22nd week of 2015 patent applcation highlights part 16 |
Patent application number | Title | Published |
20150145102 | Methods for Deep Trench MIM Capacitor Moat Isolation with N+ Epitaxial Semiconductor Wafer Scheme - An integrated circuit structure provides at least one metal-insulator-metal (MIM) capacitor and a moat isolation structure wherein the number of processes required is substantially minimized and the formation of the MIM capacitor and the moat isolation structure effectively decouple while the number of processes common to the moat isolation structure and the MIM capacitor are maximized. Additional required processes are non-critical and tolerant of overlay positioning error. | 2015-05-28 |
20150145103 | CAPACITIVE DEVICE AND METHOD OF MAKING THE SAME - A capacitive device includes a well, a first dielectric layer, a first conductive layer, a cap dielectric layer, and a first electrode. The well includes a first shoulder portion having an upper surface, a second shoulder portion having an upper surface, and a first trench, sandwiched between the first and second shoulder portions, having sidewalls and a bottom surfaces. The first dielectric layer is lined along at least a portion of the upper surfaces of the first and second shoulder portions, the sidewalls of the first trench, and the bottom surface of the first trench. The first conductive layer is lined along the first dielectric layer. The cap dielectric layer is over the well, the first dielectric layer, and the first conductive layer. The first electrode is in contact with the first shoulder portion. | 2015-05-28 |
20150145104 | INTEGRATED CAPACITOR AND METHOD FOR PRODUCING THE SAME - An integrated capacitor includes a substrate with a first main surface area and an opposing second main surface area. A capacitor structure with a dielectric layer is integrated in the first main surface area. A compensation structure with a compensation layer is integrated in the second main surface area. The ratio between a surface enlargement of the second main surface area effected by the compensation structure corresponds to at least 30% of the surface enlargement of the first main surface area effected by the capacitor structure. | 2015-05-28 |
20150145105 | HIGH-RESISTIVE SILICON SUBSTRATE WITH A REDUCED RADIO FREQUENCY LOSS FOR A RADIO-FREQUENCY INTEGRATED PASSIVE DEVICE - The application relates to a high-resistivity silicon substrate ( | 2015-05-28 |
20150145106 | ELECTRONIC DEVICE MANUFACTURE USING LOW-k DIELECTRIC MATERIALS - Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided. | 2015-05-28 |
20150145107 | Semiconductor Chip with Electrically Conducting Layer - A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side wall surface. An electrical contact area is exposed at the side wall surface of the semiconductor chip. An electrically conducting layer covers at least partially the second main surface and the electrical contact area. | 2015-05-28 |
20150145108 | MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND METHODS FOR THE PRODUCTION THEREOF - Microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the method includes producing a plurality of vertically-elongated contacts in ohmic contact with interconnect lines contained within one or more redistribution layers built over the frontside of a semiconductor die. A molded radiofrequency (RF) separation or stand-off layer is formed over the redistribution layers through which the plurality of vertically-elongated contacts extend. An antenna structure is fabricated or otherwise provided over the molded RF stand-off layer and electrically coupled to the semiconductor die through at least one of the plurality of vertically-elongated contacts. | 2015-05-28 |
20150145109 | Semiconductor Package and Method for Producing the Same - A semiconductor package includes a housing having a bottom surface and an upper surface and a solder pad arranged in the bottom surface of the housing. The solder pad includes a solderable through hole. The housing includes an opening extending from the through hole to the upper surface of the housing. | 2015-05-28 |
20150145110 | LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained. | 2015-05-28 |
20150145111 | Electronic component with electronic chip between redistribution structure and mounting structure - An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery, wherein at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure comprises electrically conductive inserts in an electrically insulating matrix. | 2015-05-28 |
20150145112 | Electronic Component - In an embodiment, an electronic component includes a housing, a die pad having a first surface and a second surface opposing the first surface, a first high voltage semiconductor device arranged on the first surface of the die pad, a further semiconductor device arranged on the second surface of the die pad and a conductive connection between the first high voltage semiconductor device and the further semiconductor device. The conductive connection is surrounded by the housing and includes a portion arranged adjacent the die pad. | 2015-05-28 |
20150145113 | SEMICONDUCTOR PACKAGE - A semiconductor package with reduced warpage problem is provided, including: a circuit board, having opposing first and second surfaces; a semiconductor chip, formed over a center portion of the first surface of the circuit board; a spacer, formed over a center portion of the semiconductor chip, having a second cross sectional dimension less than that of the first cross sectional dimension; a non-planar shaped heat spreading layer, formed over the spacer; an encapsulant layer, formed, over the circuit board, filling spaces between the non-planar shaped heat spreading layer and the circuit board; and a plurality of solder balls, formed over the second surface of the circuit board. | 2015-05-28 |
20150145114 | Thermally Enhanced Package with Lid Heat Spreader - A method and apparatus are provided for manufacturing a lead frame based thermally enhanced package ( | 2015-05-28 |
20150145115 | EMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, a die including a first surface and a second surface, a plurality of first conductive bumps disposed between the second surface of the carrier and the die, wherein the die is flip bonded on the carrier, and a molding disposed over the carrier and surrounding the die, wherein the molding includes a recessed portion disposed on the first surface of the die thereby leaving a portion of the first surface is uncovered by the molding. Further, a method of manufacturing a semiconductor device includes providing a carrier, flip bonding a die on the carrier, disposing a rubber material on a first surface of the die and within the first surface of the die, and forming a molding surrounding the rubber material and covering the carrier. | 2015-05-28 |
20150145116 | DIE STACKS WITH ONE OR MORE BOND VIA ARRAYS - An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die. | 2015-05-28 |
20150145117 | ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS - A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element. | 2015-05-28 |
20150145118 | RIDGED INTEGRATED HEAT SPREADER - An integrated circuit package is presented. In an embodiment, the integrated circuit package has a package substrate, an integrated circuit die attached to the package substrate, and a package level heat dissipation device, such as an integrated heat spreader, attached to the package substrate encapsulating the integrated circuit die. The package level heat dissipation device has a top side with a ridge formed on top of a perimeter of the top side, and a bottom side that couples to the integrated circuit die. | 2015-05-28 |
20150145119 | Integrated Circuit And Fabricating Method Thereof - An integrated circuit and a method of fabricating the integrated circuit are provided. In various embodiments, the integrated circuit includes a first substrate, a second substrate, and a bump pad. The first substrate has at least one active device and a plurality of first metallic pads electrically connected to the active device. The first substrate has front-end-of-line processing layers without back-end-of-line processing layers over the front-end-of-line processing layers. The second substrate has a semiconductor substrate and an interconnect structure disposed on the semiconductor substrate, and the interconnect structure has at least one second metallic pad. The second substrate does not include any active devices. The bump pad is sandwiched by the first substrate and the second substrate. The active device and the first metallic pad of the first substrate are electrically connected to the second metallic pad of the second substrate through the bump pad. | 2015-05-28 |
20150145120 | SEMICONDUCTOR DEVICE HAVING A THROUGH ELECTRODE - A semiconductor device includes a through electrode, a pad, and a bump. The through electrode penetrates a device body of the semiconductor device. The pad is disposed over an end of the through electrode to have a first overlap region and a second overlap region that overlap with a central portion and an edge portion of the end of the through electrode, respectively. The bump is disposed over the pad to contact the second overlap region of the pad without contacting the first overlap region of the pad. | 2015-05-28 |
20150145121 | THIN EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME - An embedded package includes a core layer having a cavity, a first semiconductor chip disposed in the cavity, and bumps disposed on a top surface of the first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip and the core layer, pads disposed on a top surface of the second semiconductor chip, and a first insulation layer disposed on the core layer and the first and second semiconductor chips. The first insulation layer has first openings that expose the bumps and second openings that expose the pads, and the first and second openings have a similar depth. | 2015-05-28 |
20150145122 | INTEGRATED CIRCUITS WITH INTERNAL PADS - An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate. | 2015-05-28 |
20150145123 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a power semiconductor module and a method of manufacturing the same. The power semiconductor module includes: a substrate on which a semiconductor device is mounted; a pin positioned on the substrate and having one side electrically connected to the substrate; and a molding part formed to cover a portion of the pin and the substrate and the semiconductor device, wherein the molding part has a pin insertion opening. | 2015-05-28 |
20150145124 | SEMICONDUCTOR CHIPS WITH THROUGH-SILICON VIAS, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Provided is a semiconductor device with through-silicon vias. The device includes a substrate including a lower semiconductor layer, a buried insulating layer, and an upper semiconductor layer, electronic devices on the upper semiconductor layer, a vertical electrode structure including a vertical electrode penetrating the substrate, and an electrode separation pattern surrounding the vertical electrode structure in a plan view and penetrating the upper semiconductor layer to directly contact the buried insulating layer. | 2015-05-28 |
20150145125 | PASSIVATION PROCESS TO PREVENT TIW CORROSION - Disclosed is an under bump metallization structure including a plurality of metal or metal alloy layers formed on chip bond pads with improved reliability due to a sacrificial metal oxide and the methods of making the under bump metallization structures. | 2015-05-28 |
20150145126 | Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP - A semiconductor device has a stress relief buffer mounted to a temporary substrate in locations designated for bump formation. The stress relief buffer can be a multi-layer composite material such as a first compliant layer, a silicon layer formed over the first compliant layer, and a second compliant layer formed over the silicon layer. A semiconductor die is also mounted to the temporary substrate. The stress relief buffer can be thinner than the semiconductor die. An encapsulant is deposited between the semiconductor die and stress relief buffer. The temporary substrate is removed. An interconnect structure is formed over the semiconductor die, encapsulant, and stress relief buffer. The interconnect structure is electrically connected to the semiconductor die. A stiffener layer can be formed over the stress relief buffer and encapsulant. A circuit layer containing active devices, passive devices, conductive layers, and dielectric layers can be formed within the stress relief buffer. | 2015-05-28 |
20150145127 | SEMICONDUCTOR PACKAGE - A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. A conductive trace is disposed on the substrate. A conductive pillar bump is disposed on the conductive trace, wherein the conductive bump is coupled to a die. In another configuration, a first conductive trace is disposed on the substrate, and a second conductive trace is disposed on the substrate. In the second configuration, a conductive pillar bump disposed on the second conductive trace, connecting to a conductive bump or a metal pad of the semiconductor die. A first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate, and a die is disposed over the first conductive trace. | 2015-05-28 |
20150145128 | Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die - A semiconductor device comprises a first semiconductor die. An encapsulant is disposed around the first semiconductor die. A first stepped interconnect structure is disposed over a first surface of the encapsulant. An opening is formed in the first stepped interconnect structure. The opening in the first stepped interconnect structure is over the first semiconductor die. A second semiconductor die is disposed in the opening of the first stepped interconnect structure. A second stepped interconnect structure is disposed over the first stepped interconnect structure. A conductive pillar is formed through the encapsulant. | 2015-05-28 |
20150145129 | MECHANISMS FOR FORMING PACKAGE STRUCTURE - Structures and formation methods of a package structure are provided. The package structure includes a semiconductor die and a substrate bonded to the semiconductor die through a first bonding structure and a second bonding structure therebetween. The first bonding structure and the second bonding structure are next to each other and the second bonding structure is wider than the first bonding structure. The first bonding structure has a first under bump metallurgy (UBM) structure and a first solder bump thereon, and the second bonding structure has a second UBM structure and a second solder bump thereon. The second UBM structure has a maximum width larger than that of the first UBM structure, and the second solder bump has a maximum width larger than that of the first solder bump. | 2015-05-28 |
20150145130 | SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF - The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape. | 2015-05-28 |
20150145131 | SUBSTRATES HAVING BALL LANDS, SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING THE SAME - A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided. | 2015-05-28 |
20150145132 | BALL ARRANGEMENT FOR INTEGRATED CIRCUIT PACKAGE DEVICES - An integrated circuit package includes a ball arrangement that includes transmitter contact pairs arranged in a first portion of a ball grid array disposed in the integrated circuit package. Each of the transmitter contact pairs include transmitter differential signal contacts. Pairs of the transmitter contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes receiver contact pairs arranged in a second portion of the ball grid array. Each of the receiver contact pairs include receiver differential signal contacts. Pairs of the receiver contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes voltage supply contacts arranged at least between every two pairs of the transmitter contact pairs and the receiver contact pairs. | 2015-05-28 |
20150145133 | Apparatus for Dicing Interposer Assembly - Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed. | 2015-05-28 |
20150145134 | Method for Forming Recess-Free Interconnect Structure - A method for forming an interconnect structure includes forming a dielectric material layer on a semiconductor substrate. An oxygen-rich layer is formed over the dielectric material layer. The dielectric material layer and the oxygen-rich layer are patterned to form a plurality of vias in the semiconductor substrate. A barrier layer is formed in the plurality of vias and on the dielectric material layer leaving a portion of the oxygen-rich layer exposed. A metal layer is formed on the bather layer and on the exposed portion of the oxygen-rich layer, wherein the metal layer fills the plurality of vias. The semiconductor substrate is annealed at a predetermined temperature range and at a predetermined pressure to transform the exposed portion of the oxygen-rich layer into a metal-oxide stop layer. | 2015-05-28 |
20150145135 | Electrically Conductive Laminate Structures - Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions. | 2015-05-28 |
20150145136 | VERTICALLY CONNECTED INTEGRATED CIRCUITS - In some examples, an integrated circuit (IC) includes a semiconductor substrate defining a perimeter of the integrated circuit and a castellation formed at the perimeter. The IC also may include a layer including an electrically conductive material formed on a surface of the castellation. In some examples, the layer including the electrically conductive material is not substantially parallel to adjacent portions of the perimeter of the IC. The integrated circuit may be used in a system, in which the metallized castellation may be used to electrically connect the IC to an external structure, such as another IC or a printed board. | 2015-05-28 |
20150145137 | METHOD TO PROVIDE THE THINNEST AND VARIABLE SUBSTRATE THICKNESS FOR RELIABLE PLASTIC AND FLEXIBLE ELECTRONIC DEVICE - An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device. | 2015-05-28 |
20150145138 | EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME - A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality of dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose the terminals, while retaining the plurality of dice in the rigid mass. A process of forming an apparatus includes separating one apparatus from the reconstituted wafer. | 2015-05-28 |
20150145139 | WORD LINE COUPLING PREVENTION USING 3D INTEGRATED CIRCUIT - A memory comprises a first layer comprising a first line. The memory also comprises second layer comprising a series of bit-cells, a word line driver, and a word line coupled to the word line driver. The memory further comprises a first plurality of through vias coupling the word line to the first line. The word line has a resistance value based on a geometry of the word line, and the first line is configured to reduce the resistance value of the word line by a degree associated with a geometry of the first line. | 2015-05-28 |
20150145140 | Substrate-to-Carrier Adhesion Without Mechanical Adhesion Between Abutting Surfaces Thereof - Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface. | 2015-05-28 |
20150145141 | Multiple Bond Via Arrays of Different Wire Heights on a Same Substrate - An apparatus relating generally to a substrate is disclosed. In such an apparatus, a first bond via array has first wires extending from a surface of the substrate. A second bond via array has second wires extending from the surface of the substrate. The first bond via array is disposed at least partially within the second bond via array. The first wires of the first bond via array are of a first height. The second wires of the second bond via array are of a second height greater than the first height for coupling of at least one die to the first bond via array at least partially disposed within the second bond via array. | 2015-05-28 |
20150145142 | MECHANISMS FOR FORMING PACKAGE STRUCTURE - In accordance with some embodiments, a package structure and a method for forming a package structure are provided. The package structure includes a semiconductor die and a molding compound partially or completely encapsulating the semiconductor die. The package structure also includes a through package via in the molding compound. The package structure further includes an interfacial layer between the through package via and the molding compound. The interfacial layer includes an insulating material and is in direct contact with the molding compound. | 2015-05-28 |
20150145143 | PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) USING CLUSTERING TO INCREASE USABLE WHITESPACE - Placement of Monolithic Inter-tier Vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace is disclosed. In one embodiment, a method of placing MIVs in a monolithic 3DIC using clustering is provided. The method comprises determining if any MIV placement clusters are included within a plurality of initial MIV placements of a plurality of MIVs within an initial 3DIC layout plan. The method further comprises aligning each MIV of the plurality of MIVs within each MIV placement cluster in the initial 3DIC layout plan at a final MIV placement for each MIV placement cluster to provide a clustered 3DIC layout plan. | 2015-05-28 |
20150145144 | USE OF A CONFORMAL COATING ELASTIC CUSHION TO REDUCE THROUGH SILICON VIAS (TSV) STRESS IN 3-DIMENSIONAL INTEGRATION - Integrated circuit assemblies, as well as methods for creating the same, are provided. The integrated circuit assembly includes a first chip and a second chip, including respective face surfaces, wherein the first chip and the second chip are bonded in a face-against-face contact configuration. The integrated circuit assembly includes a via disposed to pass through the first chip and the second chip. The via is surrounded by at least one material of the respective first chip and the second chip. A cushion layer encapsulating at least a portion of the via is formed between the via and the at least one material surrounding the via. | 2015-05-28 |
20150145145 | IC EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an IC embedded substrate that includes a core substrate having an opening, an IC chip provided in the opening, a lower insulating layer, and upper insulating layer. The IC chip and the core substrate is sandwiched between the lower insulating layer and the upper insulating layer. The upper insulating layer is formed in such a way as to fill a gap between a side surface of the IC chip and an inner peripheral surface of the opening of the core substrate. A first distance from the upper surface of the IC chip to an upper surface of the upper insulating layer is shorter than a second distance from the upper surface of the core substrate to the upper surface of the upper insulating layer. | 2015-05-28 |
20150145146 | METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RELATED SEMICONDUCTOR DEVICES - Methods of exposing conductive vias of semiconductor devices may involve positioning a barrier material over conductive vias extending from a backside surface of a substrate to at least substantially conform to the conductive vias. A self-planarizing isolation material may be positioned on a side of the barrier material opposing the substrate. An exposed surface of the self-planarizing isolation material may be at least substantially planar. A portion of the self-planarizing isolation material, a portion of the barrier material, and a portion of at least some of the conductive vias may be removed to expose each of the conductive vias. Removal may be stopped after exposing at least one laterally extending portion of the barrier material proximate the substrate. | 2015-05-28 |
20150145147 | Apparatus and Method for Increasing Bandwidths of Stacked Dies - A package structure includes a plurality of die carriers identical to each other. The respective features in each of the plurality of die carriers vertically overlap corresponding features in other ones of the plurality of die carriers. Each of the plurality of die carriers includes a plurality of through-substrate vias (TSVs) including a plurality of data buses. The plurality of die carriers is stacked and electrically connected to each other through the plurality of TSVs. The package structure further includes a plurality of device dies. Each of the plurality of device dies is bonded to one of the plurality of die carriers. Each of the plurality of data buses is configured to dedicate to data transmission of one of the plurality of device dies. | 2015-05-28 |
20150145148 | Copper Ball Bond Interface Structure and Formation - An integrated circuit copper wire bond connection is provided having a copper ball ( | 2015-05-28 |
20150145149 | Semiconductor Device Packaging - A method of manufacturing a semiconductor device package includes encapsulating at least partially a plurality of semiconductor chips with encapsulating material to form an encapsulation body. The encapsulation body has a first main surface and a second main surface. At least one of a metal layer and an organic layer is formed over the first main surface of the encapsulation body. At least one trace of the at least one of the metal layer and the organic layer is removed by laser ablation. The encapsulation body is then separated into a plurality of semiconductor device packages along the at least one trace. | 2015-05-28 |
20150145150 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ALIGNMENT MARK OF SEMICONDUCTOR DEVICE - According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can include forming a stacked layer in a memory cell region and a mark region, forming a first mask layer above the stacked layer, and forming a second mask layer above the first mask layer; forming the second mask layer into first mask pattern features and forming a first alignment mark pattern feature; forming second mask pattern features and then removing the first mask pattern features; opening part of the second mask pattern features and forming a third mask layer having an opening; removing part of the second mask pattern features; removing the third mask layer; forming a fourth mask layer; etching the first mask layer; removing the fourth mask layer and then removing the second mask pattern features; and etching the stacked layer. | 2015-05-28 |
20150145151 | Metrology Method and Apparatus, Lithographic System, Device Manufacturing Method and Substrate - A lithographic process is used to form a plurality of target structures ( | 2015-05-28 |
20150145152 | SCRUBBER WITH MULTI-FILTERING SYSTEM - A multi-stage multifilter type diffractive deodorizer ( | 2015-05-28 |
20150145153 | Steam Dispersion System - A steam dispersion system for building humidification is disclosed. At least a portion of the steam dispersion system is comprised of a flexible material that is collapsible for changing the outer dimension of the portion comprised of the flexible material from a greater, higher-pressure, size, to a smaller, lower-pressure, size. | 2015-05-28 |
20150145154 | MULTI-TRAY BALLAST VAPOR DRAW SYSTEMS - A system for supplying vaporized precursor includes an enclosure including an output. A plurality of trays is arranged in a stacked, spaced configuration inside the enclosure. The plurality of trays is configured to hold liquid precursor. A first conduit fluidly connects a carrier gas supply to the enclosure and includes a plurality of openings. A first valve is arranged along the first conduit and is configured to selectively control delivery of the carrier gas from the carrier gas supply through the first conduit to the plurality of openings in the first conduit. The plurality of openings is configured to direct the carrier gas across the liquid precursor in the plurality of trays, respectively. The output of the enclosure provides a mixture of the carrier gas and the vaporized precursor. | 2015-05-28 |
20150145155 | METHOD OF MANUFACTURING HYDROGEL OPHTHALMIC DEVICES WITH ELECTRONIC ELEMENTS - The present invention provides methods for forming an ophthalmic lens that can include a media insert and/or electronic components. In particular, the present disclosure provides for adhesion promoting functionalization steps for a biocompatible coating to bind a hydrogel material to a plastic surface or electronic component prior to the polymerization of the hydrogel. In some aspects, the media insert can be used to contain energy sources and/or functional electronic components which may be, for example, in a stacked integrated component configuration to permit a generally arcuate shape that can conform to the anterior surface of an eye. | 2015-05-28 |
20150145156 | METHOD OF CASTING IN-SITU FERROCEMENT RIBBED SLAB WITH SPLICED RACK AND SUSPENDED FORMWORK - Disclosed is a method of casting in-situ a ferrocement ribbed slab with a spliced rack and a suspended formwork. The method comprises the following specific steps: step 1: machining at a plant a transverse plane truss girder ( | 2015-05-28 |
20150145157 | PRODUCTION AND REPARATION OF NON-POROUS LAMINATES WITH ASSESSABLE LOW DEGREE OF FIBER CONTENT - A method of forming a fiber reinforced composite structure having a fiber volume fraction ( | 2015-05-28 |
20150145158 | 3D PRINT MANUFACTURING OF PACKAGES WITH PERSONALIZED LABELING TECHNOLOGY - Methods and devices use a three-dimensional scanner and a three-dimensional printing device operatively connected to a processor. The three-dimensional scanner automatically determines a size and shape of an item to be packaged and the processor automatically identifies information corresponding to the item to be packaged. The processor automatically controls the three-dimensional printing device to form a container that is customized to match the size and shape of the item to be packaged (using a continuous additive process of forming successive layers of material in different shapes). When forming the container, the processor also automatically controls the three-dimensional printing device to form a label as part of the container. The label includes color variations to visually convey the information identified by the processor. | 2015-05-28 |
20150145159 | PRESS MOULDING METHOD - A method of press moulding a moulding material to form a vehicle body panel of fibre-reinforced resin matrix composite material, the vehicle body panel having a front A-surface and a rear B-surface, the method comprising the steps of:
| 2015-05-28 |
20150145160 | PRESS MOULDING METHOD - A method of press moulding a moulding material to form a moulded part of fibre-reinforced resin matrix composite material, the method comprising the steps of:
| 2015-05-28 |
20150145161 | METHOD FOR PRODUCING POWDER FROM A GRANULAR, THERMOPLASTIC MATERIAL AND DEVICE FOR PRODUCING CHIPS FROM A POWDERY, THERMOPLASTIC MATERIAL - A method for producing powder from a coarsely granular, thermoplastic material, comprising a homogenizing first device produces a first melt from a non-homogeneous pre-mixture of the material; first chips are produced from the first melt in a second device; the chips are milled to a powder; the powder is separated into at least two fractions with coarser and finer particle sizes; and a selected fraction with finer particle sizes is returned to the method prior to milling; wherein a second melt is produced from the selected fraction in a non-homogenizing third device, with second chips being produced from the latter, and the second chips are combined with the first chips and milled with each other. | 2015-05-28 |
20150145162 | METHOD FOR MAKING NANOSTRUCTURES - A method of making nanostructures includes following steps. A carbon nanotube structure is suspended, wherein the carbon nanotube structure includes a number of carbon nanotubes orderly aligned. A carbon nanotube composite structure is formed by applying a precoated layer on the carbon nanotube structure, wherein a thickness of the precoated layer on an outer surface of each of the number of carbon nanotubes ranges from about 2 nanometers to about 10 nanometers. The carbon nanotube composite structure is transferred on a substrate and treating the carbon nanotube composite structure with a solution. The carbon nanotube structure is removed by annealing the carbon nanotube composite structure in an annealing temperature from about 500° C. to about 700° C., wherein the precoated layer is softened and contracted. | 2015-05-28 |
20150145163 | METHOD AND SYSTEM FOR IMPREGNATING FIBERS TO FORM A PREPREG - A method for impregnating a fibrous material with a curable resin to form a prepreg is disclosed. The method includes conveying a web material through at least one moving pressure nip formed between a moving pressure roller and a moving supporting surface, wherein the moving pressure roller and the moving supporting surface travel at different velocities relative to each other resulting in a relative velocity between the web material and the pressure nip. The at least one moving pressure nip travels in the same direction as the web material while applying sufficient pressure to compress the web material and to affect impregnation of the fibrous material with the curable resin. Also disclosed is a system for implementing the disclosed impregnation method. | 2015-05-28 |
20150145164 | Granular Absorbent and System and Method for Treating or Processing Granular Absorbent During Granular Absorbent Transport - A system and method for treating or processing granular absorbent while the granular absorbent is being transported in a fluid stream that preferably is a stream of air. The system includes a pneumatic conveyor with a conduit that draws pellets exiting an extruder into the conduit drying the pellets as they are transported through the conduit. Material can be introduced that dries, coats or otherwise treats the pellets while the pellets are transported through the conduit. Coating material, e.g., powdered bentonite can coat and also dry pellets during transport. A conduit can have inner pellet treating surface that abrades pellets transported through the conduit producing smaller fines that can be packaged with pellets forming a granular absorbent product that forms clumps on top that extend generally horizontally. | 2015-05-28 |
20150145165 | FIBER-CONTAINING PREPREGS AND METHODS AND SYSTEMS OF MAKING - Methods of making fiber-containing prepregs are described. The methods may include the steps of providing a plurality of fibers, and applying a reactive resin composition to the plurality of fibers to make a mixture of the plurality of fibers and the resin composition. The reactive resin composition may include at least one of monomers and oligomers capable of polymerizing into a polymerized resin matrix. The mixture may be heated to a polymerization temperature where the monomers, oligomers, or both polymerize to form a fiber-resin amalgam that includes the polymerized resin matrix. The fiber-resin amalgam may be formed into the fiber-containing prepreg. Also described are methods of forming a fiber-reinforced composite that includes the prepreg. | 2015-05-28 |
20150145166 | FOULARD FOR APPLYING A BINDER TO A GAUZE - In a foulard for applying a binder to a gauze, fleece or preliminary fleece, having at least one first roll, which can be rotated about a first roll axis and has an engraved roll sleeve, at least one second roll, which can be rotated about a second roll axis and has a roll sleeve, and wherein the gauze, the fleece or the preliminary fleece runs between the first and second rolls, the roll sleeve of the second roll has a preferably groove-shaped engraving. | 2015-05-28 |
20150145167 | CAP RETAINER AND A PULLEY ASSEMBLY INCLUDING THE CAP RETAINER AND METHOD OF ASSEMBLY - An insert moldable cap retainer for securing a bearing cap to a pulley assembly is disclosed. The cap retainer includes a hollow neck configured to receive a bearing cap, a plate that extends outward from the neck with the neck protruding upward from the plate, and a continuous or discontinuous flange extending downward from the outer periphery of the plate. The plate is configured to be juxtaposed with an upper surface of an outer race of a bearing and the flange is configured to be juxtaposed with an outer surface of the outer race of the bearing when the cap retainer is positioned on the bearing. The cap retainer and bearing are insert moldable together to have an integral pulley body connected thereto. A pulley assembly is also disclosed that includes the insert moldable cap retainer. | 2015-05-28 |
20150145168 | METHOD FOR PRINTING THREE-DIMENSIONAL PARTS WTIH CRYSTALLIZATION KINETICS CONTROL - A method for printing a three-dimensional part with an additive manufacturing system, which includes providing a part material that compositionally has one or more semi-crystalline polymers and one or more secondary materials that are configured to retard crystallization of the one or more semi-crystalline polymers, where the one or more secondary materials are substantially miscible with the one or more semi-crystalline polymers. The method also includes melting the part material in the additive manufacturing system, forming at least a portion of a layer of the three-dimensional part from the melted part material in a build environment, and maintaining the build environment at an annealing temperature that is between a glass transition temperature of the part material and a cold crystallization temperature of the part material. | 2015-05-28 |
20150145169 | Fabricating an Object With a Removable Raft by Additive Manufacturing - An additive-manufacturing removable raft. Layers of material are sequentially deposited on a build platform. Portions of the perimeters of the layers are defined as bevel portions, the bevel portion of each layer after the first overhanging the bevel portion of the preceding layer to form an edge surface of the raft at an acute angle with respect to the build platform. | 2015-05-28 |
20150145170 | Method of Making A Bayonet Sealing Closure For Containers and Lids - A method for forming a container assembly having a lid, a container and a cooperative closure mechanism, includes providing a lid form and flexible members biased toward the lid form, wherein the lid form and the flexible members are operable between a forming position defined by the lid form exerting a biasing force against the flexible members, and an extraction position defined by the biasing force being substantially removed from the flexible members, creating a lid form cavity defined by the lid form and the flexible members disposed in the forming position, injecting a lid material throughout the lid form cavity to form a lid, disposing the lid form and the flexible members in the extraction position, wherein the lid form is moved distal from the lid and the flexible members are biased away from the lid to separate the lid from the flexible members. | 2015-05-28 |
20150145171 | SYSTEMS AND METHODS OF POST-PROCESSING FEATURES FOR ADDITIVE FABRICATION - According to some aspects, a method of additive fabrication wherein a plurality of layers of material are formed on a build platform is provided. The method comprises forming a raft structure in contact with the build platform, the raft structure formed from one or more layers of material and comprising at least one removal pocket adjacent to the build platform and forming additional material in contact with the raft structure. According to some aspects, an additive fabrication apparatus configured to form a plurality of layers of material on a build platform is provided. The apparatus comprises the build platform, and at least one controller configured to form a raft structure in contact with the build platform, the raft structure formed from one or more layers of material and comprising at least one removal pocket adjacent to the build platform, and form additional material in contact with the raft structure. | 2015-05-28 |
20150145172 | IMPRINT LITHOGRAPHY - An imprint lithography template is provided with an alignment mark, wherein the alignment mark is formed from dielectric material having a refractive index which differs from the refractive index of the imprint lithography template, the dielectric material having a thickness which is such that it provides a phase difference between alignment radiation which has passed through the dielectric material and alignment radiation which has not passed through the dielectric material. | 2015-05-28 |
20150145173 | DISCHARGE PLASMA MACHINING DEVICE AND METHOD FOR MANUFACTURING DISCHARGE PLASMA MACHINED PRODUCT - A discharge plasma machining device that includes punches as a pressing unit for applying a pressure with respect to a machined item, a direct current pulse current generator as a pulse current applying unit for applying a pulse current with respect to the machined item, a spectroscope as a detection unit for detecting a spectrum of light of plasma generated by application of a pulse current, and a control unit for controlling a pulse current in accordance with a detection result of the detection unit. | 2015-05-28 |
20150145174 | MAGNETIC PLATEN ASSEMBLY FOR ADDITIVE MANUFACTURING SYSTEM - A platen assembly for use in an additive manufacturing system, which includes a platen plate that is preferably secured to a gantry mechanism of the additive manufacturing system, and having a top surface, and one or more magnets secured to the platen plate and configured to generate one or more magnetic fields at the top surface of the platen plate. The platen gantry is configured to magnetically couple interchangeable and replaceable build sheets to the top surface of the platen plate due to the one or more generated magnetic fields, and where the magnetically-coupled build sheets are configured to receive the printed layers from the printing mechanism. | 2015-05-28 |
20150145175 | NANOFIBER FILTERING MATERIAL FOR DISPOSABLE/REUSABLE RESPIRATORS - Embodiments relate generally to methods of manufacture of a filtration media, such as a personal protection equipment mask or respirator, which may incorporate a forcespinning process to form nanofibers. Some embodiments may comprise forcespinning material onto a convex mold, which may, for example, be in the shape of a human face. Other embodiments may comprise forcespinning material onto an inner and/or outer shell of a personal protective equipment mask, such as a flat fold mask. In an embodiment, the forcespun nanofibers may be functionalized, and therefore may, for example, be operable to capture one or more gases. | 2015-05-28 |
20150145176 | METHOD FOR MANUFACTURING REFLECTIVE FILM AND APPARATUS FOR MANUFACTURING THE SAME - A method for manufacturing a reflective film is disclosed. A nozzle is used to spray a mixture of photosensitive adhesive and white powder on a conveyor belt. A first roller and a second roller are used to press the mixture transferred by the conveyor belt. A first light source and a second light source are used to illuminate the mixture to form the reflective film. The reflective film is further pressed by a third roller and then coiled by a rolling device. An apparatus for manufacturing the reflective film is also disclosed. | 2015-05-28 |
20150145177 | APPARATUS AND METHOD FOR FORMING THREE-DIMENSIONAL OBJECTS USING LINEAR SOLIDIFICATION WITH CONTOURLESS OBJECT DATA - An apparatus and method for making a three-dimensional object from a solidifiable material using a linear solidification device and contourless object data is shown and described. A voxel matrix is superimposed over an object model defined by three-dimensional object data to determine active voxels that intersect at least a portion of the object model. The active voxels are related to a path generation reference frame of an apparatus for making a three-dimensional object to generate solidification energy source event data that defines scanning (y) axis locations and/or solidification times at which a linear solidification device supplies solidification energy to a solidifiable material. | 2015-05-28 |
20150145178 | BLOW MOULDING MACHINE WITH BLOW MOULD CHANGING ROBOT WITH ADDITIONAL TREATMENT FUNCTION - A system for transforming plastic parisons to plastic containers with a transport device which transports the plastic parisons along a predetermined transport path, wherein the transport device has a movable station support disposed at least indirectly on a stationary base support on which a plurality of transforming stations is disposed. The transforming stations each have blow mould devices which each form cavities within which the plastic parisons can be transformed into the plastic containers and these blow mould devices are each disposed on blow mould supports. The system has a changing device which is suitable and intended in order, in a changing mode of the system, at least to remove the blow mould devices from their blow mould supports and/or to dispose blow mould devices on the blow mould supports, and wherein, during a further mode of operation which differs from the changing mode, this changing device is suitable and intended for carrying out a treatment operation on at least one working element intended for the system. | 2015-05-28 |
20150145179 | BLOW MOULDING MACHINE WITH CHANGING ROBOT AND METHOD OF OPERATING IT - Apparatus for shaping plastics material pre-forms into plastics material containers includes a conveying device which conveys the pre-forms along a pre-set path. The conveying device has a movable station carrier arranged at least indirectly on a stationary base carrier on which are arranged a plurality of shaping stations which have in each case blow moulding devices which have cavities, inside which the pre-forms are shaped. The apparatus has a changing device for removing the blow moulding devices from the blow mould carriers and/or for arranging blow moulding devices on the blow mould carriers. The changing device has a first control device for controlling a removing and/or an arranging movement of the blow moulding devices on the blow mould carriers, and a second control device for controlling a blow moulding procedure, wherein the first control device and the second control device preferably co-operate at least for a time. | 2015-05-28 |
20150145180 | BLOW MOULDING MACHINE WITH A CHANGING ROBOT AND A GRIPPING DEVICE AND A METHOD FOR ITS OPERATION - An apparatus for shaping plastics material pre-forms into plastics material containers has a conveying device which conveys the plastics material pre-forms along a pre-set conveying path. The conveying device has a movable station carrier arranged at least indirectly on a stationary base carrier and on which a plurality of shaping stations are arranged. The shaping stations have blow moulding devices which form cavities inside which the plastics material preforms are shaped to form plastics material containers. The blow moulding devices are arranged on blow mould carriers. The apparatus has a changing device suitable for removing at least the blow moulding devices from the blow mould carriers and/or arranging blow moulding devices on the blow mould carriers. A changing device has a gripping device for gripping the blow moulding device, wherein this gripping device is movable in at least two different directions and is pivotable about at least three different axes. | 2015-05-28 |
20150145181 | Method and Apparatus for Preparing a Molded Article - This disclosure relates to a method and apparatus of preparing a molded article, and more particularly to a method and apparatus of automated molding using male molds and thermoplastic sheets in which the thermoplastic sheets are systematically draped across the mold contour. | 2015-05-28 |
20150145182 | PRESS MOULDING METHOD - A method of press moulding a moulding material to form a moulded part of fibre-reinforced resin matrix composite material, the method comprising the steps of:
| 2015-05-28 |
20150145183 | FLASH VESSEL AND METHOD FOR OPERATING SAME - A hydrostatic tower whose lower part communicates with a liquid phase space within a flash vessel, and whose upper part communicates with a gas phase space within the flash vessel is provided. A rising liquid level within the hydrostatic tower is detected by at least one maximum liquid level sensor provided at a position at the same level as a predetermined maximum liquid level within the liquid phase space. A dropping liquid level within the hydrostatic tower is detected by at least one minimum liquid level sensor provided at a position at the same level as a predetermined minimum liquid level within the liquid phase space. | 2015-05-28 |
20150145184 | METHOD FOR OPENING AND CLOSING A TAPPING OPENING OF A METALLURGICAL SMELTING VESSEL AND METALLURGICAL SMELTING VESSEL - The invention relates to a method for opening and closing a tapping opening of a metallurgical smelting vessel in particular of an electric arc furnace, in the bottom region of which a wall section having an opening is arranged, wherein a device for moving block elements in a direction (T) perpendicular to the surface normal of the wall section in the area of the opening is arranged below the opening, wherein the device holds the block elements on the wall section in such a way that he block elements lie against the wall section in a sealing manner. In order to achieve wear free and reliable opening and closing of the tapping opening it is provided that, in order to close the tapping opening, a block element free of passage openings is moved under the opening by the device and that, in order to open the tapping opening, a block element having at least one passage opening is moved under the opening by the device, such that liquid metal an drain from the smelting vessel through the passage opening in the block element. The invention further relates to a metallurgical smelting vessel. | 2015-05-28 |
20150145185 | Torch guide for metal cutting - The torch guide encloses a structural metal section to be cut on four sides of that metal section. The cutting torch guide has co-planar top and bottom guiding surfaces and parallel first and second side guiding surfaces. The top and bottom guiding surfaces intersect the first and second side guiding surfaces at four points lying in a same plane. All four guiding surfaces being aligned perpendicular to a longitudinal axis of the structural metal section to be cut, for guiding a cutting torch around the entire structural metal section to be cut. The top and bottom guiding surfaces are adjustable at angle of 90° to 45° from the longitudinal axis, while maintaining the alignment of all four guiding surfaces along a planar cutting plane through the structural metal section to be cut. | 2015-05-28 |
20150145186 | Higher Strength, Mullite-Based Iron Foundry Filter - A ceramic foam filter and method of making the filter is described. The filter comprises: a sintered reaction product of: 35-75 wt % aluminosilicate; 10-30 wt % colloidal silica; 0-2 wt % bentonite; and 0-35 wt % fused silica; wherein the ceramic foam filter has less than 0.15 wt % alkali metals measured as the oxide and a flexural strength of at least 60 psi measured at 4 minutes at 1428° C. | 2015-05-28 |
20150145187 | LEAF SPRING ASSEMBLY - A leaf spring assembly, which may be attached to, for example, an axle or suspended components a vehicle, includes a leaf having a first end and a second end on opposing sides of a center point. The leaf is the only leaf in the leaf spring assembly. The leaf spring assembly also includes a first bumper and a second bumper spaced from the first bumper. The first bumper contacts the leaf upon a first displacement of the leaf spring assembly. The second bumper also contacts the leaf upon the first displacement of the leaf spring assembly. | 2015-05-28 |
20150145188 | Multi-Stage Telescopic Shock Absorber - A multi-stage shock absorber with closed ends has a plurality of tubular shock bodies telescopically interconnected together, and includes a piston arrangement slidably mounted within certain of the shock bodies to define a number of chambers variously containing damping and/or spring elements for enabling damping of shock forces applied to the shock absorber. | 2015-05-28 |
20150145189 | Shock-absorber and method for manufacturing a shock-absorber - A shock-absorber suitable for joining a first component subjected to vibrations, such as a vehicle exhaust pipe, to a second component, such as a vehicle frame, and a method for manufacturing the shock-absorber. According to some implementations the shock-absorber is made of a first elastic material of a first density constituting a majority of the volume of the shock-absorber and a second elastic material of a second density less than the first density. The shock absorber includes a first area designed for being joined to the first component and a second area designed for being joined to the second component. The second elastic material at least partially covers the first area and is configured to at least partially contact the first component when the first component is assembled within the first area. | 2015-05-28 |
20150145190 | LIQUID SEALED-IN VIBRATION DAMPER - A liquid sealed-in vibration damper respectively connected with two members that perform a relative displacement includes an elastic member, which is provided therein with a liquid chamber in which a liquid is sealed. When a direction from a side of the liquid sealed-in vibration damper connected with one of the two members to a side of the liquid sealed-in vibration damper connected with the other of the two members is set to an extension direction of the elastic member, a recess is provided in a region between an end portion on a side of the elastic member connected with any one of the two members and the liquid chamber, the recess being recessed in a direction orthogonal to the extension direction up to a position where a position of the recess in the orthogonal direction is located at an inner side of the liquid chamber. | 2015-05-28 |
20150145191 | ISOLATORS HAVING NESTED FLEXURE DEVICES AND METHODS FOR THE PRODUCTION THEREOF - Embodiments of an isolator having a nested flexure device are provided, as are embodiments of a nested flexure device and methods for the production thereof. In one embodiment isolator includes an isolator body and a nested flexure device mounted to an end portion of the isolator body. The nested flexure device includes an inner flexure array compliant along first and second perpendicular axes orthogonal to the working axis of the isolator. The nested flexure device further includes an outer flexure array compliant along the first and second perpendicular axes, coupled in series with the inner flexure array, and circumscribing at least a portion of the inner flexure array. | 2015-05-28 |
20150145192 | SPRING ELEMENT - A spring element that includes a spring body that is at least chiefly formed from an elastomer, wherein at least one reinforcement fibre is embedded into the elastomer. The at least one reinforcement fibre has an arcuate course in a non-loaded condition of the spring element, so that the spring element has a non-linear spring characteristic. | 2015-05-28 |
20150145193 | OBJECT FASTENING DEVICE FOR FASTENING OBJECT TO RECEIVING PART, MACHINE TOOL, ROBOT, AND METHOD OF FASTENING OBJECT TO RECEIVING PART - An object fastening device which can prevent foreign matter from ending up damaging an object when confirming the object is properly seated, which object fastening device is provided with a receiving part, a pushing part which pushes the object against the receiving part, a first drive part which makes the pushing part generate a first force, a second drive part which is provided separate from the first drive part and makes the pushing part generate a second force which is smaller than the first force, and a foreign matter detecting part which detects foreign matter which is interposed between the object and receiving part while the second drive part is being used to cause the pushing part to push the object against the receiving part. | 2015-05-28 |
20150145194 | CLAMPING DEVICE - A clamping device has an actuator that moves linearly and is actuated by a drive. A pivoting clamping element is operatively connected, via a toggle lever mechanism, with the actuator. The toggle lever mechanism includes a drive-side adapter and a hand lever-side adapter. The drive side adapter and hand lever side adapter can be adjusted relative to one another to define an opening angle of the clamping element. One of the adapters has a profiled bar extending in a direction of actuation. The other adapter has an insertion region to accommodate the bar. A fixing element is provided in one of the adaptors to define the location of the adapters relative to one another. The fixing element can be clamped against the profiled bar and also against an insertion region. | 2015-05-28 |
20150145195 | CLAMP APPARATUS - A clamp apparatus is equipped with a body, and a drive unit having a piston displaced under the supply of a pressure fluid. A clamp arm is disposed rotatably on the body. In addition, a piston rod of the drive unit is connected detachably with respect to a displaceable body of a driving force transmission mechanism which is disposed in the interior of the body. Upon detachment of a connector of the piston rod from a connecting recess of the displaceable body, the state of connection between the drive unit and the driving force transmission mechanism is released. | 2015-05-28 |
20150145196 | PART FIXTURING SYSEMS HAVING EXPANDING CLAMPING DEVICES - A part fixturing system for securing a workpiece includes an expanding clamping device and a work holding device. The expanding clamping device comprises a clamp base portion, a first and a second traversing wedge blocks, and a clamp plate portion. The clamp base portion comprises a longitudinal recess. The first and the second traversing wedge blocks are located inside the longitudinal recess, each comprising an inclined contact surface. The clamp plate portion comprises a first declined contact surface and a second declined contact surface. The work holding device comprises a first support column and a second support column that define a longitudinal loading envelope. The expanding clamping device is positioned inside the longitudinal loading envelope of the work holding device. The expanding clamping device couples the workpiece to the first support column and the second support column. | 2015-05-28 |
20150145197 | Image Forming Apparatus - An image forming apparatus includes an image forming unit, a sheet receiving portion, an ejection roller, and a restriction member. The ejection roller is configured to rotate in a forward direction to eject a recording sheet fed from the image forming unit to the sheet receiving portion, and to rotate in a reverse direction to return the recording sheet to the image forming unit. The restriction member is configured to move between a restriction position where the restriction member protrudes farther in a sheet ejection direction than a peripheral surface of the ejection roller and a retracted position where the restriction member is retracted from the restriction position. The ejection roller is configured to move the restriction member to the restriction position by rotating in the forward direction, and to move the restriction member to the retracted position by rotating in the reverse direction. | 2015-05-28 |
20150145198 | IMAGE FORMING APPARATUS - An image forming apparatus includes: a sheet feed section including a plurality of sheet feed cassettes, a designation receiving section configured to receive a designation of a sheet feed cassette for exclusive use from among the plurality of sheet feed cassettes; an exclusive use control section configured to put the sheet feed cassette the designation of which has been received by the designation receiving section into an exclusive use state and, when a predetermined condition is satisfied, switch the sheet feed cassette from the exclusive use state to a non-exclusive use state; and a sheet discharge control section. When the predetermined condition is satisfied, the sheet discharge control section allows the discharge of particular paper sheets remaining in the sheet feed cassette in the exclusive use state before the sheet feed cassette is switched from the exclusive use state to a non-exclusive use state. | 2015-05-28 |
20150145199 | PAPER FEEDING DEVICE AND IMAGE FORMING APPARATUS - A paper feeding device that includes, in a drive transmission mechanism to a paper feeding roller that delivers paper, a drive member provided on an apparatus body side as a member to transmit torque in a given direction for delivery of paper from a conveying motor to the paper feeding roller and a driven member provided on the paper feeding roller side. By relatively rotating the drive member and the driven member to form a coupling state of the members before an instruction to start the delivery of paper is output, the rotation of the paper feeding roller is started without a time lag when the instruction to start the delivery of paper is output. | 2015-05-28 |
20150145200 | PRINTING SYSTEM, CONTROL METHOD THEREOF, AND STORAGE MEDIUM - A system is provided for shifting, according to an amount of stacked sheets that has been stacked in a sheet stacking device, a state of a power to be supplied to the sheet stacking device from a first power state to a second power state where power consumption is less than that in the second power state. | 2015-05-28 |
20150145201 | SHEET STACKING APPARATUS, METHOD FOR CONTROLLING THE SAME, AND STORAGE MEDIUM - A sheet stacking apparatus includes a lowering control unit, a determination unit, a notification unit, and a control unit. The lowering control unit lowers a discharge tray based on an amount of sheets discharged to the tray. The determination unit can determine that lowering of the discharge tray has been disabled before the discharge tray reaches a lower end position. The notification unit notifies removal of an object present below the discharge tray when it is determined that the lowering of the discharge tray has been disabled. The control unit executes control so as to raise the discharge tray in response to the determination that the lowering of the discharge tray has been disabled. | 2015-05-28 |