29th week of 2012 patent applcation highlights part 40 |
Patent application number | Title | Published |
20120184082 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A high power amplifier used for a front end module of a cellular telephone is a silicon-based CMOS integrated circuit. The output stage of the amplifier includes an LDMOSFET portion in which many LDMOSFET cells are integrated. In the LDMOSFET cell, to reduce the resistance between a backside source electrode and a surface source region, a polysilicon plug doped with boron in a high concentration is embedded into a semiconductor substrate. The polysilicon plug contracts due to solid phase epitaxial growth caused by a heat treatment to generate strain in the silicon substrate. The manufacturing method of a semiconductor device such as an LDMOSFET includes forming a hole passing through an epitaxial layer from the surface of a substrate and embedding a polysilicon plug. A polysilicon member is deposited out in a state where a thin silicon oxide film exists on the inner surface of the hole. | 2012-07-19 |
20120184083 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A thin semiconductor wafer, on which a top surface structure and a bottom surface structure that form a semiconductor chip are formed, is affixed to a supporting substrate. Then, on the wafer, a trench to become a scribing line is formed with a crystal face exposed so as to form a side wall of the trench. On that side wall, an isolation layer for holding a reverse breakdown voltage is formed by ion implantation and low temperature annealing or laser annealing so as to be extended to the top surface side while being in contact with a p collector region as a bottom surface diffused layer. Then, laser dicing is carried out to dice a collector electrode, formed on the p collector region, together with the p collector region. | 2012-07-19 |
20120184084 | OPTICAL DEVICE WAFER PROCESSING METHOD - An optical device layer (ODL) in an optical device wafer is transferred to a transfer substrate. The ODL is formed on the front side of an epitaxy substrate through a buffer layer. The ODL is partitioned by a plurality of crossing streets to define regions where a plurality of optical devices are formed. The transfer substrate is bonded to the front side of the ODL, and the epitaxy substrate is cut along crossing streets into a plurality of blocks. A laser beam is applied to the epitaxy substrate from the back side of the epitaxy substrate to the unit of the optical device wafer and the transfer substrate in the condition where the focal point of the laser beam is set in the buffer layer, thereby decomposing the buffer layer. The epitaxy substrate divided into the plurality of blocks is peeled off from the ODL. | 2012-07-19 |
20120184085 | METHOD FOR MANUFACTURING SOI SUBSTRATE - To suppress desorption of hydrogen ions with which a single crystal semiconductor substrate is irradiated. A method for manufacturing an SOI substrate includes the following steps: irradiating a semiconductor substrate with carbon ions; irradiating the semiconductor substrate with a hydrogen ion after the irradiation with the carbon ion so as to form an embrittled region in the semiconductor substrate; disposing a surface of the semiconductor substrate and a surface of a base substrate to face each other and to be in contact with each other so that the semiconductor substrate and the base substrate are bonded; and heating the semiconductor substrate and the base substrate which are bonded to each other and separating the semiconductor substrate along the embrittled region so that a semiconductor layer is formed over the base substrate. | 2012-07-19 |
20120184086 | PUNCH SINGULATION SYSTEM AND METHOD - A punching system for singulating IC units comprising: a punching assembly arranged to receive a substrate and singulate said substrate into the IC units; a rotary carrier rotatable from a first position to a second position said rotary carrier arranged to receive said units at the first position and carry said units to the second position through rotation; wherein said rotary carrier includes recesses for receiving at least a portion of the units. A punching assembly comprising a die block having recesses for receiving selectively replaceable inserts wherein said inserts correspond to a punch pattern specific to a predetermined IC package arrangement. | 2012-07-19 |
20120184087 | METHOD OF MANUFACTURING LACQUER USING INKJET PRINTING - A method of manufacturing a semiconductor device is provided. The method includes providing a transparent substrate having predefined active regions and non-active regions. Thereafter, the method includes spraying droplets of a lacquer on the predefined active regions to form corresponding lacquer layer regions, such that the non-active regions do not have presence of the lacquer. The lacquer layer regions are of a predefined thickness to enable their functional texturing. Texturing of lacquer layer enables light trapping or light extraction. Thereafter, one or more semiconductor layers are deposited o the lacquer layer regions and a cover substrate is provided. The cover substrate is joined to the transparent substrate at a portion of the non-active regions and encapsulates the lacquer layer regions and the one or more semiconductor layers between itself and the transparent substrate. | 2012-07-19 |
20120184088 | Method for Selective Deposition of a Semiconductor Material - A method for selective deposition of semiconductor materials in semiconductor processing is disclosed. In some embodiments, the method includes providing a patterned substrate comprising a first region and a second region, where the first region comprises an exposed first semiconductor material and the second region comprise an exposed insulator material. The method further includes selectively providing a film of the second semiconductor material on the first semiconductor material of the first region by providing a precursor of a second semiconductor material, a carrier gas that is not reactive with chlorine compounds, and tin-tetrachloride (SnCl | 2012-07-19 |
20120184089 | Organic Semiconductors - A semiconducting compound comprising the structure: | 2012-07-19 |
20120184090 | METHOD OF FABRICATING SINGLE CRYSTAL GALLIUM NITRIDE SEMICONDUCTOR SUBSTRATE, NITRIDE GALLIUM SEMICONDUCTOR SUBSTRATE AND NITRIDE SEMICONDUCTOR EPITAXIAL SUBSTRATE - A method of fabricating a single crystal gallium nitride substrate the step of cutting an ingot of single crystal gallium nitride along predetermined planes to make one or more single crystal gallium nitride substrates. The ingot of single crystal gallium nitride is grown by vapor phase epitaxy in a direction of a predetermined axis. Each predetermined plane is inclined to the predetermined axis. Each substrate has a mirror polished primary surface. The primary surface has a first area and a second area. The first area is between an edge of the substrate and a line 3 millimeter away from the edge. The first area surrounds the second area. An axis perpendicular to the primary surface forms an off-angle with c-axis of the substrate. The off-angle takes a minimum value at a first position in the first area of the primary surface. | 2012-07-19 |
20120184091 | METHOD FOR HEAT TREATING A SILICON WAFER - The invention is to provide a method for heat treating a silicon wafer reducing grown-in defects while suppressing generation of slip during RTP and improving surface roughness of the wafer. The method performing a first heat treatment while introducing a rare gas, the first heat treatment comprising the steps of rapidly heating the wafer to T | 2012-07-19 |
20120184092 | METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide semiconductor device includes the step of forming a mask pattern of a silicon oxide film by removing a portion of the silicon oxide film by means of etching employing a gas containing oxygen gas and at least one fluorine compound gas selected from a group consisting of CF | 2012-07-19 |
20120184093 | HIGH-K/METAL GATE STACK USING CAPPING LAYER METHODS, IC AND RELATED TRANSISTORS - Methods, IC and related transistors using capping layer with high-k/metal gate stacks are disclosed. In one embodiment, the IC includes a first type transistor having a gate electrode including a first metal, a second metal and a first dielectric layer, the first dielectric layer including oxygen; a second type transistor separated from the first type transistor by an isolation region, the second type transistor having a gate electrode including the second metal having a work function appropriate for the second type transistor and the first dielectric layer; and wherein the gate electrode of the first type transistor includes a rare earth metal between the first metal and the second metal and the gate electrode of the second type transistor includes a second dielectric layer made of an oxide of the rare earth metal. | 2012-07-19 |
20120184094 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE - A silicon carbide substrate having a substrate surface is prepared. An insulating film is formed to cover a part of the substrate surface. A contact electrode is formed on the substrate surface, so as to be in contact with the insulating film. The contact electrode contains Al, Ti, and Si atoms. The contact electrode includes an alloy film made of an alloy containing Al atoms and at least any of Si atoms and Ti atoms. The contact electrode is annealed such that the silicon carbide substrate and the contact electrode establish ohmic connection with each other. Thus, in a case where a contact electrode having Al atoms is employed, insulation reliability of the insulating film can be improved. | 2012-07-19 |
20120184095 | Method for Manufacturing a Semiconductor Device - A method for forming a semiconductor device is provided. The method includes providing a semiconductor body with a horizontal surface. An epitaxy hard mask is formed on the horizontal surface. An epitaxial region is formed by selective epitaxy on the horizontal surface relative to the epitaxy hard mask so that the epitaxial region is adjusted to the epitaxy hard mask. A vertical trench is formed in the semiconductor body. An insulated field plate is formed in a lower portion of the vertical trench and an insulated gate electrode is formed above the insulated field plate. Further, a method for forming a field-effect semiconductor device is provided. | 2012-07-19 |
20120184096 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is made possible to provide a method for manufacturing a semiconductor device that includes CMISs each having a low threshold voltage Vth and a Ni-FUSI/SiON or high-k gate insulating film structure. The method comprises: forming a p-type semiconductor region and an n-type semiconductor region insulated from each other in a substrate; forming a first and second gate insulating films on the p-type and n-type semiconductor regions, respectively; forming a first nickel silicide having a composition of Ni/Si<31/12 above the first gate insulating film, and a second nickel silicide having a composition of Ni/Si≧31/12 on the second gate insulating film; and segregating aluminum at an interface between the first nickel silicide and the first gate insulating film by diffusing aluminum through the first nickel silicide. | 2012-07-19 |
20120184097 | Reduced Number of Masks for IC Device with Stacked Contact Levels - A three-dimensional stacked IC device has a stack of contact levels at an interconnect region. According to some examples of the present invention, it only requires a set of N etch masks to create up to and including 2N levels of interconnect contact regions at the stack of contact levels. According to some examples, 2 | 2012-07-19 |
20120184098 | ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS - Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated. | 2012-07-19 |
20120184099 | LASER REMOVAL OF CONDUCTIVE SEED LAYERS - A method for making conductive traces and interconnects on a surface of a substrate includes, for an embodiment, forming a dielectric or polymer layer on the surface of the substrate, forming a seed layer of an electrically conductive material on the dielectric or polymer layer, patterning a photoresist on the seed layer, forming the conductive traces on the patterned photoresist and seed layer, removing the photoresist from the substrate, and irradiating the surface of the substrate with a fluence of laser light effective to ablate the seed layer from areas of the substrate surface exclusive of the conductive traces. | 2012-07-19 |
20120184100 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - A chemically amplified positive resist composition comprising (A) a substantially alkali insoluble polymer having an acidic functional group protected with an acid labile group, (B) an acid generator, and (C) a perfluoroalkyl ethylene oxide adduct or a nonionic fluorinated organosiloxane compound is coated, exposed to UV radiation having a wavelength of at least 150 nm, and developed. The composition has advantages of uniformity and minimized edge crown upon coating, and no scum formation after development. | 2012-07-19 |
20120184101 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS - In a chemically amplified positive resist composition comprising a base resin and an acid generator in a solvent, the base resin contains both an alkali-insoluble or substantially alkali-insoluble polymer having an acid labile group-protected acidic functional group having a Mw of 1,000-500,000 and an alkyl vinyl ether polymer having a Mw of 10,000-500,000. The composition forms on a substrate a resist film of 5-100 μm thick which can be briefly developed to form a pattern at a high sensitivity and a high degree of removal or dissolution to bottom. | 2012-07-19 |
20120184102 | Method for smoothing group lll nitride semiconductor substrate - The invention discloses a smoothing method to decrease bowing of group III nitride semiconductor substrate. The certain face of group III nitride semiconductor substrates is etched under the appropriate etching recipe and time, the certain morphology such as rod-type and other structures are appeared at the certain face. And such structures releases the compressive stresses at these certain faces, resulting in clearly increasing the bowing radius of the group III nitride semiconductor substrates, finally decreasing the bowing phenomenon of the group III nitride semiconductor substrate. | 2012-07-19 |
20120184103 | RESIST UNDERLAYER FILM COMPOSITION AND PATTERNING PROCESS USING THE SAME - There is disclosed a resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), and one or more kinds of compounds, represented by the following general formulae (2-1) and/or (2-2), and/or equivalent bodies thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same. | 2012-07-19 |
20120184104 | METHOD FOR FABRICATING FINE PATTERN IN SEMICONDUCTOR DEVICE - A method for fabricating a fine pattern in a semiconductor device includes forming a first photoresist over a substrate where an etch target layer is formed, doping at least one impurity selected from group III elements and group V elements, of the periodic table, into the first photoresist, forming a photoresist pattern over the first photoresist, performing a dry etching process using the photoresist pattern to expose the first photoresist, etching the first photoresist by an oxygen-based dry etching to form a first photoresist pattern where a doped region is oxidized, and etching the etch target layer using the first photoresist pattern as an etch barrier. | 2012-07-19 |
20120184105 | METHOD OF FORMING OPENINGS - A method for forming openings is provided. First, a substrate with a silicon-containing photo resist layer thereon is provided. Second, a first photo resist pattern is formed on the silicon-containing photo resist layer. Later, a first etching procedure is carried out on the silicon-containing photo resist layer to form a plurality of first openings by using the first photo resist pattern as an etching mask. Next, a second photo resist pattern is formed on the silicon-containing photo resist layer. Then, a second etching procedure is carried out on the silicon-containing photo resist layer to form a plurality of second openings by using the second photo resist pattern as an etching mask. | 2012-07-19 |
20120184106 | METHOD AND ALGORITHM FOR RANDOM HALF PITCHED INTERCONNECT LAYOUT WITH CONSTANT SPACING - An embodiment of a system and method produces a random half pitched interconnect layout. A first normal-pitch mask and a second normal-pitch mask are created from a metallization layout having random metal shapes. The lines and spaces of the first mask are printed at normal pitch and then the lines are shrunk to half pitch on mask material. First spacers are used to generate a half pitch dimension along the outside of the lines of the first mask. The mask material outside of the first spacer pattern is partially removed. The spacers are removed and the process is repeated with the second mask. The mask material remains at the locations of first set of spacers and/or the second set of spacers to create a half pitch interconnect mask with constant spaces. | 2012-07-19 |
20120184107 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - In a semiconductor device manufacturing method, the formation of a sacrificial oxide film and removal thereof by wet etching and/or the formation of a silicon dioxide film and removal thereof by wet etching are performed. In the process for manufacturing a semiconductor device, the formation of the sacrificial oxide film and/or the silicon dioxide film is performed within a processing chamber of a plasma processing apparatus using a plasma in which O( | 2012-07-19 |
20120184108 | METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR WAFER, METHOD OF PRODUCING NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR DEVICE - A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 diamond granules and 0 wt %-40 wt % oxide granules, grinding and polishing a top surface of the wafer, etching the top surface for eliminating a top process-induced degradation layer and maintaining a 0.5 μm-10 μm thick edge process-induced degradation layer. | 2012-07-19 |
20120184109 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COMPUTER READABLE MEDIUM FOR STORING PATTERN SIZE SETTING PROGRAM - A method of manufacturing a semiconductor device, which forms a pattern by performing pattern transformation steps multiple times, comprises setting finished pattern sizes for patterns to be formed in each consecutive two pattern transformation steps among the plurality of pattern transformation steps based on a possible total amount of in-plane size variation of the patterns to be formed in the consecutive two pattern transformation steps. | 2012-07-19 |
20120184110 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS - An insulating film including characteristics such as low permittivity, a low etching rate and a high insulation property is formed. Supplying a gas containing an element, a carbon-containing gas and a nitrogen-containing gas to a heated substrate in a processing vessel to form a carbonitride layer including the element, and supplying the gas containing the element and an oxygen-containing gas to the heated substrate in the processing vessel to form an oxide layer including the element are alternately repeated to form on the substrate an oxycarbonitride film having the carbonitride layer and the oxide layer alternately stacked therein. | 2012-07-19 |
20120184111 | SELECTIVE PLASMA NITRIDING METHOD AND PLASMA NITRIDING APPARATUS - A selective plasma nitriding method includes mounting an object to be processed on a mounting table in a processing chamber of a plasma processing apparatus, the object having a silicon surface and a silicon compound layer exposed; setting a pressure in the processing chamber within the range of about 66.7 Pa to 667 Pa; and generating a nitrogen-containing plasma while applying a bias voltage to the object by supplying to the mounting table a high frequency power with an output of about 0.1 W/cm | 2012-07-19 |
20120184112 | MASK FOR CRYSTALLIZING A SEMICONDUCTOR LAYER AND METHOD OF CRYSTALLIZING A SEMICONDUCTOR LAYER USING THE SAME - A mask for crystallizing a semiconductor layer includes a plurality of first main-slit portions, a plurality of second main-slit portions, upper slit portion and lower slit portion. The first main-slit portions extend along an inclined direction with respect to a first direction. The second main-slit portions are spaced apart from the first main-slit portions. The upper slit portion is disposed on the first main-slit portions along a second direction to be parallel to the first main-slit portions, and extends partway over the second main-slit portions to be longer than the first main-slit portions. The lower slit portion is disposed under the second main-slit portions along the second direction to be parallel to the second main-slit portions, and extends partway under the first main-slit portions to be longer than the second main-slit portions. | 2012-07-19 |
20120184113 | METHOD AND DEVICE FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A step of preparing a stack is performed to position each single-crystal substrate in a first single-crystal substrate group and a first base substrate face to face with each other, position each single-crystal substrate in a second single-crystal substrate group and a second base substrate face to face with each other, and stack the first single-crystal substrate group, the first base substrate, an insertion portion, the second single-crystal substrate group, and the second base substrate in one direction in this order. Next, the stack is heated so as to allow a temperature of the stack to reach a temperature at which silicon carbide can sublime and so as to form a temperature gradient in the stack with the temperature thereof getting increased in the above-described direction. In this way, silicon carbide substrates can be manufactured efficiently. | 2012-07-19 |
20120184114 | ELECTRICAL COUPLER - A male connector is capable of magnetically attracting a female connector. The female connector includes a first end surface and a second end surface. The male connector includes a first telescoping pin and a second telescoping pin. The first telescoping pin and the second telescoping pin are capable of contacting the first end surface and the second end surface, to make an electrical connection between the male connector and the female connector. | 2012-07-19 |
20120184115 | PLUG CONNECTOR AND MULTI-LAYER CIRCUIT BOARD - The invention relates to a multi-pole plug connector ( | 2012-07-19 |
20120184116 | INTERPOSER - An interposer includes a substrate having a first surface and a second surface with vias extending between the first and second surfaces. The interposer also includes a contact array mounted to the first surface that has a plurality of coil-shaped contacts. The contacts have heels terminated to corresponding vias. The contacts have beams defining a mating interface of the interposer configured for mating with an electronic component. The contacts may be conic helix shaped. The beams may include at least one turn. The beams may be free standing from the heel and may be compressible along contact axes toward the first surface of the substrate. | 2012-07-19 |
20120184117 | MOUNTING STRUCTURE OF CONNECTOR FOR CIRCUIT BOARD - A mounting structure of a connector for a circuit board is provided. A circuit board is formed with a cutout, the cutout has a rectangular shape which is defined by three rectilinear side edges and one side edge is open, and one of the three side edge is a terminal arranging side edge part. Terminals are provided in the terminal arranging side edge part and are arranged along a longitudinal direction of the terminal arranging side edge part. A connector housing is formed with terminal containing grooves on a lower face thereof. The terminals are respectively contained in the terminal containing grooves when the connector housing is fitted into the cutout. By fitting the connector housing into the cutout, the terminals are contained in the terminal containing grooves, thereby to construct the connector for the circuit board in which the terminals are used as connector terminals. | 2012-07-19 |
20120184118 | Network jack - A network jack is provided. The network jack includes a jack body having an opening and a side wall; a door body having a lateral protrusion; and a resilient pivot connecting the jack body and the door body and urging the lateral protrusion against the side wall. | 2012-07-19 |
20120184119 | ASSEMBLY RECEPTACLE CAPABLE OF SEPARATING - An assembly receptacle capable of separating includes an assembly set which has a first assembling slot, a second assembling slot and a third assembling slot, a first connection set with a first connecting element which is installed in the first assembling slot and includes a connecting portion and at least one plug connecting portion, a second connection set with a first connecting portion installed in the second assembling slot and a second connecting portion installed in the third assembling slot, and an actuation portion to control electric connection or disconnection between the first connecting portion and the second connecting portion. The second connecting portion is connected to the plug connecting portion. Thus higher assembly costs and poor positioning problem of the receptacle can be reduced, and other problems of production, material preparation and stocks incurring to different types of casings can also be eliminated. | 2012-07-19 |
20120184120 | DUAL SERIAL BUS INTERFACE - An interface protocol for patient monitoring systems includes a Dual Serial Bus (DSB) interface. The DSB interface includes a first serial protocol that is USB, Firewire, or Ethernet protocol and a second serial protocol that is a low power serial (LPS) protocol. DSB interfaces provide for communication between DSB Hosts and DSB Devices and allow for the transfer of operating and battery charging power from DSB Host to DSB Device. In addition, the DSB host contains a switched Auxiliary Voltage Supply (AVS) which can provide up to 15 W of power to DSB devices for battery charging or other high power needs. The DSB interface eliminates the need for multiple cables for different parameter sensing devices as there is only one type of connector and, accordingly, reduces the risk of damage caused by inadvertently plugging a parameter sensing device into the wrong receptacle. | 2012-07-19 |
20120184121 | LAMP AND ASSEMBLY STRUCTURE THEREOF - The embodiments disclose a lamp assembly structure that allows a plurality of lamp assemblies to form lamps of different configurations. The lamp assembly structure includes a plurality of independent block bodies, each block body has at least one convex connector or/and at least one concave connector. At least one block body has a luminous body. At least a part of the convex connector or/and the concave connector has an electrical connection component. The electrical connection component and the luminous body are connected electrically. When one block body and its adjacent block body are assembled together, the convex connector of one of the two block bodies is plugged into the concave connector of the other of the two block bodies so as to tightly combine the two block bodies. As a result the electrical connection components of the two block bodies are connected physically and electrically. | 2012-07-19 |
20120184122 | TWO-PART CONTACT ELEMENT FOR HIGH-VOLTAGE PLUG-AND-SOCKET CONNECTOR - The invention relates to a plug element ( | 2012-07-19 |
20120184123 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members aligned and housed in the first or second terminal housing, and a plurality of device side connecting terminals each integrated with the plurality of first connecting terminals at a base end side of the plurality of first connecting terminals, and electrically connected to a device to which the first terminal housing is attached. The plurality of device side connecting terminals are each plate-shaped and each include a surface parallel to a lamination direction of the laminated structure and to a fitting direction of the first and second terminal housings. The first terminal housing includes a terminal block for holding the plurality of device side connecting terminals to be aligned in the lamination direction. | 2012-07-19 |
20120184124 | Security device for HDMI cable connector - A security device for a HDMI connector having a HDMI connector head provided on an electronic device having a HDMI socket. The security device includes a locking device including a locking head and a plurality of locker arms extended from two sides of the locking head respectively to define a locker channel for detachably receiving the HDMI connector head. Each of the locker arms has a plurality of engaging teeth formed therealong, wherein the locking device is arranged to operate between a locking mode and a releasing mode, wherein in the locking mode, the locker arms are inwardly pressed to bias against the HDMI connector head when the HDMI connector is plugged into the HDMI socket, wherein in the releasing mode, the locker arms are relieved from the pressing force so as to allow the HDMI connector head to be freely detached from the HDMI socket. | 2012-07-19 |
20120184125 | CONNECTOR - A connector includes a first terminal housing for housing plural first connecting terminals aligned, a second terminal housing for housing plural second connecting terminals aligned, plural insulating members, a connecting member for collectively fixing and electrically connecting the plural first connecting terminals and the plural second connecting terminals at each contact point by pressing the plural first connecting terminals and the plural second connecting terminals. The connecting member includes a ring-shaped support fixed to the first terminal housing and a pressing portion an upper part of which is inserted into a hollow formed inside the ring-shaped support so as to be pivotally supported by the support. The pressing portion is configured to turn relative to the support by turning the upper part of the pressing portion and to move relative to the support with the turning of the pressing portion in a vertical direction. | 2012-07-19 |
20120184126 | CABLE CONNECTOR ASSEMBLY WITH IMPROVED COVER - A cable connector assembly ( | 2012-07-19 |
20120184127 | Connector - The male housing of the connector includes a flexible brace that extends in insertion direction of the male housing in a position separated from the main body and is connected to the main body at a front side and a backside of the insertion direction and has a latching block that fits into a latching hole formed on the side of a female housing, formed on a side separated from the main body of a midway part, where the midway part can be flexibly deformed so as to be close to the main body. | 2012-07-19 |
20120184128 | COUPLING PART FOR ELECTRICAL LINES - A coupling part for electrical lines, where, in an injection-molded protective or plug body, in whose first end a cable is guided, a sealing element is contained which rests circumferentially tight against the cable. The sealing element is surrounded by a capsule part and is biased by the capsule part at least proportionately against the cable, wherein the capsule part is surrounded at least proportionately by the injection-molding protective or plug body. | 2012-07-19 |
20120184129 | SOCKET CONNECTOR ASSEMBLY WITH FLEXIBLE ORIENTATION HEAT PIPE - A socket connector assembly, adapted for electrically connecting an IC package and a printed circuit board, comprises an insulative housing, a cover plate, a heat pipe retainer with two heat pipes, and a plurality of fastening members. The insulative housing defines a space for the IC package. The heat pipe retainer with the heat pipes are seated on the IC package received in the insulative housing. The cover plate is upon the heat pipe retainer. The heat pipe retainer is formed with a dowel pin in a center thereof, and the cover plate is formed with a hole receiving the dowel pin, so that the heat pipe retainer is flexibly orientated and can rotates around the hole. The cover plate defines at least one first pressing finger downward pressing an upper surface of the heat pipe retainer so as to exert downward force evenly to a heat pipe retainer therefore preventing potential warpage of the heat pipe. | 2012-07-19 |
20120184130 | Flat cable and connection structure between flat cable and printed wiring board - A flat cable includes a plurality of conductors arranged in parallel and exposed at both end portions in a longitudinal direction thereof, an insulation film covering the plurality of conductors except the exposed both end portions, and a reinforcing member that covers the plurality of conductors along a width direction of the plurality of conductors, is provided on a surface of the insulation film in a part of a region including an edge of the insulation film, and includes a metal plate and an insulative covering layer for covering the metal plate. | 2012-07-19 |
20120184131 | Method and Apparatus for Connecting a Network Device to a Daisy Chain Network - A network device configured to allow the connection of the network device to a network in a daisy chain configuration using a single cable. The network device is connected to a cable with two conductors by a socket that is adapted to receive a plug connected to the end of the cable. When the plug on the end of a cable is inserted into the socket, a first conductor in the cable is connected to an input port of a network component and a second conductor of the cable is connected to an output port of a network component. A signal from the network is transmitted down a first conductor in a cable to a network device and the signal is then transmitted back from the network device down a second conductor in the same cable. | 2012-07-19 |
20120184132 | DIRECT CURRENT OUTLET - A plug is adapted to be connected to a DC outlet to supply a DC power to the plug. The plug includes plug pins and a substantially quadrangular-shaped surrounding wall for surrounding the plug pins. The DC outlet includes: an outlet main body having an outlet unit to which the plug is adapted to be connected. The outlet unit includes a plug-receiving portion having pin-inserting holes into which the plug pins are inserted; an insertion groove formed to surround a periphery of the plug-receiving portion, the insertion groove being adapted to receive the surrounding wall; and pin-receiving pieces for being connected with the plug pins that are respectively inserted through the pin-receiving holes. Two pin-receiving holes corresponding to the pin-receiving pieces are arranged along a reference side of the plug- receiving portion and offset closer to the reference side than an opposite side to the reference side. | 2012-07-19 |
20120184133 | FASTENING DEVICE FOR DETACHABLE HOLDING OF AN ELECTRICAL DISTRIBUTOR BY LATCHING - A fastening unit has a fastening device ( | 2012-07-19 |
20120184134 | CABLE ASSEMBLY WITH IMPROVED GROUNDING BAR - A cable assembly ( | 2012-07-19 |
20120184135 | Low PIM Coaxial Connector - A coaxial connector is provided with a connector body coupled to a connector coupling body. A slip ring is provided within a bore of the connector coupling body. An outer conductor groove of the connector body is open to a cable end of the connector body. A contact surface is provided on an inner sidewall of the outer conductor groove. A spring contact is provided between the slip ring and the connector body and a stabilizing assembly is coupled to a cable end of the connector coupling body. The axial advance of the connector coupling body towards the connector body drives the slip ring against the coil spring to clamp a leading edge of the outer conductor inserted into the outer conductor groove against the contact surface. The stabilizing assembly grips a jacket of the coaxial cable, stabilizing the interconnection. Methods of manufacture and interconnection are also disclosed. | 2012-07-19 |
20120184136 | CONNECTOR ASSEMBLY - A connector assembly includes contact modules each having a dielectric frame and contacts held by the dielectric frame. The contacts are arranged along a contact plane within the frame. The dielectric frame includes frame members connected by connecting segments. The frame has windows between the frame members located between adjacent contacts. Holders support corresponding contact modules. The holders are electrically grounded. The holders each have a support wall and tabs that extend outward from the support wall. The contact modules are coupled to the holders such that the tabs are received in the windows to provide shielding within the contact modules. The holders are coupled together such that the contact modules are stacked together with the tabs of at least some of the holders that extend into the contact module held by the adjacent holder and across the contact plane defined by the contact module of the adjacent holder. | 2012-07-19 |
20120184137 | HIGH CURRENT ELECTRICAL CONNECTOR - An electrical connector includes an insulative housing, conductive terminals mounted therein, and a conductive shield generally covering the housing. A shelf of the housing supports a portion of the shield. Each terminal has a main body, a front contact portion extending from an end of the main body and capable of engagement with contacts of a battery, a rear contact portion extending from an end of the main body and capable of engagement with contacts of an electronic device, and a tail portion extending perpendicularly from the main body. The tail portion is positioned between the front and rear contact portions. The front contact portion is capable of deflecting along a plane defined by a centerline of the main body. | 2012-07-19 |
20120184138 | CONNECTOR ASSEMBLY - A connector assembly includes contact modules having dielectric bodies holding contacts having mating portions extending from the dielectric body. The connector assembly includes a conductive shield body holding the contact modules in a stacked configuration. The shield body provides shielding around the contact modules and the shield body has a mating end configured to be mated to a mating connector assembly. The mating end has one or more exposed surfaces between corresponding contacts. The shield body extends between selected contact modules. The connector assembly includes a conductive gasket positioned along the mating end of the shield body. The conductive gasket engages the exposed surfaces of the shield body to define a ground path between the conductive shield body and the mating connector assembly. | 2012-07-19 |
20120184139 | DUAL STACKED CONNECTOR - A connector has a housing and two edge card-receiving slots disposed in a stacked arrangement on a first face of the housing. The housing supports a plurality of wafers, each wafer supporting a plurality of terminals and including two grooves, the grooves aligned with the terminals supported by the wafer. The housing may be positioned in a cage that includes receptacles on a front face of the cage. A light pipe may extend toward the front face of the cage. | 2012-07-19 |
20120184140 | CONNECTOR ASSEMBLY - A connector assembly includes contact modules each having a dielectric frame and contacts held by the dielectric frame. The contacts are arranged along a contact plane within the frame. The dielectric frame includes frame members connected by connecting segments. The frame has windows between the frame members located between adjacent contacts. Holders support corresponding contact modules. The holders are electrically grounded. The holders each have a support wall and tabs that extend outward from the support wall. The contact modules are coupled to the holders such that the tabs are received in the windows to provide shielding within the contact modules. The holders are coupled together such that the contact modules are stacked together with the tabs of at least some of the holders that extend into the contact module held by the adjacent holder and across the contact plane defined by the contact module of the adjacent holder. | 2012-07-19 |
20120184141 | CONTACT SET ARRANGEMENT FOR RIGHT ANGLE JACK - A connector system includes a jack module mounted to a circuit board, which is connected to at least one processor. The jack module is configured to receive a plug connector having a first set of contacts spaced from a second set of contacts. The jack module includes a first contact arrangement configured to engage the first set of contacts of the plug and a second contact arrangement configured to engage the second set of contacts of the plug. The second contact arrangement is provided on a media reading interface, which may provide presence sensing. The first and second contact arrangements engage landings on the circuit board. One example jack module defines a right-angle jack. | 2012-07-19 |
20120184142 | CONNECTOR - To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost. | 2012-07-19 |
20120184143 | SECURING STRUCTURE OF A COVER FOR AN ELECTRIC CONNECTOR - The present invention relates to a cover-fastening structure of an electrical connector. The electrical connector has a base and a cover. The cover is connected to one side of the base. One side of the base is connected to the cover through a connecting portion, so that the cover is and the base can be integrally connected together. In this way, the molding of the cover and the base is integrated and the manufacturing process of the electrical connector is simplified. | 2012-07-19 |
20120184144 | JOINT CONNECTOR AND BUSBAR - A joint connector has a housing ( | 2012-07-19 |
20120184145 | CONNECTOR HAVING BRIDGE MEMBER FOR COUPLING GROUND TERMINALS - A connector ( | 2012-07-19 |
20120184146 | ELECTRICAL CONNECTOR HAVING SMALL SIZE - A card connector ( | 2012-07-19 |
20120184147 | ELECTRICAL CONNECTOR HAVING SMALL SIZE - A card connector ( | 2012-07-19 |
20120184148 | INTERNATIONAL OUTLET SYSTEM - A mechanical outlet system is connected to an incoming power source through power entry cables. The cables connect to cable connectors which, in turn, connect to junction blocks. The junction blocks receive outlet receptacle blocks. The receptacle blocks can be of varying types of sockets, without requiring electrical modifications to the junction blocks. | 2012-07-19 |
20120184149 | Connector - A connector includes a first terminal housing for housing three first connecting terminals aligned, a second terminal housing for housing three second connecting terminals aligned, a plurality of insulating members that are aligned and housed in the second terminal housing, and a connecting member for collectively fixing and electrically connecting the three first connecting terminals and the three second connecting terminals at each contact point by pressing one of the plurality of insulating members adjacent to the connecting member. The three first connecting terminals and the three second connecting terminals are each arranged in a form of a triangle when viewed in the fitting direction. | 2012-07-19 |
20120184150 | ELECTRIC CABLE HOLDER AND METHOD FOR CONNECTING THE SAME - An electric cable holder is provided. A housing includes cable receiving grooves provided in parallel with one peripheral wall portion and press contact terminal receiving grooves provided at opposite ends of the cable receiving grooves of the one peripheral wall portion. A cover includes a substrate portion opposite to the one peripheral wall portion and formed with holes communicating with the press contact terminal receiving grooves, a pair of cover portions erected from opposite ends of the substrate portion, and an open preventing portion connecting the cover portions. The housing is provided with an engaging portion engages with the open preventing portion. When press contact terminals are press-contacted with electric cables and received in the press contact terminal receiving grooves while the open preventing portion is engaged with the engaging portion, an engaging receiving portion is disposed between the open preventing portion and the engaging portion. | 2012-07-19 |
20120184151 | ELECTRICAL CONNECTOR - An electrical connector includes an insulative housing with a number of passageways extending therethrough, a number of electrical contacts secured in the passageways respectively, and a number of solder balls contacting with the electrical contacts. The passageways each includes a solder ball receiving slot and a pre-setting slot below the solder ball receiving slot and expanded therefrom. The electrical contacts each have a solder tail at a lower end thereof and a contact section at an upper end thereof. The solder balls and the solder tails are disposed in the solder ball receiving slot and the pre-setting slot. The pre-setting slot restricts the solder ball at a first position and the solder ball receiving slot restricts the solder ball at a second position. | 2012-07-19 |
20120184152 | CONNECTOR - A connector includes a first terminal housing for housing a plurality of first connecting terminals aligned, a second terminal housing for housing a plurality of second connecting terminals aligned, a plurality of insulating members aligned and housed in the first or second terminal housing, and a connecting member for collectively fixing and electrically connecting the plurality of first connecting terminals and the plurality of second connecting terminals at each contact point by pressing the plurality of first connecting terminals and the plurality of second connecting terminals. The connecting member includes a ring-shaped support fixed to the first terminal housing, a rotating portion an upper portion of which is inserted into a hollow formed inside the ring-shaped support so as to be pivotally supported by the support, and a pressing portion to move in a vertical direction relative to the rotating portion by turning the rotating portion. | 2012-07-19 |
20120184153 | CABLE CONNECTOR ASSEMBLY - A cable connector assembly ( | 2012-07-19 |
20120184154 | Method and System for Improving Crosstalk Attenuation Within a Plug/Jack Connection and Between Nearby Plug/Jack Combinations - This application describes a jack for improving crosstalk attenuation. The jack has a housing, a foil at least partially surrounding the housing, a printed circuit board, and at least one pair of insulation displacement contacts and vias. Each pair of insulation contacts and vias are associated with a differential signal. A conductive trace stub is routed on the printed circuit board near the edge of the board proximate to the foil in order to at least partially balance the coupling from one of the insulation displacement contacts and vias of a pair to the foil with the other insulation displacement contact and via of the pair by electrically connecting the trace stub to the via that is further from the foil. | 2012-07-19 |
20120184155 | TERMINAL BLOCK - A terminal block | 2012-07-19 |
20120184156 | CONTACT ASSEMBLY FOR AN ELECTRICAL CONNECTOR - An electrical contact assembly is provided. The assembly includes a contact hood having a body including an axis and an opening extending through the body along the axis. The opening has an inner surface. The contact hood is configured to be received in an opening of a connector housing. At least two protrusions are formed on the inner surface of the contact hood opening. An electrical contact is provided having a body including a contact end and a socket end. The socket end is inserted axially into the opening of the contact hood. The contact end of the electrical contact is configured to extend from a mating end of the connector housing. At least two apertures are formed on the socket end of the electrical contact. The at least two protrusions are received in the at least two apertures to secure the electrical contact within the contact hood. | 2012-07-19 |
20120184157 | ELECTRICAL CONTACT FOR INTERCONNECT MEMBER - An electrical contact is provided. The electrical contact includes an integrally-formed body having a mating segment, a mounting segment, and a pair of arms interconnect the mating segment and the mounting segment. The arms extend along helical paths for at least some distance as the arms extend from the mating segment to the mounting segment. | 2012-07-19 |
20120184158 | SLEEVE FOR ELECTRICAL CONNECTORS AND METHOD OF ASSEMBLING IT - An electrically conductive sleeve for electrical connectors, the sleeve extending around a longitudinal axis and having a first end and a second end, the second end being opposite the first end, at least one slot being produced in the sleeve and extending from the first end in the direction of the second end, and including at least one lug extending transversely, notably radially, relative to the axis of the sleeve. | 2012-07-19 |
20120184159 | Amphibious Vehicle That Tilts While Floating To Facilitate Climbing Onto Sea Ice - A tracked amphibious vehicle having adjustable ballasting means for changing between a neutral-trim position and an ice-engaging-end-up trim position when floating so as to facilitate moving from floating in water to the surface of adjacent floating ice. | 2012-07-19 |
20120184160 | LENGTH-ADJUSTABLE TIE BAR FOR MARINE ENGINES - The present invention relates to a tie bar. The tie bar has a first subassembly and a second subassembly. The first subassembly includes an end portion configured to connect to a propulsion unit, a first tube that extends from the end portion and a threaded member operatively connected to the end portion and disposed within and at least partially extending along the first tube. The second subassembly includes an end portion configured to connect to a further propulsion unit and a second tube that extends from the end portion of the second subassembly. The second subassembly is configured to threadably engage with the threaded member. The distance of separation between the end portions is selectively adjustable thereby. | 2012-07-19 |
20120184161 | MARINE DEVICE - A marine device has a floating buoy containing electronics, a submerged payload containing electrical devices and electronics, a power source and a mooring line. At least a part of the power source is submerged and electrically connected to at least one of the submerged payload and the floating buoy, and the mooring line extends between the buoy and at least one of the power source submerged part, the submerged payload and a submerged anchor having a mass allowing it to stay under the water surface. | 2012-07-19 |
20120184162 | Human/Water Propelled Buoyant Skis - Equipment for a human subject's use in an upright position for transportation on the water's surface. The equipment includes: two buoyant skis ( | 2012-07-19 |
20120184163 | Apparatus for walking and resting upon the water - A water walking apparatus having a pair of inflatable pontoons with footwells at their center, allowing user to step into and out of pontoons without their feet getting caught up inside of the footwell. The pontoons are connected together by stretch cords and a platform. The pontoons are designed to be able to hold a platform that allows the user to sit and rest after walking on the water. The platform has a ladder inside the cavity of the platform, assisting the user to get on the apparatus from water. Pontoons have a board sleeve at its bottom which holds the support board for pontoon. The support board gives the pontoon rigidity. Pontoons have pockets at bottom for scoops, the scoops pass over water freely when pontoons are going forward, and drop down into water when opposite pontoon is going forward. When scoops are down into water they reduce the backward movement of pontoon. The pontoons have support sleeves inside of them which are open at their tops and sealed off to the inside bottom of pontoons, these support sleeves hold the support tubes that are inserted into them. The support tubes hold and support the platform support, which in turn holds the platform, this platform allows the user to be able sit and rest after walking on the water. The pontoons are designed to be light weight and easy to use. The front ends of pontoons are up and out of water like the bow on a boat. The apparatus can come apart for easy storing and transporting. | 2012-07-19 |
20120184164 | PAPERBOARD OR CARDBOARD - A paperboard and a cardboard comprising at least one nonwoven web layer are provided. The nonwoven web layer comprises a plurality of first fibers, a plurality of second fibers, and a binder. The first fibers comprise a water non-dispersible synthetic polymer and have a different configuration and/or composition than the second fibers. The first fibers have a length of less than 25 millimeters and a minimum transverse dimension of less than 5 microns. The nonwoven web layer comprises at least 1 weight percent of the first fibers, at least 10 weight percent of the second fibers, and at least 1 weight percent of the binder. The paperboard and cardboard can incorporate a large amount of post consumer recycled fibers and still exhibit high strength and durability. Also disclosed is a process for producing the first fibers and the multicomponent fibers from which they are derived. | 2012-07-19 |
20120184165 | SELF-ASSEMBLED FUNCTIONAL LAYERS IN MULTILAYER STRUCTURES - Functionalized multilayer structures are manufactured by a process whereby a substrate material is treated with a reactive-gas plasma to form an activated layer on the surface thereof, and then by depositing a liquid functional monomer on the activated layer to form a self-assembled functional layer. Any excess liquid monomer must be allowed to re-evaporate in order to obtain optimal functionality on the surface of the resulting structure. The deposition of the liquid layer is preferably carried out with high kinetic energy to ensure complete penetration of the monomer throughout the body of the substrate. For particular applications, prior to formation of the reactive layer the substrate may be coated with a high glass-transition temperature polymer or a metallic layer. | 2012-07-19 |
20120184166 | FIBER AND FIBER STRUCTURE - Provided is a fiber containing a composition obtained by mixing a compound having at least a ring structure containing one carbodiimide group, the first nitrogen and second nitrogen thereof being linked together through a linking group, with a polymer compound having an acidic group. Also provided is a fiber structure made thereof. A fiber and a fiber structure, which have improved hydrolysis resistance and from which no free isocyanate compounds are produced, can be provided. | 2012-07-19 |
20120184167 | COMPOSITE MATERIAL - A composite material formed from a sheet of material ( | 2012-07-19 |
20120184168 | THERMAL BONDING CONJUGATE FIBER AND NONWOVEN FABRIC USING THE SAME - The present invention provides a thermal bonding conjugate fiber with excellent compression resistance and nonwoven fabric using the same. More specifically, the present invention provides a thermal bonding conjugate fiber and nonwoven fabric using the same, in which the bulkiness of the nonwoven fabric under a light load is retained well even under a heavy load, and the rate of decrease in bulkiness between under a light load and under a heavy load can be reduced. The thermal bonding conjugate fiber with thermal shrinkage properties has an eccentric core-sheath structure in which a first component comprising a polyester resin constitutes a core and a second component comprising a polyolefin resin having a melting point at least 15° C. lower than a melting point of the polyester resin constitutes a sheath, and a shrinkage ratio after a heat treatment of 120° C. is at least 20% when calculated by a predetermined measurement method. The nonwoven fabric is obtained by blending the thermal bonding conjugate fiber with one or more types of a different thermal bonding fiber, and the thermal bonding conjugate fiber is contained therein at a blend ratio of 10 to 60 wt %. | 2012-07-19 |
20120184169 | Extrusion Bonded Laminates For Absorbent Articles - An absorbent article of the present invention may comprise a topsheet, an outer cover, and an absorbent core disposed therebetween. The outer cover may comprise an extrusion bonded laminate. The EBL may comprise a multi-layer coextruded elastomeric film and a nonwoven. The film may comprise a core layer, a first outer layer, and a second outer layer, wherein the core layer is between the first and second outer layers. The nonwoven may comprise fibers and/or filaments. The first outer layer may be non-adhesively joined to the nonwoven via extrusion coating. Further, the outer cover may be elastic to at least about 50% engineering strain. The nonwoven may have high chemical affinity for the first outer layer. The first outer layer may have a low chemical affinity for the core layer; and the multi-layer coextruded elastomeric film may have a basis weight no greater than about 40 gsm. | 2012-07-19 |
20120184170 | Electret Materials - Disclosed are electret materials with outstanding thermal and charge stability. The electret materials comprise a melt blend of a thermoplastic polymer and one or more compounds selected from the aromatic trisamides. The aromatic trisamides are for example of the formula | 2012-07-19 |
20120184171 | METHOD FOR MANUFACTURING IGNITION PLUG - A method for manufacturing an ignition plug is provided. The method includes: preparing an insulator having a cavity provided at a leading end portion thereof by disposing a leading end of a center electrode more inwards in an axial hole than a leading end of the insulator; building the insulator in an interior of a metal shell; disposing a ground electrode at a leading end portion of the metal shell; positioning a center of a through hole of the ground electrode and a center of the cavity of the insulator; and welding the ground electrode and the metal shell together after the positioning step. | 2012-07-19 |
20120184172 | METHOD FOR PRODUCING PLASMA DISPLAY PANEL - A method for producing a plasma display panel having a base layer including metallic oxides and agglomerated particles dispersed on the base layer includes the following steps of: forming the base layer on the dielectric layer; spreading an organic solvent in which the agglomerated particles are dispersed on the base layer to form a coating layer thereon; drying the coating layer under a reduced pressure to form an organic solvent coating film on at least the base layer; disposing the rear plate and the front plate on which the coating film is formed so as to face each other; heating the front plate and the rear plate facing each other to evaporate the coating film, dispersing the agglomerated particles on the base layer, and removing components of the evaporated coating film from the discharge space; and sealing the rear plate and the front plate from which the coating film is evaporated to each other. | 2012-07-19 |
20120184173 | METHOD FOR PRODUCING A DISCHARGE LAMP - In various embodiments, a method for producing high-pressure discharge lamp including discharge vessel sealed off on two sides, discharge vessel having two ends with an electrode system with foil, an electrode with shaft and an outer current lead-in, by: providing a quartz glass discharge vessel having two still open, tubular ends; introducing an electrode system into the open first end and, if necessary also into the second open end; optionally flushing the discharge vessel; heating first open end at the level of the shaft, at no less than two selected points lying on a circumference and enabling centering; provisional fixing in place of the shaft by means of a bossing process, wherein fingers made of quartz glass are formed at tubular first end and extend toward shaft; heating and fuse-sealing the sealing-in region, comprising the foil and the fingers, at the first end, thereby sealing off first end. | 2012-07-19 |
20120184174 | TUBE CONNECTOR FOR ASSEMBLY TOY - Disclosed is a tube connector for an assembly toy, which includes a cylindrical body having upper and lower horizontal surfaces, a circular hole perforated through the center of the body perpendicular to the horizontal surfaces for insertion of a tube, and at least one coupling rib integrally formed around the body at the level of one of the horizontal surfaces. As a tube is coupled to the coupling rib, assembly of various shapes of three-dimensional toys is possible. | 2012-07-19 |
20120184175 | CUP-SHAPED BALLOON HOLDER WITH STICK - An improved balloon cup for mounting and supporting a balloon with the valve tail on a stick includes a frustoconical top for supporting and holding a balloon with a first depending slot therethrough for passing the balloon tail therethrough. A stem depends from the top with an open inner channel circular in cross section extending the length of the stem. The channel is in open communication with the slot through an elongated channel opening for receiving the balloon tail therethrough. After the balloon tail is placed within the inner channel, the stick is transversely placed into the circular inner channel through the elongate channel opening and the stick and balloon tail are held in place by opposing bias flanges along the elongate channel opening. | 2012-07-19 |
20120184176 | AEROSTATS WITH LINEAR/NON-LINEAR GAS FILLED CONNECTING LADDER STRUCTURES - A gas-inflatable character aerostat or balloon with at least one gas-inflatable appendage comprising a linear and non-linear gas-inflatable connecting ladder structure connecting the gas-inflatable appendage to the gas-inflatable aerostat to permit free movement of the appendage in relation to the aerostat in three dimensions. The ladder structure includes two sheets of elongate polymeric material fused together with the ladder structure to be inflated with gas between the sheets. The ladder structure includes an elongate gas-inflatable main channel and gas-inflatable lateral extensions extending from and in flow communication with the main channel. | 2012-07-19 |
20120184177 | AMUSEMENT APPARATUS - A game apparatus | 2012-07-19 |
20120184178 | AUTOTUNES MUSIC MOVEMENT TOY VEHICLE - An educational and entertaining toy vehicle that includes a body member that is designed for including a mechanical music movement. The music movement is coupled to the rear axle via a gear system that winds the spring of the music movement through a first gear ratio while pushing the vehicle in the reverse direction and propels the vehicle through a second gear ratio on release of the vehicle. The release of said spring is controlled by a speed regulator. The toy vehicle is further enhanced by including a toy figure that is representative of the included tune and a lenticular image that wraps around a substantial portion of the top of said vehicle. | 2012-07-19 |
20120184179 | NURSING UNDERGARMENT - A nursing undergarment having an inner breast cup that is attached, to an undergarment structure along a lower cup portion and releasably attachable to the undergarment structure along an upper cup portion, combined, with an outer cover having an upper cover portion attached to the upper cup portion and releasably fastenable to the undergarment structure along a lower cover portion. The attached upper cup and cover top portions may be released from the undergarment structure to allow insertion of a breast pump flange through an opening in the inner breast cup, and the lower cover portion may be released from the undergarment structure to allow the flange to protrude outward. During nursing, the upper cup and cover top portions are fastened to the undergarment structure and the lower cover portion is released and raised to provide access to the nipple through the opening. | 2012-07-19 |
20120184180 | BREAST ENHANCING BRASSIERE - A breast-enhancing brassiere is provided having a pair of breast-receiving cups, each cup including at least one cushioned layer having an inner breast-receiving side and an outer side, and having at least one outer fabric layer affixed to the outer side of the cushioned layer, the inner breast-receiving side including a lower portion and an upper portion, the lower portion having a cushioned thickness greater than the cushioned thickness of the upper portion and projecting inwardly to provide lift and breast enhancement to a wearer, a first pocket formed on the inner breast-receiving side and having a slit formed therein, and a first cushion conforming substantially to the shape of the pocket, the cushion being removably insertable into the pocket to provide supplemental lift and breast enhancement to a wearer. | 2012-07-19 |
20120184181 | SUPPORT STRUCTURE FOR A BRASSIERE - A support structure for placement in a lower periphery of a breast cup for a brassiere, the support structure including a support component shaped to follow the curve of at least the underside of a wearer's breast, the support component including a first region formed by a first polymer material and a second region formed by a second polymer material, wherein the first polymer material is harder than the second polymer. | 2012-07-19 |