35th week of 2012 patent applcation highlights part 14 |
Patent application number | Title | Published |
20120217629 | Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump - A semiconductor device has a carrier. A semiconductor wafer including a semiconductor die is mounted to the carrier with an active surface of the semiconductor die facing away from the carrier. A plurality of bumps is formed over the active surface of the semiconductor die. An opening is formed in a periphery of the semiconductor die. An encapsulant is deposited over the carrier and semiconductor die, in the opening, and around the plurality of bumps such that an exposed portion of the plurality of bumps is devoid of encapsulant. A conductive via is formed through the encapsulant, within the opening, and extends to the carrier. A conductive layer is formed over the encapsulant and electrically connects to the conductive via and the exposed portion of the plurality of bumps. The carrier is removed to expose an end of the conductive via. | 2012-08-30 |
20120217630 | HEATSINK, HEATSINK ASSEMBLY, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE WITH COOLING DEVICE - According to one embodiment, a heatsink includes a base and heat radiation fins placed on one of surfaces of the base and arranged in parallel to each other with a submillimeter narrow pitch. Each of the multiple heat radiation fins has a submillimeter thickness, a length in a width direction of 60 mm or smaller, and a height of 40 mm or smaller. The heatsink assembly may be constituted by allaying a plurality of the heatsinks and thermally connecting each of the heatsinks to each other using a heat transport device. | 2012-08-30 |
20120217631 | INTEGRATED CIRCUIT DEVICES INCLUDING AIR SPACERS SEPARATING CONDUCTIVE STRUCTURES AND CONTACT PLUGS AND METHODS OF FABRICATING THE SAME - An integrated circuit device includes first and second conductive structures spaced apart from one another on a substrate along a first direction. The first and second conductive structures extend in a second direction substantially perpendicular to the first direction. A contact plug is interposed between the first and second conductive structures and is separated therefrom along the first direction by respective air gaps on opposite sides of the contact plug. The air gaps define first and second air spacers that electrically insulate the contact plug from the first and second conductive structures, respectively. An upper insulation layer covers the first and second air spacers and the first and second conductive structures. The air spacers may sufficiently reduce the loading capacitance between the conductive structures. Related fabrication methods are also discussed. | 2012-08-30 |
20120217632 | Extending Metal Traces in Bump-on-Trace Structures - A device includes a work piece, and a metal trace on a surface of the work piece. A Bump-on-Trace (BOT) is formed at the surface of the work piece. The BOT structure includes a metal bump, and a solder bump bonding the metal bump to a portion of the metal trace. The metal trace includes a metal trace extension not covered by the solder bump. | 2012-08-30 |
20120217633 | PASSIVATION LAYER FOR SEMICONDUCTOR DEVICES - An embodiment of the disclosure provides a semiconductor device. The semiconductor device includes a plurality of metallization layers comprising a topmost metallization layer. The topmost metallization layer has two metal features having a thickness T | 2012-08-30 |
20120217634 | Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier - A semiconductor device includes a first semiconductor die or component having a plurality of bumps, and a plurality of first and second contact pads. In one embodiment, the first and second contact pads include wettable contact pads. The bumps are mounted directly to a first surface of the first contact pads to align the first semiconductor die or component. An encapsulant is deposited over the first semiconductor die or component. An interconnect structure is formed over the encapsulant and is connected to a second surface of the first and second contact pads opposite the first surface of the first contact pads. A plurality of vias is formed through the encapsulant and extends to a first surface of the second contact pads. A conductive material is deposited in the vias to form a plurality of conductive vias that are aligned by the second contact pads to reduce interconnect pitch. | 2012-08-30 |
20120217635 | Packaging Structure and Method - A method of making a semiconductor device includes providing a substrate and forming a conductive layer on the substrate. The conductive layer includes a first metal. A semiconductor die is provided. A bump is formed on the semiconductor die. The bump includes a second metal. The semiconductor die is positioned proximate to the substrate to contact the bump to the conductive layer and form a bonding interface. The bump and the conductive layer are metallurgically reacted at a melting point of the first metal to dissolve a portion of the second metal from an end of the bump. The bonding interface is heated to the melting point of the first metal for a time sufficient to melt a portion of the first metal from the conductive layer. A width of the conductive layer is no greater than a width of the bump. | 2012-08-30 |
20120217636 | Ni PLATING OF A BLM EDGE FOR Pb-FREE C4 UNDERCUT CONTROL - A structure and a method of manufacturing a Pb-free Controlled Collapse Chip Connection (C4) with a Ball Limiting Metallurgy (BLM) structure for semiconductor chip packaging that reduce chip-level cracking during the Back End of Line (BEOL) processes of chip-join cool-down. An edge of the BLM structure that is subject to tensile stress during chip-join cool down is protected from undercut of a metal seed layer, caused by wet etch of the chip to remove metal layers from the chip's surface and solder reflow, by an electroplated barrier layer, which covers a corresponding edge of the metal seed layer. | 2012-08-30 |
20120217637 | SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed. | 2012-08-30 |
20120217638 | WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE - By forming a metal layer | 2012-08-30 |
20120217639 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device including an electrode having low contact resistivity to a nitride semiconductor is provided. The manufacturing method includes a carbon containing layer forming step of forming a carbon containing layer containing carbon on a nitride semiconductor layer, and a titanium containing layer forming step of forming a titanium containing layer containing titanium on the carbon containing layer. A complete solid solution Ti (C, N) layer of TiN and TiC is formed between the titanium containing layer and the nitride semiconductor layer. As a result, the titanium containing layer comes to be in ohmic contact with the nitride semiconductor layer throughout the border therebetween. | 2012-08-30 |
20120217640 | Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer - A semiconductor wafer has a plurality of semiconductor die with contact pads for electrical interconnect. An insulating layer is formed over the semiconductor wafer. A bump structure is formed over the contact pads. The bump structure has a buffer layer formed over the insulating layer and contact pad. A portion of the buffer layer is removed to expose the contact pad and an outer portion of the insulating layer. A UBM layer is formed over the buffer layer and contact pad. The UBM layer follows a contour of the buffer layer and contact pad. A ring-shaped conductive pillar is formed over the UBM layer using a patterned photoresist layer filled with electrically conductive material. A conductive barrier layer is formed over the ring-shaped conductive pillar. A bump is formed over the conductive barrier layer. The buffer layer reduces thermal and mechanical stress on the bump and contact pad. | 2012-08-30 |
20120217641 | Preventing the Cracking of Passivation Layers on Ultra-Thick Metals - A device includes a top metal layer; a UTM line over the top metal layer and having a first thickness; and a passivation layer over the UTM line and having a second thickness. A ratio of the second thickness to the first thickness is less than about 0.33. | 2012-08-30 |
20120217642 | SEMICONDUCTOR DEVICE PACKAGES HAVING A SIDE-BY-SIDE DEVICE ARRANGEMENT AND STACKING FUNCTIONALITY - A semiconductor device package including a substrate, a first device module, a second device module, and an package body. The first device module and the second device module are disposed side-by-side on a carrier surface of the substrate. The first device module includes first connecting elements provided with a first pitch. The second device module includes second connecting elements provided with a second pitch. The first pitch is different from the second pitch. The package body is disposed on the carrier surface and covers the first chip module and the second chip module. The package body includes first openings exposing the first connecting elements and second openings exposing the second connecting elements. | 2012-08-30 |
20120217643 | Semiconductor Device and Method of Forming Bond Wires Between Semiconductor Die Contact Pads and Conductive TOV in Peripheral Area Around Semiconductor Die - A semiconductor wafer has a plurality of semiconductor die with contact pads. An organic material is deposited in a peripheral region around the semiconductor die. A portion of the organic material is removed to form a plurality of vias. A conductive material is deposited in the vias to form conductive TOV. The conductive TOV can be recessed with respect to a surface of the semiconductor die. Bond wires are formed between the contact pads and conductive TOV. The bond wires can be bridged in multiple sections across the semiconductor die between the conductive TOV and contact pads. An insulating layer is formed over the bond wires and semiconductor die. The semiconductor wafer is singulated through the conductive TOV or organic material between the conductive TOV to separate the semiconductor die. A plurality of semiconductor die can be stacked and electrically connected through the bond wires and conductive TOV. | 2012-08-30 |
20120217644 | Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding - A semiconductor device has a plurality of semiconductor die mounted to a carrier. An encapsulant is deposited over the carrier around a peripheral region of the semiconductor die. A plurality of vias is formed through the encapsulant. A first conductive layer is conformally applied over a sidewall of the vias to form conductive vias. A second conductive layer is formed over a first surface of the semiconductor die between the conductive vias and contact pads of the semiconductor die. The first and second conductive layers can be formed during the same manufacturing process. A third conductive layer is formed over a second surface of the semiconductor die opposite the first surface of the semiconductor die. The third conductive layer is electrically connected to the conductive vias. A plurality of semiconductor die is stacked and electrically connected through the conductive vias and second and third conductive layers. | 2012-08-30 |
20120217645 | Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP - A semiconductor device has a substrate with a plurality of conductive vias and conductive layer formed over the substrate. A semiconductor die is mounted over a carrier. The substrate is mounted to the semiconductor die opposite the carrier. An encapsulant is deposited between the substrate and carrier around the semiconductor die. A plurality of conductive TMVs is formed through the substrate and encapsulant. The conductive TMVs protrude from the encapsulant to aid with alignment of the interconnect structure. The conductive TMVs are electrically connected to the conductive layer and conductive vias. The carrier is removed and an interconnect structure is formed over a surface of the encapsulant and semiconductor die opposite the substrate. The interconnect structure is electrically connected to the conductive TMVs. A plurality of semiconductor devices can be stacked and electrically connected through the substrate, conductive TMVs, and interconnect structure. | 2012-08-30 |
20120217646 | VIAS BETWEEN CONDUCTIVE LAYERS TO IMPROVE RELIABILITY - Another semiconductor device includes a first layer including a plurality of electrically conductive wires, a second layer, a plurality of non-functional via pads are included in the second layer or between the first layer and the second layer. A dangling via is included within a specified area of the first layer. The dangling vias connect one or more of the wires in the first layer to a respective one of the via pads. | 2012-08-30 |
20120217647 | Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer - A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer. | 2012-08-30 |
20120217648 | THROUGH SUBSTRATE STRUCTURE, DEVICE PACKAGE HAVING THE SAME, AND METHODS FOR MANUFACTURING THE SAME - A through substrate structure, an electronic device package using the same, and methods for manufacturing the same are disclosed. First, a via hole pattern is formed by etching an upper surface of a first substrate. A pattern layer of a second substrate is formed on the first substrate by filling the via hole pattern with a material for the second substrate by reflow. A via hole pattern is formed in the pattern layer of the second substrate by patterning the upper surface of the first substrate. Moreover, a via plug filling the via hole pattern is formed by a plating process, for example, thereby forming a through substrate structure, which can be used in an electronic device package. | 2012-08-30 |
20120217649 | DIGITAL INTEGRATED CIRCUIT - An array of functional cells includes a subset of cells powered by at least one supply rail. That supply rail is formed of first segments located on a first metallization level and second segments located on a second metallization level with at least one conductor element extending between the first and second segments to electrically connect successive segments of the supply rail. | 2012-08-30 |
20120217650 | SEMICONDUCTOR DEVICE, SENSOR AND ELECTRONIC DEVICE - A first substrate with a penetration electrode formed thereon is stacked on a second substrate with a protruding electrode formed thereon. The penetration electrode has a recessed portion. The substrates are stacked with the protruding electrode entered in the recessed portion. A distal width of the protruding electrode is smaller than an opening width of the recessed portion. | 2012-08-30 |
20120217651 | THROUGH SUBSTRATE VIAS - Methods and apparatus for forming through-vias are presented, for example, a method for forming a via in a portion of a semiconductor wafer comprising a substrate. The method comprises forming a trench surrounding a first part of the substrate such that the first part is separated from a second part of the substrate, forming a hole through the substrate within the first part, and forming a first metal within the hole. The trench extends through the substrate. The first metal extends from a front surface of the substrate to a back surface of the substrate. The via comprises the hole and the first metal. | 2012-08-30 |
20120217652 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES - Semiconductor devices and methods of manufacturing semiconductor devices. One example of a method of fabricating a semiconductor device comprises forming a conductive feature extending through a semiconductor substrate such that the conductive feature has a first end and a second end opposite the first end, and wherein the second end projects outwardly from a surface of the substrate. The method can further include forming a dielectric layer over the surface of the substrate and the second end of the conductive feature such that the dielectric layer has an original thickness. The method can also include removing a portion of the dielectric layer to an intermediate depth less than the original thickness such that at least a portion of the second end of the conductive feature is exposed. | 2012-08-30 |
20120217653 | SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD - A first semiconductor chip ( | 2012-08-30 |
20120217654 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a wafer comprising a chip that passes a test and a chip that does not pass a test, one or more first stacked chips that are stacked over the chip that passes a test, and one or more second stacked chips that are stacked over the chip that does not pass a test, wherein the second stacked chips comprise at least one between an chip that does not pass a test and a dummy chip. | 2012-08-30 |
20120217655 | ELECTRONIC DEVICE FOR HIGH POWER APPLICATIONS - An electronic device includes a first semi-conductor die, a second semi-conductor die and an electrically conductive element. The electrically conductive element includes a first electrically conductive part interposed at least partially between the first semi-conductor die and the second semi-conductor die, wherein said first part is electrically coupled to the first semi-conductor die. The electrically conductive element further includes a second electrically conductive part electrically coupled to the first part, wherein said second part extends from at least part of the first part. The first part is an electrically conductive strap between the dice, and the second part is clip extending from at least part of the strap. | 2012-08-30 |
20120217656 | Semiconductor Package Including Multiple Chips And Separate Groups of Leads - Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package. | 2012-08-30 |
20120217657 | MULTI-CHIP MODULE PACKAGE - A multi-chip module package is provided, which includes a first chip mounted on via a first conductive adhesive and electrically connected to a first chip carrier, a second chip mounted on via a second conductive adhesive and electrically connected to a second chip carrier which is spaced apart from the first chip carrier, wherein the second conductive adhesive is made of an adhesive material the same as that of the first conductive material, a plurality of conductive elements to electrically connect the first chip to the second chip and an encapsulant encapsulating the first chip, the first chip carrier, the second chip, the second chip carrier and the plurality of conductive elements, allowing a portion of both chip carriers to be exposed to the encapsulant, so that the first chip and second chip are able to be insulated by the separation of the first and second chip carriers. | 2012-08-30 |
20120217658 | MULTI-STACK SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception. | 2012-08-30 |
20120217659 | INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY - An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer. | 2012-08-30 |
20120217660 | SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELECTRIC DEVICE - A semiconductor apparatus includes: a semiconductor device including a first electrode; a substrate including a second electrode and a recess; and a heat-dissipating adhesive material to set the semiconductor device in the recess so as to arrange the first electrode close to the second electrode, wherein the first electrode is coupled to the second electrode and the heat-dissipating adhesive material covers a bottom surface and at least part of a side surface of the semiconductor device. | 2012-08-30 |
20120217661 | SEPARATOR ROLL MEMBRANE COATING FOR FUEL CELL HUMIDIFIER - A water vapor transfer unit with separator plates and a method of making the same. In such an assembly, an ionomer coating that facilitates moisture transfer from a moisture-rich flowpath to a moisture-deficient flowpath and an underlying separator may both be prepared from continuous, roll-based methods. The ionomer may be applied to a separator assembly as the last processing step such that the handling of the fragile membrane is kept to a minimum. | 2012-08-30 |
20120217662 | Evaporative Cooling Tower and Method - A cooling tower for evaporating water from a brine solution is provided and may include a housing having an air inlet and a brine inlet. The cooling tower may also include a heat-exchange assembly having a heat-exchange media that suspends the brine solution and at least one nozzle in fluid communication with the brine inlet. The at least one nozzle may receive the brine solution from the brine inlet and may transfer the brine solution from the brine inlet to the heat-exchange media to allow the heat-exchange media to transfer moisture from the brine solution to air received from the air inlet to reduce the moisture content of the brine solution. | 2012-08-30 |
20120217663 | SOLAR CONCENTRATOR AND PRODUCTION METHOD - The invention relates to a method for producing a solar concentrator from a transparent material. The solar concentrator comprises a light coupling surface and a light decoupling surface, the solid body comprises a supporting frame with an outer edge between the light coupling surface and the convex light decoupling surface and the transparent material is precision moulded between a first mould and a second mould to form the solar concentrator in such a way that the outer edge is moulded or formed without any or with only partial contact with said mould. | 2012-08-30 |
20120217664 | METHOD FOR PRODUCING PLASTIC LENS AND INJECTION COMPRESSION MOLDING APPARATUS - Provided is a method for producing a plastic lens, wherein, in molding a plurality of plastic lenses having different optical surface shapes simultaneously in a single mold 50, by designing cavities 3 | 2012-08-30 |
20120217665 | Method for Preparation of Well-Dispersed, Discrete Nanoparticles by Spray Drying Techniques - A method for preparing uniquely sized nanoparticles of CaF | 2012-08-30 |
20120217666 | Easily Millable CAD Blocks Of Polymer Foam Which Can Be Burned Out And Their Use - Polymer blocks for use in the pressing technique, which include a polymer foam and use of the polymer blocks for the production of dental restorations or restoration parts by pressing. The polymer block may be selected from the group consisting of polystyrene, polymethyl methacrylate, polyurethane, phenol- or urea-formaldehyde resins, polyethylene, polypropylene and styrene-acrylonitrile copolymers. | 2012-08-30 |
20120217667 | METHOD FOR RECYCLING PAPER MACHINE CLOTHING - A method for recycling the construction material of paper machine clothing, in particular forming screens and press felts to be used as starting product, includes the steps of a) Classification of a starting product to be recycled at least in regard to the material composition thereof, b) Comminution of the starting product and c) Extrusion of the comminuted starting product. | 2012-08-30 |
20120217668 | CLOSED LOOP CONTROL OF AUXILIARY INJECTION UNIT - A method and apparatus of controlling commencement of an injection of a melt stream of moldable material from an auxiliary injection unit. A sensor is placed in an injection molding system to sense a condition related to an injection of a first melt stream of a first moldable material provided by a primary injection unit. Commencement of a second melt stream of a second moldable material from the auxiliary injection unit is initiated upon the sensed condition related to the injection of the first melt stream being detected at a preselected value. The sensed condition may be a pressure, velocity or temperature of the first melt stream as provided by a direct sensor, a force or strain on a hot runner component as provided by an indirect sensor or the occurrence of a function of the injection molding system as provided by a functional sensor. | 2012-08-30 |
20120217669 | Method for Manufacturing Ceramic Honeycombs with Reduced Shrinkage - A method of manufacturing porous ceramic articles is provided that includes forming a plurality of extruded green bodies from a ceramic precursor batch composition. The method also includes firing the extruded green bodies in a tunnel kiln to produce porous ceramic articles, periodically determining a shrinkage characteristic of at least one sample passing through the tunnel kiln, and adjusting a top soak temperature in the kiln if the shrinkage characteristic is outside of a predetermined range. | 2012-08-30 |
20120217670 | Manufacture of Composites by a Flexible Injection Process Using a Double or Multiple Cavity Mold - The present invention generally relates to a mold assembly ( | 2012-08-30 |
20120217671 | PARTICLE BOARD - The present invention relates to a particle board comprising a lower and an upper surface layer ( | 2012-08-30 |
20120217672 | METHOD OF FABRICATING AN IMPLANTABLE MEDICAL DEVICE WITH BIAXIALLY ORIENTED POLYMERS - Methods and systems for manufacturing an implantable medical device, such as a stent, from a tube with desirable mechanical properties, such as improved circumferential strength and rigidity, are described herein. Improved circumferential strength and rigidity may be obtained by inducing molecular orientation in materials for use in manufacturing an implantable medical device. Methods of inducing circumferential molecular orientation by inducing circumferential flow in a molten polymer are disclosed. | 2012-08-30 |
20120217673 | SEALANT MOLD FIXTURE FOR A DOMED CAP - A sealant mold for sealing a domed nutplate unit particularly at a lower region about an adhesively attached interface with a substrate such as an aircraft fuel tank wall. The sealant mold is formed from a lightweight plastic material, and includes an inner cap in combination with an outer skirt to define a gap or trough for receiving and supporting a metered quantity of a curable sealant material. The mold is fitted onto a dome of the nutplate unit with an inner cap inboard edge landed onto a dome shoulder. The outer skirt is then displaced downwardly about the landed inner cap to extrude the sealant material about the lower region of the nutplate unit particularly such as the adhesively attached interface with the substrate. The sealant material is allowed to cure, after which the sealant mold can be stripped quickly and easily from the cured sealant material. | 2012-08-30 |
20120217674 | DEVICE AND PROCEDURE FOR EXPANDING THE END OF A PLASTIC PIPE - A device for expanding an end of a pipe made of a plastic having a shape memory includes a plurality of spreading elements movable in a radial direction from a starting position, in which the spreading elements are insertable by a predetermined distance into the end of the pipe, to an outward-extended position, in which spreading surfaces of the spreading elements are each brought into an effective position against an interior surface of the end of the pipe, so as to expand the end of the pipe. A mechanism is configured to move the spreading elements from the starting position to the outward-extended position. An actuator is configured to vary a maximum radial distance of the spreading surfaces in the outward-extended position from a center axis. At least one fastener is configured to lock the radial maximum radial distance set by the actuator. | 2012-08-30 |
20120217675 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An imprint apparatus comprises: a first scope configured to measure a position deviation amount between a shot region and an original; and a controller. The controller brings the original into contact with the resin coated on each of not less than two shot regions of plural shot regions, which is aligned based on preobtained layout data, and measures a position deviation amount between each of the not less than two shot regions and the original using the first scope, calculates a position deviation amount between each of the plural shot regions and the original statistically processing the measured position deviation amounts, and corrects the layout data of the plural shot regions using the calculated position deviation amounts, and executes the imprint process while aligning each shot region other than the not less than two shot regions with the original based on the corrected layout data. | 2012-08-30 |
20120217676 | FLUORINATED SILAZANE RELEASE AGENTS IN NANOIMPRINT LITHOGRAPHY - An imprint lithography release agent having general formula (1): | 2012-08-30 |
20120217677 | Boxless Casting Mold and Method for the Production Thereof - A boxless casting form which is separated horizontally and which is composed of a lower casting body ( | 2012-08-30 |
20120217678 | LIQUID CRYSTAL POLYESTER COMPOSITION AND PROCESS FOR PRODUCING THE SAME - The present invention provides a liquid crystal polyester composition, comprising (i) 100 parts by weight of a liquid crystal polyester, and (ii) 65 to 100 parts by weight of a combination of a fibrous filler with a plate-like filler, wherein the fibrous filler has a number-average fiber diameter of 5 to 15 μm, and a number-average aspect ratio of 20 to 40, and a content ratio by weight of the fibrous filler to the plate-like filler is more than 1.0 and 1.6 or less; and a process for producing the liquid crystal polyester composition comprising a step of melt-kneading the above respective components with one another. | 2012-08-30 |
20120217679 | INJECTION DEVICE AND RESIN INJECTION METHOD - As an injection screw | 2012-08-30 |
20120217680 | CHITOSAN-BASED ADHESIVES AND USES THEREOF - There is provided an adhesive comprising chitosan an optionally a crosslinking agent. A method for preparing such an adhesive is also disclosed. A wood-panel made with such an adhesive is also provided. Moreover, a method for manufacturing a wood-based panel is provided. The method comprises preparing a mixture comprising wood, chitosan, optionally a crosslinking agent, and optionally an acid, forming a mat with the mixture, and pressing the mat under heat and pressure so as to obtain the wood-based panel. | 2012-08-30 |
20120217681 | PROCESS FOR PRODUCING NANOFIBRES - The present invention relates to a process for producing metal oxide nanofibers using a sol-gel precursor. The nanofibers produced by the process according to the invention are notable for an increased metal oxide content compared to the prior art. | 2012-08-30 |
20120217682 | Methods of Improving the Physical Properties of Polyolefin Films - Methods of improving the physical properties of a polyolefin film that include providing interpolymer resin particles, forming a blend composition by blending from about 0.1 to about 25% by weight based on the weight of the blend composition of interpolymer resin particles into a second polyolefin; and forming a film from the blend composition. The interpolymer resin particles are made up a styrenic polymer intercalated within a first polyolefin. The first polyolefin is present at from about 20% to about 80% by weight based on the weight of the particles and the styrenic polymer is present at from about 20% to about 80% by weight based on the weight of the particles. | 2012-08-30 |
20120217683 | WASTE HEAT SYSTEM - A preheat charging system for preheating scrap metal prior to delivery to a melting furnace. The system includes a preheating station having a heating chamber adapted to receive scrap metal. Hot gas from a burner chamber is circulated around the scrap metal. The burner chamber is adapted to receive exhaust gas from a hot exhaust gas source such as a melting furnace. A burner apparatus is mounted within the burner chamber in a flow path of an exhaust inlet port. The burner is configured to supply supplemental heat on demand to the heating chamber to supplement the hot exhaust gas. A first fan can be provided to direct exhaust air from a furnace to the burner chamber. A second fan can be provided for directing air into the burner apparatus. | 2012-08-30 |
20120217684 | METHOD FOR OPERATING A SHAFT FURNACE, AND SHAFT FURNACE OPERABLE BY THAT METHOD - Method for operating a shaft furnace, whereby an upper section of the shaft furnace is charged with raw materials which due to gravity descend inside the furnace while the atmosphere prevailing within the shaft furnace causes part of the raw materials to melt and/or to be reduced, and in a lower section of the shaft furnace a process gas is injected so as to at least partly modify the atmosphere prevailing in the shaft furnace. The pressure and/or volume flow of the injected process gas is dynamically modulated within a time span of 40 s. Also, a shaft furnace operable by said method, thus achieving improved through-gassing. | 2012-08-30 |
20120217685 | DROSS COOLING SYSTEM AND COOLING METHOD - Embodiments of an aluminum dross cooling head are disclosed. The cooling cooperates with a material container encapsulate dross and reduce thermiting of the dross. In one embodiment, the cooling head also serves as a compression head when forced into the dross by a cooperating dross press assembly. | 2012-08-30 |
20120217686 | COMPRESSION SENSITIVE SUSPENSION DAMPENING - A spring for a suspension is described. The spring includes: a spring chamber divided into at least a primary portion and a secondary portion, and a fluid flow path coupled with and between the primary portion and the secondary portion. The fluid flow path includes a bypass mechanism, wherein the bypass mechanism is configured for automatically providing resistance within the fluid flow path in response to a compressed condition of the suspension. | 2012-08-30 |
20120217687 | GAS SPRING FOR SLIDING REFRACTORY GATE VALVE - A gas spring ( | 2012-08-30 |
20120217688 | GAS SPRING PISTON WITH PARTIAL BELLOWS SUPPORT FEATURE AND GAS SPRING ASSEMBLY INCLUDING SAME - A piston for use in forming a gas spring assembly includes a longitudinally extending axis, a first end wall extending approximately transverse to the axis, and an outer side wall extending longitudinally from adjacent the first end wall. The outer side wall includes a first side wall portion that forms a fully circumferential outer surface and a second side wall portion that forms a partially circumferential outer surface that extends longitudinally beyond the fully circumferential outer surface. A gas spring assembly including such a piston is also included. | 2012-08-30 |
20120217689 | Drawer front jig - A drawer front jig with a base plate, a drawer front stop bar, a drawer box positioning bracket assembly, a rail and a first and second drawer box stop bar assembly. The drawer box stop bars each include an adjustment slot. The rail is attached to the top of the base plate. The drawer box stop bars are is held at right angles to the rail. The rail has longitudinal T shaped slots along its top and side surfaces. The bar and bracket assemblies are held onto the rail by lock lever mechanisms. The drawer front stop bar is held in place to the inner facing wall of the rail. When a person places a drawer front against the rail and places the drawer box on the drawer front, the jig helps the drawer front and drawer box to be accurately positioned so that they can be joined together in a standard way. | 2012-08-30 |
20120217690 | CLAY MODEL SUPPORT DEVICE - A clay model support device includes a base, a support frame connected with the base, and a panel connected with the support frame. The base includes a lower surface configured to engage an associated horizontal floor surface. The support frame is pivotable with respect to the base about a generally horizontal axis. The panel is configured to support an associated clay model. The panel is slidable with respect to the support frame | 2012-08-30 |
20120217691 | CLAMPING DEVICE IN MAIN SHAFT DRIVING DEVICE FOR MACHINE TOOL - A clamping device in a main shaft driving device for a machine tool, which rotationally drives a main shaft, wherein the main shaft is rotatably supported by a frame. The clamping device includes a clamp piston, a pressure chamber and an operating fluid supplying mechanism, wherein the clamp piston has a first pressure-receiving surface and a second pressure-receiving surface, the first pressure-receiving surface receiving the spring force of a spring member, the second pressure-receiving surface receiving pressure of an operating fluid, wherein the operating fluid supplying mechanism includes a switching portion that selectively supplies the corresponding operating fluid from a common operating fluid supply source to at least one of a first pressure chamber and a second pressure chamber, the first pressure chamber being formed by the first pressure-receiving surface and the frame, the second pressure chamber being formed by the second pressure-receiving surface and the frame. | 2012-08-30 |
20120217692 | MOBILE MEASURING PLATFORM FOR PRECISION MEASURING SYSTEM - A mobile measuring platform, comprises a fixing seat; a driving assembly fixed to the fixing seat, the driving assembly comprises an electric motor and a leadscrew driven by the electric motor; two leading guides mounted on the fixing seat; each of the two leading guides comprises a slide member parallel to the leadscrew, and a guide track slidably sleeved on the slide member; a sliding assembly fixed to the guide track of each of the two leading guides; and a driving guide comprising a slide member perpendicular to the leadscrew and a guide track slidably sleeved on the slide member of the driving guide; wherein the guide track of the driving guide is driven by the electric motor via the leadscrew, the slide member of the driving guide is fixed to the sliding assembly, and the two leading guides and the driving guide are all gas hydrodynamic guides. | 2012-08-30 |
20120217693 | Sheet Processing Device, Image Forming Apparatus, And Sheet Processing Method - A sheet processing device for stacking one or more sheets temporarily on a stacking unit, and stapling the sheets by a stapling unit after aligned by an alignment unit. The device includes a shift unit that shifts the sheet in both a sheet conveying direction and a direction orthogonal to the sheet conveying direction, and a control unit that controls a shift amount of the shift unit so that an alignment distance of a width direction alignment unit to align the sheet in the direction orthogonal to the sheet conveying direction is constant regardless of a staple position and a sheet size, when stacking the sheets on the stacking unit. | 2012-08-30 |
20120217694 | SHEET FEED DEVICE AND IMAGE RECORDING APPARATUS HAVING SUCH SHEET FEED DEVICE - An image recording apparatus including a first tray having a first holding portion for holding sheets, a second tray disposed above the first tray and including a second holding portion for holding sheets, a sheet feeder that selectively feeds a sheet from one of the first tray and the second tray in a sheet feed direction, a recording unit that records an image on the sheet fed by the sheet feeder, and a discharge roller that discharges the sheet on which the image is recorded by the recording unit. The second holding portion of the second tray moves above the first holding portion of the first tray. The second tray further includes a discharged sheet receiving portion for receiving the sheet discharged by the discharge roller. The second tray including the discharged sheet receiving portion pivots relative to the first tray. | 2012-08-30 |
20120217695 | Document Processing Apparatus, Assembly and Sub-Assembly and Method for Operating the Same - A sub-assembly of a document processor that routes at least one document from an input hopper, along a document path and to an output bin is disclosed. The document processor includes a flag movably-arranged within the input hopper to/from a closed orientation and an open orientation; a rod fixed to and extending from the flag, wherein the rod includes an outer surface; a cam member including a camming surface, wherein the camming surface is communicatively-coupled to the outer surface of the rod; a driven shaft connected to the cam member, wherein the cam member further includes a one-way clutch, wherein the driven shaft extends through the one-way clutch; and a feed motor connected to the driven shaft. A method for operating the sub-assembly is also disclosed. | 2012-08-30 |
20120217696 | Sheet Feeder and Image Forming Apparatus - A sheet feeder includes a casing having a loading surface, a supply roller, a drive mechanism, a blocking member, and an interlocking mechanism. The supply roller is configured to feed recording sheets on the loading surface toward the image forming unit. The drive mechanism is configured to move the supply roller. The blocking member is disposed upstream from the supply roller in a sheet feed direction and includes a block surface configured to be moved between a first position and a second position. The block surface is configured to block insertion of a recording sheet to a downstream side when in the first position, and configured to allow insertion of the recording sheets on the loading surface when in the second position. The interlocking mechanism is configured to receive a drive force from the drive mechanism to move the blocking member. | 2012-08-30 |
20120217697 | SHEET STACKING DEVICE - A sheet stacking device for a sheet handling system, a method and a computer program product are provided for controlling a sheet stacking device of a sheet handling system. The sheet stacking device includes at least one sheet entrance pathway for receiving incoming sheets and a sheet output unit with at least one output tray for stacking the received sheets to form a at least one stack on the at least one output tray. The sheet stacking device further includes a control unit for determining the weight of the stack on the at least one output tray and for providing a control signal if the determined weight exceeds a predetermined value, and a stack separating mechanism for distinguishing two or more stacks on the same output tray, said stack separating mechanism being controlled by the control unit to limit the weight of the distinguished stacks. | 2012-08-30 |
20120217698 | SHEET REVERSING APPARATUS, IMAGE FORMING APPARATUS AND SHEET REVERSING METHOD - A sheet reversing apparatus including: a right angle reversing conveyance section which reverses front/back sides of a sheet while changing a conveyance direction of the sheet, being conveyed in a first conveyance direction, to a second conveyance direction perpendicular to the first conveyance direction; a sheet skew sensor which detects a sheet skew of the sheet being conveyed by the right angle reversing conveyance section; and a sheet skew correction mechanism which corrects the sheet skew of the sheet while the sheet is being conveyed by the right angle reversing conveyance section. | 2012-08-30 |
20120217699 | Image Forming Apparatus - An image forming apparatus includes a body frame, an image forming unit and a transporting unit. The transporting unit includes a transporting tray, a side guide, a plate, a skew roller and an urging member. The transporting tray is configured to support the recording medium which is being transported. The side guide is configured to abut with an end of the recording medium in a width direction. The plate is facing the transporting tray. The skew roller is rotatably supported by the plate and is configured to skew the recording medium toward the side guide. The urging member is configured to urge a portion of the plate toward the transporting tray. | 2012-08-30 |
20120217700 | SHEET FEEDER AND IMAGE FORMING APPARATUS - A sheet feeder includes a loading surface, a supply roller configured to feed recording sheets loaded on the loading surface, an overload prevention member disposed upstream from the supply roller in a sheet feed direction, and a movable member disposed downstream from the overload prevention member in the sheet feed direction. The overload prevention member includes a restriction surface configured to be moved between a first position and a second position. The movable member is configured to be moved from a third position to a fourth position by being pushed by leading ends of the recording sheets. The movable member and the overload prevention member are configured to interlock each other such that, when the movable member is in the third position, the restriction surface is in the first position, and when the movable member is in the fourth position, the restriction surface is in the second position. | 2012-08-30 |
20120217701 | RECORDING APPARATUS - A recording apparatus includes a case. In the case, a feeding unit configured to feed a recording medium in a feeding direction, a feeding path through which the recording medium is fed, a recording unit configured to record on the recording medium, and an ink tube connected to the recording unit and an ink cartridge for supplying ink to the recording unit are provided. A first opening is provided in a face of the case for allowing the recording medium disposed in the feeding path to be removable. A second opening is provided in the face where the first opening is provided for allowing the ink cartridge to be installed. An operating unit is provided above the first opening. | 2012-08-30 |
20120217702 | JAM PROCESSING ASSISTING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE JAM PROCESSING ASSISTING DEVICE - A jam-processing assisting device that performs a jam removal process for removing a sheet jammed at a carriage roller by rotating the carriage roller includes: a motor that drives the carriage roller to rotate; a rotation-direction detecting unit that detects a direction of rotation in which the motor is required to rotate for removing a jam; and a motor-driving controlling unit that drives the motor to rotate in the direction that has been detected. The rotation-direction detecting unit determines, based on a detection of a pulling-out direction in which the jammed sheet is pulled by an external force, the pulling-out direction that has been detected as the direction of rotation of the motor and drives the motor in the direction that has been determined. | 2012-08-30 |
20120217703 | Intershaft Seal System for Minimizing Pressure Induced Twist - An intershaft seal system capable of communicating a balanced pressure profile onto forward and aft faces along a piston ring is presented. Seal system includes forward and aft mating rings and a piston ring. Mating rings include a plurality of divergent flow grooves adjacent to the piston ring. Each divergent flow groove includes a pair of grooves which intersect at and are substantially symmetric about an apex. The piston ring includes channels which direct a fluid from a high pressure region upward, downward, or directly through the piston ring and onto the divergent flow grooves. The divergent flow grooves separate the fluid in a symmetrically divergent fashion prior to communication onto the piston ring. The divergent flow grooves communicate a substantially symmetric pressure force along the radial width of the piston ring so as to minimize twisting thereof, thus reducing wear along the piston ring and increasing seal life. | 2012-08-30 |
20120217704 | GAS SEAL FOR AEROSPACE ENGINES AND THE LIKE - A gas seal for aerospace engines has a stationary seal housing, a rotating seal plate mounted on the engine drive shaft and a carbon ring seal movably supported in the housing with a face which mates with the face of the seal plate to create a gas seal therebetween. A plurality of flexible pins have first ends supported on the housing and second ends slidably connected with the carbon ring seal to permit the latter to shift axially. A plurality of compression springs bias the two seal faces together. The housing has a first twist lock which selectively engages a second twist lock on the carbon ring seal to movably retain the latter in the housing. The second ends of the spring pins resiliently deflect during mutual rotation of the carbon ring seal and the housing to facilitate engagement and disengagement of the first and second twist locks. | 2012-08-30 |
20120217705 | SLIDING MEMBER - An annular sliding member which is used in a mechanical seal, is attached to a rotating shaft, and slidably comes into contact, by being applied with energizing force in the axial direction, with another annular sliding member attached to a housing, wherein the sliding surface which comes into contact with the other sliding member is formed from: a dynamic pressure generating groove which guides a fluid to be sealed from a region to be sealed to the side of a region to not be sealed of the sliding surface, and a concave-convex section configured from a plurality of minute grooves which have a shallower depth than the dynamic pressure generating groove. | 2012-08-30 |
20120217706 | Floating Wear Sleeve Assembly for Shaft Seals - A wear sleeve assembly for a seal on a shaft includes a sleeve having inner and outer circumferential surfaces, the outer surface being engageable by a seal inner surface at a contact location to prevent fluid flow between the seal inner surface and the sleeve outer surface. The sleeve inner surface defines a bore sized to receive a portion of the shaft with clearance. A coupler is configured to connect the sleeve with the shaft and provides a clearance space between the sleeve inner surface and a shaft outer surface at about the seal contact location. Thereby, the sleeve is adjustably positionable relative to the shaft so that the sleeve remains generally centered within the seal as the sleeve and shaft rotate about the axis. The coupler preferably includes an annular body with first and second axially-spaced, relatively displaceable sections for displacing the sleeve relative to the shaft. | 2012-08-30 |
20120217707 | OIL SEAL - An oil seal ( | 2012-08-30 |
20120217708 | END SEAL - A kit, apparatus, and method for sealing a junction between a manhole and a pipe within a sewer system are provided. In a first embodiment, the end of a pipe adjacent a manhole is sealed by the use of a pipe liner and a tubular sleeve made of a hydrophilic material. The tubular sleeve is held in place by a mechanical fastener and a pipe liner is installed or otherwise placed through the tubular sleeve and against the wall of the pipe. In a second embodiment, a majority of the area surrounding a junction of a pipe and a manhole is sealed by the use of a tubular sleeve made of a hydrophilic material including a flange portion, a mechanical fastener, a pipe liner, and a manhole liner. | 2012-08-30 |
20120217709 | Devices, Systems and Methods for Securing a Stake - Devices, systems, and methods are disclosed which relate to a stake that is twisted into and out of the ground via an adaptor. The adaptor adapts the stake to a power drill, allowing the power drill to twist the stake into and out of the ground by activating the drill. The adaptor is designed to fit a standard drill chuck at one end. At the other end, the adaptor has a fitting to receive the stake. The fitting is such that the stake and adaptor are axially locked so that the stake and adaptor rotate in unison when the drill is activated. The stake is a wire designed in a coil shape with a pilot. The pilot is fit into the adaptor which axially locks the stake with the adaptor. | 2012-08-30 |
20120217710 | Medi-spa service cart - Disclosed herein is a medi-spa service cart having improved storage, convenience and portability properties. The cart includes a castered base, a selectively extensible tubular vertical support and, affixed to the upper end of the support, a principal service tray. | 2012-08-30 |
20120217711 | STORABLE INTRAVENOUS STAND - The present invention is directed to a base member for a portable intravenous stand. The base member includes a plurality of segments configured to facilitate the close nesting or alignment of multiple portable intravenous stands; and thus reducing the amount of space required for storing the portable intravenous stands when not in use. | 2012-08-30 |
20120217712 | VEHICLE WHEEL AND AXLE SYSTEM - An axle and wheel system for enhancing the safety of occupants of a vehicle. An axle structure is provided which is engineered to be crushable upon impact. The axle is structurally attached to the chassis of the vehicle and extends beyond the chassis on both sides thereof. Each axle end is attached to a wheel suspension. The portion of the axle extending beyond the chassis is covered by an aerodynamic ally shaped, crushable fairing and each wheel is covered by an aerodynamically shaped, crushable pod. | 2012-08-30 |
20120217713 | WHEELCHAIR SUSPENSION - A wheelchair includes a frame, a rear caster coupled to the frame, a drive wheel coupled to the frame, a front caster, and a pivoting assembly. The pivoting assembly couples the front caster to the frame such that upward movement of the front caster relative to the frame causes the front caster to move toward the drive wheel. | 2012-08-30 |
20120217714 | TWIST BEAM SUSPENSION WITH Y-BEAM CONTROL ARM - A suspension arrangement for interconnecting a frame and an axle in a vehicle includes a control arm having a first beam and a second beam in parallel, spaced relation, each beam having a first end with a single arm and a second end with an upper arm and a lower arm to define a Y-shape, the first end being pivotally connectable to a vehicle frame, and the second end being connectable to a vehicle axle disposed between the upper and lower arms, and a bushing arrangement mountable to the vehicle axle, the bushing arrangement having an upper portion connecting between the upper arms of the first beam and second beam and a lower portion connecting between the lower arms of the first beam and second beam. | 2012-08-30 |
20120217715 | SUSPENSION OF A VEHICLE AXLE AND VEHICLE - A suspension is provided for a vehicle axle, with a twist-beam axle having two trailing arms interconnected via a cross brace, of which each trailing arm comprises a mounting device for the rotatable fastening of the twist-beam axle to a vehicle body, which includes, but is not limited to a bushing and a connecting element, which is formed on the trailing arm and in which the bushing is received such that the twist-beam axle can be pivoted about the longitudinal axis of the bushing. The bushing is fastened to a holder, which can be connected to the vehicle body, and the bushing with its longitudinal axis is arranged in a horizontal vehicle plane. | 2012-08-30 |
20120217716 | SUSPENSION OF A VEHICLE AXLE AND VEHICLE - A suspension of a vehicle axle is provided having a twist-beam axle that includes, but is not limited to two trailing arms, each of which have a wheel suspension and are interconnected via a cross brace with a torsion profile, which is designed stiff to bending and torsionally soft. The twist-beam axle connects to a Watt linkage of arrowed design, which articulates on the trailing arms laterally offset to an axis through a wheel center of the wheel suspension. | 2012-08-30 |
20120217717 | Control Arm For A Vehicle - A component, especially a control arm for a vehicle, includes a base wall and a passage extending away from said base wall, and in particular, a control arm lug. A method for producing such a component includes shortening a deep-drawn contour which connects one side of the base wall to an inner contour of a passage in the longitudinal direction of the passage by means of upsetting. | 2012-08-30 |
20120217718 | CAMERA CAR - A mobile camera vehicle has a roll cage or similar structure attached to a chassis. Upper and lower horizontal bars are attached to the vehicle structure. Front and rear vertical bars are each attached to the upper and lower horizontal bars. A lift plate is attached to and vertically moveable on the front and rear vertical bars. A lift plate actuator may be attached to the lift plate and used to raise and lower the lift plate on the front and rear vertical bars. Alternatively, the lift plate may be moved manually. A camera platform is supported on the lift plate. A vertical shock isolator may optionally be supported on the lift plate, and with a camera on the camera platform on the vertical shock isolator. | 2012-08-30 |
20120217719 | Mud flap holder - A mud flap holder for securing a mud flap to a motor vehicle includes a base plate, a pivot plate, and a securing mechanism. The base plate mounts to a vehicle. The pivot plate is connected to the base plate via a hinge. The securing mechanism secures the base and pivot plates in a locked position, which frictionally secures a mud flap between the base and pivot plates. | 2012-08-30 |
20120217720 | CHILD TRAILER - A child trailer includes a body with a plurality of wheels located at the bottom thereof, a joint and a coupler. The joint is located in front of the body to adjust the angle with the body. The coupler includes a coupling dock, a pair of adjustment arms and a pair of strap holders. The coupling dock is connected to the front end of the joint. The adjustment arms are respectively connected to the left side and right side of the coupling dock. Each of the adjustment arms includes a sleeve to adjust the transverse distance and an adjustment bar to adjust the longitudinal distance. The adjustment arm also has a pivotal member hinged on the strap holder. The strap holders are fastened to a stroller to enhance steadiness and safety and improve practicality. | 2012-08-30 |
20120217721 | BI-DIRECTIONAL PROPULSION CASTER - A bidirectional propulsion caster assembly is disclosed for enabling a rider to generate bi-directional motion from a ride-on device. A mounting bracket is attachable to the bottom of the device and defines a pivot axis extending in a generally transverse direction across the bottom of the device. A rocker bracket and caster shaft having a caster shaft axis are attached to the mounting bracket and pivot about the pivot axis along an arc between first and second positions. A wheel bracket is mounted to and rotates about the caster shaft. A wheel is mounted to the wheel bracket for rotation about a wheel axis angularly offset from the caster shaft axis. One or more changeable pivot stops may be attached to the rocker bracket or the mounting bracket and effective to further define the available arc of rotation. | 2012-08-30 |
20120217722 | MOLD AND PROCESS FOR OBTAINING A BICYCLE FRAME MADE OF RECYCLABLE POLYMER - A mold and an injection process for making a one-piece bicycle frame made of recyclable polymer. The mold includes one stationary part and one movable part. Sliding columns with guiding lower portions are formed in the stationery part. Both the stationary part and movable part are provided with base plates for supporting bearing cavity plates that collectively form a structural channel that receives a thermal injected polymer. The cavity bearing plate of the movable part includes a longitudinal bed that receives a main central drawer and side beds that receive secondary drawers. The longitudinal bed includes peripheral tracks enabling the main drawer to slide. The bed includes drawing pins positioned at an angle, allowing the main drawer to move horizontally. The side beds also include drawing pins for the secondary drawers. | 2012-08-30 |
20120217723 | ALL WHEEL 180-DEGREE STEER TRANSPORT - A steering system for a towed farm implement or wagon, such as a header transport, is provided that allows the tongue of the header transport to pivot approximately 90 degrees to the right or the left (i.e., 180 degrees in total) and translates the movement of the tongue to all of the wheels of the header transport. Front steering linkages are coupled to the tongue, and are configured to oscillate front wheels in response to rotation of the tongue. Rear steering linkages are coupled to the front steering linkages by front-to-rear linkages, and the rear steering linkages are configured to oscillate rear wheels in response to rotation of the tongue. | 2012-08-30 |
20120217724 | HEIGHT ADJUSTABLE STOW-AWAY RECEIVER HITCH - An adjustable hitch assembly including a mounting collar, a hitch base with a vertical post having a plurality of alternating square sections and circular sections, a hitch ball member having at least one hitch ball and a pivot shaft extending therefrom. The vertical post is slidably and rotatably received through the mounting collar; the pivot shaft is rotatably received in the mounting collar. The mounting collar, to which the hitch ball member is attached, may slide vertically along the vertical post and may rotate about the vertical post to adjust the height and angular position of the hitch ball member. The hitch ball member may have a plurality of variously sized hitch balls that a user may select by rotating the hitch ball member about the pivot shaft. A single rotatable latch pin received by the mounting collar engages and disengages the various components of the hitch assembly to allow adjustability. | 2012-08-30 |
20120217725 | DUAL TOW BALL COUPLING APPARATUS - A coupling apparatus includes a base, an arm extending from the base, a first tow ball extending from a first side of the arm, and a second tow ball extending from an opposite second side of the arm. The base is configured to be removably attached to a vehicle in opposite first and second positions such that the first tow ball is in an upright orientation when the base is attached to a vehicle in the first position, and the second tow ball is in an upright orientation when the base is attached to a vehicle in the second position. Each of the first and second end portions of the base includes a respective post, and a retainer assembly is configured to be removably attachable to each post. | 2012-08-30 |
20120217726 | TOWING DEVICE FOR A TOWING VEHICLE - A towing device, for a towing vehicle, with a coupling shaft attached to the towing vehicle, a ball head mounted on the coupling shaft so that the ball head can rotate about a vertical axis, which can be coupled to a coupling counterpart of a trailer vehicle, and with an angle-measuring device by which rotation of the ball head about the vertical axis, relative to the coupling shaft, can be determined, and a force-measuring device by which force exerted by the ball head on the coupling shaft in the direction of the vertical axis can be determined. | 2012-08-30 |
20120217727 | Wheeled Collapsible Stand for a Power Driven Machine - A wheeled collapsible stand for a power driven machine includes first and second frame units pivotally connected to each other and respectively pivotally connected to a tabletop bracing member that is adapted to support the machine thereon. The first frame unit includes front and rear frames pivotally coupled to each other such that the front frame is movable from an unfolded position to a folded position to displace the tabletop bracing member from a working position to a collapsed position. An extendible lifting unit is disposed to provide a lift to a front end of the tabletop bracing member to move toward the working position, and a buffer during movement of the tabletop bracing member to the collapsed position. | 2012-08-30 |
20120217728 | TABLET-BREAKING INITIATOR FOR AIRBAG INFLATOR - An igniter for a passenger vehicle safety airbag module includes a housing with apertured walls, gas-generating tablets filling the housing, and, in direct contact with gas-generating tablets, an initiator containing combustible material. A plurality of four malleable flaps of substantially identical shape and size are secured about the squib in an upstanding circumscribing array with spaced-apart, opposed lateral edges between adjacent of the flaps interconnected by fluid seals in the form of webbing that is structurally less robust than the flaps. The ends of the flaps remote from the squib curl radially inwardly into a spaced-apart edge-to-edge disposition beyond the combustible material. The webbing and the flaps together enclose an interior space and the combustible material. Pressure from the ignition of the combustible material causes the fluid seals to burst and the flaps to pivot outwardly crushing the gas-generating tablets in the housing. | 2012-08-30 |