information terminal device that includes a first housing electrically and movably connected to a second housing via a cable, the first housing includes a first substrate, a cable guide member having a portion of the cable therein so that the cable guide member guides an end portion of the cable to the first substrate, and a cable cover member which integrally includes a cable surrounding unit which covers the portion of the cable in the cable guide member and a sensor holding unit which holds a detection sensor for detecting the position of the second housing in relation to the first housing. | 2010-09-30 |
20100246121 | RELEASE MODULE AND COMPUTER HOUSING USING THE SAME - A computer housing includes a main body, a panel, a latch piece, and a release member. The main body defines a latch hole. The panel has a hook on a first side thereof. The latch piece is positioned on a second side of the panel and defines a receiving hole therein. The release member is positioned on the main body and forms a latch protrusion. The hook is received in the latch hole of the main body. The latch protrusion engages with the receiving hole such that the panel is locked to the main body. The release member is deformable so that the latch protrusion disengages from the receiving hole. | 2010-09-30 |
20100246122 | Equipment Rack and Associated Ventilation System - A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape. A cable management system includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device. | 2010-09-30 |
20100246123 | COOLING DEVICE - A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space. | 2010-09-30 |
20100246124 | Enclosure for Confining the Released Chemicals of Electrical Devices - An enclosure comprised of at least two members creates a sealable enclosed space. At least one of the members is a vessel that absorbs thermal energy from the enclosed space and transfers it into material it holds. Built into the enclosure is a connection means for connecting an enclosed device to outside devices. Disclosed is a moat based sealing configuration for a top and base enclosure. Also disclosed is an easily detachable heat transfer apparatus in which thermal energy transfer contact from an enclosed device to a housing member is formed as a housing portion is moved into closed position and concluded as the housing portion is moved away from closed position. | 2010-09-30 |
20100246125 | Electronic Apparatus - An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component. | 2010-09-30 |
20100246126 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink, a fan, and a fixing structure. The fan defines a number of fixing holes. The fixing structure includes a base, two resilient side panels bent from two sides of the base. The base and the side panels bound an accommodating space to accommodate the fan. An airflow opening is defined in the base for allowing air to flow between the heat sink and the fan. First ends of a number of fasteners secure the base of the fixing structure to the heat sink. Second ends of the number of fasteners protrude through the base into the accommodating space, to be accommodated in the corresponding fixing holes of the fan. | 2010-09-30 |
20100246127 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit. | 2010-09-30 |
20100246128 | Circuit Pack Cooling Solution - An improved apparatus and system are provided for heat dissipation in a bank of circuit components using heat pipes and/or vapor chambers, wherein the heat pipes and/or vapor chambers efficiently transport heat away from high heat components. | 2010-09-30 |
20100246129 | Electronic Apparatus - An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board. | 2010-09-30 |
20100246130 | Translating Hinge - A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element. | 2010-09-30 |
20100246131 | HEAT SINK AND MOTHERBOARD ASSEMBLY UTILIZING THE HEAT SINK - A heat sink for dissipating heat for a motherboard, includes a package portion, a heat dissipating device made of heat conducting material, and a number of grounding pins made of heat conducting material. The package portion includes a top wall. The heat dissipating device is exposed out of the top wall of the package portion. The number of grounding pins extending down through the package portion, to be soldered to a number of bonding grounding pads of a corresponding idle chip installing area of the motherboard, respectively. Top portions of the grounding pins contact the heat dissipating device. A motherboard assembly utilizing the heat sink is also disclosed. | 2010-09-30 |
20100246132 | FASTENER AND HEAT SINK ASSEMBLY HAVING THE SAME - A heat sink assembly is mounted on a printed circuit board to dissipate heat generated by an electronic component. The heat sink assembly includes a heat sink and a plurality of fasteners fixing the heat sink to the printed circuit board. The fastener includes a head, a post extending downwardly from the head through the heat sink, an elastic member encircling the post and compressed between the head and the heat sink, and an engaging member fixed to the printed circuit board. A top of the engaging member is fastened to a bottom of the post. When the post, together with the head, is rotated relative to an axis thereof toward a locked position, the post would be driven by the engaging member to automatically lock with the engaging member at the locked position. | 2010-09-30 |
20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL - Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip. | 2010-09-30 |
20100246134 | THERMAL INSULATION STRUCTURE - A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device. | 2010-09-30 |
20100246135 | ELECTRONIC DEVICE - An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base. | 2010-09-30 |
20100246136 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is formed between every two adjacent heat dissipation fins. The heat dissipation fin can resiliently deform to change a distance between the heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink. The electronic device comprises a shell and an electronic component mounted in the shell. One of the heat spreaders is attached to the electronic component and the other one is attached to the shell. | 2010-09-30 |
20100246137 | THERMAL-ELECTRICAL ASSEMBLY FOR A PORTABLE COMMUNICATION DEVICE - A thermal-electrical assembly ( | 2010-09-30 |
20100246138 | METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES - Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed. | 2010-09-30 |
20100246139 | SEMICONDUCTOR APPARATUS AND HEAT CONDUCTIVE SHEET - A semiconductor apparatus is comprising a circuit board with a semiconductor device surface-mounted on one surface thereof. A heatsink is disposed and fixed with a connection member and separated with a predetermined distance on one side of the circuit board opposite to the surface where the semiconductor device is mounted. A heat conductive sheet is provided between the circuit board and the heatsink and thermally connecting the semiconductor device and the heatsink through the circuit board. The heat conductive sheet is constituted as a laminate of a first member and a second member and one of the first and second members is a ceramic board whereas the other is a resin sheet material having highly heat conductive fillers mixed therein. | 2010-09-30 |
20100246140 | Circuit Board and Method for Manufacturing Semiconductor Modules and Circuit Boards - The deterioration of dielectric breakdown strength arising from an opening of a metal plate is prevented and the reliability as a circuit board is enhanced. A circuit board is provided with a metal plate, having openings, as core material. The opening is provided in a manner that the size of the opening gradually increases from a lower surface side toward an upper surface side of the metal plate. On both surface sides of the metal plate there are provided wiring patterns, respectively, via insulating layers. The insulating layer provided on an upper region of the opening and the corresponding wiring pattern are provided such that they have a recess on the upper surface of them. To electrically connect each wiring pattern, the circuit board further includes a conductor which penetrates the metal plate via the opening and which connects the wiring patterns with each other. An LSI chip is directly coupled to the upper surface side of the metal plate via a solder ball. | 2010-09-30 |
20100246141 | ELECTRONIC PACKAGE AND METHOD OF FABRICATION THEREOF - One aspect of the present invention provides an electronic package, comprising at least a first module and a second module arranged on top of the first module, the modules together in the form of a module stack, wherein the first and second modules are adhesively connected together, each module includes a substrate layer having at least one metal layer, at least one die and a plastic(s) package molding compound layer molded over said die or dice, in each module the die or dice are bonded on said substrate layer via the metal layer, a plurality of channels formed generally vertically acting as vias to connect the metal layers and arranged adjacent to the die or dice in at least one of the modules, some or all the channels provided with an inner surface coated with a conductive material layer or filled with a conductive material for electrical connection whereby the dice are electrically connected together, and means serving as an intermediary for providing electrical, mechanical and thermal connectivity, communication externally and connected to the channels. | 2010-09-30 |
20100246142 | LATCH ASSEMBLY FOR A PLUGGABLE ELECTRONIC MODULE - A latch assembly for a pluggable electronic module matable with a receptacle assembly includes a lever actuatable between a latched position and an unlatched position, a yoke assembly operatively coupled to the lever, and a latch element coupled to the latch end of the yoke assembly. The yoke assembly has a latch end rotatable between a latched position and an unlatched position. The latch element is movable between an engaged position and an unengaged position as the latch end is rotated between the latched and unlatched positions, respectively. The latch element is configured to engage the receptacle assembly to lock the pluggable electronic module within the receptacle assembly when the latch element is in the engaged position. | 2010-09-30 |
20100246143 | Electromagnetic Interference Shielding for Compact Electronic Devices - Improved approaches for providing electromagnetic interference shielding to one or more electrical components within a housing of a portable electronic device are disclosed. According to one aspect of certain embodiments, an electromagnetic shield can be attached to one or more edges of a substrate (e.g., printed circuit board) provided within a housing of a portable electronic device. Advantageously, this allows the substrate space to be efficiently utilized such that relatively wide electrical components can be provided on the substrate without having to further increase the width of the substrate to provide space for an EMI shielding structure and its attachment to the substrate. The housing of the portable electronic device can be compact, such as a low profile housing. | 2010-09-30 |
20100246144 | ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE - The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor package | 2010-09-30 |
20100246145 | ELECTRONIC DEVICE AND DUMMY CONNECTOR THEREOF - An electronic device includes a shell, a printed circuit board, and a dummy connector. The shell defines a through hole and accommodates the printed circuit board. The dummy connector includes a main body and a grounded portion. The main body includes a projection engaging the through hole. The grounded portion extends from the main body and is electrically fixed to the printed circuit board to be grounded. | 2010-09-30 |
20100246146 | Electronic device and method of producing the same - A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet. | 2010-09-30 |
20100246147 | Microphonics Suppression in High-Speed Communications Systems - One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system. | 2010-09-30 |
20100246148 | Electronic Apparatus Produced using lead-Free bonding Material for Soldering - Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature. | 2010-09-30 |