31st week of 2011 patent applcation highlights part 16 |
Patent application number | Title | Published |
20110186964 | METHODS OF FORMING INTEGRATED CIRCUIT DEVICES - The invention includes methods of forming semiconductor constructions and methods of forming pluralities of capacitor devices. An exemplary method of the invention includes forming conductive material within openings in an insulative material to form capacitor electrode structures. A lattice is formed in physical contact with at least some of the electrode structures, a protective cap is formed over the lattice, and subsequently some of the insulative material is removed to expose outer surfaces of the electrode structures. The lattice can alleviate toppling or other loss of structural integrity of the electrode structures, and the protective cap can protect covered portions of the insulative material from the etch. After the outer sidewalls of the electrode structures are exposed, the protective cap is removed. The electrode structures are then incorporated into capacitor constructions. | 2011-08-04 |
20110186965 | REVERSE-CONDUCTING INSULATED GATE BIPOLAR TRANSISTOR - Reverse-conducting insulated gate bipolar transistor in which IGBT region and FWD region are integrated into a single body in a semiconductor substrate with a common active region is disclosed. MOS gate structure is on a first major surface side. Rear surface side structure is in a second major surface side of the semiconductor substrate and includes a plurality of recessed parts vertical to the second major surface, which are repeated periodically along the second major surface. A plurality of protruding parts are interposed between the recessed parts. Rear surface side structure includes p type collector region on a bottom surface of the recessed part, n type first field stop region at a position deeper than the collector region, n type cathode region on the top surface of the protruding part, and n type second field stop region in the protruding part at a position deeper than the cathode region. | 2011-08-04 |
20110186966 | GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME - A gallium arsenide (GaAs) integrated circuit device is provided. The GaAs circuit device has a GaAs substrate with a copper contact layer for making electrical ground contact with a pad of a target device. Although copper is known to detrimentally affect GaAs devices, the copper contact layer is isolated from the GaAs substrate using a barrier layer. The barrier layer may be, for example, a layer of nickel vanadium (NiV). This nickel vanadium (NiV) barrier protects the gallium arsenide substrate from the diffusion effects of the copper contact layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. In some cases, a gold or copper seed layer may be deposited on the GaAs substrate prior to depositing the copper contact layer. | 2011-08-04 |
20110186967 | Component Stacking Using Pre-Formed Adhesive Films - A method of forming integrated circuits includes laminating a patterned film including an opening onto a wafer, wherein a bottom die in the wafer is exposed through the opening. A top die is placed into the opening. The top die fits into the opening with substantially no gap between the patterned film and the top die. The top die is then bonded onto the bottom die, followed by curing the patterned film. | 2011-08-04 |
20110186968 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device may include, but is not limited to, a semiconductor substrate having a device isolation groove defining first to fourth device formation portions. The second device formation portion is separated from the first device formation portion. The third device formation portion extends from the first device formation portion. The third device formation portion is separated from the second device formation portion. The fourth device formation portion extends from the second device formation portion. The fourth device formation portion is separated from the first and third device formation portions. The third and fourth device formation portions are positioned between the first and second device formation portions. | 2011-08-04 |
20110186969 | PATTERNED DOPING OF SEMICONDUCTOR SUBSTRATES USING PHOTOSENSITIVE MONOLAYERS - A semiconductor device and a method of fabricating a semiconductor device are disclosed. Embodiments of the invention use a photosensitive self-assembled monolayer to pattern the surface of a substrate into hydrophilic and hydrophobic regions, and an aqueous (or alcohol) solution of a dopant compound is deposited on the substrate surface. The dopant compound only adheres on the hydrophilic regions. After deposition, the substrate is coated with a very thin layer of oxide to cap the compounds, and the substrate is annealed at high temperatures to diffuse the dopant atoms into the silicon and to activate the dopant. In one embodiment, the method comprises providing a semiconductor substrate including an oxide surface, patterning said surface into hydrophobic and hydrophilic regions, depositing a compound including a dopant on the substrate, wherein the dopant adheres to the hydrophilic region, and diffusing the dopant into the oxide surface of the substrate. | 2011-08-04 |
20110186970 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device comprises: etching a semiconductor substrate to form a plurality of pillars; depositing a first protective film on the sidewalls of the pillar; first etching the semiconductor substrate with the pillar deposited with the first protective film as a mask; forming a first insulating film on the sidewalls of the pillar and the first etched semiconductor substrate; second etching the semiconductor substrate with the pillar including the first insulating film as a mask; forming a second protective film and a second insulating film on the surface of the second etched semiconductor substrate; depositing a barrier film on the sidewalls of the pillar including the second insulating film; and removing the first insulating film, the second insulating film and the barrier film disposed at one sidewall of the pillar to form a contact hole defined by the first protective film and the second protective film. | 2011-08-04 |
20110186971 | METHOD OF MAKING DENSE, CONFORMAL, ULTRA-THIN CAP LAYERS FOR NANOPOROUS LOW-K ILD BY PLASMA ASSISTED ATOMIC LAYER DEPOSITION - Barrier layers and methods for forming barrier layers on a porous layer are provided. The methods can include chemically adsorbing a plurality of first molecules on a surface of the porous layer in a chamber and forming a first layer of the first molecules on the surface of the porous layer. A plasma can then be used to react a plurality of second molecules with the first layer of first molecules to form a first layer of a barrier layer. The barrier layers can seal the pores of the porous material, function as a diffusion barrier, be conformal, and/or have a negligible impact on the overall ILD k value of the porous material. | 2011-08-04 |
20110186972 | Method for Producing a Protective Structure - A protective structure is produced by providing a semiconductor substrate with a doping of a first conductivity type. A semiconductor layer with a doping of a second conductivity type is applied at a surface of the semiconductor substrate. A buried layer with doping of a second conductivity type is formed in a first region of the semiconductor layer, wherein the buried layer is produced at the junction between the semiconductor layer and semiconductor substrate. A first dopant zone with a doping of a first conductivity type is formed in the first region of the semiconductor layer above the buried layer. A second dopant zone with a doping of a second conductivity type is formed in a second region of the semiconductor layer. An electrical insulation is formed between the first region and the second region of the semiconductor layer. A common connection device is formed for the first dopant zone and the second dopant zone. | 2011-08-04 |
20110186973 | Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die - A semiconductor device is made by mounting an insulating layer over a temporary substrate. A via is formed through the insulating layer. The via is filled with conductive material. A semiconductor die has a stress sensitive region. A dam is formed around the stress sensitive region. The semiconductor die is mounted to the conductive via. The dam creates a gap adjacent to the stress sensitive region. An encapsulant is deposited over the semiconductor die. The dam blocks the encapsulant from entering the gap. The temporary substrate is removed. A first interconnect structure is formed over the semiconductor die. The gap isolates the stress sensitive region from the first interconnect structure. A shielding layer or heat sink can be formed over the semiconductor die. A second interconnect structure can be formed over the semiconductor die opposite the first interconnect structure. | 2011-08-04 |
20110186974 | HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE - A high frequency flip chip package substrate of a polymer is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost. | 2011-08-04 |
20110186975 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a substrate with a first surface and an opposite second surface, a plurality of metal rods throughout the first surface and the second surface of the substrate, a reflector surrounding the first surface of the substrate to form a functional area, a glass reflection layer covering the surfaces of reflector and the functional area and exposing a part of a first electrode area and a part of a second electrode area, at least one semiconductor chip adhered on the functional area, and a transparent gel covering the at least one semiconductor chip. | 2011-08-04 |
20110186976 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - According to the method of manufacturing a semiconductor device, a lead frame is provided wherein the thickness of a tab-side end portion of a silver plating for wire connection formed on each suspending lead | 2011-08-04 |
20110186977 | Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint - A semiconductor wafer has a plurality of first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. The active surface of the first semiconductor die is oriented toward an active surface of the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die. A portion of a back surface of the second semiconductor die opposite the active surface is removed. Conductive pillars are formed around the second semiconductor die. TSVs can be formed through the first semiconductor die. An interconnect structure is formed over the back surface of the second semiconductor die, encapsulant, and conductive pillars. The interconnect structure is electrically connected to the conductive pillars. A portion of a back surface of the first semiconductor die opposite the active surface is removed. A heat sink or shielding layer can be formed over the back surface of the first semiconductor die. | 2011-08-04 |
20110186978 | STACK PACKAGE - A stack package includes a first semiconductor chip first pads and second pads disposed thereon and a second semiconductor chip having third pads and fourth pads electrically connected with the second pads disposed thereon. Capacitors are interposed between the first semiconductor chip and the second semiconductor chip, and include first electrodes electrically connected with the first pads to of the first semiconductor chip, second electrodes electrically connected with the third pads of the second semiconductor chip, and dielectrics interposed between the first electrodes and the second electrodes. | 2011-08-04 |
20110186979 | SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCTOR DEVICE - According to an embodiment, a semiconductor package includes: a base substrate made of a metal; a frame body made of a dielectric, placed on a surface of the base substrate, and including an opening portion in its center portion; a seal member placed on an upper surface of the frame body, and including an opening portion in its center portion; and a lid portion placed on an upper surface of the seal member. The thickness of the seal member is substantially equal to that of the base substrate, and a coefficient of linear expansion of the seal member is substantially equal to that of the base substrate. The base substrate, the first frame body, the second frame body, the seal member and the lid portion form a space. | 2011-08-04 |
20110186980 | Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages - In one embodiment, a wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate where the substrate includes one or more openings formed thereon. The opening in the substrate enables the flow of encapsulation material when the wireless tag is embedded into a semiconductor package. In another embodiment, a wireless tag is attached to the package substrate of a semiconductor package where the thin film substrate of the wireless tag has an opening sufficient to accommodate the integrated circuit die of the semiconductor package. In another embodiment, a wireless tag is formed using a metal film as the antenna and a wireless element attached to the metal film. The wireless tag is attached to the package substrate of a semiconductor package using a non-conductive adhesive. The metal film includes an opening sufficient to accommodate the die of the semiconductor package. | 2011-08-04 |
20110186981 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element. | 2011-08-04 |
20110186982 | SURFACE MOUNT DIODE AND METHOD OF FABRICATING THE SAME - According to one embodiment, a surface mount diode including a diode chip including a first main surface and a second main surface, a cathode electrode including a first internal electrode portion on the first main surface and a first external electrode portion on the first internal electrode portion, an anode electrode including a second internal electrode portion on the second main surface and a second external electrode portion on the second internal electrode portion, a thickness of the second external electrode portion being the same as a thickness of the first external electrode portion, a first covering member covering a periphery surface of one of the internal electrode portions and a periphery surface of the diode chip, and a second covering member covering a periphery surface of the other of the internal electrode portions, the second covering member being different in color from the first covering member. | 2011-08-04 |
20110186983 | PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME - According to one embodiment, a package for housing semiconductor element includes: a base plate including a top surface and a recessed portion formed as a downwardly-recessed portion of the top surface; a peripheral wall provided on the top surface of the base plate; a lid provided on an upper side of the peripheral wall and forming a semiconductor element housing space in cooperation with the base plate and the peripheral wall; and a feed-through terminal including a bottom end and fixed to the recessed portion so that the bottom end is located at a lower position than the top surface of the base plate except the recessed portion. | 2011-08-04 |
20110186984 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device which are able to form a conductive film, which is dense, includes a low concentration of source-derived impurities and has low resistivity, at a higher film-forming rate. The substrate processing apparatus includes a processing chamber configured to stack and accommodate a plurality of substrates; a first processing gas supply system configured to supply a first processing gas into the processing chamber; a second processing gas supply system configured to supply a second processing gas into the processing chamber; and a control unit configured to control the first processing gas supply system and the second processing gas supply system. Here, at least one of the first processing gas supply system and the second processing gas supply system includes two nozzles which are vertically arranged in a stacking direction of the substrates and have different shapes, and the control unit is configured to supply at least one of the first processing gas and the second processing gas into the processing chamber through the two nozzles having different shapes when films are formed on the substrates by supplying the first processing gas and the second processing gas into the processing chamber at pulses having different film-forming rates. | 2011-08-04 |
20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 2011-08-04 |
20110186986 | T-Shaped Post for Semiconductor Devices - A T-shaped post for semiconductor devices is provided. The T-shaped post has an under-bump metallization (UBM) section and a pillar section extending from the UBM section. The UBM section and the pillar section may be formed of a same material or different materials. In an embodiment, a substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like, having T-shaped posts is attached to a contact of another substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like. The T-shaped posts may have a solder material pre-formed on the pillar section such that the pillar section is exposed or such that the pillar section is covered by the solder material. In another embodiment, the T-shaped posts may be formed on one substrate and the solder material formed on the other substrate. | 2011-08-04 |
20110186987 | STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME - A mounting structure for a semiconductor device includes a stepwise stress buffer layer under a likewise stepwise UBM structure. | 2011-08-04 |
20110186988 | Multi-Direction Design for Bump Pad Structures - An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction. | 2011-08-04 |
20110186989 | Semiconductor Device and Bump Formation Process - A semiconductor device includes a solder bump overlying and electrically connected to a pad region, and a metal cap layer formed on at least a portion of the solder bump. The metal cap layer has a melting temperature greater than the melting temperature of the solder bump. | 2011-08-04 |
20110186990 | PROTRUDING TSV TIPS FOR ENHANCED HEAT DISSIPATION FOR IC DEVICES - An integrated circuit (IC) device includes a substrate having a top surface including substrate pads, and a through substrate via (TSV) die including a semiconductor substrate including a topside semiconductor surface having active circuitry and a bottomside surface. The topside semiconductor surface includes bonding connectors that are coupled to the substrate pads on the top surface of the substrate. A plurality of TSVs include an inner metal core that extends from the topside semiconductor surface to protruding TSV tips which extend out from the bottomside surface. At least one of the plurality of TSVs are dummy TSVs that have their protruding TSV tips exclusive of any electrically connection thereto that provide additional surface area that enhances heat dissipation from the bottomside of the TSV die. | 2011-08-04 |
20110186991 | Package substrate and method of fabricating the same - There is provided a package substrate capable of controlling the degree of warpage thereof by improving the composition and formation of a post terminal and a method of fabricating the same. The package substrate includes a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a separation barrier layer provided on the conductive pad inside the opening and formed to be higher than the upper surface of the insulating layer along the side walls thereof; a post terminal provided on the separation barrier layer; and a solder bump provided on the post terminal. | 2011-08-04 |
20110186992 | RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES - Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed. | 2011-08-04 |
20110186993 | SEMICONDUCTOR MODULE AND PORTABLE APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE - A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded. | 2011-08-04 |
20110186994 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer. | 2011-08-04 |
20110186995 | SOLDER BUMP INTERCONNECT - A semiconductor package includes a device pad on a substrate. A polybenzoxazole (PBO) layer overlies the substrate, and the PBO layer has an opening to expose the device pad. A redistribution layer (RDL) comprises a landing pad, and the RDL is positioned on the PBO layer and conductively coupled to the device pad. A polymer layer is on the RDL, and an under bump metal pad (UBM) is on the landing pad and extends onto a top surface of the polymer layer. The UBM electrically connects to the landing pad through an opening in the polymer layer. A solder bump is secured to the UBM. A shortest distance from a center of the landing pad to an outer edge of the landing pad, and a shortest distance from a center of the UBM to an outer edge of the UBM are in a ratio that ranges from 0.5:1 up to 0.95:1. | 2011-08-04 |
20110186996 | MULTI-CHIP SEMICONDUCTOR DEVICE - An interposer has an opening in the central portion. A plurality of first electrode terminals are formed on the front surface near the opening of the interposer, a plurality of second electrode terminals are formed on the front surface of the peripheral portion thereof and corresponding ones of the plurality of first and second electrode terminals are electrically connected to one another via a plurality of wirings. A plurality of bump electrodes is formed on the front surface of a child chip. A plurality of bump electrodes containing a plurality of bump electrodes for connection with the exterior are formed on the front surface of a parent chip. The front surfaces of the parent chip and child chip are set to face each other with the interposer disposed therebetween and the bump electrodes are electrically connected to one another in the opening of the interposer. | 2011-08-04 |
20110186997 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed. | 2011-08-04 |
20110186998 | RECESSED SEMICONDUCTOR SUBSTRATES - Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed. | 2011-08-04 |
20110186999 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Hardness of bonding end portions of an external connection terminal to be bonded to circuit patterns of an insulating substrate which is not lower than 90 in Vickers hardness is disclosed. An ultrasonic welding tool is used. In the external connection terminal in which the bonding end portions are provided integrally with a bar, one of the bonding end portion located substantially in the lengthwise center of the bar is first bonded, and the other bonding end portions are bonded alternately in order toward either end. The hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased. Since the external connection terminal including the bonding end portions is bonded in such a manner that the bonding end portion located substantially in the center is first bonded and the other bonding end portions are then bonded in order of increasing distance substantially from the central bonding end portion, displacement of the bonding end portion in either end from its regular position can be suppressed to keep bonding strength high. In this manner, the bonding strength of the ultrasonic welding portions between the external connection terminal and the circuit patterns of the insulating substrate can be increased so that long-term reliability can be secured in a semiconductor device. | 2011-08-04 |
20110187000 | Integrated Circuits Having TSVS Including Metal Gettering Dielectric Liners - An IC includes a substrate having a semiconductor top surface and a bottom surface, wherein the semiconductor top surface includes one or more active circuit components and a plurality of through silicon vias (TSVs) extending through the substrate. The plurality of TSVs include an outer dielectric liner. The dielectric liner includes at least one halogen or a Group 15 element metal gettering agent in an average concentration from 1 to 10 atomic %. A metal diffusion barrier layer is on the dielectric liner and a metal filler is on the metal barrier layer. The metal gettering agent getters metal filler that escapes the metal barrier layer. | 2011-08-04 |
20110187001 | SEMICONDUCTOR DEVICE INCLUDING PROCESS MONITORING PATTERN AND METHODS OF FABRICATING THE SAME - The semiconductor device includes a process monitoring pattern and an input/output (I/O) pad array area, the process monitoring pattern including a lower layer having a peripheral area surrounding a first internal area, the first internal area exposed by an internal open area, an external structure on the peripheral area of the lower layer, and a first dam disposed in the peripheral area spaced apart from the external structure by an external open area, the first dam defining the first internal area. The peripheral area overlaps the input/output (I/O) pad array area of the semiconductor device. | 2011-08-04 |
20110187002 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD - A support substrate includes a first surface and a second surface located above the level of the first surface. Chips are mounted on the first surface. A first insulating film is disposed over each chip. First conductive plugs are connected to the chip extending through each first insulating film. Filler material made of resin filling a space between chips. Wirings are disposed over the first insulating film and the filler material for interconnecting different chips. The second surface, an upper surface of the first insulating film and an upper surface of the filler material are located at the same level. | 2011-08-04 |
20110187003 | POWER SEMICONDUCTOR DEVICE - A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits. | 2011-08-04 |
20110187004 | SEMICONDUCTOR DEVICES INCLUDING AN INTERCONNECTION PATTERN AND METHODS OF FABRICATING THE SAME - A semiconductor device includes a first insulating layer having a plurality of via plugs therein, a second insulating layer on the first insulating layer, and a conducting interconnection pattern disposed in the second insulating layer and having at least one interconnection landing arranged over and electrically connected to the via plugs. | 2011-08-04 |
20110187005 | Semiconductor Device and Method of Forming Cavity Adjacent to Sensitive Region of Semiconductor Die Using Wafer-Level Underfill Material - A semiconductor wafer has a plurality of first semiconductor die with a stress sensitive region. A masking layer or screen is disposed over the stress sensitive region. An underfill material is deposited over the wafer. The masking layer or screen prevents formation of the underfill material adjacent to the sensitive region. The masking layer or screen is removed leaving a cavity in the underfill material adjacent to the sensitive region. The semiconductor wafer is singulated into the first die. The first die can be mounted to a build-up interconnect structure or to a second semiconductor die with the cavity separating the sensitive region and build-up interconnect structure or second die. A bond wire is formed between the first and second die and an encapsulant is deposited over the first and second die and bond wire. A conductive via can be formed through the first or second die. | 2011-08-04 |
20110187006 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE - Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor. | 2011-08-04 |
20110187007 | EDGE CONNECT WAFER LEVEL STACKING - A stacked microelectronic assembly includes a first stacked subassembly and a second stacked subassembly overlying a portion of the first stacked subassembly. Each stacked subassembly includes at least a respective first microelectronic element having a face and a respective second microelectronic element having a face overlying and parallel to a face of the first microelectronic element. Each of the first and second microelectronic elements has edges extending away from the respective face. A plurality of traces at the respective face extend about at least one respective edge. Each of the first and second stacked subassemblies includes contacts connected to at least some of the plurality of traces. Bond wires conductively connect the contacts of the first stacked subassembly with the contacts of the second stacked subassembly. | 2011-08-04 |
20110187008 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTER DEVICE - A semiconductor device has a semiconductor chip and a first interconnection tape. The semiconductor chip has a plurality of first electrode pads arranged on a first surface. The first interconnection tape is in contact with each of the plurality of first electrode pads such that the plurality of first electrode pads are electrically connected with each other. | 2011-08-04 |
20110187009 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group. | 2011-08-04 |
20110187010 | SEMICONDUCTOR CLEANING USING SUPERACIDS - A method of cleaning a substrate includes contacting a surface of a semiconductor substrate with a composition comprising a superacid. The semiconductor substrate may be a wafer. | 2011-08-04 |
20110187011 | DEVICE TO INFUSE GAS INTO LIQUID - A device for infusion of gas into fluid, off gassing said fluid and returning said off gassed fluid to a body of fluid, comprises an intake tube having a bottom opening submergable below a body of fluid, gas diffusion means positioned within a bottom portion of said intake tube for infusing gas into fluid within said intake tube, whereby the rising bubbles of infused gas drives the liquid in the intake tube upwardly to a top portion of the intake tube and through a cross tube section in communication with said intake tube portion, said cross tube section extending substantially perpendicularly to said intake tube and above said body of fluid to an off gassing section, said off gassing section extending above the cross tube section and allowing said liquid to have surface exchange with the air and thus removal of gasses from the liquid and being positioned above the body of water, thereby creating a head differential. A discharge tube portion communicates with the cross tube, being positioned below said off gas section and extends downwardly therefrom into the body of fluid, whereby the fluid entering the discharge tube has imparted a downward velocity due to the head differential between the liquid at the top of the off gassing section. | 2011-08-04 |
20110187012 | AUTOMATIC MULTIFUNCTIONAL LIPOSOME MANUFACTURING DEVICE - Provided is a device for formulating a large quantity of many kinds of liposomes quickly and efficiently using a small amount of organic solvent through computer-based automatic control. To this end, an automatic multifunctional liposome manufacturing device ( | 2011-08-04 |
20110187013 | METHOD FOR MOLDING GOLF BALL COVER OVER SOFT CORE - A method for compression molding a thin cover layer over a large or soft core golf ball, wherein the process includes mold press speed of closure, pressure within the mold cavities, temperature of materials being molded, and the movement of the compression press is controlled by as the mold position rather than any fixed amounts of time. A Ram press is moved in a very controlled fashion during the low pressure stage by a servo controller, and is governed by data fed to a control computer by a linear potentiometer, which allows for a very deliberate movement, especially over the last 0.4 inches of closing. A pressure transducer and thermocouples determine the flow point of the cover layer. Once the cover material starts to flow, the Ram press is triggered into a high pressure close wherein the cover layer is formed and then finally cooled. | 2011-08-04 |
20110187014 | Method and Apparatus for Embossing a Deformable Body - A deformable body is embossed using a stamp as a function of a pressure distribution. The pressure distribution is obtained by running a deformation model determined based on convolving a contact pressure distribution with a mechanical response of a surface topography of the deformable body and convolving the pressure distribution with a point load response of the stamp. | 2011-08-04 |
20110187015 | System and method for uniaxial compression of an article, such as a three dimensionally printed dosage form - A uniaxially compressed dosage form manufactured by three-dimensional printing that preserves the predetermined internal architecture of the dosage form while producing an improved surface finish. The compression compacts the dosage form, eliminating at least some of the void space that remains at the end of conventional three-dimensional printing. Surface finish obtained as a result of the uniaxial compression process can be essentially equal to that obtained from conventional tablet pressing. Additionally, the internal structure or spatial variation of composition of the dosage form is preserved during the pressing operation, with geometric shrinkage occurring mostly in the direction of the axis of pressing. Further, as a result of compression, a greater quantity of API can be packed into a given final volume of dosage form. | 2011-08-04 |
20110187016 | RAPID LOW-COST MANUFACTURE OF TABLETS USING DISPOSABLE EQUIPMENT - A tablet-pressing apparatus comprising i) a hopper ( | 2011-08-04 |
20110187017 | PREPARATION OF A POWDERY PHARMACEUTICAL COMPOSITION BY MEANS OF AN EXTRUDER - The invention relates to a method for the preparation of a powdery pharmaceutical composition comprising a pharmaceutical excipient and a pharmaceutical component, the method comprising the step of extruding a mixture of the pharmaceutical excipient and the pharmaceutical component in an extruder at a temperature profile allowing a liquid melt of the mixture to congeal in the extruder and to exit the extruder in form of a powder. | 2011-08-04 |
20110187018 | CROSSLINKED FIBERS OR OTHER ARTICLES MADE FROM POLYOLEFIN ELASTOMERS - The invention relates to an improved process for controlling the amount of crosslinking in polyolefin based articles such as fibers or films. The invention relates to mixing silane grafted material together with ungrafted material prior to crosslinking. The article can then be formed and cured, optionally with a curing catalyst which can preferably be applied to the surface of a shaped article. The amount of crosslinking will be controlled in part by the level of silane grafting on the grafted silane material as well as the amount of the grafted material in the blend. | 2011-08-04 |
20110187019 | Method and Device for Saving Energy in Extrusion - The invention relates to a method for saving energy in an extrusion line comprising at least one extruder, an extrusion tool, a cooling section, and an outlet, energy being applied in the form of heat to a plastic for plasticization at least in the extruder, in order to produce a profile ( | 2011-08-04 |
20110187020 | METHOD FOR FORMING A CHAIR - The method of an embodiment of the present invention comprises the following steps: (A) filling a melted thermoplastic material for a first time; (B) closing the forming mold and blowing air into the forming mold; (C) opening the first forming mold and removing the chair legs; (D) placing at least two of the chair legs into a second forming mold; (E) filling the melted thermoplastic material for a second time; and (F) closing the second forming mold and blowing air into the second forming mold. | 2011-08-04 |
20110187021 | Device For Separating Components of a Fluid Sample - A device for separating heavier and lighter fractions of a fluid sample is provided, the device including a container and a unitary separator located therein, the separator having an overall density between the heavier and light fractions. The separator is capable of moving between the fractions upon centrifugation, and sealing the fractions from one another when centrifugation ends. | 2011-08-04 |
20110187022 | Flame retardant-containing plastic shipping container - A halogen free fire resistant RF transparent polymer pallet has attenuated electrical resistance. A pallet body has a fire resistant layer and a substrate supporting the fire resistant layer. The fire resistant layer includes fire retardant materials, such as Al(OH) | 2011-08-04 |
20110187023 | MOULDING DEVICE - Moulding equipment for the production of plastic parts via the injection of a molten thermoplastic resin, chiefly consisting of a mould ( | 2011-08-04 |
20110187024 | Deciduous Dentition Jewelry and Method of Manufacture - The invention discloses jewelry made of pulverized and recombined primary human teeth, or baby teeth. The human deciduous dentin are partially pulverized and bonded with a chemical bonding agent in a frame configured to receive the pulverized dentin mold or pre-formed frame to create designs personalized to the family members. | 2011-08-04 |
20110187025 | LASER ETCHING SYSTEM AND METHOD - A system and method of laser etching materials is provided. A series of optical elements are used to reduce the spot size of a laser for a given field size, allowing fine detailed graphics associated with small spot sizes to be etched with larger field sizes. This may be accomplished, for example, by increasing the size of a laser beam beyond its natural state before passing the beam through a focusing lens, such expander lens, focus lens and mirror system increased in size so as to generate a laser spot size less than or equal to 0.5 mm at a field size equal to or larger than 1500 mm square. | 2011-08-04 |
20110187026 | Method of Production of a Holographic Sensor - A method for the production of a holographic sensor which comprises a support medium supporting a reflection hologram wherein the support medium interacts with its physical or chemical environment to create an optical response which is a change in one or more optical properties of the hologram, the method comprising the steps of: a) introducing a colloidal dispersion of a recording material into the support medium; and b) ablating the colloidal particles of the recording material using a pulsed laser to form the holographic element in the support medium. The method of production can be used to introduce a reflection holographic grating into a hydrophobic support medium, in particular, polydimethylsiloxane (PDMS), which possesses an extraordinary ability to swell in the presence of both liquid and/or gaseous low molecular weight hydrocarbons and organic solvents and thus has many applications as a holographic sensor. | 2011-08-04 |
20110187027 | MANUFACTURING METHOD OF POWER TRANSMISSION SYSTEM MOLDED PRODUCT AND APPARATUS THEREOF - A manufacturing method of a power transmission system molded product by infusing resin constituents prepared by adding an additive composed of a magnetic material to a molten resin into a cavity of a metallic mold and solidifying the resin constituents, wherein the additive composed of the magnetic material is oriented in a fixed direction by applying a magnetic field to a resin molded product infused into the metallic mold before solidification by a magnetic field orientation structure provided in the metallic mold. | 2011-08-04 |
20110187028 | Blow Molded Liner for Overpack Container and Method of Manufacturing the Same - The present disclosure relates to flexible, three-dimensional injection blow molded or injection stretch blow molded liners for use in overpacks, bottles, containers, etc. and methods for manufacturing the same. A method for manufacturing a liner may include injecting a polymeric material into a preform mold die to form a preform, blow molding the preform to form the liner, collapsing the liner and positioning the liner in an overpack, and inflating the liner. A fluoropolymer may be used for the preform. A liner may comprise a flexible body that substantially conforms to the interior of an overpack and a fitment port integral with the flexible body. The flexible body may be adapted to be removably inserted into the overpack by collapsing the flexible body, inserting the flexible body into the overpack, and re-inflating the flexible body inside the overpack. The flexible body may comprise a fluoropolymer and may comprise multiple layers. | 2011-08-04 |
20110187029 | ALIPHATIC-AROMATIC POLYESTER - The present invention provides an aliphatic aromatic polyester comprising:
| 2011-08-04 |
20110187030 | PROCESS FOR PRODUCING SiC FIBER-BONDED CERAMICS - Provided is a process for producing dense SiC fiber-bonded ceramics excellent in heat resistance and having a shape hard to form by hot pressing such as an elongated shape. The process for producing SiC fiber-bonded ceramics composed of: inorganic fiber made of SiC; and interfacial layers mainly made of carbon includes vacuum-sealing a preform, prepared by forming specific silicon carbide-based inorganic fiber into a certain shape, into a capsule and hot-isostatic-pressing the preform. The process is characterized in that the ratio of the number of carbon atoms to the number of silicon atoms in the preform is 1.02 to 1.20, and before the hot isostatic pressing, the preform is heated in an inert gas atmosphere or a reducing gas atmosphere at a temperature of 1200° C. to 1800° C. to adjust the oxygen content in the inorganic fiber to 6.0% by weight or lower, and then the hot isostatic pressing is carried out. | 2011-08-04 |
20110187031 | DEVICE AND METHOD FOR HEATING A METAL MATERIAL - Device for heating a metal material, includes an elongated DFI burner device, arranged to be driven with gaseous oxidant and gaseous fuel and to be displaceable and longitudinally arranged with respect to the metal material. The device has supply devices for fuel and oxidant. The burner device includes longitudinal, tubular vessels for fuel and for oxidant, arranged in parallel to one another and relative to the surface of the metal material. Each vessel has one or more openings arranged along the vessel, through which the fuel and oxidant are arranged to flow out and then converge in an ignition zone outside the respective vessels, where a flame is generated. The respective supply devices are arranged via a regulator to keep the pressure constant throughout the vessel in question during operation. Each vessel has a longitudinally displaceable piston for controlling the longitudinal extension of the flame in the longitudinal direction of the vessels. | 2011-08-04 |
20110187032 | RESILIENT ELEMENT COMPRISING AN S-SHAPED ELONGATED BODY OF AN ELASTIC MATERIAL - A resilient element having an elongated body of an elastic material through which a rope of a corresponding elongated and flexible tension element winds undulating, wherein a spring force being generated by the body at stretching of said undulation when applying a tension force in the tension element. The body having at least one S-shaped portion with at least three essentially traverse legs, in which two adjacent legs alternately are joined with each other at one side of the elongated the body and having an opening at the other side of the elongated body, wherein the tension element is intended to be introduced through said opening and undulates alternately over and below, respectively, adjacent legs. | 2011-08-04 |
20110187033 | BELLOWS-TYPE SHOCK-ABSORBING DEVICE - The present invention discloses a bellows-type shock-absorbing device, which comprises an outer pipe, an inner pipe, and a chamber enclosed by the inner and outer pipes. The outer pipe has a bellows structure. At least one orifice is disposed on the surface of the outer pipe for injecting fluids into the chamber. By means of injecting different ratios of liquid and gas into the chamber, it is able to provide the bellows-type shock-absorbing device with an adjustable shock-absorbing performance. | 2011-08-04 |
20110187034 | Cushion, Bedding and Seating Surface Assemblies - A cushioning assembly (i.e., for bedding, chairs, sofas, couches among other surfaces which require or benefit from cushioning) which includes a plurality of springs and fiber bundles. The plurality of springs are disposed at predetermined locations. The fiber bundles are cooperatively associated with the plurality of springs. The fiber bundles are disposed into association with the plurality of springs. Subsequently, they are integrated through a heating process with the plurality of springs and each other. | 2011-08-04 |
20110187035 | COMPRESSION SPRING ASSEMBLY AND METHOD - A compression spring assembly can include a compression spring core and a compression spring shell that can be assembled onto the compression spring core. The compression spring core can include a core body with an outer core wall. The compression spring shell can include a shell body having an inner shell wall. The compression spring shell can be supported on the compression spring core such that the inner shell wall extends along at least a portion of the outer core wall. A method of manufacturing a compression spring assembly is also included. | 2011-08-04 |
20110187036 | ADJUSTABLE STIFFNESS SPRING - A mechanical arm comprises a forearm, a spring, and an upper arm disposed between the forearm and the spring, wherein the forearm applies a moment to the upper arm. A translation device associated with the upper arm translates a force associated with the moment to the spring. The spring is adapted to apply a counter-force resisting at least a portion of the moment to reduce a torque for urging the forearm. | 2011-08-04 |
20110187037 | SAWTOOTH JOG FOR MULTI-COPY/MULTI-SET OUTPUT - A method of positioning copy or subsets for the easy insertion of tabs thereinto that includes creating a shingled boundary between subsets, with the top sheets of all subsets in the same position, but with the rest of each subset progressively offset so that the last page of the upper subset is significantly offset from the top sheet of the next subset in sawtooth fashion. As a result, the subsets can then be separated from one side more easily and tabs or other pages can be manually inserted with minimal difficulty. | 2011-08-04 |
20110187038 | DEVICE FOR DEPOSITING FOR A PRINTING MACHINE - The invention relates to a device for depositing sheets for a printing machine, preferably for an electrophotographically operating printing machine, said device comprising at least one sheet transport member which can be driven so as to rotate and which is provided for the detection of a lead edge of a sheet and for depositing the sheet after it has covered a rotating path. Therefore, the object of the invention is to make depositing a sheet and turning over a sheet, in particular also larger and/or thinner sheets, more reliable with the use of a device of the aforementioned type. In accordance with the invention, this object is achieved by a device which is characterized by a blower arrangement for the application of air to the sheet to be deposited. Due to the application of air, the sheet to be deposited and to be turned over is advantageously supported by an additional momentum and by its inherent stiffness, so that the sheet will unroll fully after its lead edge has been caught by the rotation. | 2011-08-04 |
20110187039 | IMAGE FORMING APPARATUS - An image forming apparatus with a double-face printing function is provided. The image forming apparatus includes an image forming unit, a sheet feeding path including a regular feeding path and a return-feeding path and capable of accommodating a plurality of recording sheets, a sheet-ejection controller to eject the recording sheet out of the sheet feeding path through a sheet outlet. The sheet-ejection controller controls a recording sheet closer to the sheet outlet in the direction of sheet-conveyance along the sheet feeding path to be ejected prior to a recording sheet further from the sheet outlet when cancellation of the print job is entered during a double-face printing operation, in which the images are formed on one side of N pieces of recording sheets continuously and the other side of M pieces of recording sheets thereafter, whilst M is smaller than or equal to N. | 2011-08-04 |
20110187040 | IMAGE PRINTING APPARATUS - An image printing apparatus includes a printing unit and a supporting member opposing the printing unit and having a supporting surface for supporting the printing medium. The image printing apparatus further includes a first pair of rollers disposed upstream of the printing unit, a second pair of rollers and a third pair of rollers which are disposed downstream of the printing unit. The image printing apparatus further includes a guide member disposed between the second pair of rollers and the third pair of rollers. The guide member includes a guide portion which guides the printing medium transported by the second pair of rollers. The guide member is configured to pivot between a slanting position and a laying position. | 2011-08-04 |
20110187041 | SHEET PROCESSING APPARATUS - A sheet processing apparatus includes a sheet-table unit, a sheet-separating unit, a convey unit, a discharge unit, a sheet processing unit, and a sensor arranged at an upstream end of the convey unit and spaced from the discharge unit with a predetermined distance. The convey unit has a convey roller, a convey pulley, and an elastic device connected with the convey pulley. The elastic device has a cylinder, a fixing shaft fixed to the cylinder, and a spring having two free ends fixed to the fixing shaft and a portion of the convey pulley opposite to the convey roller. When the signal resulted from a rear end of the sheet apart from the sensor is sent to the system controller, the cylinder is commanded by the system controller to draw back the fixing shaft. The spring is elongated to make the convey pulley away from the convey roller. | 2011-08-04 |
20110187042 | Feeding device and image forming apparatus - A feeding device includes: a sheet housing unit; a sheet conveying unit having an endless belt member, which faces a topmost sheet of sheets stacked in the sheet housing unit, and a suction unit disposed inside the belt member; a sheet lifting unit that lifts the topmost sheet to a position where the topmost sheet is attracted on a surface of the belt member by a negative pressure generated by the suction unit; and an external device sheet conveying unit that conveys a sheet fed from another feeding device connected to the feeding device to a gap between the topmost sheet in the sheet housing unit and the belt member. In feeding the sheet fed from the other feeding device to the subsequent step, the sheet lifting unit is stopped while the suction unit, the belt member, and the external device sheet conveying unit are operated. | 2011-08-04 |
20110187043 | SHEET TRANSPORTATION DEVICE INCLUDING ELECTROMAGNETIC COMPONENT AND CONTROL METHOD THEREOF - A sheet transportation device includes a transportation path for transportation of a sheet, a transportation unit for applying force to a sheet on the transportation path, and an electromagnetic component for driving the transportation unit by receiving supply of electric power. At the sheet transportation device, the absence/presence of a sheet is detected at a downstream side of the region where the transportation unit applies force to a sheet in the transportation path, and counter electromotive force induced in response to electric power being supplied to the electromagnetic component is supplied as the electric power for the detector. | 2011-08-04 |
20110187044 | Sheet feeding device and image forming apparatus - A sheet feeding device includes an air separating unit includes a floating air blowing unit and a separating air blowing unit that blow air to leading edges of a bundle of sheets in a paper feeding direction to float and separate upper sheets, and a side air blowing unit that blows air to both side edges of the sheet bundle to separate each of the sheets in the bundle, an air suctioning unit that suctions the air to suction a top sheet thus separated, a sheet feeding unit that feeds the sheet thus suctioned and retained, and a control unit that controls to blow floating air, to blow separating air, to blow side air, and to suction the air all at different operational timings. | 2011-08-04 |
20110187045 | SHEET FEEDING APPARATUS AND PRINTING APPARATUS - A sheet feeding apparatus includes: a sheet storage unit into which a sheet is inserted in a generally vertical direction through a sheet inlet, the sheet storage unit having a first opening portion formed on a front of the sheet storage unit, a second opening portion formed on a rear thereof, and a third opening portion formed on a top thereof; a pressure plate having a bottom portion on which the sheet inserted into the sheet storage unit is placed, and a rear portion formed on rear of the bottom portion, the pressure plate being disposed in a manner slidable in front and rear directions; a moving device configured to slide the pressure plate in the front direction so that the rear portion presses the sheet through the second opening portion; and a roller rotatably disposed so as to contact with the sheet through the first opening portion, the roller moving the sheet in a vertical direction in response to rotation of the roller, to output the sheet through the third opening portion. | 2011-08-04 |
20110187046 | NIP RELEASE SYSTEM - Methods and system for reducing sheet skew in a sheet transport system are disclosed. A sheet transport system may include an idler wheel, a drive wheel a drive motor and an actuator. The idler wheel may have a substantially rigid outer layer. The drive wheel may have a compliant outer layer and may correspond to the idler wheel. The drive motor may be operably connected to the drive wheel and may be configured to cause the drive wheel to rotate around a shaft. The actuator may be operably connected to the drive wheel and configured to cause the drive wheel to move between a closed position and an open position. The drive wheel is configured to contact a sheet in the closed position and to not contact a sheet in the open position. | 2011-08-04 |
20110187047 | Sheet Feeding Device and Image Forming Apparatus - A sheet feeding device is provided. The sheet feeding device includes a body, a sheet cassette, a lifting plate, which is movable to an uplifted position when the sheet cassette is in the body and to a lowered position when the sheet cassette is outside the body, and uplifts the stack of sheets according to the uplifting movement thereof, a feeder to pick up and feed a topmost sheet, and a restrictive member, which is movable in association with the movement of the lifting plate. The restrictive member is in a restrictive position, in which at least a restricting part of the restrictive member is arranged over the stack of sheets, when the lifting plate is in the lowered position. The restrictive member is in a retracted position, in which the restrictive member is retracted off from the stack of sheets, when the lifting plate is in the uplifted position. | 2011-08-04 |
20110187048 | FEEDER DEVICE AND METHOD FOR MOVING PRINTED PRODUCTS BY PLANAR MOTION - A feeder device for printed products is provided including at least one first drum rotatable about a first axis; at least one second drum rotatable about a second axis; and an actuator coupled to the at least one first drum and the at least one second drum for reciprocating the at least one first drum and the at least one second drum axially. A printed product conveying device and a method of transporting printed products are also provided. | 2011-08-04 |
20110187049 | SHEET MATERIAL DETECTION APPARATUS AND RECORDING APPARATUS - A sheet material detection apparatus detects passage of a sheet material over a sheet material transportation path. The apparatus includes: a lever member that is exposed over the transportation path and turns from a reference position when the sheet material is brought into contact therewith; a detecting section that detects the turn of the lever member; a holder that supports the lever member in such a manner that the lever member can turn freely toward both sides in a direction of the transportation of the sheet material at a guide-facing-surface side, the guide facing surface being a surface facing a guide surface along which the sheet material is guided over the transportation path; and a counter weight with which the turning lever member is brought into contact, the counter weight turning due to contact with the lever member, the counter weight being thereafter brought into contact with the holder. | 2011-08-04 |
20110187050 | SHEET MATERIAL TRANSPORT APPARATUS AND RECORDING APPARATUS - A sheet material transport apparatus includes a second planetary gear engaging with a transmission gear and providing planetary motion around the transmission gear. The second planetary gear is in a second separated position not capable of engaging with a first planetary gear during forward-direction rotation. The transmission gear engages with the first planetary gear and rotates in a direction that causes a second transport roller to rotate in the forward rotation direction, and positioned to engage with the first planetary gear that is positioned in a first engaging position during reverse rotation. A load is placed on the transmission gear by the second transport roller. The transmission gear rotates in the opposite direction to the forward-direction rotation. The second planetary gear applies a force on the first planetary gear in the direction that separates the first planetary gear from the transmission gear due to rotation. | 2011-08-04 |
20110187051 | Board Game Teaching Healthy Eating Habits - A game to help players learn how to make the best choices in regards to nutrition and exercise is disclosed. A game board may be configured with start areas, food choice areas, and exercise areas. Players on food choice areas must answer a food choice question and add tokens to the player's weight container based on the answer. Players on an exercise question must answer an exercise question and add or remove tokens to or from player's weight container based on the answer. Answers to an exercise question can require that a player perform an exercise listed on a selected exercise card and remove tokens from the player's weight container based on successfully performing the exercise in whole or in part. When all the players have made a complete circuit of the game board, each player weighs his or her weight container and determines in which weight category his or her weight container falls. | 2011-08-04 |
20110187052 | SYSTEMS AND METHODS FOR FACILITATING PARTICIPATION IN CARD GAMES - A gaming system for facilitating participation in a card game by a player located remotely from a dealer of the card game is disclosed. The gaming system may include a dealer system, which may include a scanner for capturing electronic information representing a remote playing card dealt by the dealer. Additionally, the dealer system may include a first communications module for transmitting the information to one or more player systems. The gaming system may also include a player system, which may include a second communications module for receiving the information. Additionally, the player system may include a printing mechanism for (i) printing the information to a face of a local playing card and (ii) outputting the printed local playing card to a flipping mechanism. The player system may also include a flipping mechanism for selectively dealing the printed local playing card to the player either face up or face down. | 2011-08-04 |
20110187053 | TOY BLOW GUN, A PROJECTILE, A TARGET AND A SET INCLUDING SAME - According to embodiments of the present invention, there is provided a toy kit. The toy kit comprises a user-operatable blow gun; a projectile, the projectile being made from a first material; a target, the target being made from a second material; the first material and the second material being selected such that when the projectile is expelled from the user-operatable blow gun under a blow force applied by a user, it penetrates exclusively the target. | 2011-08-04 |
20110187054 | TEMPERATURE ADAPTIVE RADIAL SHAFT SEAL ASSEMBLIES USING SHAPE MEMORY ALLOY ELEMENTS - A dynamic shaft seal assembly for sealing a rotating or reciprocating shaft includes an elastic seal member having at least a portion thereof in sealing communication with the rotating or reciprocating shaft. A shape memory alloy element is in contact with the elastic seal member, the shape memory alloy element being discontinuously disposed about the elastic seal member, and being configured to i) directly apply a compressive force in a radial direction on the seal member against the rotating or reciprocating shaft, and ii) maintain the compressive force on the seal member as a function of temperature. The seal assembly is adapted to seal at a temperature ranging from about −55° C. to about 250° C. Methods including the seal assembly are also disclosed. | 2011-08-04 |
20110187055 | Shaft Seal Assembly - A method for maintaining a seal during shaft misalignment using a shaft seal assembly comprising a first sealing means adjacent said shaft with a defined clearance between said shaft and said sealing means, said shaft moveable axially in relation to said first sealing means; a second sealing means, said first sealing means partially encompassed within second sealing means and in cooperative communication with said second sealing means; a third sealing means, said second sealing means partially encompassed within third sealing means and in cooperative communication with said third sealing means, said third sealing means attached to said housing or vessel and allowing said first sealing means and second sealing means to cooperatively respond to said forces produced by angular misalignment of said shaft during rotation of said shaft while maintaining defined clearance between said shaft and said sealing means. | 2011-08-04 |
20110187056 | DUCT ASSESSMENT AND LEAK SEALING METHOD FOR DUCTS TRANSPORTING GAS - The present invention relates to a method of assessing the condition of a duct along which a gas is flowing. The method comprises producing one or more sensor carrying elements, wherein the elements are formed to have selected parameters; introducing the sensor carrying elements into the flowing gas; and selecting the parameters of the sensor carrying elements such that the elements are transported along the duct by saltation. The present invention also relates to a method of reducing leakage through a leak in the duct. In this respect, the method comprises producing sealing elements, wherein the sealing elements are formed to have selected parameters; introducing a plurality of the sealing elements into the flowing gas; and selecting the parameters of the sealing elements such that the elements are transported along the duct by saltation and such that, at the locality of the leak, at least one of said sealing elements is captured by a pressure differential associated with the leak and is thereby drawn to and held in position at the leak for stemming or sealing it. | 2011-08-04 |
20110187057 | PROCEDURE FOR COVERING AN ELECTRICAL CONDUCTOR WITH A FLEXIBLE SEAL ELEMENT - The present invention concerns a method for sheathing an electrical conductor with an elastic sealing element. In the method, first a through-opening is produced in the sealing element with a first equivalent diameter. Next the through-opening which has been produced with a first equivalent diameter is expanded to a second equivalent diameter, in order to be able to introduce an electrical conductor into it. Then contraction of the through-opening which has been expanded to the second equivalent diameter is brought about, in order thus to obtain sealing off of the electrical conductor from the elastic sealing element. | 2011-08-04 |
20110187058 | Composite Metallic Elastomeric Sealing Components for Roller Cone Drill Bits - An earth boring bit has a bit body with a depending bearing pin, a cone rotatably mounted on the bearing pin, a seal gland between the cone and the bearing pin, and a seal assembly located in the seal gland. The seal assembly includes an annular metallic spring encircling the bearing pin. The spring has a geometric center line that extends in a circle around the bearing pin. The spring is elastically deformable in radial directions relative to the center line. An elastomeric layer is located on an exterior side of the spring and is biased by the spring against a surface of the seal gland. | 2011-08-04 |
20110187059 | Sealing Gasket for Corrugated Pipe - A sealing gasket and pipe coupling system for corrugated pipe where a male pipe end of a male section of corrugated pipe has an axially extending bore defined by a smooth inner wall fused to a corrugated outer wall having axially adjacent, annular, outwardly-extending corrugation ribs separated by corrugation valleys, each corrugation rib having a circumference. The sealing gasket has an annular gasket body with an inner circumferential region which defines a base for the gasket and an outer sealing region, the inner circumferential region of the gasket is received within a selected corrugation valley of the male pipe end. The base of the gasket body includes a pair of laterally extending lips which, when viewed in cross section, extend outwardly across the selected corrugation valley to fit larger valleys and which bend inwardly to fit narrower valleys. The base of the gasket body extends radially outward to form a main body region, the main body region having a pair of oppositely arranged wing portions which are separated from the laterally extending lips by void regions which accommodate inward bending of the lateral lips in narrower valleys. | 2011-08-04 |
20110187060 | FLUSH QUARTER GLASS SEAL - A method and resultant apparatus for a window seal assembly is shown and described. A thin layer of elastomer is introduced between a reinforcement member and a first surface of a window member. The subassembly of the glass member, elastomer, and rigid reinforcement is then introduced into a mold. Preferably, the thin layer of elastomer is provided by an extrusion process, such as on a metal reinforcement member, or as a co-extrusion process when an extruded reinforcement member is formed. A curable, elastomer/plastomer material is then injection molded to provide a flush glass appearance where an outer surface of the window is devoid of any seal material. | 2011-08-04 |
20110187061 | STATIC SEALING DEVICE FOR LARGE-DIAMETER FLANGE WITH MAGNETIC FLUID SEAL - A static sealing device for a large-diameter flange with magnetic fluid seal is provided, the device includes a left flange, magnets, a right flange, a large non-magnetic ring, a small non-magnetic ring, screws, bolts, nuts and washers. The large non-magnetic ring ( | 2011-08-04 |
20110187062 | COLLET SYSTEM - A collet system having greater axial load capability and debris protection includes a sleeve and a collet. The collet is disposed in a debris protected position relative to the sleeve and is radially adjacent and axially supported by sleeve. | 2011-08-04 |
20110187063 | ADHESIVE CHUCK, AND APPARATUS AND METHOD FOR ASSEMBLING SUBSTRATES USING THE SAME - An adhesive chuck, and an apparatus and method for assembling substrates using the same are disclosed. The apparatus comprises a chamber, a first adhesive chuck inside the chamber and having a plurality of adhesive protrusions to adhere to a first substrate conveyed from an outside into the chamber via an intermolecular attractive force, and a driving unit to move the first substrate adhered to the first adhesive chuck and a second substrate toward each other to be compressed and assembled to each other. The apparatus can achieve adhesion and separation of a substrate with minimal power consumption, enhancing an to operating efficiency. Additionally, the adhesive chuck can overcome a problem of spot generation on a display panel caused by remaining static electricity. Furthermore, since the adhesive chuck is almost free from a problem of electric instability, it can exhibit high stability and efficiency and can be fabricated at lower costs. | 2011-08-04 |