39th week of 2013 patent applcation highlights part 19 |
Patent application number | Title | Published |
20130249068 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXTERNAL INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a routable distribution layer on a leadframe; mounting an integrated circuit over the routable distribution layer; encapsulating with an encapsulation over the routable distribution layer; peeling the leadframe away from the routable distribution layer with a bottom distribution side of the routable distribution layer exposed from the encapsulation; and mounting an external interconnect on the routable distribution layer. | 2013-09-26 |
20130249069 | CIRCUIT PACKAGE, AN ELECTRONIC CIRCUIT PACKAGE, AND METHODS FOR ENCAPSULATING AN ELECTRONIC CIRCUIT - A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures. | 2013-09-26 |
20130249070 | SEMICONDUCTOR PACKAGE STRUCTURE - A semiconductor package structure comprises a lead frame, at least one chip, a molding compound and an anti-conduction film. The lead frame comprises a plurality of leads, each of the leads comprises a first end portion and a second end portion, wherein the first end portion comprises a first upper surface and a first lower surface, and the second end portion comprises a second upper surface and a second lower surface. The chip comprises a plurality of bumps electrically connected with the lead frame. The chip and the leads are covered with the molding compound. The first lower surface of each of the first end portions and the second lower surface of each of the second end portions are exposed by the molding compound. The first lower surface of the first end portion of each of the leads is covered with the anti-conduction film. | 2013-09-26 |
20130249071 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A method of assembling a semiconductor device includes providing a lead frame having a die pad and a fame member with lead fingers that surround the die pad. The lead fingers have distal ends connected to the frame member and proximal ends near the die pad. A die is attached to the die pad and die connection pads are electrically connected to the proximal ends of the lead fingers with bond wires. The die, bond wires, and part of the lead fingers are encapsulated with an encapsulant. The encapsulating process includes separating the lead fingers into first and second sets of lead fingers. The proximal ends of the first set lie in a first plane and the proximal ends of the second set lie in a second plane that is spaced and maintained from the first plane solely by the encapsulation material. | 2013-09-26 |
20130249072 | Direct Contact Package for Power Transistors - Some exemplary embodiments of a direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a first contact lead frame portion, a paddle portion, and an extended contact lead frame portion held together by a mold compound. A first semiconductor device is attached to a top side of the paddle portion and is enclosed by said mold compound, while a second semiconductor device is attached to a bottom side of said paddle portion and is in electrical contact with said the first semiconductor device. The extended contact lead frame portion is in direct electrical contact with the second semiconductor device without using a bond wire. Alternative exemplary embodiments may include additional extended lead frame portions, paddle portions, and semiconductor devices in various configurations. | 2013-09-26 |
20130249073 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a single-layer support structure having a structure non-horizontal surface; forming a single-layer contact coplanar with the single-layer support structure, the single-layer contact having a contact non-horizontal surface; forming a single-layer insulation coplanar with the single-layer contact and horizontally between the structure non-horizontal surface and the contact non-horizontal surface; forming an upper support pad over the single-layer insulation and directly on the single-layer support structure; and mounting an integrated circuit over the upper support pad. | 2013-09-26 |
20130249074 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board. | 2013-09-26 |
20130249075 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer. | 2013-09-26 |
20130249076 | Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces - A semiconductor device has a substrate. A first conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the first conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad. | 2013-09-26 |
20130249077 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINALS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting platform; applying an attach layer on the mounting platform; mounting an integrated circuit die on the attach layer; forming an encapsulation on the integrated circuit die and the attach layer, the mounting platform exposed from the encapsulation; and forming a terminal having a terminal protrusion from the leadframe, the terminal protrusion below a horizontal plane of the mounting platform. | 2013-09-26 |
20130249078 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a one-layer substrate with a symmetrical structure, the one-layer substrate having a redistribution pad and an insulation, the redistribution pad only at an insulation top side of the insulation; mounting an integrated circuit over the one-layer substrate; and forming an encapsulation over the integrated circuit. | 2013-09-26 |
20130249079 | Semiconductor Device and Method of Singulating Semiconductor Wafer along Modified Region within Non-Active Region Formed by Irradiating Energy through Mounting Tape - A semiconductor device has a semiconductor wafer with a plurality of semiconductor die separated by a non-active region. The semiconductor die can be circular or polygonal with three or more sides. A plurality of bumps is formed over the semiconductor die. A portion of semiconductor wafer is removed to thin the semiconductor wafer. A wafer ring is mounted to mounting tape. The semiconductor wafer is mounted to the mounting tape within the wafer ring. The mounting tape includes translucent or transparent material. A penetrable layer is applied over the bumps formed over the semiconductor wafer. An irradiated energy from a laser is applied through the mounting tape to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. | 2013-09-26 |
20130249080 | Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation - A semiconductor device has a semiconductor die with an encapsulant deposited over the semiconductor die. A first insulating layer having high tensile strength and elongation is formed over the semiconductor die and encapsulant. A first portion of the first insulating layer is removed by a first laser direct ablation to form a plurality of openings in the first insulating layer. The openings extend partially through the first insulating layer or into the encapsulant. A second portion of the first insulating layer is removed by a second laser direct ablation to form a plurality of trenches in the first insulating layer. A conductive layer is formed in the openings and trenches of the first insulating layer. A second insulating layer is formed over the conductive layer. A portion of the second insulating layer is removed by a third laser direct ablation. Bumps are formed over the conductive layer. | 2013-09-26 |
20130249081 | METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF - A method for manufacturing fine-pitch bumps comprises providing a silicon substrate; forming a titanium-containing metal layer having a plurality of first zones and a plurality of second zones on the silicon substrate; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer; forming a plurality of copper bumps having a plurality of first top surfaces and a plurality of first ring surfaces; heating the photoresist layer to form a plurality of body portions and removable portions; etching the photoresist layer; forming a plurality of bump protection layers on the titanium-containing metal layer, the first top surface and the first ring surface, each of the bump protection layers comprises a bump coverage portion; plating a plurality of gold layers at the bump coverage portion; eventually, removing the second zones to enable each of the first zones to form an under bump metallurgy layer. | 2013-09-26 |
20130249082 | CONDUCTIVE BUMP STRUCTURE ON SUBSTRATE AND FABRICATION METHOD THEREOF - A conductive bump structure is formed on a substrate having a plurality of bonding pads and a first insulating layer thereon. The first insulating layer has a plurality of openings formed therein for exposing the bonding pads and a conductive post is formed on the bonding pads exposed through the openings. Therein, a gap is formed between the conductive post and the wall of the opening such that no contact occurs between the conductive post and the first insulating layer, thereby preventing delamination of the conductive bump structure caused by stresses concentrating on an interface of different materials as in the prior art. | 2013-09-26 |
20130249083 | PACKAGING SUBSTRATE - A packaging substrate is provided, wherein a plurality of conductive posts together with a conductive bonding layer formed thereon form a plurality of external connection structures with the same height, thereby preventing tilted stack structures and poor coplanarity in a subsequent stacking process. | 2013-09-26 |
20130249084 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an interlayer insulating film containing Si, O, C, and H, an under-bump metal film disposed over the interlayer insulating film and containing Ni, and a bump electrode disposed over the under-bump metal film. In the interlayer insulating film, a ratio of a peak height of Si—CH | 2013-09-26 |
20130249085 | SEMICONDUCTOR DEVICE HAVING PENETRATING ELECTRODES EACH PENETRATING THROUGH SEMICONDUCTOR CHIP - Disclosed herein is a device that includes: a semiconductor substrate; plurality of first through-substrate vias each penetrating through the semiconductor substrate, a plurality of second through-substrate vias each penetrating through the semiconductor substrate, an insulating film formed over the semiconductor substrate, the insulating film including a first opening and a plurality of second openings, the first opening being located over the first through-substrate vias, and each of the second openings being located over a corresponding one of the second through-substrate vias. | 2013-09-26 |
20130249086 | CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF - A chip structure, a chip bonding structure, and manufacturing methods thereof are provided. The chip structure includes a chip, a plurality of bumps, and an insulation layer. The bumps are disposed on the chip. Each bump has a first bump portion and a second bump portion connected to each other, wherein the first bump portion and the second bump portion have different activities. The bumps are subjected to chemical reaction to form an insulation layer on the surface of one of the first bump portion and the second bump portion which has higher activity, so as to avoid short-circuit between the adjacent bumps. | 2013-09-26 |
20130249087 | ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF - An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads. | 2013-09-26 |
20130249088 | ADAPTIVE PATTERNING FOR PANELIZED PACKAGING - An adaptive patterning method and system for fabricating panel based package structures is described. Misalignment for individual device units in a panel or reticulated wafer may be adjusted for by measuring the position of each individual device unit and forming a unit-specific pattern over each of the respective device units. | 2013-09-26 |
20130249089 | METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF - A method for manufacturing fine-pitch bumps comprises the steps of providing a silicon substrate; forming a titanium-containing metal layer on the silicon substrate, wherein the titanium-containing metal layer comprises a plurality of first zones and a plurality of second zones; forming a photoresist layer on the titanium-containing metal layer; patterning the photoresist layer to form a plurality of opening slots; forming a plurality of copper bumps at the opening slots, wherein each of the copper bumps comprises a first top surface and a ring surface; heating the photoresist layer to form a plurality of body portions and a plurality of removable portions; etching the photoresist layer; and removing the second zones to enable each of the first zones to form an under bump metallurgy layer having a bearing portion and an extending portion. | 2013-09-26 |
20130249090 | Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die - A semiconductor device has a substrate with a die attach area. A conductive layer is formed over a surface of the substrate and extending below the surface. An insulating layer is formed over the surface of the substrate outside the die attach area. A portion of the conductive layer is removed within the die attach area to expose sidewalls of the substrate. The remaining portion of the conductive layer is recessed below the surface of the substrate within the die attach area. A semiconductor die has bumps formed over its active surface. The semiconductor die is mounted to the substrate by bonding the bumps to the remaining portion of the first conductive layer recessed below the first surface of the substrate. The sidewalls of the substrate retain the bumps during bonding to the remaining portion of the conductive layer. An encapsulant is deposited between the semiconductor die and substrate. | 2013-09-26 |
20130249091 | Multi-Direction Design for Bump Pad Structures - An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction. | 2013-09-26 |
20130249092 | PACKAGED MICROELECTRONIC DEVICES RECESSED IN SUPPORT MEMBER CAVITIES, AND ASSOCIATED METHODS - Packaged microelectronic devices recessed in support member cavities, and associated methods, are disclosed. Method in accordance with one embodiment includes positioning a microelectronic device in a cavity of a support member, with the cavity having a closed end with a conductive layer, and an opening through which the cavity is assessable. The microelectronic device can have bond sites, a first surface, and a second surface facing opposite from the first surface. The microelectronic device can be positioned in the cavity so that the second surface faces toward and is carried by the conductive layer. The method can further include electrically coupling the bond sites of the microelectronic device to the conductive layer. In particular embodiments, the microelectronic device can be encapsulated in the cavity without the need for a releasable tape layer to temporarily support the microelectronic device. | 2013-09-26 |
20130249093 | CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE - A conductive film of an embodiment includes: a fine catalytic metal particle as a junction and a graphene extending in a network form from the junction. | 2013-09-26 |
20130249094 | METHOD OF PREPARING TRANSPARENT CONDUCTING OXIDE FILMS - The present invention discloses a method of preparing a transparent conducting oxide (TCO) film comprising the steps of: applying surface modified TCO nanoparticles onto a surface of a substrate; and cross-linking the surface modified TCO nanoparticles. The present invention also provides a transparent conducting oxide film prepared according to the method. | 2013-09-26 |
20130249095 | GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. Direct die solder (DDS) attach can be achieved by use of electroless nickel plating of the copper contact layer followed by a palladium flash. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 2013-09-26 |
20130249096 | THROUGH SILICON VIA FILLING - A method for forming a through silicon via (TSV) in a substrate comprising: depositing a seed layer in a TSV hole; and annealing the seed layer. | 2013-09-26 |
20130249097 | Schemes for Forming Barrier Layers for Copper in Interconnect Structures - A method of forming a semiconductor structure includes providing a substrate; forming a low-k dielectric layer over the substrate; embedding a conductive wiring into the low-k dielectric layer; and thermal soaking the conductive wiring in a carbon-containing silane-based chemical to form a barrier layer on the conductive wiring. A lining barrier layer is formed in the opening for embedding the conductive wiring. The lining barrier layer may comprise same materials as the barrier layer, and the lining barrier layer may be recessed before forming the barrier layer and may contain a metal that can be silicided. | 2013-09-26 |
20130249098 | PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE BONDING - A method of protecting through substrate via (TSV) die from bonding damage includes providing a substrate including a plurality of TSV die having a topside including active circuitry, a bottomside, and a plurality of TSVs that include an inner metal core that reaches from the topside to protruding TSV tips that extend out from the bottomside. A protective layer is formed on or applied to the bottomside of the TSV die including between and over the protruding TSV tips. The TSV die is bonded with its topside down onto a workpiece having a workpiece surface and its bottomside up and in contact with a bond head. The protective layer reduces damage from the bonding process including warpage of the TSV die by preventing the bond head from making direct contact to the protruding TSV tips. | 2013-09-26 |
20130249099 | Techniques to Form Uniform and Stable Silicide - In one aspect, a method of fabricating a metal silicide includes the following steps. A semiconductor material selected from the group consisting of silicon and silicon germanium is provided. A metal(s) is deposited on the semiconductor material. A first anneal is performed at a temperature and for a duration sufficient to react the metal(s) with the semiconductor material to form an amorphous layer including an alloy formed from the metal(s) and the semiconductor material, wherein the temperature at which the first anneal is performed is below a temperature at which a crystalline phase of the alloy is formed. An etch is used to selectively remove unreacted portions of the metal(s). A second anneal is performed at a temperature and for a duration sufficient to crystallize the alloy thus forming the metal silicide. A device contact and a method of fabricating a FET device are also provided. | 2013-09-26 |
20130249100 | POWER SEMICONDUCTOR DEVICE MODULE - A power semiconductor device module includes: a base plate; an insulating substrate mounted on the base plate; and a diode chip mounted on the insulating substrate, wherein the insulating substrate has an upper surface electrode layer disposed on an upper main surface and a lower surface electrode layer disposed on a lower main surface, the diode chip is joined onto the upper surface electrode layer, the lower surface electrode layer is joined onto the upper main surface of the base plate, and a thermal resistance reducing section that reduces thermal resistance is provided in lower surface electrode layer or the base plate of a portion corresponding to a place immediately below the diode chip. | 2013-09-26 |
20130249101 | Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units - A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted over the carrier and around or in a peripheral region around the semiconductor die such that the modular interconnect unit is offset from the back surface of the semiconductor die. An encapsulant is deposited over the carrier, semiconductor die, and modular interconnect unit. A first portion of the encapsulant is removed to expose the semiconductor die and a second portion is removed to expose the modular interconnect unit. The carrier is removed. An interconnect structure is formed over the semiconductor die and modular interconnect unit. The modular interconnect unit includes a vertical interconnect structures or bumps through the semiconductor device. The modular interconnect unit forms part of an interlocking pattern around the semiconductor die. | 2013-09-26 |
20130249102 | SEMICONDUCTOR DEVICE WITH STRENGTHENED INTER-WIRE AIR GAP STRUCTURES - A semiconductor device with a plurality of wires wherein at least some of the regions between wires (inter-wire regions) contain an air gap region formed by capping the wires and inter-wire regions with an insulator film using a film coating process, for example chemical vapor deposition. The existence, size, and shape of the air gap depend upon the film coating parameters and the spacing between wires. | 2013-09-26 |
20130249103 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip, a first electrode terminal, a second electrode terminal, and a connector. The semiconductor chip is carried on the first electrode terminal. The second electrode terminal is separated from the first electrode terminal. The connector includes first through third structural parts. The first structural part is connected to an electrode of the semiconductor chip via the first connecting part; the third structural part is connected to a second electrode terminal via the second connecting part; the second structural part connects the first and third structural parts; and holes are formed on at least one of the first through third structural parts. Additionally, laser ablated recesses may be formed in the first electrode terminal to align the semiconductor chip therewith. | 2013-09-26 |
20130249104 | Semiconductor Device and Method of Forming Conductive Layer Over Metal Substrate for Electrical Interconnect of Semiconductor Die - A semiconductor device has a substrate with a cavity. A conductive layer is formed within the cavity and over the substrate outside the cavity. A plurality of indentations can be formed in a surface of the substrate opposite the cavity for stress relief. A first semiconductor die is mounted within the cavity. A plurality of conductive vias can be formed through the first semiconductor die. An insulating layer is disposed between the first semiconductor die and substrate with the first conductive layer embedded within the first insulating layer. An encapsulant is deposited over the first semiconductor die and substrate. An interconnect structure is formed over the encapsulant. The interconnect structure is electrically connected to the first semiconductor die and first conductive layer. The substrate is removed to expose the first conductive layer. A second semiconductor die is mounted to the conductive layer over the first semiconductor die. | 2013-09-26 |
20130249105 | Semiconductor Device and Method of Forming Micro-Vias Partially through Insulating Material over Bump Interconnect Conductive Layer for Stress Relief - A semiconductor device has a semiconductor die and first insulating layer formed over the semiconductor die. A plurality of first micro-vias can be formed in the first insulating layer. A conductive layer is formed in the first micro-openings and over the first insulating layer. A second insulating layer is formed over the first insulating layer and conductive layer. A portion of the second insulating layer is removed to expose the conductive layer and form a plurality of second micro-openings in the second insulating layer over the conductive layer. The second micro-openings can be micro-vias, micro-via ring, or micro-via slots. Removing the portion of the second insulating layer leaves an island of the second insulating layer over the conductive layer. A bump is formed over the conductive layer. A third insulating layer is formed in the second micro-openings over the bump. The second micro-openings provide stress relief. | 2013-09-26 |
20130249106 | Semiconductor Device and Method of Forming a Robust Fan-Out Package including Vertical Interconnects and Mechanical Support Layer - A semiconductor device has a semiconductor die. An encapsulant is deposited around the semiconductor die. An interconnect structure having a conductive bump is formed over the encapsulant and semiconductor die. A mechanical support layer is formed over the interconnect structure and around the conductive bump. The mechanical support layer is formed over a corner of the semiconductor die and over a corner of the interconnect structure. An opening is formed through the encapsulant that extends to the interconnect structure. A conductive material is deposited within the opening to form a conductive through encapsulant via (TEV) that is electrically connected to the interconnect structure. A semiconductor device is mounted to the TEV and over the semiconductor die to form a package-on-package (PoP) device. A warpage balance layer is formed over the encapsulant opposite the interconnect structure. | 2013-09-26 |
20130249107 | MULTI-CHIP SEMICONDUCTOR APPARATUS - A multi-chip semiconductor apparatus includes a plurality of semiconductor chips electrically connected and stacked. Each of the semiconductor chips trims a voltage level used in the semiconductor chip in response to a chip select signal. | 2013-09-26 |
20130249108 | SEMICONDUCTOR PACKAGES, ELECTRONIC SYSTEMS EMPLOYING THE SAME AND METHODS OF MANUFACTURING THE SAME - Semiconductor packages are provided. The semiconductor package includes a first chip having a first inclined sidewall in an edge of the first chip; and a second chip having a second inclined sidewall in an edge of the second chip and the second chip being horizontally adjacent to the first chip such that the first and second inclined sidewalls are in substantial contact with each other. | 2013-09-26 |
20130249109 | INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEGRATION WITH INTEGRATED CIRCUIT CHIPS - Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed. | 2013-09-26 |
20130249110 | METHOD AND APPARATUS FOR REDUCED PARASITICS AND IMPROVED MULTI-FINGER TRANSISTOR THERMAL IMPEDANCE - A transistor, a method and an apparatus for forming multiple connections to a transistor for reduced gate (FET/HEMT) or base (BJT/HBT) parasitics, and improved multi-finger transistor thermal impedance. Providing for a method and an apparatus that reduces a transistor's parasitics and reduces a transistor's thermal impedance, resulting in higher device bandwidths and higher output power. More particularly, providing for a method and an apparatus for applying compact, multiple connections to the gate of a FET (or HEMT) or the base of a BJT (or HBT) from many sides resulting in reduced parasitics and improved transistor thermal impedance. | 2013-09-26 |
20130249111 | Semiconductor Device and Method of Forming RDL Wider than Contact Pad Along First Axis and Narrower than Contact Pad along Second Axis - A semiconductor device has a semiconductor die and first conductive layer formed over a surface of the semiconductor die. A first insulating layer is formed over the surface of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. An opening is formed in the second insulating layer over the first conductive layer. A second conductive layer is formed in the opening over the first conductive layer and second insulating layer. The second conductive layer has a width that is less than a width of the first conductive layer along a first axis. The second conductive layer has a width that is greater than a width of the first conductive layer along a second axis perpendicular to the first axis. A third insulating layer is formed over the second conductive layer and first insulating layer. | 2013-09-26 |
20130249112 | PASSIVE WITHIN VIA - A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. | 2013-09-26 |
20130249113 | SEMICONDUCTOR MEMORY DEVICE - The semiconductor memory device comprises a plurality of first wiring lines extending in a first direction, a plurality of second wiring lines extending in a second direction crossing the first direction, and a memory cell array comprising memory cells, the memory cells being connected to the first wiring lines and second wiring lines in the crossing portions of the first and second wiring lines. A plurality of first dummy-wiring-line regions are formed in the peripheral area around the memory cell array. A contact is formed in the peripheral area, the contact extending in a third direction perpendicular to the first and second directions. A plurality of second dummy-wiring-line regions are formed in the periphery of the contact. The mean value of the areas of the second dummy-wiring-line regions is less than the mean value of the areas of the first dummy-wiring-line regions. | 2013-09-26 |
20130249114 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device includes a memory cell array layer which includes a first wiring line, a memory cell stacked on the first wiring line, and a second wiring line formed on the memory cell so as to intersect the first wiring line, wherein a step is formed in the first wiring line so that the height of an upper surface of the first wiring line in the memory cell array region where the memory cell array is formed is higher than the height in a peripheral region around the memory cell array region. | 2013-09-26 |
20130249115 | Semiconductor Method and Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units - A semiconductor device has a carrier with a die attach area. A semiconductor die is mounted to the die attach area with a back surface opposite the carrier. A modular interconnect unit is mounted over the carrier and around or in a peripheral region around the semiconductor die such that the modular interconnect unit is offset from the back surface of the semiconductor die. An encapsulant is deposited over the carrier, semiconductor die, and modular interconnect unit. A first portion of the encapsulant is removed to expose the semiconductor die and a second portion is removed to expose the modular interconnect unit. The carrier is removed. An interconnect structure is formed over the semiconductor die and modular interconnect unit. The modular interconnect unit includes a vertical interconnect structures or bumps through the semiconductor device. The modular interconnect unit forms part of an interlocking pattern around the semiconductor die. | 2013-09-26 |
20130249116 | MICROELECTRONIC PACKAGE - A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips. | 2013-09-26 |
20130249117 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a circuit substrate having an active side opposite to an inactive portion; attaching a nonconductive cover to the active side; forming a separation-gap partially cutting into the nonconductive cover and the circuit substrate to a kerf depth; attaching a back-grinding tape to the nonconductive cover; removing a portion of the inactive portion; and exposing the nonconductive cover by removing the back-grinding tape. | 2013-09-26 |
20130249118 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A GRID ARRAY WITH A LEADFRAME AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a conductive trace having a terminal end and a circuit end; forming a terminal on the terminal end; connecting an integrated circuit die directly on the circuit end of the conductive trace, the integrated circuit die laterally offset from the terminal, the active side of the integrated circuit die facing the circuit end; and forming an insulation layer on the terminal and the integrated circuit die, the integrated circuit die covered by the insulation layer. | 2013-09-26 |
20130249119 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - Provided is a semiconductor integrated circuit device having flexible pin arrangement. A semiconductor integrated circuit is bonded to a die pad with an insulating paste, and the potential of the die pad is fixed through a bonding wire from an Al pad provided on the surface of the semiconductor integrated circuit. In the case of a P-type semiconductor substrate, the die pad is set as a terminal other than a terminal having a minimum operating potential of the semiconductor integrated circuit. | 2013-09-26 |
20130249120 | CARBURETOR FUEL FILTER - An on-board fuel filter for a carburetor includes a filter element made from a non-metallic material. The material can be a polymeric material and may be a woven or a non-woven material. The fuel filter may be adapted to have an interference fit with a fuel passage of the carburetor and constructed so that the fuel filter is substantially not plastically deformed by the interference fit. Filter elements may be cut from a sheet of polymeric material and aligned with a fuel passage opening in a body of the carburetor while being cut. | 2013-09-26 |
20130249121 | CARBURETOR - A carburetor includes a main fuel path connected to a main nozzle and a slow fuel path connected to a slow port. The main fuel path and the slow fuel path are separated from each other and are independently communicated to a constant fuel chamber below a fuel level of the fuel chamber. The slow fuel path includes a first slow jet located above the fuel level and a second slow jet located in the downstream of the first slow jet. A opening size of the second slow jet is smaller than that of the first slow jet, and the first and second slow jets are arranged in series. | 2013-09-26 |
20130249122 | HUMIDIFYING APPARATUS - Humidifying apparatus includes one or more motor and impeller units for generating a first air flow and a second air flow. A nozzle has a first air outlet for emitting the first air flow, with the nozzle defining an opening through which air from outside the humidifying apparatus is drawn by air emitted from the first air outlet. The second air flow is humidified and emitted from a plurality of second air outlets. A body comprising a water tank for supplying water for humidifying the second air flow is configured to releasably retain the nozzle on the apparatus. | 2013-09-26 |
20130249123 | FROTH WAND FOR ESPRESSO MAKER - The present invention is a froth wand for an espresso machine that can generate a high velocity stream of steam to foam a beverage at the beverage brewing apparatus. The wand includes an adapter for attaching to the beverage brewing machine at a steam supply outlet, and a conduit for communicating the steam to a steam tube. The steam tube has a cylindrical body with an annular recessed exit, and is surrounded by a cylindrical sheath. The sheath includes a cylindrical plug with a small longitudinal aperture that fits into the outlet of the steam tube. The mating of the sheath's plug and the steam tube forces the steam through the aperture, accelerating the steam at the exit. | 2013-09-26 |
20130249124 | HUMIDIFYING APPARATUS - A humidifying apparatus includes a nozzle and a base on which the nozzle is mounted. The nozzle has respective first and second air inlets, air outlets and interior passages for conveying air therefrom and thereto. The nozzle defines a bore through which air outside the humidifying apparatus is drawn by air emitted from the air outlets. The base generates first and second air flows through the respective first and second interior passages, and a water reservoir. First and second air passageways convey the first and second air flows to the respective first and second air inlets. As the second air passageway conveys the second air flow over the water in the reservoir, water stored in the reservoir is agitated. An ultraviolet radiation generator irradiates the agitated water for a period of time before water stored in the reservoir is atomized to increase the humidity of the second air flow. | 2013-09-26 |
20130249125 | VARIABLE CONCENTRATION DYNAMIC HEADSPACE VAPOR SOURCE GENERATOR - A vapor source generator comprising: a vapor pressure chamber within which carrier gas flows over a vapor source; means to regulate chamber temperature; and means to regulate chamber pressure. | 2013-09-26 |
20130249126 | HUMIDIFYING APPARATUS - Humidifying apparatus includes a housing defining a water reservoir, and a water tank mounted on the housing for supplying water to the reservoir. An air flow is conveyed over water stored in the reservoir and emitted from the apparatus. The water stored in the reservoir is irradiated by ultraviolet radiation and atomized by a transducer to humidify the air flow passing over the reservoir. A flow of water entering the reservoir is guided adjacent to, and preferably along, the ultraviolet radiation generator. | 2013-09-26 |
20130249127 | LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND MOLDED PART - A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. | 2013-09-26 |
20130249128 | INJECTION MOLD AND METHOD FOR MOLDING AN OPTICAL ELEMENT - An injection mold composed of a movable mold and a fixed mold. The movable mold has bases, a heat insulating layer and a surface processed layer, and the fixed mold has a base. A heat insulator is provided on the inner circumferential surface of the base of the movable mold at a part forming a wall of a cavity. The heat insulating layer is in the rear of the surface processed layer, and therefore, the transfer accuracy of a fine configuration of the surface processed layer is improved. Additionally, since the heat insulator is provided adjacent to the fine configuration, heat radiation from resin is inhibited, and the transfer accuracy of the fine configuration is further improved. | 2013-09-26 |
20130249129 | METHOD OF MANUFACTURING POLARIZING PLATE - The present invention provides a method of manufacturing a polarizing plate having sufficient heat resistance, without deteriorating the dye-affinity and the like of the polarizing film and without the necessity of transferring or detaching the polarizing film. Provided is a method of manufacturing a polarizing plate ( | 2013-09-26 |
20130249130 | APPARATUS AND METHOD FOR WORKING AN OPTICAL LENS - An apparatus and a method for processing an optical lens, whereby a block piece for the lens is first processed by cutting and then is provided with markings for positioning the lens on the block piece. | 2013-09-26 |
20130249131 | PROCESS FOR PRODUCING PELLETS FOR PHARMACEUTICAL COMPOSITIONS - Water is used to control particle size in a process comprising mixing water with a composition comprising a rheology modifying agent and possibly sugar and cellulose to produce a paste. The paste is extruded to form particles which are then spheronised and dried. One advantage of using water to control particle size is that the number of particles having a diameter within a required range, e.g. between from about 800 to about 1500 μm, may be increased. | 2013-09-26 |
20130249132 | Process and Systems for Molding Thermosetting Plastics - Process and systems for molding or forming products from thermosetting plastics. The system utilizes a deformable container that is placed within the cavity of the housing of the mold with the resins and initiator mixed therein. As a piston slides into the cavity, the upper edges of the container engage between the housing and the piston to seal the housing form leakage. The pressure of the piston along with heat on the housing enable the curing process to be controlled to minimize shrinkage and porosity. | 2013-09-26 |
20130249133 | METHOD OF PRODUCING SYNTACTIC FOAM - A method of manufacturing syntactic foam comprises mixing a non-liquid amine adduct and a liquid epoxy to form a matrix. Hollow microspheres are added to the mixture and mixed together to form a mixture, which may then be poured into a mold and heated to form a molded syntactic foam component. | 2013-09-26 |
20130249134 | DIMENSIONALLY STABLE POLYURETHANE MOLDED BODIES HAVING LOW DENSITY - The present invention relates to a process for producing polyurethane foam moldings where the density of the molding is at most 500 g/L, by mixing the following to give a reaction mixture: a) organic polyisocyanates with b) polyesterols, c) blowing agents, d) cell-opening additives selected from the group consisting of homo- or copolymers based on ethylhexyl acrylate, on polybutadiene, on polyisobutene, and on diorganosilicones, or a mixture of two or more of said antifoams, e) silicone-based cell stabilizers and optionally f) chain extenders and/or crosslinking agents, g) catalysts, and h) other auxiliaries and/or additives, and charging the materials to a mold, and permitting them to complete a reaction to give a polyurethane foam molding. The present invention further relates to polyurethane moldings obtainable by this process, and to the use of said moldings as shoe sole, steering wheel, seat, or armrest. | 2013-09-26 |
20130249135 | POLYSTYRENE MELT EXTRUSION PROCESS - Extruded polystyrene foams are made with an added brominated styrene-butadiene polymer as a flame retardant. The blowing agent is a mixture of carbon dioxide, ethanol and water, which may also contain a C | 2013-09-26 |
20130249136 | CAST BODIES, CASTABLE COMPOSITIONS, AND METHODS FOR THEIR PRODUCTION - A low-water-content castable composition produces cast products with an increased modulus of rupture, an increased cold crushing strength, and decreased porosity. The composition employs closed fractions of constituent particles with specified populations and specified gaps in the particle size distribution to produce these properties. The composition is suitable for refractory applications. | 2013-09-26 |
20130249137 | SOLVENT APPLICATION OF BORON PYRROMETHENE DYE TO POLYMER PRIOR TO INJECTION MOLDING - The embodiments described herein generally relate to methods for incorporating dye compounds into various polymer materials. In some cases, organic solvents having high boiling points may be utilized to dissolve, disperse, or suspend dye compounds which may then be applied to a polymer material. | 2013-09-26 |
20130249138 | HIGH FIDELITY NANO-STRUCTURES AND ARRAYS FOR PHOTOVOLTAICS AND METHODS OF MAKING THE SAME - A photovoltaic device includes an electron accepting material and an electron donating material. One of the electron accepting or donating materials is configured and dimensioned as a first component of a bulk heterojunction with a predetermined array of first structures, each first structure is substantially equivalent in three dimensional shape, has a substantially equivalent cross-sectional dimension, and where each first structure of the array of first structures has a substantially equivalent orientation with respect to adjacent first structures of the predetermined array forming a substantially uniform array. | 2013-09-26 |
20130249139 | METHOD FOR MANUFACTURING TUBULAR BODY - Provided is a tubular body manufacturing method including preparing a resin composition containing a crystalline thermoplastic resin and molding the tubular body, using an extrusion molding machine that includes a cylindrical portion and a transport member which has a shaft member and a protrusion and is divided into a supply portion, a compressing portion and a measuring portion, by melting, kneading and transporting the resin composition through heating of the heat source and rotation of the transport member, and then extruding the molten resin composition, in which, when ΔTm (° C.) is a difference between a crystalline melt finish temperature and a crystalline melt start temperature of the crystalline thermoplastic resin, D (mm) is a diameter of the transport member, and Lc (mm) is a length of the compressing portion of the transport member, a relationship of following Expression (1) is satisfied: | 2013-09-26 |
20130249140 | METHOD OF PRODUCING A SOLID PREPARATION - A method for producing a solid preparation containing a compound represented by the formula (I) below or a pharmacologically acceptable salt thereof, which includes a step wherein a composition containing the compound represented by the formula (I) below or a pharmacologically acceptable salt thereof is mixed, while applying a mechanical stress to the composition. The compound of the formula (I) is as follows: | 2013-09-26 |
20130249141 | Manufacturing of a cast block candle - gelpressing method - The method of manufacturing a pillar candle consists in cooling down the mould before the raw material is poured into it. Then the heated raw material is poured into the mould and pressed. | 2013-09-26 |
20130249142 | Injection-Molded Composite Construct And Tool For Forming Construct - A structure is injection molded onto a group of panels to form a container. The container has a tray and an injection-molded feature. The tray has a plurality of side panels that extend at least partially around, and at least partially define, a cavity of the container. The tray has a plurality of multi-part flanges with at least one of the multi-part flanges including a lower flange portion and an upper flange portion. The injection-molded feature has band that is injected molded onto the lower flange portion and the upper flange portion. An injection-molded strip extends along and at least partially defines the corner of the container. The strip extends downward from the inner portion of the band in the elongate corner of the container. A tool is also disclosed for forming the container. | 2013-09-26 |
20130249143 | PRESSURIZED RAPID CASTING PROCESS - A method for molding a component. The method includes: providing a mold tool having a sprue and a cavity; heating the mold tool to a predetermined mold temperature; placing the heated mold tool into a pressure vessel; pouring a material through the sprue into the cavity of the heated mold tool; prior to complete polymerization of the material in the cavity of the heated mold tool, elevating an internal pressure of the pressure vessel to a predetermined pressure to apply a force to the material in the heated mold tool; completely polymerizing the material in the cavity in heated mold tool to form the molded component; and removing the molded component from the mold tool. | 2013-09-26 |
20130249144 | MOLDING APPARATUS - A method and apparatus for low pressure molding are disclosed. The molding apparatus comprises a frame, a mold assembly and a transmission assembly. The mold assembly may comprise a first mold and a second mold, the second mold being coupled to the frame. The transmission assembly may be coupled to the frame and to the first mold. A motor may be coupled to the transmission assembly for moving the first mold relative to the second mold. A pneumatic actuator may also be coupled to the transmission assembly for increasing clamping pressure between the first mold and the second mold. | 2013-09-26 |
20130249145 | METHOD OF MANUFACTURING COMPOSITE MOLDED ARTICLE - A method of manufacturing a composite molded article including a metal molded article and a resin molded article, the method including steps of: performing laser scanning on a joint surface of the metal molded article so as to form markings including straight lines and/or curved lines in a certain direction or in the different direction, and performing laser scanning so that the markings including the respective straight lines and/or the respective curved lines do not intersect with each other; and positioning, in a die, a portion including the joint surface of the metal molded article in which the marking is formed, to thereby perform insert-molding of a resin serving as the resin molded article. | 2013-09-26 |
20130249146 | METHOD FOR PRODUCING A THREE-DIMENSIONAL OBJECT AND STEREOLITHOGRAPHY MACHINE EMPLOYING SAID METHOD - Method for producing a three-dimensional object in layers by way of a stereolithography machine ( | 2013-09-26 |
20130249147 | METHODS FOR PERFORATING GRAPHENE USING AN ACTIVATED GAS STREAM AND PERFORATED GRAPHENE PRODUCED THEREFROM - Graphene sheets having a plurality of holes in their basal planes are described herein. Methods for making the graphene sheets can involve contacting graphene sheets with an activated gas that has contacted a helium or argon atmospheric pressure plasma. The size and/or number of holes introduced can be altered by changing the contact time, the stand-off distance, the activated gas concentration, and/or the plasma power. Polymer composites containing the perforated graphene sheets are also described. | 2013-09-26 |
20130249148 | SHAPE ADJUSTING MECHANISM FOR EXTRUSION MOLDING MACHINE, AND METHOD OF MANUFACTURING CYLINDRICAL MEMBER - A shape adjusting mechanism for an extrusion molding machine includes a shape adjusting member, a blow-in mechanism, and a discharge mechanism. The shape adjusting member comes into contact with an inner circumferential surface of a molten substantially cylindrical resin extruded and transported from a ferrule provided to an extrusion molding machine, and adjusts the shape of the substantially cylindrical resin. The blow-in mechanism blows a gas into the substantially cylindrical resin transported between the ferrule and the shape adjusting member. The discharge mechanism discharges to the outside the gas in the substantially cylindrical resin transported between the ferrule and the shape adjusting member. | 2013-09-26 |
20130249149 | MOLTEN METAL FURNACE - An improved molten metal furnace including an enlarged buffer plate of nickel-based superalloy material which seals and separates the furnace burners from the product to be heated. The seal from the buffer plate provides for the creation of a generally inert atmosphere for the bath of molten metal. Additionally, angling the interconnecting passageways between the furnace regions improve the thermal efficiency of the circulating molten metal. | 2013-09-26 |
20130249150 | COOLING SYSTEM FOR HOT-ROLLED STEEL STRIP - Provided is a cooling system for a hot-rolled steel strip capable of increasing the cooling rate for rapidly cooling a rolled steel immediately after rolling and suitable for an apparatus for manufacturing a hot-rolled steel strip having a fine-grained structure. For this purpose, guides ( | 2013-09-26 |
20130249151 | GAS SPRING OIL RESERVOIR - A gas spring includes a housing having an end configured to receive a rod therethrough, the rod extending to a piston movably positionable within the housing. A spacer separates a pair of sealing devices and forming a compartment containing oil that is positioned near the end of the housing, the compartment having a first portion and a second portion. The first portion is defined by the sealing devices, the spacer and the rod. The second portion is defined by the sealing devices, the spacer and the housing. The first portion is in fluid communication with the second portion permitting circulation of oil therebetween. | 2013-09-26 |
20130249152 | LANDING GEAR DOOR DAMPING MECHANISM FOR AIRCRAFT - The invention provides a damping mechanism which comprises a damper; and a coupling mechanism. The coupling mechanism comprises a coupling member which is pivotally attached to the damper and has a pivot bearing for pivotally connecting the coupling member to a structure when in use; and a fitting which can be engaged with the coupling member to couple the fitting with the damper and disengaged with the coupling member to decouple the fitting from the damper. More, the coupling member has a pair of parallel planar faces which taper outwardly from the pivot bearing to a convex curved edge, an upper edge and a lower edge; and a first and a second recess formed in the convex curved edge, a rib between the first and the second recesses and, a third recess formed in the lower edge. | 2013-09-26 |
20130249153 | HOLDING APPARATUS - A holding apparatus for holding an object, includes a support mechanism, a driven mechanism slidably coupled to the support mechanism and slidable between a first position and a second position, a driving mechanism slidably coupled to the support mechanism and adapted to drive the driven mechanism to slide between the first position and the second position, and a clamping mechanism rotatably secured to the driven mechanism and the support mechanism. When the driven mechanism is slid to the second position, the clamping mechanism moves inwards to clamp the object, and the driven mechanism clamps the support mechanism to prevent the driven mechanism from moving relative to the support mechanism so the clamping mechanism can hold the object firmly. When the driven mechanism is slid to the first position, the clamping mechanism expands out to allow the object to be released. | 2013-09-26 |
20130249154 | SPRING CLAMP - A spring clamp includes a first body which comprises a gripping portion and a clamping portion, a second body which comprises a gripping portion and a clamping portion, a first pivot element which pivotally connects the first body and the second body, and a locking mechanism which comprises at least a pair of friction pair components. The first friction pair component is arranged on the first body, and includes a first friction pair element; and the second friction pair component is arranged on the second body, and includes a second friction pair element. The first and second friction pair elements rub against each other to effect the locking function. The rubbing of the friction pair elements occurs mainly in the plane perpendicular to the first pivot element axis. | 2013-09-26 |
20130249155 | ASSEMBLY JIG - An assembly jig used for assembling a magnet connector including a magnetic body includes a magnet, and a base body having a rear surface and a front surface. The front surface is concaved rearward to form a holding room. The rear surface is concaved forward to form a receiving cavity having a shape in accordance with the external outline of the magnetic body. The magnet is held in the holding room of the base body with the magnetic poles thereof being located in a kind of only certain way. When assembling the magnet connector, the magnetic body is partly attracted in the receiving cavity of the base body by the magnet and then is assembled to the magnet connector with the magnetic poles thereof being uniformly arranged in a kind of only certain way after mass production of the magnet connector. | 2013-09-26 |
20130249156 | CLAMP APPARATUS - A clamp apparatus comprises a guide member with a top wall and a circumferential wall that protrude above a housing and are inserted into a hole of a work. The guide member is inserted into the housing to be movable downward against an advancing unit that pushes the guide member upward, within a locking stroke of downward movement. Through the circumferential wall, a plurality of guide grooves are made at predetermined intervals in circumferential directions. A locking member inserted into each guide groove is biased radially inward by an annular elastic member which is a thin strip. A clamp rod has wedge surfaces engaging with the respective locking members from above, and is clamp-driven downward and unclamp-driven upward by a piston. | 2013-09-26 |
20130249157 | DEFORMABLE THIN OBJECT SPREADING DEVICE AND METHOD - A deformable thin object spreading device and method are disclosed. The device includes a control part configured to: control a clamping unit and a moving mechanism to cause the clamping unit to clamp a first point of a deformable thin object; cause an endpoint detecting part to detect a first endpoint; control the clamping unit and the moving mechanism to cause the clamping unit to clamp the first endpoint; cause the endpoint detecting part to detect a second endpoint; control the clamping unit and the moving mechanism to cause the clamping unit to clamp both of the first endpoint and the second endpoint; cause the endpoint detecting part to detect a third endpoint; and control the clamping unit and the moving mechanism to cause the clamping unit to clamp both of the first endpoint or the second endpoint and the third endpoint of the deformable thin object. | 2013-09-26 |
20130249158 | MACHINING TOOL FOR AN AIRCRAFT FUSELAGE FRAME - A tool for machining a curved profile along an axis of rotation X, said curved profile comprising at least one first section along a plane perpendicular to the axis of rotation X and at least one second section parallel to the axis of rotation X. The tool includes blocks, each having a clamping surface against which the profile can take support. The blocks include positioning elements against which the first section and the second section of the profile can take support, and an apparatus arranged to immobilize the profile which is adapted to occupy a first activated state, wherein it immobilizes the profile, and a second deactivated state, wherein it does not immobilize the profile. The tool includes manual presses for maintaining the profile flattened against the positioning elements until the profile immobilizing apparatus is in the activated state. | 2013-09-26 |
20130249159 | Apparatus for Conducting Oral Care Experiments and Method of Forming and Using the Same - An apparatus for conducting oral care experiments with enamel block substrates ( | 2013-09-26 |
20130249160 | SHEET PROCESSING DEVICE - A sheet processing device includes a supporting plate, a stapler, a casing, a protrusion structure, and a swinging arm. The casing is disposed over the supporting plate. A sheet conveying channel is formed between the supporting plate and the casing. The protrusion structure is disposed on a lower surface of the casing, located beside the stapler and accommodated within the sheet conveying channel. During the process of introducing a sheet into the supporting plate, the stapled side of the sheet is flattened by the protrusion structure, and thus the possibility of upturning the sheet is minimized. During the process of introducing the plural sheets to the stapler, the stapled sides of the plural sheets are flattened by the protrusion structure, and thus the formation of the folded corners of the sheets is avoided. | 2013-09-26 |
20130249161 | SHEET CONVEYING DEVICE AND IMAGE RECORDING DEVICE - A first guide member and a second guide member define therebetween a first path. The second guide member and a third guide member define therebetween a second path. The second guide member pivots between a first position in which a first contact surface of a contact portion thereof is in contact with the first guide member, and a second position in which the first contact surface is separated from the first guide member. The third guide member pivots between a third position in which a third contact surface thereof is in contact with the second contact surface of the second guide member in the first position, and a fourth position in which the third contact surface is separated from the second guide member. The first, second, and third contact surfaces are disposed outer than the first path and the second path in a direction perpendicular to a sheet conveying direction. | 2013-09-26 |
20130249162 | GUIDE DEVICE AND IMAGE FORMING APPARATUS - A guide device includes a plate on which a first medium is to be placed, and provided above a space in which a container is to be inserted, a moving member that moves along a surface of the plate in a supply direction of the first medium or in an opposite direction, a substantially sheetlike guide member that guides the first medium in the supply direction, and a drawing member that draws the moving member toward the plate. When the container is taken out of the space, the moving member is drawn toward the plate in the opposite direction by the drawing member, and the guide member withdraws to a position superposed on the plate. When the container is inserted in the space, the moving member is pushed in the supply direction by the container, and the guide member protrudes from the position in the supply direction. | 2013-09-26 |
20130249163 | PAPER TRANSMITTING MECHANISM AND THE DOCUMENT FEEDER WITH THE PAPER TRANSMITTING MECHANISM - A paper transmitting mechanism mounted on the transmitting path which includes a driving wheel, a driving system drives the driving wheel, a pressure wheel, a pressure wheel adjusting unit, and a paper sensor settled upstream to the driving wheel and pressure wheel. The pressure wheel adjusting unit includes an elastomeric unit; one end of the elastomeric unit is connected to the axle of the pressure wheel, and the other end is connected to a linear driving device. When the paper sensor detects the paper is going to enter or leave the driving wheel, the paper sensor will send a signal for adjusting the clamping force between the driving wheel and the pressure wheel to make the clamping force and the friction between the driving wheel and the pressure wheel adjustable according to the position of the paper, so as to avoid the paper slipping or vibrating during transmitting. | 2013-09-26 |
20130249164 | INFORMATION RECORDING DEVICE - Provided is an information recording device in which jam processing operation can be easily performed with simple operation when a recording medium such as a card is jammed in a conveyance passage. A card storing section and a medium conveyance passage for conveying a card to an image forming section are arranged in a housing at upper and lower sides and a passage open-close member for removing a card jammed at the image forming section is arranged therebetween. Then, electronic information recording means is incorporated in the passage open-close member and a medium conveyance path which conveys a card toward the electronic information recording means is arranged on a medium introduction passage for feeding a card from the card storing section to the medium conveyance passage. According to the above, a card jammed at the image forming section or the information recording section can be easily removed to the outside of the device by opening the card storing section. | 2013-09-26 |
20130249165 | METHOD FOR MONITORING THE TRANSPORT OF BANK NOTES - A method for monitoring transport of bank notes in a transport system, using sensors arranged along the transport system for sensing transported bank notes, and a control device for monitoring and controlling the transport system using signals from the sensors, from which the control device derives a presence or absence of a bank note at the location of the respective sensor. The signals from all sensors are stored in a memory, and the signals from all sensors are assigned an explicit time statement or clock statement. All transported bank notes are assigned an explicit object code by the control device, and the object code is linked to the explicit time statement or clock statement. Stored signals from the sensors derive the occurrence and type of errors during the transport of the bank notes, and the signals are linked to the bank notes denoted by the object codes. | 2013-09-26 |
20130249166 | SHEET CONVEYANCE APPARATUS AND IMAGE FORMING SYSTEM - A sheet conveyance apparatus includes a shift unit which includes a conveyance roller pair capable of being placed in a contact state and a separation state and configured to convey sheets having an overlapping portion where a rear end portion of a preceding sheet and a front end portion of a following sheet overlap each other. The shift unit is movable in a widthwise direction while conveying the sheets by the conveyance roller pair. The sheet conveyance apparatus moves the shift unit in the widthwise direction when it is determined that the overlapping portion of the sheets has reached the conveyance roller pair. | 2013-09-26 |
20130249167 | Improved Game of Roulette - A method for a roulette game played by at least one player and a roulette wheel and ball to cooperate with the roulette wheel to indicate a winning number may include the steps of: providing a first area to provide a winning number only based on the winning number indicated by the ball in the roulette wheel in a first operation of the ball and roulette wheel; providing a second area defining a group of winning numbers to provide the player to advance to a second operation of the ball and roulette wheel which would provide another chance for a winning number. | 2013-09-26 |