33rd week of 2011 patent applcation highlights part 15 |
Patent application number | Title | Published |
20110198729 | Methods and Compositions for Preparing Tensile Strained Ge on Ge1-ySNy Buffered Semiconductor Substrates - The present disclosure describes methods for preparing semiconductor structures, comprising forming a Ge | 2011-08-18 |
20110198730 | HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD - A method of synthesizing a hyperbranched polymer by living radical polymerization of a monomer in the presence of a metal catalyst includes at least adding a compound or setting the amount of the monomer in the living radical polymerization. The compound added is at least a compound represented by R | 2011-08-18 |
20110198731 | Apparatus and Method for Defining Laser Cleave Alignment - An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide. | 2011-08-18 |
20110198732 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate. | 2011-08-18 |
20110198733 | SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAYER ON SUBSTRATE OF THE SAME - In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom. | 2011-08-18 |
20110198734 | METHOD OF IMPROVING A SHALLOW TRENCH ISOLATION GAPFILL PROCESS - A method of forming a graded trench for a shallow trench isolation region is provided. The method includes providing a semiconductor substrate with a substrate region. The method further includes forming a pad oxide layer overlying the substrate region. Additionally, the method includes forming an etch stop layer overlying the pad oxide layer. The method further includes patterning the etch stop layer and the pad oxide layer to expose a portion of the substrate region. In addition, the method includes forming a trench within an exposed portion of the substrate region, the trench having sidewalls and a bottom and a first depth. The method additionally includes forming a dielectric layer overlying the trench sidewalls, the trench bottom, and mesa regions adjacent to the trench. The method further includes removing a first portion of the dielectric layer from the trench bottom to expose the substrate region with a second portion of the dielectric layer remaining on the sidewalls of the trench. In addition, the method includes etching the substrate region to increase the depth of at least a portion of the trench to a second depth. Also, the method includes removing the second portion of the dielectric layer from the trench. | 2011-08-18 |
20110198735 | ASSEMBLY OF A MICROELECTRONIC CHIP HAVING A GROOVE WITH A WIRE ELEMENT IN THE FORM OF A STRAND, AND METHOD FOR ASSEMBLY - Assembly of at least one microelectronic chip with a wire element, the chip comprising a groove for embedment of the wire element. The wire element is a strand with a longitudinal axis substantially parallel to the axis of the groove, comprising at least two electrically conducting wires covered with insulator. The chip comprises at least one electrically conducting bump in the groove, this bump being in electric contact with a stripped area of a single one of the electrically conducting wires of the strand. | 2011-08-18 |
20110198736 | REACTIVE SITE DEACTIVATION AGAINST VAPOR DEPOSITION - Methods and structures relating to the formation of mixed SAMs for preventing undesirable growth or nucleation on exposed surfaces inside a reactor are described. A mixed SAM can be formed on surfaces for which nucleation is not desired by introducing a first SAM precursor having molecules of a first length and a second SAM precursor having molecules of a second length shorter than the first. Examples of exposed surfaces for which a mixed SAM can be provided over include reactor surfaces and select surfaces of integrated circuit structures, such as insulator and dielectric layers. | 2011-08-18 |
20110198737 | QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING FUNCTION AND METHOD FOR FABRICATING THE SAME - A quad flat non-leaded (QFN) package structure with an electromagnetic interference (EMI) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from EMI. A method of fabricating the package structure as described above is further proposed. | 2011-08-18 |
20110198738 | METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING AT LEAST ONE MICROELECTRONIC DEVICE - A method for manufacturing a microelectronic package ( | 2011-08-18 |
20110198739 | Method for Manufacturing Semiconductor Device - A semiconductor device manufacturing method prevents the occurrence of a short-circuit between leads caused by peeling-off of residual resin formed on lead side faces or lead lower portions. A laser beam is radiated a plurality of times from a main surface side of leads and also a plurality of times from a back surface side of the leads to intra-dam resin formed in a dam portion, the dam portion being enclosed with adjacent leads, a dam bar and a sealing body, thereby removing all the intra-dam resin formed on lead side faces and lead lower portions. The laser beam radiation of the intra-dam resin may leave behind a sealing body-side resin portion and a projecting resin portion which projects outwardly from the sealing body. | 2011-08-18 |
20110198740 | SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF - According to one embodiment, a semiconductor storage device includes an organic board provided with external connection terminals on one surface and formed as an individual piece into a plane shape substantially identical to that of an area where the external connection terminals are provided, a lead frame having a mounting area positioned relative to the organic board, and a semiconductor memory chip bonded to the mounting area. | 2011-08-18 |
20110198741 | Integrated Circuit Package with Enlarged Die Paddle - An integrated circuit package system having a body with a top surface, a bottom surface, and a plurality of side surfaces has a leadframe and encapsulating material that encapsulates at least a portion of the leadframe. The leadframe and encapsulating material are part of the body. The leadframe has a die paddle for supporting a die, and a plurality of leads spaced from the die paddle. The encapsulating material thus also separates the die paddle from the plurality of leads. At least a first portion of the die paddle is exposed to the top surface, while at least a second portion of the die paddle is exposed to the bottom surface. | 2011-08-18 |
20110198742 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE - This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab. In such a semiconductor device, a circuit formed in the semiconductor element in a monolithic manner is comprised of a plurality of circuit parts and, in a specified circuit part (a low noise amplifier) which forms a portion of the circuit parts, all grounding electrode terminals out of electrode terminals of the semiconductor element are not connected to the tab through wires but are connected with the leads through wires. | 2011-08-18 |
20110198743 | Method of Manufacturing a Semiconductor Device with a Carrier Having a Cavity and Semiconductor Device - A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first semiconductor chip in the first cavity of the carrier, and applying the dielectric foil to the carrier. | 2011-08-18 |
20110198744 | LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE BETWEEN A LAND AND A SOLDER RESIST - A land grid array (LGA) package including a substrate having a plurality of lands formed on a first surface of the substrate, a semiconductor chip mounted on a second surface of the substrate, a connection portion connecting the semiconductor chip and the substrate, and a support layer formed on part of a surface of a first land. | 2011-08-18 |
20110198745 | WAFER-LEVEL PACKAGED DEVICE HAVING SELF-ASSEMBLED RESILIENT LEADS - A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board. | 2011-08-18 |
20110198746 | MEMS DEVICES - A method of manufacturing a MEMS device comprises forming a MEMS device element ( | 2011-08-18 |
20110198747 | CONDUCTIVE PILLAR STRUCTURE FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - A semiconductor component formed on a semiconductor substrate is provided. The semiconductor substrate has a first surface and a second surface. The semiconductor substrate includes a plurality of devices on the first surface. A plurality of through silicon vias (TSVs) in the semiconductor substrate extends from the first surface to the second surface. A protection layer overlies the devices on the first surface of the semiconductor substrate. A plurality of active conductive pillars on the protection layer have a first height. Each of the active conductive pillars is electrically connected to at least one of the plurality of devices. A plurality of dummy conductive pillars on the protection layer have a second height. Each of the dummy conductive pillars is electrically isolated from the plurality of devices. The first height and the second height are substantially equal. | 2011-08-18 |
20110198748 | Semiconductor device and method of fabricating same - A method of fabricating a semiconductor device includes: forming a semiconductor chip portion having an electrode on a main surface of a wafer; forming a first resist pattern having a first opening on the electrode; filling the first opening with a first electrically conductive material, thereby forming an electrically conductive post; removing the first resist pattern after said forming of the electrically conductive post; forming an interlayer dielectric film having a second opening positioned on the electrically conductive post; and forming an electrically conductive redistribution layer extending from an upper surface of the electrically conductive post over an upper surface of the interlayer dielectric film. | 2011-08-18 |
20110198749 | Semiconductor chip package and method of manufacturing the same - Provided are a semiconductor chip package and a method of manufacturing the same. The semiconductor chip package includes a semiconductor chip comprising a chip pad, and a rerouting layer disposed on the semiconductor chip and including a metal interconnection electrically connected to the chip pad and a partial oxidation region formed by the oxidation of metal and insulating the metal interconnection. | 2011-08-18 |
20110198750 | SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING SAME, ELECTRODE STRUCTURE OF SEMICONDUCTOR CHIP AND METHOD FOR FORMING SAME, AND SEMICONDUCTOR DEVICE - A semiconductor chip according to the present invention includes a semiconductor substrate, a bump of a metal projecting from a surface of the semiconductor substrate, and an alloy film covering the entire surface of the bump, the alloy film being composed of an alloy of the metal of the bump and a second metal. | 2011-08-18 |
20110198751 | BOND PAD WITH MULTIPLE LAYER OVER PAD METALLIZATION AND METHOD OF FORMATION - A semiconductor device structure has a semiconductor die that has a bond pad with a passivation layer surrounding a portion of the bond pad. A nickel layer, which is deposited, is on the inner portion. A space is between a sidewall of the nickel layer and the passivation layer and extends to the bond pad. A palladium layer is over the nickel layer and fills the space. The space is initially quite small but is widened by an isotropic etch so that when the palladium layer is deposited, the space is sufficiently large so that the deposition of palladium is able to fill the space. Filling the space results in a structure in which the palladium contacts the nickel layer, the passivation layer and the bond pad. | 2011-08-18 |
20110198752 | LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE - A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package. | 2011-08-18 |
20110198753 | IMPROVED WAFER LEVEL CHIP SCALE PACKAGING - An improved wafer level chip scale packaging technique is described which does not use an encapsulated via to connect between a redirection layer and a pad within the pad ring on the semiconductor die. In an embodiment, a first dielectric layer is formed such that it terminates on each die within the die's pad ring. Tracks are then formed in a conductive layer which contact one of the pads and run over the edge of an opening onto the surface of the first dielectric layer. These tracks may be used to form an electrical connection between the pad and a solder ball. | 2011-08-18 |
20110198754 | Semiconductor device including porous layer covered by poreseal layer - A method of forming a semiconductor device includes forming a trench on a porous insulating film, placing a chemical material including a structure comprising —Si—O— including vinyl group on a surface of the porous insulating film or in the porous insulating film, and performing polymerization of the chemical material to provide a dielectric film having a density higher than that of porous insulating film on the surface of the trench. The structure may be a structure defined by a formula 1. | 2011-08-18 |
20110198755 | SOLDER ALLOY AND SEMICONDUCTOR DEVICE - A solder alloy includes 5 to 15% by mass of Sb, 3 to 8% by mass of Cu, 0.01 to 0.15% by mass of Ni, and 0.5 to 5% by mass of In. The remainder thereof includes Sn and unavoidable impurities. Thereby, highly reliable solder alloy and semiconductor device suppressing a fracture in a semiconductor element and improving crack resistance of a solder material can be obtained. | 2011-08-18 |
20110198756 | Organometallic Precursors and Related Intermediates for Deposition Processes, Their Production and Methods of Use - Vapor deposition precursors that can deposit conformal thin ruthenium films on substrates with a very high growth rate, low resistivity and low levels of carbon, oxygen and nitrogen impurities have been provided. The precursors described herein include a compound having the formula CMC′, wherein M comprises a metal or a metalloid; C comprises a substituted or unsubstituted acyclic alkene, cycloalkene or cycloalkene-like ring structure; and C′ comprises a substituted or unsubstituted acyclic alkene, cycloalkene or cycloalkene-like ring structure; wherein at least one of C and C′ further and individually is substituted with a ligand represented by the formula CH(X)R | 2011-08-18 |
20110198757 | SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MANUFACTURING THE SAME - A semiconductor structure includes a first metal-containing layer, a dielectric capping layer, a second metal-containing layer, and a conductive pad. The first metal-containing layer includes a set of metal structures, a dielectric filler disposed to occupy a portion of the first metal-containing layer, and an air-gap region defined by at least the set of metal structures and the dielectric filler and abutting at least a portion of the set of metal structures. The second metal-containing layer includes at least a via plug electrically connected to a portion of the set of metal structures. The conductive pad and the via plug do not overlap the air-gap region. | 2011-08-18 |
20110198758 | SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a substrate having a conductive area, a first pattern formed on the substrate and having a contact hole through which the conductive area is exposed, and a contact plug in the contact hole. The contact plug includes first and second silicon layers. The first silicon layer, formed from a first compound including at least two silicon atoms, is formed in the contact hole to contact a top surface of the conductive area and a side wall of the first pattern. The second silicon layer, formed from a second compound including a number of silicon atoms less than the number of the silicon atoms of the first compound, is formed on the first silicon layer and fills a remaining space of the contact hole, the second silicon layer being spaced apart from the first pattern at an entrance of the contact hole. | 2011-08-18 |
20110198759 | METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT HAVING REDISTRIBUTION LAYER WITH RECESSED CONNECTORS - A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud. | 2011-08-18 |
20110198760 | Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method - A technique which prevents cracking in a solder resist layer covering an interposer surface between external coupling terminals of an interconnection substrate, thereby reducing the possibility of interconnect wire disconnection resulting from such cracking. A semiconductor package is mounted over an interconnection substrate. An underfill resin layer seals the space between the semiconductor package and the interconnection substrate. External coupling terminals, interconnect wires and a solder resist layer are formed over the surface of an interposer (constituent of the semiconductor package) where the semiconductor chip is not mounted. In an area where an interconnect wire passing between two neighboring ones of the external coupling terminals intersects with a line connecting the centers of the two external coupling terminals, the interconnect wire is not covered by the solder resist layer. | 2011-08-18 |
20110198761 | Methods for Multi-Wire Routing and Apparatus Implementing Same - A rectangular interlevel connector array (RICA) is defined in a semiconductor chip. To define the RICA, a virtual grid for interlevel connector placement is defined to include a first set of parallel virtual lines that extend across the layout in a first direction, and a second set of parallel virtual lines that extend across the layout in a second direction perpendicular to the first direction. A first plurality of interlevel connector structures are placed at respective gridpoints in the virtual grid to form a first RICA. The first plurality of interlevel connector structures of the first RICA are placed to collaboratively connect a first conductor channel in a first chip level with a second conductor channel in a second chip level. A second RICA can be interleaved with the first RICA to collaboratively connect third and fourth conductor channels that are respectively interleaved with the first and second conductor channels. | 2011-08-18 |
20110198762 | PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC - A method of panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die units in place, which are then encapsulated. The cured dielectric film is then patterned utilizing a mask-less patterning technique. | 2011-08-18 |
20110198763 | DIFFUSER MEMBRANES WITH MODIFIED ELECTRICAL PROPERTIES - A diffuser membrane for use in a wastewater treatment application comprises an additive or coating operative to substantially reduce the ability of at least a portion of the diffuser membrane to buildup static charge. Aeration efficiency and contamination resistance are thereby improved. | 2011-08-18 |
20110198764 | AERATION SYSTEM WITH ANTIMICROBIAL PROPERTIES - Aeration pipe for diffusion of a gas into a liquid medium, the pipe having a flexible microporous tubular wall of thermoset polymer particles and a thermoplastic binder for melt bonding said thermoset polymer particles and dispersing an antimicrobial compound substantially uniformly throughout the wall. The aeration pipe is useful in various environments such as aquaculture and waste water treatment. | 2011-08-18 |
20110198765 | OPTICAL TRANSMISSION MEDIUM SHAPING METHOD, OPTICAL TRANSMISSION MEDIUM SHAPING APPARATUS, AND OPTICAL TRANSMISSION MEDIUM MANUFACTURING METHOD - An optical transmission medium shaping method and an optical transmission medium shaping apparatus can accurately adjust desire curvature radius without cracking the optical transmission medium. The optical transmission medium shaping method for bending an optical transmission medium using a transferring means and a noncontacting heating means, includes a transferring and heating process for heating part of the optical transmission medium by the noncontacting heating means while transferring the transferring means, and a bending process for bending the optical transmission medium. | 2011-08-18 |
20110198766 | METHOD AND APPARATUS FOR PRODUCING OPTICAL FIBER - An optical fiber producing method and apparatus are provided in which sufficient pulling tension is applied to an optical fiber to enhance the twisting efficiency without affecting winding tension of a winding bobbin, whereby the PMD of the optical fiber can be reduced. In a method of producing an optical fiber in which, in a path where an optical fiber | 2011-08-18 |
20110198767 | METHOD AND APPARATUS FOR CONSTRUCTING RAILWAY FOR RUBBER-WHEELED AUTOMATED GUIDEWAY TRANSIT SYSTEM - A method and apparatus for constructing railways for a rubber-wheeled AGT system are provided. The method includes forming guideways, along which guide rollers of a light rail vehicle moves when the light rail vehicle runs along railways and forming, using a pressing unit of a finisher, the railways applied with concrete such that the railways have a same trace as the guideways by moving a finisher along the guideways. The apparatus includes a vehicle that is provided with rollers to run along guideways installed on vertical walls of a road bed and a pressing unit that is disposed under the vehicle to make lateral and longitudinal traces of railways correspond to lateral and longitudinal traces of the guideways by pressing and forming a top surface of railway concrete during the running along the guideways. | 2011-08-18 |
20110198768 | METHOD AND PLANT FOR THE MANUFACTURE OF CONTAINER PREFORMS - A method for the manufacture of container preforms in which recycled plastic material is subjected to at least one heat treatment in a recycling machine before it is transferred to a preform machine, where at least a major portion of heat introduced into the plastic material during its heat treatment and storage is transferred from the recycling machine with the plastic material into the preform machine. In a plant embodied for carrying out the method, the recycling machine is coupled with the preform machine either directly or via at least one intermediate storage such that at least a major portion of heat introduced in the recycling machine during a heat treatment of the plastic material can be transferred with the plastic material into the preform machine. | 2011-08-18 |
20110198769 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - The imprint apparatus of the present invention molds an uncured resin on a substrate using a mold to form a resin pattern on the substrate. The apparatus includes a measuring device configured to project a light onto the mold, to receive a light scattered by the mold, and to measure the scattered light; and a controller. The controller is configured to store a reference signal, to cause the measuring device to measure the mold to obtain a measurement signal, and to obtain an index indicating a discrepancy between the measurement signal and the reference signal. | 2011-08-18 |
20110198770 | INJECTION MOLDING A HOLLOW PRODUCT - The dimensions of a portion of an injection molded hollow product formed in a mold cavity between a first cavity surface of a cavity section and a first core surface of a core section are adjusted by adjusting the position of the first cavity surface relative to the position of the first core surface so that the first cavity surface and the first core surface are in a selected relative position when the cavity section is combined with the core section and a protractible and retractable core part is protracted so that a cavity abutment mold part can be connected directly to the protracted core part and the cavity abutment mold part also can be connected indirectly to the protracted core part by a series consisting of abutting mold parts. This series includes a pair of abutting rotatable eccentric rings, which are rotated to adjust the relative positions of the first cavity surface and the first core surface. | 2011-08-18 |
20110198771 | MANUFACTURING METHOD OF ALUMINUM-DIAMOND COMPOSITE - A process for the production of an aluminum-diamond composite, characterized by comprising the step of preparing a diamond powder having a specific diameter, the step of adding a colloidal silica to the diamond powder to form a slurry, the step of subjecting the slurry to press forming or slip casting to produce a compact of the diamond particles, the step of firing the compact either in air or in a nitrogen atmosphere to form a porous diamond preform, the step of heating the porous diamond preform, the step of heating an aluminum alloy to a temperature equal to or above the melting point of the alloy and impregnating the molten alloy into the porous diamond preform to make a flat plate-like aluminum-diamond composite wherein both surfaces are covered with surface layers containing an aluminum-base metal, and the step of working the aluminum-diamond composite into an aluminum-diamond composite. | 2011-08-18 |
20110198772 | METHOD FOR MANUFACTURING HONEYCOMB FILTER - There is provided a method for manufacturing a honeycomb filter, the method including: a step of depositing plugging material particles which burn away due to a thermal treatment on the inflow cell side surface layer portion of a honeycomb-shaped substrate having porous partition walls separating and forming plural cells, and plugging portions, a step of depositing membrane-forming particles on the surface layer portion where the plugging material particles deposit, and a step of subjecting the honeycomb-shaped substrate having the plugging material particles and membrane-forming particles depositing on the partition walls thereof to a thermal treatment. The number average particle diameter of the first particles is at most an average pore size of the pores formed in the partition walls. | 2011-08-18 |
20110198773 | POLY(ARYLENE ETHER) COMPRESSION MOLDING - A method for compression molding of poly(arylene ether) powder comprises introducing a powder comprising unheated poly(arylene ether) powder to compaction equipment comprising a compression mold and subjecting the powder in the compression mold to a pressure sufficient to produce an article having a density greater than the unheated poly(arylene ether) powder wherein the pressure is applied at a temperature less than the glass transition temperature of the poly(arylene ether) powder. | 2011-08-18 |
20110198774 | USING OF ORGANIC SOLVENTS IN WET GRANULATION OF MOXIFLOXACIN - This invention encompasses to obtain non-convertible solid pharmaceutical formulations of moxifloxacin anhydrous by using of wet granulation with an organic solvent or mixtures of organic solvents. | 2011-08-18 |
20110198775 | POINTER WITH A FITTED COVER FOR A GAUGE OR SIMILAR AND A METHOD OF FABRICATING FITTED COVERS - An exemplary embodiment of a pointer for a gauge includes a body of transparent material, the body including a hub and an indicator portion extending from the hub. The pointer further includes a fitted cover of transparent material to cover the body, the fitted cover including a visible pattern. | 2011-08-18 |
20110198776 | Crepe agent composition and method for producing crepe paper - The present invention provides a crepe agent composition that forms a layer having excellent durability and a method for producing a crepe paper using the same. The crepe agent composition is to be applied to a surface of a cylindrical dryer, and comprises an inorganic solid lubricant, a dispersant for dispersing the inorganic solid lubricant, a thermosetting polymer for fixing the inorganic solid lubricant to the surface of the cylindrical dryer, and water that is a solvent, the inorganic solid lubricant having a particle diameter of 0.5 to 20 μm. | 2011-08-18 |
20110198777 | METHOD FOR MANUFACTURING SEAMLESS THIN-WALLED ARTICLES WITH THERMOPLASTIC MATERIALS - A method for manufacturing seamless thin-walled articles with thermoplastic material is disclosed, wherein the seamless thin-walled articles each having single opening are coated onto plural mold surfaces, which move along a track and respectively have a rotation. The method includes a molten and coating step to coat thermoplastic materials in molten state from at least two extruding mechanisms on the surfaces of the molds; a heating and cooling step to heat the thermoplastic materials by passing the molds, which rotate at the same time, through a heating mechanism to form thin-walled articles with even thickness, and then cool the thermoplastic materials; a lip rolling step to roll up the thermoplastic materials at the lower edge of the opening to form a lip; and a mold releasing step to release the thin-walled articles from the molds. | 2011-08-18 |
20110198778 | Seal and Method of Making Same - A method of producing a seal comprising forming an elongated strip of a thermoplastic material having laterally spaced, interlockable portions; bending such strip along a longitudinal line disposed between the spaced interlockable portions to position the interlockable portions in opposed relation; and interlocking the interlockable portions together when such portions are disposed in opposed relation to provide a bulb segment and a mount segment. | 2011-08-18 |
20110198779 | Polymeric Compositions - A one or two part organopolysiloxane composition capable of cure to an elastomeric body, the composition comprising a polymer having a polymer backbone selected from an organopolysiloxane backbone and a telechelic backbone, which polymer has not less than two reactable silicon-bonded groups selected from alkenyl group, condensable groups, silyl-hydride groups, 5 to 50% by weight of the composition of an extender; a suitable cure catalyst; and optionally a siloxane and/or silane cross-linker having at least two groups per molecule which are reactable with the reactable groups in (a) and/or one or more fillers. The extender is selected from an alicyclic ester having at least two ester groups, and a boiling point of at least 180° C. or a mixture thereof having a boiling point range commencing at 180° C. or above; each ester group being the same or different and comprising from 2 to 30 carbon atoms. | 2011-08-18 |
20110198780 | LIGHT EMITTING DEVICE WITH MOLDED WAVELENGTH CONVERTING LAYER - A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold. | 2011-08-18 |
20110198781 | METHODS FOR CHANGING THE SHAPE OF A SURFACE OF A SHAPE MEMORY POLYMER ARTICLE - Methods for changing the shape of a surface of an article are disclosed. The methods may include providing a liquid polymer precursor, casting the precursor against a first tool assembly, curing the precursor to form a shape memory polymer substrate, deforming one or more surfaces of the substrate, and mobilizing the shape memory polymer to shift the deformed surface of the substrate from a deformed shape to a pre-set shape. | 2011-08-18 |
20110198782 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 2011-08-18 |
20110198783 | PROCESS FOR PRODUCING A DEVICE USING A MOLD - In order to provide a mold and an imprint apparatus which permit adjustment of a depth of an imprint pattern after the imprint pattern is formed, the mold is constituted by a mold substrate including a first material and a surface layer, constituting a projection of the mold and including a second material, for forming a pattern on the photocurable resin material. The first material is more etchable than the second material. The first material and the second material have optical transmittances capable of curing the photocurable resin material with respect to at least a part of wavelength range of ultraviolet light. | 2011-08-18 |
20110198784 | MOLD LOCK KEY SAFETY DEVICE - An improved safety device for a blow molding apparatus is disclosed. The safety device allows the user to trigger or disarm the locking mechanism and return the locking pins to the safe position instead of leaving it in the loaded position. The safety device prevents potential damage to an individual that is accessing the blow molding apparatus. | 2011-08-18 |
20110198785 | Methods and Appartus for Casting Ceramic Sheets - A method for making a thin, free-standing ceramic sheet may include drawing a carrier film proximate a casting head and across a casting bed of a tape caster at a rate from about 2 cm/min to about 500 cm/min. Depositing a thin film of ceramic slip less than about 150 μm on the carrier film with the casting head. The ceramic slip may comprises a ceramic powder with an ultimate crystallite size of less than about 10 μm dispersed in a fluid vehicle such that the ceramic slip has a ceramic solids fraction of greater than about 20% by volume. The deposited ceramic slip may be dried on the carrier film thereby forming a green ceramic sheet on the carrier film. After the green ceramic sheet is dried, the green ceramic sheet may be sintered. | 2011-08-18 |
20110198786 | Method and device for the continuous creation of a bainite structure in a carbon steel, particularly in a strip steel - A method continuously creates a bainite structure in a carbon steel, especially a strip steel by austenitizing the carbon steel; introducing the austenitized carbon steel into a bath containing a quenching agent; adjusting the carbon steel to the transformation temperature for bainite and maintaining the transformation temperature for a certain period of time; and then cooling the carbon steel. The carbon steel stays in the bath until a defined percentage of the bainite structure relative to the total structure of the carbon steel has formed. Residues of the quenching agent are removed from the surface of the carbon steel by blowing the same off when the carbon steel is discharged from the bath, and the remaining structure components of the carbon steel are then transformed into bainite in an isothermal tempering station without deflecting the carbon steel at all. | 2011-08-18 |
20110198787 | FLUID DAMPER WITH INTERNAL COMPRESSION SPRING - A monotube shock absorber assembly includes a housing ( | 2011-08-18 |
20110198788 | Shock wave generation, reflection and dissipation device. - An outer hard-shell casing for a protection device that has airspace between the outer shell and inner shell or surface. This outer shell is designed to generate a shock wave during an impact to the casing. The generated shock wave then reflects off of the inner surface or shell. The reflected shock wave then dissipates along the air channel and out of the exit vents before it can be absorbed into the inner hard shell of the base or other protection device. | 2011-08-18 |
20110198789 | SPIRAL SPRING - A spiral spring for a reclining adjustment mechanism for a vehicle seat in which ridges are formed on both ends in a direction perpendicular to a coiling direction of a surface of a spring plate member formed by a band-like steel plate having high hardness so that the ridges project from the surface, projected surfaces of the ridges are curved, and the spring plate member is spirally formed into a coil. The spring plate member has a pitch coiled structure in which a gap between an intermediate spring plate member and an inner spring plate member is formed to be smaller than a gap between an outer spring plate member and the intermediate spring plate member. An engagement piece bent in the radial direction is formed at the end of the outer spring plate member, and an engagement coiled core section is formed in the inner spring plate member. | 2011-08-18 |
20110198790 | APPARATUS FOR MOUNTING AN ACCESSORY TO A COORDINATE POSITIONING APPARATUS - An apparatus for mounting a coordinate positioning apparatus accessory, such as a tool setter, to the workpiece mounting surface of a coordinate positioning apparatus, the workpiece mounting surface having a slot formed in it. The apparatus includes an insert for inserting into the slot of the workpiece mounting surface, and a mount attachable to a coordinate positioning apparatus accessory. The insert includes structure to fix the insert within the slot; the insert is substantially contained within the slot when inserted therein. The mount includes at least one protruding member for engaging the insert when contained within the slot, thereby fixing the mount, and therefore any coordinate positioning apparatus accessory attached to the mount, to the workpiece mounting surface of the coordinate positioning apparatus. | 2011-08-18 |
20110198791 | DOOR SPACER FOR A VEHICLE ASSEMBLY LINE - An assembly jig for a vehicle door panel is provided. The jig includes a first frame with means for adjustably fastening it to a vehicle body in the vicinity of a door opening, a second frame with means for supporting the door of the vehicle on the second frame, and link arms between the first and second frames that are hinged to the first and second frames so as to form a deformable quadrilateral in association therewith. The hinges between the arms and the frames include at least one ball joint arranged between a carrier element secured to one of the frames or arms and a carried element secured to one of the arms or frames, carrying being relative to the effect of gravity, wherein at least one of the carrier and carried ball joint elements is secured to the corresponding arm or frame in such a manner that the position in three-dimensional space of the center of the ball joint is adjustable in three spatial directions. | 2011-08-18 |
20110198792 | TURNTABLE - A turntable for a wrapping machine for rotating an article to be wrapped up, wherein the turntable comprises a rotatable round cover plate comprising two grooves in parallel with each other. The grooves are fitted to receive the forks of the lifting fork of a pallet truck so that the article to be wrapped up may be conveyed by the pallet truck onto the cover plate to be supported by it, and respectively off the pallet truck. A base plate is immovably supported to a fixed base. The cover plate which is to be rotated relative to the base plate is bearing-mounted to rotate about a central vertical rotating axis. A vertical wall extends up from the cover plate substantially perpendicularly on the periphery of the base plate. The vertical wall comprises an opening. An access ramp is fitted in alignment with the opening and mounted to the vertical wall. The forks of the pallet truck may be conveyed to the grooves of the cover plate through the access ramp. The vertical wall comprises at least two openings directed from the rotating axis radially in different directions from each other to fit the access ramp selectively in alignment with at least one of the openings so as to selectively determine the approach direction of the pallet truck. | 2011-08-18 |
20110198793 | CART SUPPORT SYSTEM FOR DYNAMOELECTRIC MACHINE COILS - A cart system is provided for a coil of a dynamoelectric machine. The cart system includes one or more support rails disposed substantially horizontally, a plurality of lifting rails disposed substantially vertically, and connected at one end to the one or more support rails, and a plurality of coil clamps for applying a compressive force. The coil clamps are attached to the lifting rails in a removable manner. The coil of the dynamoelectric machine can be placed on the cart system and the coil clamps can be arranged on the lifting rails to apply a compressive force to the coil to facilitate a testing procedure. | 2011-08-18 |
20110198794 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle-stitching unit to stitch a center of a sheet bundle, a folding unit to fold the center and to form a fold, a first and a second rollers that move along a direction of the fold while nipping and pressing the fold of the sheet bundle and reinforce the fold, and a drive section to move the first and the second rollers along the fold from a standby position apart from an edge of the sheet bundle, and the first and the second rollers are separate from each other in a thickness direction of the sheet bundle at the standby position, and after the first and the second rollers reach to a position where they pass the edge of the sheet bundle of a processable maximum size, they come close to each other in the thickness direction and nip the fold. | 2011-08-18 |
20110198795 | METHOD FOR STITCHING PRINTED PRODUCTS WITH A STITCHING MACHINE AND A STITCHING MACHINE FOR IMPLEMENTING THE METHOD - A method and device for stitching printed products with a stitching machine, which includes a stitcher head and a bending device, which travel concomitantly with each printed product as it is conveyed in a travel direction during the stitching operation. The bending device is positioned first in a first position, which corresponds to the thickness of the printed products and is a certain distance away from the stitcher head in the direction transverse to the travel direction. Before a printed product is introduced, its thickness is determined and compared with a predetermined limit value; and, if this limit value is exceeded, the bending device is brought into a predetermined second position, which is farther away than the first position from the stitching head. After the printed product has been introduced, the bending device is moved back into the first position, and the wire stitch is driven into the printed product. | 2011-08-18 |
20110198796 | GATHERING AND STITCHING MACHINE - A new gathering and stitching machine ( | 2011-08-18 |
20110198797 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section. | 2011-08-18 |
20110198798 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section. | 2011-08-18 |
20110198799 | SEPARATOR FOR SEPARATING ENVELOPES FROM A STACK - A method for separating envelopes from a stack using a separator having a feeding roller for exerting a force onto the envelope, urging it in a direction tangential to its circumference and parallel to a separating plane, and having a deflecting surface for deflecting a leading edge of the envelope as it is urged in the tangential direction. The feeding roller and the deflecting surface bound a feeding path having a width, and starting at the separating position. Both feeding roller and deflecting surface include portions each extending from or from beyond opposite lateral sides of the feeding path inwardly across a lateral outer portion of the feeding path. | 2011-08-18 |
20110198800 | RETARD ROLLER AND RETARD ROLLER MODULE HAVING SUCH RETARD ROLLER - A retard roller and a retard roller module are provided. The retard roller is used in an automatic document feeder for providing a frictional force to separate plural documents from each other. Unidirectional rotation of the retard roller is permitted. Due to the unidirectional rotation, the contact surface of the retard roller can be switched. During the sheet-feeding process, the document is contacted with a specified contact surface. By rotating the retard roller, the document is contacted with another contact surface. | 2011-08-18 |
20110198801 | IMAGE FORMING APPARATUS - The present invention provides an image forming apparatus which can secure a stacking ability even when a paper is curled. | 2011-08-18 |
20110198802 | Paper discharge device - Provided is a paper discharge device ( | 2011-08-18 |
20110198803 | Paper discharge device - Provided is a paper discharge device ( | 2011-08-18 |
20110198804 | Image capturing card shuffler - The present invention features a playing card shuffling device, which through the use of a small image capturing means, captures an image of the face value of each card and stores the image in memory. This image is sorted in the format of a bitmap image. The operator of the machine would be able to recall through the use of a keypad, the images of the cards that comprised the individual hands in the previous game. This feature allows for verification of a winning hand after a game has been completed. Thereby, a quick recheck of hands before playing a winning hand is performed. The face value of each card is determined by character recognition software. These card values would be stored in memory for archival access for use in monitoring the randomness of the game and determining the number of winnings hands. | 2011-08-18 |
20110198806 | Board Game - A board game and methods for playing the same are disclosed. The board game can include a playing surface having a plurality of playing spaces, and a plurality of playing pieces that comprise at least first and second player playing pieces, wherein each playing piece is assigned a numerical value, and wherein the numerical value corresponds to: a movement value, wherein the movement value corresponds to the number of playing spaces that each playing piece can move on the playing surface; and a challenge value, wherein the challenge value corresponds to a challenge between a first player playing piece and a second player playing piece, wherein the second player playing piece can be removed from the playing surface when the first player playing piece has an equal or greater challenge value then the second player playing piece and when the first player playing piece is moved into the second player playing piece's playing space. | 2011-08-18 |
20110198807 | CHRISTMAS TREE GAME - A game comprises: a game board; a tree trunk for each player playing the game, the tree truck attachable to the game board; a plurality of branches for the each player playing the game, the plurality of branches attachable to the tree trunk; a tree topper; and a pair of dice; wherein players in turn roll the pair of dice and build a tree from the tree trunk and the plurality of branches based on rolls of the pair of dice. | 2011-08-18 |
20110198808 | Collapsible Game - A collapsible game is disclosed. In one embodiment, the game includes a divider and multiple outlets to obtain random distribution of objects in the game. The game also includes a movably coupled lid that can be moved relative to the opening of the game. The lid includes a finger recess that facilitates movement of the lid. | 2011-08-18 |
20110198810 | Magic card deck - A deck of cards includes a plurality of cards. Each of the cards includes a front face, a rear face and a plurality of corners. At least one of the corners has a first radius of curvature and at least one other of the corners has a second radius of curvature. The second radius of curvature is less than the first radius of curvature. Methods of performing magic tricks with a deck of cards are also provided. | 2011-08-18 |
20110198811 | METHOD & APPARATUS FOR PROVIDING TARGET GAME MATS UTILIZED WITH A GAME - A kit of components for playing a game and a method of using the components of the kit is provided. The kit may include a plurality of game mats. Each of the game mats may include a plurality of sections and each of the sections may be assigned a different point value that is marked on respective sections of the game mats. The different point values of each of the sections may be marked on an upper surface of the game mats. The kit may also include a plurality of tossable objects that are tossable on one or more of the sections of the game mats to obtain points associated with the value of the sections. The kit may also include a set of instructions or rules for playing the game and a case for carrying the game mats, the tossable objects and the instructions or rules. | 2011-08-18 |
20110198812 | LEAK SEALING APPARATUS - The present invention relates to apparatus comprising one or more sealing elements ( | 2011-08-18 |
20110198813 | MECHANICAL SEAL - A mechanical seal of an “outside type” for sealing a sealed fluid that may leak from an inside periphery of a sliding face towards an outside periphery is provided. The seal includes a rotating-side sealing element and a stationary-side sealing element disposed so as to be situated externally with respect to a stuffing box. The stationary-side sealing element, which accommodates a spring, is installed on a seal cover that is secured to the housing. The rotating-side sealing element is installed on a collar that is installed directly on the rotating shaft. The rotating side, which comprises the rotating-side sealing element and the collar, is positioned such that rotation takes place in the atmosphere on a machine-exterior side. A balance ratio A2/A1 is 1 or less, A1 being an axial-direction projection area of the sliding face of the stationary-side sealing element and A2 being an axial-direction projection area that is subjected to a seal fluid pressure acting as a motive force in the axial direction relative to the stationary-side sealing element. An annular cooling jacket is disposed between an inside periphery of the housing and an outside periphery of the rotating shaft. | 2011-08-18 |
20110198814 | SEAL DEVICE - A seal device has a magnetic force generator for generating a magnetic force in a vicinity of a shaft. A first magnetism transmission member for transmitting the magnetic force generator is disposed adjacent to one side of the magnetic force generator. A second magnetism transmission member for transmitting the magnetic force generated by the magnetic force generator is disposed adjacent to another side of the magnetic force generator. A slide bush is disposed and secured between an inner flange of the second magnetism transmission member and the shaft. A seal member for sliding relative to an outer peripheral surface of the shaft, is accommodated in a sealing. And, a magnetic fluid is held between the shaft and the magnetism transmission member by the magnetic force generated by the magnetic force generator. | 2011-08-18 |
20110198815 | SLUDGE AND SEDIMENT REMOVAL SYSTEM BY REMOTE ACCESS - A compound conduit containing inner and outer conduits with apertures in the former that are angled to direct jets of fluid in a rearward direction from the inner conduit into the annular space is used to draw sludge or undesirable material from a vessel without imposing a vacuum on the system. In conjunction with the compound conduit is a rotary tube seal that allows the conduit to be mounted to an orifice in a tank wall and pivoted or rotated over a range of angles. A tubing drive mechanism grasps the tubing at locations well removed from the distal end and causes the tubing to travel in the direction of the tubing axis. The gripping members in the mechanism engage the sides of the tubing and are capable of shifting position relative to each other to accommodate changes in the curvature of the tubing. | 2011-08-18 |
20110198816 | MINIMIZING FLOW DISTURBANCES IN FLUIDIC CELLS UTILIZING SOFT SEALS - Devices comprising multi-compartment fluidic cell with multiple inlets. Compartments can be separated from one another using soft seals. The main cell can be located between two adjacent secondary cells. The main cell carries the main flow while the secondary cells can carry either the main flow or any auxiliary flows. The flow in the multi-compartment cells minimizes fluid leakage and causes reduced pressure difference between the main cell and the two secondary cells especially under similar flow conditions. | 2011-08-18 |
20110198817 | THIN WAFER CARRIER - An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings. | 2011-08-18 |
20110198818 | Tool holder for a rotary tool - The invention proposes a tool holder ( | 2011-08-18 |
20110198819 | CONVERTIBLE AND STEERABLE SCOOT-A-BOUT - A child vehicle includes a front portion having a front wheel and a first handlebar configured to steer the vehicle, and a rear portion coupled to the front portion and having a rear wheel. The front portion is capable of rotating relative to the rear portion about a first pivot axis. A pivot member is coupled to the vehicle and rotatable about a second pivot axis between a first position and a second position. In the first position, the pivot member operates as a seat for supporting a rider thereon to define a ride-on configuration. In the second position, the pivot member operates as a second handlebar to define a scooter configuration. The second handlebar is also configured to steer the vehicle when in the scooter configuration. The vehicle may include a graphical interface for decorating or otherwise marking the vehicle in a manner preferred by the child. | 2011-08-18 |
20110198820 | Stabilizer and a method for producing a stabilizer - The present invention relates to a stabilizer ( | 2011-08-18 |
20110198821 | CONTROL ARM, AND METHOD OF PRODUCING A CONTROL ARM - A control arm for installation to an axle of a motor vehicle includes a base body made of sheet metal and having three bearing zones. The base body has two suspension arms to define a base body plane. One of the bearing zones includes two bearing receptacles, each having a receiving opening disposed in an opening plane. The opening plane of one of the receiving openings and the opening plane of the other one of the receiving openings are disposed in spaced-apart relationship and oriented in substantial perpendicular relationship to the base body plane. | 2011-08-18 |
20110198822 | CHILD VEHICLE HAVING A GRAPHICAL INTERFACE - A child vehicle includes a front frame having a handlebar and at least one front wheel, and a rear frame movably coupled thereto and having at least one rear wheel. At least one graphical interface is coupled to the vehicle and includes a placard having a frame secured to the vehicle and a working surface disposed generally within the frame. The working surface is configured to be marked thereon by the child using a marking utensil so as to create an artistic expression for customizing the vehicle. A tool-less coupling between the front and rear frames and an associated method of a tool-less assembly of a child vehicle are also disclosed. | 2011-08-18 |
20110198823 | AIRFOIL SHAPE FOR BICYCLE - The bicycle may have a frame and a seat post. A cross section of the seat post may have an airfoil shape wherein a leading surface is sharper (i.e. less round) compared to prior art airfoil shaped bicycle frames. Additionally, a maximum thickness of the airfoil shape may be located more rearward compared to prior art airfoil shaped bicycle frames and bicycle front forks. This configuration may provide for a reduction in drag. A battery pack may be mounted to a rear side of the seat post. | 2011-08-18 |
20110198824 | Utility trailer - The present invention relates to the field of utility trailers, in particular, utility trailers with rear pivotable gates. The utility trailer includes a trailer bed supported on wheels for rolling motion on the ground. The trailer bed has a floor on which cargo may be placed and a support frame for carrying the floor. The support frame includes a front end; a rear end; and a pair of spaced apart, upper and lower, bent U-shaped members extending between the front and rear ends of the support frame. Each U-shaped member is fabricated from a hollow section having one of a square cross-section and a rectangular cross-section. The support frame further includes a plurality of spaced apart, substantially upright struts extending between, and connecting the upper and lower bent U-shaped members to each other and a plurality of spaced apart cross-members connecting portions of the lower bent U-shaped member to each other. The utility trailer is also provided with a gate pivotally mounted to rear end of the support frame. The gate is movable between a substantially upright position relative to the floor of the trailer bed and a lowered, in-use position. | 2011-08-18 |
20110198825 | Bicycle trailer and hand cart mobile transport - A mobile transport has a frame on which two wheels are mounted. A basket type container is permanently affixed to a portion of the frame, which also includes a foot rest section for child passengers. A receptacle post is provided which can support either a bicycle type seat for transporting a child or a container which doubles the carrying capacity of the transport. The frame of the transport also includes a frame extension, removeably attached to the frame, with a towing hitch for connection to a bicycle. Upon removal of the frame extension, the transport can be used as a manual cart, with the upper end of the frame providing the handle for pushing or pulling the cart. | 2011-08-18 |
20110198826 | Novel Trailer and Towing Related Technologies - The inventive technology, in embodiments, may be described as an extended trailer hitch receiver tube support apparatus that uses triangulation of key structural components to provide a hitch of comparatively higher strength. Tensionable receiver tube supporters may be used to achieve a triangular lattice support; a vertical member established above a cross member may provide a forward attachment site for the tensionable receiver tube supporters, thereby allowing the transfer of forces from the extended receiver tube to the vertical member, and then back to the vehicle frame (or frame attached component) via tensionable vertical member supporters. | 2011-08-18 |
20110198827 | PASSENGER SIDE ACTIVE KNEE BOLSTER - An energy management system for mounting in a vehicle, the energy management system comprising an inflatable bolster for mounting in a glove box door of a glove box of the vehicle, the inflatable bolster including an expansible hollow interior, an inflator module for inflating the expansible hollow interior, a front wall for projecting inwardly into the vehicle and away from the glove box on inflation of the expansible hollow interior, and a back wall located between the expansible hollow interior and the glove box, and a support structure for mounting to the inflatable bolster, the support structure being operable to resist the back wall being forced into the glove box due to inflation of the inflatable bolster. | 2011-08-18 |
20110198828 | AIR BAG WITH ADAPTIVE TETHER - An apparatus ( | 2011-08-18 |
20110198829 | ROLLOVER PROTECTION SYSTEM FOR AUTOMOBILES - The invention relates to a rollover protection system for automobiles, comprising an extensible rollover body ( | 2011-08-18 |
20110198830 | REDUCED-SIZE VEHICLE WITH COMPLEMENTARY INTERNAL COMPARTMENTS AND SUSPENSION SYSTEM COMPONENTS - Various embodiments of reduced-size vehicles such as all-terrain vehicles (ATVs) and utility vehicles (UVs) are disclosed herein. In at least some embodiments, the vehicles include frames that are wider near the front and rear sections of the vehicles than within the mid-sections of the vehicles. This, in combination with the use of shock-absorbers that are substantially vertically oriented, allows for the opening-up of large interior cavities within the front and rear sections of the vehicles within which can be positioned large front and rear internal compartments that can provide storage/carrying capacity as well as added buoyancy for the vehicle, among other things. Also, in at least some embodiments, the vehicles can include special cooling and/or exhaust systems having components that are positioned substantially within the mid-sections of the vehicles, thus further increasing the amounts of space available for the cavities/compartments within the front and rear sections of the vehicles. | 2011-08-18 |