39th week of 2014 patent applcation highlights part 16 |
Patent application number | Title | Published |
20140284774 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD - A semiconductor device includes a drift zone of a first conductivity type formed within a semiconductor body, wherein one side of opposing sides of the drift zone adjoins a first zone within the semiconductor body and the other side adjoins a second zone within the semiconductor body. First semiconductor subzones of a second conductivity type different from the first conductivity type are formed within each of the first and second zones opposing each other along a lateral direction extending parallel to a surface of the semiconductor body. A second semiconductor subzone is formed within each of the first and second zones and between the first semiconductor subzones along the lateral direction. An average concentration of dopants within the second semiconductor subzone along 10% to 90% of an extension of the second semiconductor subzone along a vertical direction perpendicular to the surface is smaller than the average concentration of dopants along a corresponding section of extension within the drift zone. | 2014-09-25 |
20140284775 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - According to one embodiment, there is disclosed a semiconductor device which has a wiring substrate, a semiconductor element mounted on the wiring substrate, a molding resin which seals the semiconductor element, and a shield layer provided on the molding resin, wherein the molding resin has a marking portion by laser irradiation on a surface, and the shield layer is provided on the molding resin having the marking portion. | 2014-09-25 |
20140284776 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a circuit substrate, a semiconductor element, a sealing resin layer, and a conductive shielding layer. The circuit substrate includes an insulating layer, a plurality of interconnections forming first interconnection layers provided on an upper surface side of the insulating layer, a plurality of interconnections forming second interconnection layers provided on a lower surface side of the insulating layer, and a plurality of vias penetrating from the upper surface to the lower surface of the insulating layer. The semiconductor element is mounted on the upper surface side of the circuit substrate. The conductive shielding layer covers the sealing resin layer and part of an end portion of the circuit substrate. Any of the plurality of vias and the conductive shielding layer are electrically connected. | 2014-09-25 |
20140284777 | Multi-Chip Semiconductor Power Device - A semiconductor device includes a first semiconductor power chip mounted over a first carrier and a second semiconductor power chip mounted over a second carrier. The semiconductor device further includes a contact clip mounted over the first semiconductor power chip and on the second semiconductor power chip. A semiconductor logic chip is mounted over the contact clip. | 2014-09-25 |
20140284778 | Methods And Systems For Selectively Forming Metal Layers On Lead Frames After Die Attachment - Methods and systems are disclosed for selectively forming metal layers on lead frames after die attachment to improve electrical connections for areas of interest on lead frames, such as for example, lead fingers and down-bond areas. By selectively forming metal layers on areas of interest after die attachment, the disclosed embodiments help to eliminate anomalies and associated defects for the lead frames that may be caused by the die attachment process. A variety of techniques can be utilized for selectively forming one or more metal layers, and a variety of metal materials can be used (e.g., nickel, palladium, gold, silver, etc.). Further, cleaning can also be performed with respect to the areas of interest prior to selectively forming the one or more metal layers on areas of interest for the leaf frame. | 2014-09-25 |
20140284779 | SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS - A method of assembling semiconductor devices includes connecting a bond wire between a bond pad on a top side surface of a semiconductor die having its bottom side surface attached to a package substrate and a bonded area within a metal terminal of the package substrate, where a bond is formed along a bonding interface between the bond wire and bonded area. After the connecting, a metal paste is applied including a plurality of metal particles and a binder over the bonded area. The metal paste is sintered to densify the plurality of metal particles to form reinforcement material including within a portion of the bonding interface for providing improved wirebond performance, such as increased pull strength. | 2014-09-25 |
20140284780 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - Provided is a semiconductor device with improved reliability. A logic chip (first semiconductor chip) and a laminated body (second semiconductor chip) are stacked in that order over a wiring substrate. An alignment mark formed over the wiring substrate is aligned with an alignment mark formed on a front surface of the logic chip, whereby the logic chip is mounted over the wiring substrate. An alignment mark formed on a back surface of the logic chip is aligned with an alignment mark formed on a front surface of the laminated body, whereby the laminated body is mounted over the back surface of the logic chip LG. | 2014-09-25 |
20140284781 | SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF - A first electrode of a first switching element is connected to a first electrode of a second switching element via a first lead frame. A second electrode of the first switching element is connected to an element of a snubber circuit via a second lead frame. A second electrode of the second switching element is connected to the element of the snubber circuit via a third lead frame. A first portion of the element of the snubber circuit is joined to a front face of the second lead frame and a second portion thereof is joined to a front face of the third lead frame. A resin portion has a slit formed to extend from an outer surface of the resin portion to an inside of a gap between opposed end faces of the second lead frame and the third lead frame. | 2014-09-25 |
20140284782 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device | 2014-09-25 |
20140284783 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes: a heat sink; a semiconductor element provided on a mounting surface of the heat sink; and a sealing body wrapping the heat sink and the semiconductor element, a thickness of a portion of the sealing body on a side of a surface on an opposite side to the mounting surface of the heat sink being smaller than a thickness of a portion of the sealing body on the mounting surface side of the heat sink. A first concave-convex is provided on the surface on an opposite side to the mounting surface of the heat sink. A second concave-convex larger than the first concave-convex is provided on a surface crossing the surface on an opposite side to the mounting surface of the heat sink. | 2014-09-25 |
20140284784 | SEMICONDUCTOR DEVICE - A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively. | 2014-09-25 |
20140284785 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Disclosed are a semiconductor device and a manufacturing method thereof, which can achieve miniaturization and improvement in the integration level by forming a substrate using a pattern layer implemented on a wafer in a semiconductor fabrication (FAB) process. In one exemplified embodiment, the manufacturing method of the semiconductor device includes preparing a first semiconductor die including a plurality of through electrodes and a plurality of first conductive pillars, mounting the first semiconductor die to connect the first conductive pillars to the pattern layer provided on a wafer, forming a first encapsulant to cover the pattern layer and the first semiconductor die, mounting a second semiconductor die to electrically connect second conductive pillars provided in the second semiconductor die to the plurality of through electrodes exposed to a second surface of the first semiconductor die, and removing the wafer from a first surface of the pattern layer. | 2014-09-25 |
20140284786 | SEMICONDUCTOR DEVICE - An aspect of the present embodiment, there is provided a semiconductor device, including an insulating substrate, at least one semiconductor chip provided above the insulating substrate, a wiring terminal including a connection portion electrically connected to the semiconductor chip, a surrounding frame surrounding the semiconductor chip and the connection portion, an embedded material provided in the surrounding frame covering the semiconductor chip and the connection portion, and a pressing unit provided on a surface of the embedded material. | 2014-09-25 |
20140284787 | JET IMPINGEMENT COOLING APPARATUSES HAVING NON-UNIFORM JET ORIFICE SIZES - Jet impingement cooling apparatuses having non-uniformly sized jet orifices for producing an array of impingement jets that impinge a target surface are disclosed. In one embodiment, a cooling apparatus includes at least one fluid inlet channel, at least one fluid outlet channel, a target surface, and a jet orifice surface that is offset from the target surface. The jet orifice surface includes an array of jet orifices fluidly coupled to the at least one fluid inlet channel, wherein each individual jet orifice of the array of jet orifices has an area corresponding to a distance of the individual jet orifice to the at least one fluid outlet channel such that individual jet orifices closer to the at least one fluid outlet have an area that is smaller than individual jet orifices further from the at least one fluid outlet. Power electronics modules are also disclosed. | 2014-09-25 |
20140284788 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOOD DIE INTERCONNECTED WITH CONDUCTIVE BUMPS - A PiP semiconductor device has an inner known good semiconductor package. In the semiconductor package, a first via is formed in a temporary carrier. A first conductive layer is formed over the carrier and into the first via. The first conductive layer in the first via forms a conductive bump. A first semiconductor die is mounted to the first conductive layer. A first encapsulant is deposited over the first die and carrier. The semiconductor package is mounted to a substrate. A second semiconductor die is mounted to the first conductive layer opposite the first die. A second encapsulant is deposited over the second die and semiconductor package. A second via is formed in the second encapsulant to expose the conductive bump. A second conductive layer is formed over the second encapsulant and into the second via. The second conductive layer is electrically connected to the second die. | 2014-09-25 |
20140284789 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - To improve coupling reliability in flip chip bonding of a semiconductor device. By using, in the fabrication of a semiconductor device, a wiring substrate in which a wiring that crosses an opening area of a solder resist film on the upper surface of the wiring substrate has, on one side of the wiring, a bump electrode and, on the other side, a plurality of wide-width portions having no bump electrode thereon, a solder on the wiring can be dispersed to each of the wide-width portions during reflow treatment in a solder precoating step. Such a configuration makes it possible to reduce a difference in height between the solder on each of terminals and the solder on each of the wide-width portions and to enhance the coupling reliability in flip chip bonding. | 2014-09-25 |
20140284790 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented. | 2014-09-25 |
20140284791 | CORELESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF - A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation. | 2014-09-25 |
20140284792 | ELECTRONIC DEVICE PACKAGE - A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed. | 2014-09-25 |
20140284793 | SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA - Semiconductor devices are described that include a via that extends only partially through the substrate. Through-substrate vias (TSV) furnish electrical interconnectivity to electronic components formed in the substrates. In implementations, the semiconductor devices are fabricated by first bonding a semiconductor wafer to a carrier wafer with an adhesive material. The semiconductor wafer includes an etch stop disposed within the wafer (e.g., between a first surface a second surface of the wafer). One or more vias are formed through the wafer. The vias extend from the second surface to the etch stop. | 2014-09-25 |
20140284794 | TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A tin (Sn)-based solder ball having appropriate characteristics for electronic products and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.3 to 3.0 wt. % silver (Ag), about 0.4 to 0.8 wt. % copper (Cu), about 0.01 to 0.09 wt. % nickel (Ni), about 0.1% to 0.5 wt. % bismuth (Bi), and balance of tin (Sn) and unavoidable impurities. | 2014-09-25 |
20140284795 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Various embodiments are directed to a semiconductor package and a method for manufacturing the same. A semiconductor package includes the following: a substrate having a plurality of connection pads; a semiconductor chip provided with a plurality of bonding pads on a first surface thereof and attached onto the substrate in a face-down position so that the bonding pads are positioned right above the corresponding connection pads; and thermoplastic conductive members introduced between the substrate and the semiconductor chip such that the bonding pad and the corresponding connection pad may be electrically connected. | 2014-09-25 |
20140284796 | MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTRONIC DEVICES - Microelectronic devices and methods for filling vias and forming conductive interconnects in microfeature workpieces and dies are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece having a plurality of dies and at least one passage extending through the microfeature workpiece from a first side of the microfeature workpiece to an opposite second side of the microfeature workpiece. The method can further include forming a conductive plug in the passage adjacent to the first side of the microelectronic workpiece, and depositing conductive material in the passage to at least generally fill the passage from the conductive plug to the second side of the microelectronic workpiece. | 2014-09-25 |
20140284797 | POWER SEMICONDUCTOR DEVICE FABRICATION METHOD, POWER SEMICONDUCTOR DEVICE - A method for fabricating a power semiconductor device that comprises a base substrate with a conductive layer on a surface of the base substrate and semiconductor components mounted on the base substrate includes forming a hardened layer on the surface of the conductive layer before mounting a semiconductor component on the base substrate. The forming of the hardened layer may optionally be performed using a peening process, for example, a shot peening process, a laser peening process, or an ultrasonic peening process. The conductive layer may comprise a metal such as, for example, aluminum or copper. | 2014-09-25 |
20140284798 | GRAPHENE WIRING AND METHOD OF MANUFACTURING THE SAME - A graphene wiring has a substrate a catalyst layer on the substrate a first graphene sheet layer on the catalyst layer and a second graphene sheet layer on the first graphene layer. The second graphene layer comprises multilayer graphene sheets. The multilayer graphene sheets are intercalated with an atomic or molecular species. | 2014-09-25 |
20140284799 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a substrate a lower layer wiring on the substrate, an interlayer dielectric on the lower layer wiring having a contact hole, a catalyst metal layer at the bottom of the contact hole having catalyst metal particles, multi-walled carbon nanotubes on the catalyst metal layer passing through the contact hole, and an upper layer wiring on the multi-walled carbon nanotubes. The multi-walled carbon nanotubes are intercalated with an atomic or molecular species. | 2014-09-25 |
20140284800 | GRAPHENE WIRING - A graphene wiring has a substrate, a catalyst layer on the substrate, a graphene layer on the catalyst layer, and a dopant layer on a side surface of the graphene layer. An atomic or molecular species is intercalated in the graphene layer or disposed on the graphene layer. | 2014-09-25 |
20140284801 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to an embodiment, a semiconductor device, includes a substrate, an inter-layer insulating layer provided above the substrate, a first interconnect provided in a first trench, and a second interconnect provided in a second trench. The first interconnect is made of a first metal, and the first trench is provided in the inter-layer insulating layer on a side opposite to the substrate. The second interconnect is made of a second metal, and the second trench is provided in the inter-layer insulating layer toward the substrate. A width of the second trench is wider than a width of the first trench. A mean free path of electrons in the first metal is shorter than a mean free path of electrons in the second metal, and the first metal is a metal, an alloy or a metal compound, including at least one nonmagnetic element as a constituent element. | 2014-09-25 |
20140284802 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor device includes a metal interconnect and a graphene interconnect which are stacked to one another. | 2014-09-25 |
20140284803 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is disclosed, which includes: a substrate having a plurality of switching pads, a plurality of first conductive pads and a plurality of circuits formed between the switching pads and the first conductive pads; an insulating layer covering the circuits; a conductive layer formed on the insulating layer and extending to the switching pads and the first conductive pads; and a semiconductor element disposed on the substrate and electrically connected to the switching pads through a plurality of bonding wires. By electrically connecting the switching pads and the first conductive pads through the conductive layer, the invention dispenses with the conventional short bonding wires so as to prevent the conventional problem of short circuits caused by contact of the short bonding wires with other bonding wires. | 2014-09-25 |
20140284804 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first electrode formed on a substrate, the first electrode being a first electrical potential; and a second electrode formed on the first electrode, the second electrode including a signal wiring that transmits a signal and a planar electrode part with a prescribed area. A shape of the first electrode corresponding to the planar electrode part is made into a slit shape such that a longitudinal direction of a slit is parallel to a direction in which the signal proceeds in the planar electrode part. | 2014-09-25 |
20140284805 | MULTIPLE HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME - A three dimensional package includes a substrate having a columnar part including a sidewall, and stairs or steps arranged along the sidewall of the columnar part in the form of multiple helixes twisted around the columnar part. Semiconductor integrated circuits (IC dies) are attached on one or both of the supporting surfaces of the stairs. The columnar part, the stairs and the IC dies can be encapsulated with a mold compound. | 2014-09-25 |
20140284806 | SEMICONDUCTOR DEVICE DIE ATTACHMENT - A semiconductor device has first and semiconductor dies having active faces presenting electrical contact elements and back faces attached to first and second bonding areas side by side on an electrically conductive die support. A layer of electrically insulating material is applied to the first bonding area of the die support. A layer of electrically insulating adhesive bonding material attaches the back face of the first semiconductor die to the first bonding area of the die support through the layer of electrically insulating material. A layer of electrically conductive adhesive bonding material attaches the back face of the second semiconductor die to the second bonding area of the die support. | 2014-09-25 |
20140284807 | ENCAPSULATION PROCESS AND ASSOCIATED DEVICE - The invention relates to an encapsulation process for an electronic component ( | 2014-09-25 |
20140284808 | STACKED SEMICONDUCTOR DEVICE, AND METHOD AND APPARATUS OF MANUFACTURING THE SAME - Provided is a method of manufacturing a stacked semiconductor device, which includes forming a stacked film on a semiconductor substrate, the stacked film including a plurality of silicon oxide films and a plurality of silicon nitride films, which are alternately arranged on top of each other, and the stacked film being obtained by repeatedly performing a series of operations of forming the silicon oxide film on the semiconductor substrate using one of triethoxysilane, octamethylcyclotetrasiloxane, hexamethyldisilazane and diethylsilane gases, and forming the silicon nitride film on the formed silicon oxide film; etching the silicon nitride films in the stacked film; removing carbons contained in the silicon oxide films, which are not removed in the etching, to reduce a concentration of the carbons; and forming electrodes in regions where the silicon nitride films are etched in the etching. | 2014-09-25 |
20140284809 | POWER CONVERTER - A power converter includes a bus bar, a semiconductor device, a lead, and solder. The bus bar has a vertical wall. The semiconductor device includes an electrode. The lead has one end connected to the bus bar and another end connected to the semiconductor device to supply power from the bus bar to the electrode of the semiconductor device via the lead. The one end of the lead includes a bending part which is spaced away from the bus bar by a predetermined distance and which is inclined in a vertical downward direction. The vertical wall of the bus bar and the bending part are bonded to each other via the solder. The vertical wall extends in a substantially vertical direction to face the bending part. | 2014-09-25 |
20140284810 | SEMICONDUCTOR DEVICE - In a semiconductor device, a first contact-diffusion-layer is in a first well to be connected to the first well and extends in a channel width direction of a first transistor in a first well. A second contact-diffusion-layer is in the first well so as to be electrically connected to the first well and extends in a channel-length direction of the first transistor. A first contact on the first contact-diffusion-layer has a shape with a diameter in the channel-width direction larger than that in the channel-length direction when viewed from above the substrate. A second contact on the second contact-diffusion-layer has a shape with a diameter in the channel-width direction smaller than that of the first contact and a diameter in the channel-length direction almost equal to that of the first contact when viewed from above the substrate. A wiring is electrically connected to the first transistor through the second contact. | 2014-09-25 |
20140284811 | Methods for Multi-Wire Routing and Apparatus Implementing Same - A rectangular interlevel connector array (RICA) is defined in a semiconductor chip. To define the RICA, a virtual grid for interlevel connector placement is defined to include a first set of parallel virtual lines that extend across the layout in a first direction, and a second set of parallel virtual lines that extend across the layout in a second direction perpendicular to the first direction. A first plurality of interlevel connector structures are placed at respective gridpoints in the virtual grid to form a first RICA. The first plurality of interlevel connector structures of the first RICA are placed to collaboratively connect a first conductor channel in a first chip level with a second conductor channel in a second chip level. A second RICA can be interleaved with the first RICA to collaboratively connect third and fourth conductor channels that are respectively interleaved with the first and second conductor channels. | 2014-09-25 |
20140284812 | FORMING ARRAY CONTACTS IN SEMICONDUCTOR MEMORIES - Array contacts for semiconductor memories may be formed using a first set of parallel stripe masks and subsequently a second set of parallel stripe masks transverse to the first set. For example, one set of masks may be utilized to etch a dielectric layer, to form parallel spaced trenches. Then the trenches may be filled with a sacrificial material. That sacrificial material may then be masked transversely to its length and etched, for example. The resulting openings may be filled with a metal to form array contacts. | 2014-09-25 |
20140284813 | INTERCONNECT LEVEL STRUCTURES FOR CONFINING STITCH-INDUCED VIA STRUCTURES - A design layout is provided such that an underlying conductive line structure underlies a stitch region in an overlying conductive line structure. A stitch-induced via structure can be formed between the underlying conductive line structure and the overlying conductive line structure when a stitch region in a hard mask layer is etched multiple times. At least one of the underlying conductive line structure and the overlying conductive line structure is electrically isolated from other conductive line structures in a same design level so as to avoid unintentional electrical shorts. | 2014-09-25 |
20140284814 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - According to one embodiment, a semiconductor device includes a first wiring, a second wiring disposed in the same layer as the first wiring, a first via connected to a bottom surface of the first wiring and formed of a carbon nanotube, and a second via connected to a bottom surface of the second wiring and formed of a metal. | 2014-09-25 |
20140284815 | INTERLEVEL DIELECTRIC STACK FOR INTERCONNECT STRUCTURES - A dielectric stack and method of depositing the stack to a substrate using a single step deposition process. The dielectric stack includes a dense layer and a porous layer of the same elemental compound with different compositional atomic percentage, density, and porosity. The stack enhances mechanical modulus strength and enhances oxidation and copper diffusion barrier properties. The dielectric stack has inorganic or hybrid inorganic-organic random three-dimensional covalent bonding throughout the network, which contain different regions of different chemical compositions such as a cap component adjacent to a low-k component of the same type of material but with higher porosity. | 2014-09-25 |
20140284816 | THROUGH SILICON VIA WAFER, CONTACTS AND DESIGN STRUCTURES - Disclosed herein are through silicon vias (TSVs) and contacts formed on a semiconductor material, methods of manufacturing, and design structures. The method includes forming a contact hole in a dielectric material formed on a substrate. The method further includes forming a via in the substrate and through the dielectric material. The method further includes lining the contact hole and the dielectric material with a metal liner using a deposition technique that will avoid formation of the liner in the viaformed in the substrate. The method further includes filling the contact hole and the via with a metal such that the metal is formed on the liner in the contact hole and directly on the substrate in the via. | 2014-09-25 |
20140284817 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - According to one embodiment a method is provided including positioning and bonding a plurality of first semiconductor chips in a coplanar relation on a first substrate, laminating at least a plurality of second semiconductor chips on the first semiconductor chips, cutting the first substrate for separation into a discrete chip lamination, aligning an electrode pad provided on a surface of the discrete lamination with an electrode pad on a second substrate, and temporarily connecting the electrode pads on the lamination and the second substrate in an opposing relation to the first substrate, providing electrical connection between the electrode pads by a reflow process, flowing a liquid resin from the side of the first substrate towards the second substrate to seal the chip lamination and spaces between the chip lamination and the first and second substrate, and cutting the chip lamination to form a discrete device. | 2014-09-25 |
20140284818 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE - Provided is a semiconductor chip that is flip-chip mounted where an inner chip pad array and an outer chip pad array, which are arranged on an inner side and an outer side of IO cells in a staggered manner, are arranged to be spaced away from each other by a predetermined gap or greater. The predetermined gap represents a gap where one via can be arranged between an inner substrate pad array and an outer substrate pad array on a substrate which faces and is connected to the inner chip pad array and the outer chip pad array. In addition, the predetermined gap represents a gap where a plated wire is interconnected and then a resist opening for etch-back can be formed. Even in a case where a space for forming an interconnection is not present between outer substrate pad arrays, interconnection characteristics of the substrate are improved. | 2014-09-25 |
20140284819 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATION LAYER - A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to the first surface and a plurality of semiconductor components is provided. The semiconductor substrate has a device thickness. At least one metallisation layer is formed on the second surface of the semiconductor substrate. The metallisation layer has a thickness which is greater than the device thickness. | 2014-09-25 |
20140284820 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor includes a first insulation layer having first and second surfaces on the opposite sides and having a penetrating hole penetrating through the first insulation layer, an electrode formed in the penetrating hole in the first insulation layer and having a protruding portion protruding from the second surface of the first insulation layer, a first conductive pattern formed on the first surface of the first insulation layer and connected to the electrode, a second insulation layer formed on the first surface of the first insulation layer and the first conductive pattern and having a penetrating hole penetrating through the second insulating layer, a second conductive pattern formed on the second insulation layer and for mounting a semiconductor element, and a via conductor formed in the penetrating hole in the second insulation layer and connecting the first and second conductive patterns. | 2014-09-25 |
20140284821 | Method of curing thermoplastics with microwave energy - A method for densifying thermoplastics, particularly polyimides, for use in conjunction with electronic circuits while producing improved physical properties and a high degree of crystallinity, involves variable frequency microwave (VFM) processing at temperatures typically 100° C. below the glass transition temperature or lower, for times of about 50 to 100 minutes. It is particularly applicable to polymers based on BPDA-PPD, but may also be generally applied to other intentionally designed polyimide structures with the same features. The invention enables the creation of layered structures involving integrated circuits with small feature sizes and overcoatings of polymers with high T | 2014-09-25 |
20140284822 | APPARATUSES, SYSTEMS AND METHODS FOR EFFICIENT SOLUBILIZATION OF CARBON DIOXIDE IN WATER USING HIGH ENERGY IMPACT - A method for the efficient solubilization of carbon dioxide in water through the use of high energy impacts is disclosed. The method can optionally includes mixing the carbon dioxide and water to form an annular dispersed flow, accelerating the carbon dioxide and water prior to the collision; providing a retention network to collect the carbonated water flow. Also disclosed are systems and apparatuses for practicing the disclosed methods. | 2014-09-25 |
20140284823 | AERATOR AND METHOD FOR AERATING A LIQUID - An aerator may be inserted into the neck of a wine bottle to aerate the wine as it is poured from the bottle. A cavity created in the distal end of the bottle as the wine is dispensed is vented to aid in high flow rate. The aerator seals against the inside surface of a typical wine bottle, and regulates pressures to create high flow and a high degree of aeration throughout the full dispense cycle of wine from the bottle. | 2014-09-25 |
20140284824 | BASE FOR A MASS TRANSFER COLUMN - The invention relates to a tray for a mass transfer column, having gas passage openings distributed over the tray ( | 2014-09-25 |
20140284825 | METHODS FOR MANUFACTURING AN EMBOSSER DRUM FOR USE IN PRE-FORMATTING OPTICAL TAPE MEDIA - Various embodiments herein include utilities for generating embosser drums that are used to pre-format optical media such as optical tape with a pattern of nanostructures such as wobbled grooves. One utility includes generating a plurality of replicas from an embossing master, bonding the replicas together to form a bonded replica structure having a surface with the nanostructure pattern imprinted therein, creating a replica of the bonded replica structure and electroforming a metallic layer onto the bonded replica structure replica to create a single, one piece, metallic shim which can be used to create a weld-less embosser drum. | 2014-09-25 |
20140284826 | DEVICE FOR MANUFACTURING OPTICAL FILM AND A METHOD FOR MANUFACTURING THE SAME - A device includes a feed unit containing hot melted UV curable glue, a first pressing roller defining a first central axis, a second pressing roller defining a second central axis, and two UV lamp assemblies received in the two pressing rollers respectively. The first pressing roller rotates about the first central axis in a first direction. The second pressing roller rotates about the second central axis in a second direction opposite to the first direction. The first central axis and the second central axis are arranged on a common horizontal plane and parallel to each other. A molding channel is formed between the two pressing rollers. The two pressing rollers cooperatively press the hot melted UV curable glue transmitted into the molding channel from the feed unit. The UV lamp assemblies emit UV light beams to solidify the pressed UV curable glue to form an optical film. | 2014-09-25 |
20140284827 | METHOD FOR PRODUCTION OF MATERIALS HAVING ANISOTROPIC PROPERTIES COMPOSED OF NANOFIBRES OR MICROFIBRES AND AN APPARATUS FOR IMPLEMENTATION OF SAID METHOD - A method of producing fibres includes continuously drawing a fibre out of a solution, and pulling it to a rotary set of n electrodes by means of an electrostatic field. The individual electrodes of the set are arranged at regular spacing to each other and at the same distance from the set's rotation axis, and parallel with it. The fibre is wound on the set of electrodes by rotating the set of electrodes. The electrostatic field is disconnected and rotation of the set of electrodes is stopped. A layer of the fibres formed in the field between two adjacent electrodes is removed. The rotating set of electrodes turns through an angle of 360/n, the layer of the fibres formed between two adjacent electrodes in the field adjacent to the field from which the layer was removed, is removed, and this step is repeated in total n-times. | 2014-09-25 |
20140284828 | METHOD OF CHARACTERIZATION OF VISCOELASTIC STRESS IN ELONGATED FLOW MATERIALS - The present invention generally relates to a device for measuring characteristics of polymeric fluids (semi-dilute and concentrated polymer solutions and melts) in extremely strong elongational flows. In one embodiment, the present invention relates to a device for measuring characteristics of polymeric fluids (semi-dilute and concentrated polymer solutions and melts) in extremely strong elongational flows in spinning jets and/or electrified jets. In another embodiment, the present invention relates to a method for determining the elastic modulus and the relaxation time of a polymeric fluid. Also, the present invention enables one to determine and/or measure the primary parameters needed to describe a viscoelastic material. | 2014-09-25 |
20140284829 | METHOD FOR THE PREPARATION OF METAL ORGANIC FRAMEWORKS - A process for the preparation of a dry crystalline metal organic framework which comprises: a) spray drying at least one metal ion and at least one organic ligand which is at least bidentate into a spray dryer in the presence of a solvent, wherein the reaction of the at least one metal ion with the at least one organic ligand to yield the metal organic framework and the drying of the obtained metal organic framework take place simultaneously inside the spray dryer, and b) collecting the formed dry crystalline metal organic framework. | 2014-09-25 |
20140284830 | METHOD AND DEVICE FOR PRODUCING A CONCRETE COMPONENT, AND CONCRETE COMPONENT PRODUCED ACCORDING TO THE METHOD - The subject matter of the invention is a method for producing a concrete component ( | 2014-09-25 |
20140284831 | DEVICE AND METHOD FOR THE PRODUCTION OF A COSMETIC PRODUCT FOR MAKE-UP - A device for accurately dosing cosmetic pastes in multicolour form on a base for the production of a cosmetic product for make-up, comprising a base element adapted to house a base, a mould which moves at least between an opening position and a closing position, said mould having at least one partition which divides a surface thereof facing the base element into at least two compartments, a peripheral element provided with walls which define an opening with shape similar to the perimeter shape of the mould and in which the mould is at least partially housed when it is in said closed position, said peripheral element being provided with at least two channels which run into said opening and protrude into it at least partially, the device providing means adapted to prevent the gluing of said cosmetic paste at least to the wall of the mould facing the base element. | 2014-09-25 |
20140284832 | System and Method for Manufacturing a Three-Dimensional Object from Freely Formed Three-Dimensional Curves - A three-dimensional object is manufactured by forming a series of three-dimensional formed curves of extruded material that together comprise the geometry of the surface of the object. The material is extruded from a nozzle that is positioned by a robotic arm under the control of a robotic controller. A computer that has a definition of the geometric surface generates commands to the robotic controller to cause it to sequentially form the series of formed curves that the computer calculates comprise the surface geometry. | 2014-09-25 |
20140284833 | SYSTEM FOR CONTROLLING CUTTER HUB POSITION IN UNDERFLUID PELLETIZER - A cutter hub position control device for consistent blade adjustment in an underfluid pelletizer is provided in connection with a motion rod attached to the pelletizer cutter hub and extending through a hollow shaft of the pelletizer motor. The cutter hub position control device can be collinear, transaxial or in a plane parallel to the axis of the motion rod to which it is attached. Adjustment of the cutter hub position control device is automated through use of feedback control mechanisms. | 2014-09-25 |
20140284834 | UNIVERSAL FEEDING SYSTEM FOR EXTRUDERS - A novel universal main feeder is described for cutting the large items into smaller items before they are fed into the feeder, hopper of the extruder. The sensor based control and the cutting device based resizing and quantity control enables a non-clog and smoother operation for recycling or waste management. The unique design of interchangeable cutting device enables the user to fit the pertinent cutting device blade, knives, shredders or hummer mills. | 2014-09-25 |
20140284835 | METHOD FOR PRODUCING A BONDED ARTICLE COMPRISING A PRESS-MOULDED, CARBONATED GRANULAR MATERIAL - The present invention relates to a method for producing a bonded article by press-moulding and carbonating a granular, carbonatable material. The granular material is applied in a mould, is press-moulded therein under a compaction pressure of at least 25 MPa, and is carbonated during said press-moulding step by means of a gas which contains at least 1 vol. % of carbon dioxide. By carbonating the material when press-moulding it, high compressive strengths can be achieved in a short period of time. | 2014-09-25 |
20140284836 | Method and Apparatus for Reducing Ply Wrinkling of Composite Laminates During Forming - Ply wrinkling during hot drape forming of a composite laminate is reduced at corner radii. A tensioning material placed over an uncured composite laminate charge maintains a compressive force on the laminate charge as the charge is formed over a tool. | 2014-09-25 |
20140284837 | METHOD FOR MANUFACTURING MAGNET-CONDUCTIVE DEVICE AND GLUE-INJECTABLE PUNCH STRUCTURE THEREOF - A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates. | 2014-09-25 |
20140284838 | APPARATUS AND METHOD FOR EXTRUDING A MEDICAL INSTRUMENT - According to the invention, an apparatus is provided for extruding a medical instrument which can be inserted into a human or animal body. The apparatus comprises a device for supplying rod-shaped bodies, an extrusion device comprising a housing, said housing having a surrounding side wall which, at the frontward end as seen in the manufacturing direction, is provided with a nozzle wall comprising a discharge nozzle and, at the rearward end as seen in the manufacturing direction, is provided with a spindle sleeve. The space in the housing between the spindle sleeve, the side wall and the discharge nozzle delimits an extrusion space and the housing is provided with a polymer supply device in the area of the extrusion space. Further, a cannula device is provided which extends in the manufacturing direction and is designed to insert at least one rod-shaped body from the device for supplying rod-shaped bodies into the extrusion space in a predetermined spatial arrangement, which comprises at least one tubular cannula having a rearward supply end as seen in the manufacturing direction and a frontward discharge end as seen in the manufacturing direction, the cannula device being arranged approximately in straight alignment with respect to the discharge nozzle and extending through the spindle sleeve such that its discharge end situated in the manufacturing direction terminates at a distance from the discharge nozzle in the extrusion space. | 2014-09-25 |
20140284839 | DEVICE FOR PRODUCING A THREE-DIMENSIONAL OBJECT USING A PRESSURE GENERATING UNIT - The invention relates to a device for producing a three-dimensional object ( | 2014-09-25 |
20140284840 | METHODS FOR FABRICATING LIDS FOR VESSELS - A method for fabricating a lid for attachment to a vessel having an open top surrounded by a peripheral edge portion, includes injection molding from a molten plastic material a first shot structure defining a web portion, a peripheral portion surrounding the web portion; in a second shot procedure, over-molding an elastomeric material different from said plastic material onto the first short structure to form a seal structure portion integrated with the lid portion to form a unitary lid-seal structure, wherein the seal structure portion is permanently adhered to the peripheral portion of the first shot structure, and wherein the seal structure portion is configured to provide an air-tight seal between the lid and a sealing surface portion of the peripheral edge of the vessel when the lid is attached to the vessel. | 2014-09-25 |
20140284841 | SURGICAL TISSUE SEALER - A method for manufacturing an end effector assembly includes providing first and second jaw members moveable relative to one another about a pivot between a first, spaced-apart position and a second, approximated position. One of the first and second jaw members includes a cavity defined therein and the other of the first and second jaw members includes a stop member configured to be inserted into the cavity. A gap-setting gauge is grasped between the first and second jaw members to define a gap-distance between the jaw members equivalent to a thickness of the gap-setting gauge. The first and second jaw members are set such that the jaw members are prevented from approximation beyond the gap-distance. | 2014-09-25 |
20140284842 | SURFACE COMPOSITION AND METHOD OF APPLICATION - A surface composition for reducing degradation and fading of surfaces subjected to extended periods of submersion in an aqueous liquid includes at least one clear barrier layer and at least one under layer, wherein the clear barrier layer is in use, disposed atop the under layer and in contact with the aqueous liquid whereby the clear barrier layer protects the structure and appearance of the under layer. The clear barrier layer provides structural protection against degradation from chemical attack and from fading due to UV exposure. | 2014-09-25 |
20140284843 | PROCESS FOR PRODUCING A REINFORCED PLASTIC ARTICLE - Plastics articles with continuous reinforcement strands are normally produced by pultrusion. Pultrusion methods are known for producing straight or curved plastics profiles. It has not hitherto been possible for reinforced plastics articles of more complex form to be produced by pultrusion methods. The invention provides a pultrusion method in which a part of a curved plastics article serves, together with a mold ( | 2014-09-25 |
20140284844 | Precast Pervious Concrete Panels - A precast pervious concrete panel is formed in a containment vessel under controlled conditions and allowed to reach an acceptable strength before removal from the containment vessel, thereby producing standard sizes or shapes for installation in the field. Each piece of pervious concrete may include slots cut into the piece at predetermined locations allowing installation of a joint connector; either dry or with a bonding material thereby allowing connection of multiple pieces into a solid slab. A strip material may be used under the slab joints to dissipate load bearing and allow the panels to slide together when picked up by the embedded lifting device. Multiple pervious concrete pieces can be combined with a collection system allowing collection/reuse of water passing through the panels. Precast pervious concrete panels can be used as inserts in ready mix or cast in place concrete frames allowing for easy replacement of the pieces. | 2014-09-25 |
20140284845 | Motor Water-Cooling Structure and Manufacturing Method Thereof - A motor water-cooling structure and a manufacturing method thereof are disclosed. The motor water-cooling structure includes a motor case having a wall portion and a tube. The tube is embedded in the wall portion to serve as a flow passage. To manufacture the motor water-cooling structure, the tube is positioned in a mold cavity of a mold, and the motor case is formed in the mold by pour molding to embed the tube therein, so that the motor case and the tube form an integral body. With the manufacturing method, the motor water-cooling structure can be formed with reduced material, labor and time to save the manufacturing costs, and the risk of water leakage can be avoided. | 2014-09-25 |
20140284846 | MOLD AND MOLD MANUFACTURING METHOD - According to one embodiment, a mold includes a base, a first concave pattern, a second concave pattern, and a third concave pattern. The base includes a first surface and a pedestal projecting from the first surface. The pedestal includes a first region and a second region disposed outside the first region. The first concave pattern is formed in the first region. The second concave pattern is formed in the second region. The third concave pattern extends from the first region to the second region. | 2014-09-25 |
20140284847 | DEVICE AND METHOD FOR MANUFACTURING TIRE TREAD FEATURES - A device and method for manufacturing features into the tread of a tire are provided. The device and method provide for manufacturing tread features of various shapes and sizes. The tread features may be recessed, protruding, or flush with respect to the surrounding tread surface. The device and method may be used for both new tire constructions as well as retreading operations. | 2014-09-25 |
20140284848 | METHOD AND APPARATUS ASSOCIATED WITH ANISOTROPIC SHRINK IN SINTERED CERAMIC ITEMS - A manufacturing method for producing ceramic item from a photocurable ceramic filled material by stereolithography. The method compensates for the anisotropic shrinkage of the item during firing to produce a dimensionally accurate item. | 2014-09-25 |
20140284849 | METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT - A method for manufacturing a three-dimensional integrated circuit. The method includes: 1) adding a non-metallic light-induced catalyst including an alcohol and/or an aldehyde to a thermoplastic carrier material, and molding the resulting mixture by an injection molding machine to form a structural component; 2) irradiating a surface of the structural component with a laser ray to form a line pattern thereon; 3) immersing the structural component in a metal ion solution at room temperature for between 5 and 7 minutes; 4) washing the structural component with distilled water, and immersing the structural component in an aqueous solution including a reducing agent for between 5 and 7 minutes to allow the surface of the structural component to form a metal core; and 5) performing electroless copper plating and medium-phosphorus electroless nickel plating on an area comprising the metal core to yield a conductor track. | 2014-09-25 |
20140284850 | Cross-Linked Organic Polymer Compositions and Methods for Controlling Cross-Linking Reaction Rate and of Modifying Same to Enhance Processability - The invention includes a cross-linking composition comprising a cross-linking compound and a cross-linking reaction additive selected from an organic acid and/or an acetate compound, wherein the cross-linking compound has the structure according to formula (IV): | 2014-09-25 |
20140284851 | HARDENING CELL - A cell for quenching a charge under an atmosphere of gas comprises a centrifugal or helicon-centrifugal impeller comprising a gas intake opening and gas discharge openings. The impeller is rotated by a motor to cause a flow of the gas between the charge and a heat exchanger. The quenching cell comprises first and second mobile half-scrolls. In a first position, the first half-scroll guides the gas discharged by a first part of the discharge openings and the second half-scroll closes off a first portion of the intake opening. In a second position, the second half-scroll guides the gas discharged by a second part, different from the first part, of the discharge openings and the first half-scroll shuts off a second portion of the intake opening. | 2014-09-25 |
20140284852 | LANCES FOR TOP SUBMERGED INJECTION | 2014-09-25 |
20140284853 | METHOD FOR THE PRODUCTION OF A REFRACTORY FILTER - A method for the production of closed edge filters suitable for filtering molten metal and filters made by such a method. The method comprises: providing a reticulated foam substrate having at least one first surface for forming a side face of the filter and two opposed second surfaces for forming the through-flow faces of the filter; applying a liquid comprising an organic coating component to the first surface; solidifying the organic coating component to form a filter precursor having a volatilisable coating on the first surface; impregnating the filter precursor with a slurry comprising particles of a refractory material, a binder and a liquid carrier; and drying and firing the impregnated filter precursor to form the filter having a closed edge. | 2014-09-25 |
20140284854 | METAL MELTING FURNACE VORTEX CHAMBER BODY AND METAL MELTING FURNACE USING THE SAME - A metal melting furnace includes: a furnace body including a storage space storing molten metal; a vortex chamber body including a vortex chamber communicating with the storage space, the vortex chamber body including a partition plate serving as a drop weir uprightly formed inside the vortex chamber, the partition plate disposed at a communication side with respect to the storage space in the vortex chamber so that the longitudinal direction of the partition plate follows the communication direction and divides the communication side to form first and second vortex chamber openings positioned at both sides of the partition plate and communicating with both the storage space and the vortex chamber; and a molten metal whirling gap formed between a front end portion of the partition plate positioned inside of the vortex chamber in the longitudinal direction and an inner wall of the vortex chamber body facing the front end portion. | 2014-09-25 |
20140284855 | HIGH STRENGTH, LIGHT WEIGHT COMPOSITE LEAF SPRING AND METHOD OF MAKING - A composite leaf spring comprising a thermoplastic matrix material reinforced with fibers embedded and aligned in the matrix of the composite leaf spring. | 2014-09-25 |
20140284856 | LIGHT WEIGHT COMPOSITE LEAF SPRING AND METHOD OF MAKING - A composite leaf spring comprising a thermoset matrix material reinforced with fibers embedded in the matrix of the composite leaf spring. | 2014-09-25 |
20140284857 | ELECTRONIC ACTIVE MOUNT CAPABLE OF BIDIRECTIONAL CONTROL - An electronic active mount capable of a bidirectional control includes a core positioned inside a housing and connected to an engine. A main rubber is configured to connect the core and the housing. An upper orifice is coupled to an end of the main rubber to form an upper fluid chamber. A membrane is coupled to be moved up and down is connected to a lower orifice. A lower housing is formed at a central portion of the lower orifice, and a diaphragm is spaced apart from the lower orifice at a predetermined distance, which may attenuate vibration by using two electromagnets provided in an electronic mount. | 2014-09-25 |
20140284858 | ANTIVIBRATION DEVICE - [Problem to be Solved] | 2014-09-25 |
20140284859 | BUMP STOPPER AND MANUFACTURING METHOD THEREFOR - Disclosed are a bump stopper and a manufacturing method therefor which can maintain the shock-absorbing characteristics and durability performance constantly for a prolonged period of time regardless of the temperature or humidity of the usage environment, which can maintain a constant dimensional precision for a finished product, which is excellent in material yield rate and manufacturing efficiency, and which is low-cost, lightweight, recyclable, and ecological. A bump stopper ( | 2014-09-25 |
20140284860 | CLAMPING DEVICE - Clamping device for clamping a workpiece defining at least three protection holes, includes a supporting seat, a pressing plate, a clamping assembly, and an operation assembly. The supporting seat can define a sliding groove, a first receiving groove, a second receiving groove, and a receiving hole, and includes a protrusion portion. The pressing plate can be securely stacked upon the supporting seat. The clamping assembly can include a first and a second clamping subassembly, and is sandwiched between the supporting seat and the pressing plate. The operation assembly can include a locking member and a transmission pin eccentrically assembled to an end of the locking member. When the locking member is rotated, the transmission pin can be driven to resist the second clamping subassembly to be partially exposed from the supporting seat, simultaneously. The locking member can resist the first subassembly to be partially exposed from the supporting seat. | 2014-09-25 |
20140284861 | Bar clamp with ratchets - A clamp with a fixed jaw; a groove with the fixed jaw mounted thereon; a moveable jaw slidably mounted on the groove; a connecting member having one end secured to the moveable jaw and including a hollow cylinder at an other end disposed in the fixed jaw, and a strap interconnecting the cylindrical element and the hollow cylinder; a gear including a plurality of teeth disposed on the fixed jaw; a biasing member disposed on the fixed jaw opposite to the gear; a bifurcated handle put on the fixed jaw to cover both the gear and the biasing member; a first pawl in the handle; a lever secured to the first pawl; a rotatable pin with the hollow cylinder fastened thereon, the pin being for fastening the handle, the biasing member, the fixed jaw, the hollow cylinder, and the gear together; and the second pawl in the fixed jaw. | 2014-09-25 |
20140284862 | JAWS AND ADAPTER ASSEMBLY FOR A MACHINING SYSTEM - A jaws apparatus and method for using the jaws apparatus within a vise is described herein. A jaws apparatus may include a fixed jaw secured to the vise through an adapter. The adapter may have an adapter contact face and the fixed jaw may have a jaw contact face in slidable engagement with the adapter contact face. The adapter contact face may be comprised of a first physical material and the jaw contact face comprised of a second physical material. The first physical material and the second physical material may have substantially similar mechanical properties. The jaws apparatus may further include a movable jaw secured to a movable portion of the vise. | 2014-09-25 |
20140284863 | POSTPROCESSING APPARATUS AND IMAGE FORMING SYSTEM - A postprocessing apparatus includes a support unit that supports a sheet that is transported, an abutment unit against which a leading end of the sheet supported by the support unit abuts, a postprocessing unit that performs a postprocessing operation on the sheet abutting against the abutment unit, a detection unit that detects an image formed at a predetermined position on the sheet and detects a position of the image when the sheet abuts against the abutment unit, and a changing unit that changes a position of the abutment unit relative to the postprocessing unit on the basis of the position of the image detected by the detection unit. | 2014-09-25 |
20140284864 | SHEET PROCESSING METHOD, SHEET PROCESSING APPARATUS, AND SHEET PROCESSING SYSTEM - According to one embodiment, a sheet processing method of a sheet processing apparatus having a plurality of processing modes includes taking in sheets one by one from a bundle of the sheets in which a batch card having identification information, and the sheets as mediums to be inspected are piled, conveying the sheet which has been taken in, discriminating a kind of the batch card, switching the processing mode of the sheet processing apparatus based on the kind of the batch card which has been discriminated, discriminating and counting the sheets subsequent to the batch card, storing a count result of the sheets in correlation with the identification information, and sorting the sheet into a stacker based on a discrimination result of the sheet. | 2014-09-25 |
20140284865 | DOCUMENT-SHEET CONVEYANCE DEVICE AND IMAGE FORMING APPARATUS - A document conveyance device includes: a reader reading a document-sheet passing on a contact glass; a white plate being placed opposite to the contact glass; a first conveyance roller and a first driven roller placed upstream of the reader in a sheet conveying direction; a second conveyance roller and a second driven roller placed downstream of the reader in the sheet conveying direction; a holding member configured to hold rotatably the first and second driven roller; a spacer configured to support the holding member and include one or more of support planes different in height; wherein a support plane selected from the one or more support planes in accordance with a thickness of the document-sheet is moved manually to support the holding member, and the white plate is configured to lift upward from the contact glass plate by a forehead of the sheet passing through the contact glass plate. | 2014-09-25 |
20140284866 | IMAGE FORMING SYSTEM AND RELAY APPARATUS - An image forming system includes a sheet feed apparatus that feeds a sheet; an image forming apparatus that is provided independently of the sheet feed apparatus and that includes an image-formation transport path used for transporting the sheet fed from the sheet feed apparatus and an image forming section that forms an image onto the sheet transported along the image-formation transport path; and a relay apparatus that is independently provided between the sheet feed apparatus and the image forming apparatus. The relay apparatus relays the sheet fed from the sheet feed apparatus toward the image forming apparatus and ensures a distance along which the sheet is transported from the sheet feed apparatus to the image forming apparatus. | 2014-09-25 |
20140284867 | PAPER SHEET PICKUP DEVICE AND PAPER SHEET PROCESSING APPARATUS - According to one embodiment, a paper sheet pickup device includes an input portion, pickup mechanism, and pickup assist mechanism. The pickup mechanism picks up, one by one, the paper sheets supplied to a pickup position. The pickup assist mechanism is arranged upstream of the pickup mechanism in the pickup direction of the paper sheet. The pickup assist mechanism includes a suction belt configured to be arranged to be able to travel in the pickup direction, an air drawing portion configured to suck a paper sheet to the suction belt through the suction belt, and a driving motor configured to drive the suction belt. | 2014-09-25 |
20140284868 | SHEET CONVEYING APPARATUS, AND SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - A sheet conveying apparatus according to one aspect of the present disclosure includes a housing, a sheet storage portion, a sheet conveying path, and a guide member. Housing is mounted to apparatus body that includes bottom portion having opening portion, and main sheet conveying path extending upward from opening portion to convey sheets, and includes top face portion arranged opposing bottom portion. Sheet conveying path extends from sheet storage portion to top face portion, and is configured to be capable of communicating with main sheet conveying path. Sheets are conveyed on sheet conveying path. Guide member is pivotably supported by housing, and is configured to be capable of changing its position between a first position where guide member follows along top face portion and a second position where guide member projects upward from top face portion to guide sheet toward main sheet conveying path from sheet conveying path. | 2014-09-25 |
20140284869 | MEDIUM FEEDING APPARATUS - A medium feeding apparatus includes an opening unit (a lock shaft, a lock arm, a hopper, a link member, and a rotating member) that performs an opening operation in a direction in which rollers coming into press contact with each other on a conveying path for a medium are separated from each other when a conveyance error of the medium occurs. An error release operation control unit of a controller controls the opening unit by switching whether an opening operation is performed to the degree of opening in which a conveying roller and a driven roller are separated from each other or an opening operation is performed to the degree of opening in which a separating roller and a braking roller are separated from each other, according to an entering distance of the medium on the conveying path. | 2014-09-25 |
20140284870 | INPUT FEEDER DEVICE FOR AN APPARATUS FOR PROCESSING PAPER DOCUMENTS, PARTICULARLY BANK CHEQUES - The feeder device comprises a support structure (2) wherein, between a feeder plate (3) and an opposite surface (4), there is defined an input receptacle (5) for the introduction of one or more documents (BC) to be processed, and a motorized aligning and conveying de vice (6), adapted to engage and urge a document (BC) introduced into the input receptacle (5) towards a lateral stationary aligning surface (50). The feeder device is characterized in that the aligning and conveying device comprises an assembly (10) which is rotatable about a first axis (A) and which includes a pick-up member (24) rotatable in the assembly (10) about a second axis (B) spaced apart from the first axis (A), between a first, resting angular position and a second, working angular position, in the first of which positions the pick-up member (24) is retracted, while in the second it protrudes into the assembly (10) in the input receptacle (5) to engage a document (BC) introduced thereinto; and an electric control motor (18), coupled to the assembly (10) and to the pick-up member (24) through transmission means (12-22, 30-33). | 2014-09-25 |
20140284871 | SHEET CONVEYING APPARATUS, AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - A sheet conveying apparatus according to one aspect of the present disclosure includes a roller drive portion, a first drive portion, a restriction member, a second drive portion, and a drive control portion. Restriction member contacts with rear end of sheet surface, in conveying direction, of uppermost sheet in sheet stack stored in sheet storage portion to restrict feeding of sheet from sheet storage portion. Drive control portion controls roller drive portion, first drive portion, and second drive portion, and causes opposing member to separate from sheet feed roller, and causes restriction member to contact with sheet surface of second sheet to be conveyed immediately after first sheet, after first sheet located on uppermost position of sheet stack is fed by pickup roller and leading end of first sheet in conveying direction passes through sheet feed nip portion. | 2014-09-25 |
20140284872 | SHEET FEED DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feed device according to an aspect of the present disclosure includes an apparatus body, a cassette, a sheet conveying path, a pickup roller, a feeding portion, a lift plate, and a regulation member. Feeding portion conveys sheet fed from pickup roller downstream in sheet conveying direction while holding sheet at nip portion. Lift plate is changeable in position between first position and second position. When cassette is removed from apparatus body and lift plate is positioned in first position, regulation member protrudes to sheet conveying path on upstream side in sheet conveying direction relative to nip portion to thereby regulate entering of sheet stored in sheet storage portion into nip portion. When cassette is mounted into apparatus body and lift plate is positioned in second position, regulation member retreats from sheet conveying path thereby to cause sheet conveying path to become open. | 2014-09-25 |
20140284873 | PAPER-SHEET STACKING APPARATUS - According to one embodiment, a paper-sheet stacking apparatus includes a holding unit, a pushing mechanism, a backup, and a variable-force spring mechanism. The holding unit has a stacking base for holding a plurality of paper sheets in standing position and is configured to stack the paper sheets, one laid on another in a direction of a plane. The pushing mechanism is configured to push paper sheets transported, into the holding unit. The backup opposed to the pushing mechanism, is able to move in the direction the paper sheets are stacked and is configured to hold any paper sheet stacked between the backup and the pushing mechanism and to move away from the pushing mechanism as paper sheets are stacked one after another. | 2014-09-25 |