15th week of 2016 patent applcation highlights part 55 |
Patent application number | Title | Published |
20160105928 | METHOD AND APPARATUS FOR HANDLING DUPLICATED E-RABS FOR DUAL CONNECTIVITY IN WIRELESS COMMUNICATION SYSTEM - A method and apparatus for handling duplicated evolved universal terrestrial radio access network (E-UTRAN) radio access bearers (E-RABs) for dual connectivity in a wireless communication system is provided. A mobility management entity (MME) receives an E-RAB modification indication message including several E-RAB identifiers (IDs) set to the same value, and triggers a user equipment (UE) context release procedure with a cause value. | 2016-04-14 |
20160105929 | APPARATUS FOR CURING COMPOSITE MATERIALS AND METHOD OF USE THEREOF - An apparatus may include a curing apparatus and an electrical coupler. The curing apparatus may include one or more electrical components related to curing a composite material inside a vacuum chamber at least partially defined by a flexible wall. The electrical coupler may be connected to the curing apparatus. The coupler may include a first set of one or more electrical contacts electrically connected to the one or more electrical components of the curing apparatus inside the vacuum chamber. The coupler may be configured to hermetically extend through a hole in the flexible wall. Such extension may dispose the first set of one or more electrical contacts in a space outside of the vacuum chamber for electrical interconnection of the one or more electrical components of the curing apparatus inside the vacuum chamber with circuitry disposed in the space outside of the vacuum chamber. | 2016-04-14 |
20160105930 | Voltage-Leveling Heater Cable - A heater cable produces a substantially level voltage across its cross-section, providing a uniform and controllable thermal output along its length. The heater cable includes at least one center bus wire extending axially along a central axis of the heater cable, and at least one radial bus wire extending axially through the heating cable and positioned adjacent to the center bus wire. The heater cable further includes a thermally and electrically conductive interstitial material disposed around the at least one center bus wire and the at least one radial bus wire, and a jacket disposed about the interstitial material, the at least one center bus wire, and the at least one radial bus wire. | 2016-04-14 |
20160105931 | DEVICE FOR HEAT TREATING PRODUCTS BY MEANS OF MICROWAVES AND HEAT TREATMENT METHOD IMPLEMENTING SUCH A DEVICE - A device for heat-treating products by means of microwaves includes an enclosure ( | 2016-04-14 |
20160105932 | METHOD AND APPARATUS FOR DYNAMIC SELECTION OF ELECTRIC ARC-FURNACE CONTROL SET-POINTS - An electric arc furnace (EAF) including a set of mast hydraulics, a current transformer, a voltage transformer, a legacy control system and a set-point modifier. The legacy control system is in control of the set of mast hydraulics of the EAF, and receives information from the current transformer relative to current being supplied to the EAF and from the voltage transformer relative to voltage being applied to the EAF. The legacy control system using a set of set-points for the control of the set of mast hydraulics, the voltage and the current of the EAF. The set-point modifier communicates with the legacy control system, and executes the steps of: evaluating a cost function of key performance indicators of a previous heat of the EAF, the key performance indicators including electrical energy use and/or electrode consumption; and altering the set of set-points dependent upon the cost function. | 2016-04-14 |
20160105933 | REDUCED-DISTORTION HYBRID INDUCTION HEATING/WELDING ASSEMBLY - In certain embodiments, inductive heating is added to a metal working process, such as a welding process, by an induction heating head. The induction heating head may be adapted specifically for this purpose, and may include one or more coils to direct and place the inductive energy, protective structures, and so forth. Productivity of a welding process may be improved by the application of heat from the induction heating head. The heating is in addition to heat from a welding arc, and may facilitate application of welding wire electrode materials into narrow grooves and gaps, as well as make the processes more amenable to the use of certain compositions of welding wire, shielding gasses, flux materials, and so forth. In addition, distortion and stresses are reduced by the application of the induction heating energy in addition to the welding arc source. | 2016-04-14 |
20160105934 | HIGH-PRODUCTIVITY HYBRID INDUCTION HEATING/WELDING ASSEMBLY - In certain embodiments, inductive heating is added to a metal working process, such as a welding process, by an induction heating head. The induction heating head may be adapted specifically for this purpose, and may include one or more coils to direct and place the inductive energy, protective structures, and so forth. Productivity of a welding process may be improved by the application of heat from the induction heating head. The heating is in addition to heat from a welding arc, and may facilitate application of welding wire electrode materials into narrow grooves and gaps, as well as make the processes more amenable to the use of certain compositions of welding wire, shielding gasses, flux materials, and so forth. In addition, distortion and stresses are reduced by the application of the induction heating energy in addition to the welding arc source. | 2016-04-14 |
20160105935 | HYBRID INDUCTION HEATING/WELDING ASSEMBLY - In certain embodiments, inductive heating is added to a metal working process, such as a welding process, by an induction heating head. The induction heating head may be adapted specifically for this purpose, and may include one or more coils to direct and place the inductive energy, protective structures, and so forth. Productivity of a welding process may be improved by the application of heat from the induction heating head. The heating is in addition to heat from a welding arc, and may facilitate application of welding wire electrode materials into narrow grooves and gaps, as well as make the processes more amenable to the use of certain compositions of welding wire, shielding gasses, flux materials, and so forth. In addition, distortion and stresses are reduced by the application of the induction heating energy in addition to the welding arc source. | 2016-04-14 |
20160105936 | RIPPLE REDUCTION IN LIGHT EMITTING DIODE (LED)-BASED LIGHT BULB THROUGH INCREASED RIPPLE ON AN ENERGY STORAGE CAPACITOR - A buck stage configured as a second stage of a lamp circuit for a light-emitting diode-based (LED-based) light bulb may reduce manufacturing costs associated with the bulb by reducing a size of a capacitor in the lamp circuit. A controller of the buck stage may adjust a duty cycle of a switch to increase a ripple, such as a voltage ripple, across the capacitor to increase accessibility of energy stored in the capacitor and decrease a ripple, such as in output current, to the LEDs. | 2016-04-14 |
20160105937 | Decorative Light String Switchable Between Different Illumination States - A system and method of creating a steady ON and a special effects light effect from a bulb without providing any special wiring thereto. In one embodiment, the bulb contains an illumination element and a controller which produces the special effect in the element. By interrupting the flow of current to the controller periodically, the controller is initialized to its initial steady ON condition. A plurality of steady ON pulses at a high frequency will appear as a steady ON light, instead of pules, thereby producing a steady ON appearance without special wiring. When the current is allowed to flow continuously, the controller produces the special effect. A second embodiment uses parallel polarized light element which produce different effect when power is applied in opposite polarities, thereby providing two effects with no special wiring. | 2016-04-14 |
20160105938 | LED Lamp - A LED lamp includes a body, and a switcher configured for controlling the body. The body includes two power input ends, a controlling signal input end, at least an LED load, and a controlling switch unit. The controlling switch unit controls the LED load to work according to an input signal from the controlling signal input end. The switcher includes a controlling signal output end. The controlling signal output end is electrically connected to the controlling signal input end and outputs controlling signal for the controlling switch unit to control working condition of the LED load. The switcher can be assembled onto any location of the LED lamp, such as two ends of the body, the junction assembly, and so on. As a result, it is easy for people to install, use and control the LED lamp. | 2016-04-14 |
20160105939 | DIMMABLE LED LIGHTING APPARATUS - A dimmable LED lighting apparatus including a power input unit generating drive voltage through rectification of received AC power and outputting the generated drive voltage to the drive controller, an insulation type signal transceiver receiving a pulse width modulation (PWM) signal output from a PWM dimmer and outputting the PWM signal to the drive controller, while electrically insulating the PWM dimmer from the drive controller, a first LED group to an nth LED group, n being a positive integer of 2 or greater, receiving the drive voltage and sequentially operating under control of the drive controller, and a drive controller controlling sequential operation of the first LED group to the nth LED group according to a voltage level of the drive voltage, determining a dimming level based on the received PWM dimming signal, and controlling dimming of the first LED group to the nth LED group based on the determined dimming level. | 2016-04-14 |
20160105940 | LIGHT EMITTING APPARATUS - A light emitting apparatus includes a light emitting unit including a monochromatic light source configured to emit light having a predetermined color, and a wavelength conversion element configured to generate white light from the light emitted by the monochromatic light source, a spectrum detection unit configured to detect a first spectrum distribution from the light emitted by the monochromatic light source, and detect a second spectrum distribution from the white light, and a controller configured to compare the first spectrum distribution and the second spectrum distribution with a first reference spectrum distribution and a second reference spectrum distribution, respectively, and adjust at least one of a wavelength and an intensity of the light emitted by the monochromatic light source. | 2016-04-14 |
20160105941 | LOAD DRIVING APPARATUS WITH WIDE VOLTAGE INPUT - A load driving apparatus is provided, which includes: a DC high voltage generation circuit, configured to selectively receive one of first and second AC input voltages different to each other, and process the received AC input voltage to obtain and provide a DC high voltage, wherein the DC high voltage obtained by processing either the first or second AC input voltages is substantially or approximately the same; a switching circuit, configured to selectively output the DC high voltage or a ground potential in response to two complementary PWM signals, so as to provide an AC signal; a transformer, having a primary side receiving the AC signal from the switching circuit, and a secondary side providing a driving signal to drive a light-emitting load in response to the AC signal; and a control circuit, configured to generate the two complementary PWM signals to control switching of the switching circuit. | 2016-04-14 |
20160105942 | INTEGRATED OCCUPANCY AND AMBIENT LIGHT SENSORS - Technologies are generally described herein for controlling and using integrated occupancy and ambient light sensors. In some examples, a lighting device includes an illumination source, a light sensor, and a transceiver. A determination can be made to determine if the illumination source is operating in an on mode of operation or an off mode of operation. In response to determining that the illumination source is operating in the off mode of operation, an instruction can be received at the lighting device to pulse operation of the illumination source to emit a light pulse. The lighting device can also be configured to receive an instruction to compressively sense, using the light sensor, a light level associated with an area illuminated by the light pulse. The lighting device can output data indicating the light level compressively sensed by the light sensor. | 2016-04-14 |
20160105943 | GRID CONNECTED COORDINATED LIGHTING ADAPTER - In embodiments of the present invention improved capabilities are described for systems and methods that employ a control component and/or power source integrated in an LED based light source to control and/or power the LED light source wirelessly. In embodiments, the LED based light source may take the form of a standard light bulb that plugs into a standard lighting socket or fixture. | 2016-04-14 |
20160105944 | ENERGY DISSIPATIVE TUBES - One aspect of the invention provides an energy dissipative tube including: a length of corrugated stainless steel tubing; a conductive resin layer adjacent to the outside of the tubing; and an insulative resin layer adjacent to the conductive layer. Another aspect of the invention provides an energy dissipative tube consisting of: a length of corrugated stainless steel tubing; a conductive thermoplastic polymer layer adjacent to the outside of the tubing, the conductive thermoplastic polymer layer having a volume resistivity of less than about 10 | 2016-04-14 |
20160105945 | SUBSTRATE COVER - A substrate cover has a conductive frame body covering a surface circumference edge region and an upper circumference region of a substrate drawn with a charged particle beam, the conductive frame body comprising a notch portion provided at part of an inner circumference of the conductive frame body, and a recessed portion provided on the outer circumference side of the upper surface of the conductive frame body, such that the recessed portion is arranged adjacent to the notch portion in a direction of a frame width of the conductive frame body, and a conductive member provided on the recessed portion so as to pass through the notch portion to project inward to the inside of the frame of the conductive frame body, the conductive member comprising a contact portion electrically connected to the surface of the substrate, and a brim portion covering an upper portion of a gap. | 2016-04-14 |
20160105946 | Electrostatic Grounding Apparatus - An ESD grounding apparatus for grounding mats or other equipment to provide a ground connection to mat as well as receptacles for operator wrist straps, and other equipment. The apparatus attaches to a mat by means of securing member such as a clamp or compressing screw rather than using destructive rivets or snaps that create holes in the mat. By using a securing member to secure the device to the mat, the device can be easily removed and reused in another location without damaging or weakening the mat, whereas the previous devices require installing an additional snap into the mat in each location that requires a ground. | 2016-04-14 |
20160105947 | ESD PROTECTION DEVICE - The present invention relates to an electrostatic discharge protection device containing a first insulating substrate and a second insulating substrate; a first opposing electrode and a second opposing electrode which two are disposed between the first insulating substrate and the second insulating substrate; external electrodes connected to the first opposing electrode and the second opposing electrode; and a discharge inducing section disposed apart from the front end of the first opposing electrode and the front end of the second opposing electrode. | 2016-04-14 |
20160105948 | SURGE PROTECTION DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT INCLUDING THE SAME - The present disclosure provides a surge protection device including a ceramic substrate ( | 2016-04-14 |
20160105949 | PRINTED CIRCUIT BOARD AND DISPLAY DEVICE - A printed circuit board and a display device are provided. The printed circuit board comprises a substrate, a package chip, and a metal heat dissipation layer. The package chip is disposed on a first surface of the substrate and comprises a chip body. The metal heat dissipation layer is disposed on a second surface of the substrate. A projection of the metal heat dissipation layer on the first surface of the substrate covers the chip body. The metal heat dissipation layer of the present invention is disposed on the reverse side of the printed circuit board to reduce the temperature of the package chip. | 2016-04-14 |
20160105950 | Electronic Device Having Structured Flexible Substrates With Bends - A flexible substrate may be provided with an array of holes and conductive traces that extend along the flexible substrate between the holes. The flexible substrate may form part of a display or other component in an electronic device. The conductive traces may be metal traces that have meandering path shapes to resist damage upon bending. A polymer coating may be applied over the metal traces to align a neutral stress plane with the metal traces and to serve as a moisture barrier. The holes may allow the flexible substrate to twist and form a three-dimensional shape as the flexible substrate is bent. A rigid or flexible protective coating may be formed by depositing a liquid polymer precursor on the flexible substrate and curing the liquid polymer precursor. | 2016-04-14 |
20160105951 | DISPLAY DEVICE - A display device, including a display panel; a flexible printed circuit board (FPCB) including a driving integrated circuit (IC) and attached to a rear surface of the display panel; a conductive member at the rear surface of the display panel; an FPCB connection pad connected to the conductive member at the rear surface of the display panel and connected to the FPCB; an FPCB connection terminal connected to the FPCB connection pad and at the FPCB; and a ground at the FPCB. | 2016-04-14 |
20160105952 | LIQUID CRYSTAL DISPLAY DEVICE HAVING TOUCH SCREEN AND TEST METHOD OF TOUCH PANEL - A liquid crystal display device having a touch screen and a test method of a touch panel are provided that can prevent a block dim that may occur in a lighting test. The liquid crystal display device includes common voltage probe pads, which are connected to common voltage output pads and are larger than the common voltage output pads, in a non-display area of the touch panel. | 2016-04-14 |
20160105953 | METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD - For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. | 2016-04-14 |
20160105954 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof. | 2016-04-14 |
20160105955 | CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE - A circuit substrate includes: a plurality of signal wirings formed at different positions of the circuit substrate in a thickness direction and extending in parallel in the circuit substrate; and ground layers or power supply layers formed at both sides of the circuit substrate in the thickness direction by interposing the plurality of the signal wirings between the ground layers or between the power supply layers, wherein the plurality of signal wirings are electrically coupled with each other by a plurality of conductors formed at an interval narrower than an interval by which a resonance is caused. | 2016-04-14 |
20160105956 | PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME - The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member. | 2016-04-14 |
20160105957 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having a cavity, an interlayer insulating layer formed on the substrate such that the interlayer insulating layer is covering the cavity of the substrate, a conductor layer formed on the interlayer insulating layer, an electronic component accommodated in the cavity of the substrate and including a rectangular cuboid body and three terminal electrodes such that each of the three terminal electrodes has a metal film form formed on an outer surface of the rectangular cuboid body, and via conductors formed in the interlayer insulating layer such that the via conductors are connecting the conductor layer and the three terminal electrodes of the electronic component. The three terminal electrodes are arrayed in parallel on the outer surface of the rectangular cuboid body such that adjacent terminal electrodes have the opposite polarities. | 2016-04-14 |
20160105958 | MULTI-LAYER SUBSTRATE, ELECTRONIC DEVICE USING MULTI-LAYER SUBSTRATE, MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE, SUBSTRATE, AND ELECTRONIC DEVICE USING SUBSTRATE - In a multi-layer substrate, a glass cloth of a build-up layer is deformed toward a land below the land. A thickness of a resin layer of the build-up layer from the glass cloth to a surface adjacent to the land is set to be smaller than a dimension from the glass cloth to a front surface of a core layer. With the above configuration, a progress or an enlargement of a crack can be suppressed from a stage in which the crack is smaller. Therefore, the progress and the enlargement of the crack can be delayed. As a result, even if the crack is generated, an insulating property between the land and an inner layer wire is ensured, and the land and the inner layer wire can be restricted from being short-circuited. | 2016-04-14 |
20160105959 | PAD ELECTRODE STRUCTURE, FLAT DISPLAY APPARATUS COMPRISING THE PAD ELECTRODE STRUCTURE, AND THE METHOD OF MANUFACTURING THE FLAT DISPLAY APPARATUS - A pad electrode structure including a substrate, an insulating layer on the substrate, a pad electrode on a portion of the insulating layer, and an organic insulating layer on the pad electrode and having an opening exposing an upper surface of the pad electrode, wherein an insertion area is in the insulating layer near the substrate, and wherein the organic insulating layer is separated from an end portion of the substrate, and a portion of the organic insulating layer is in the insertion area. | 2016-04-14 |
20160105960 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A multilayer wiring board includes a main wiring board including insulation layers, first via conductors formed in the insulation layers, and a first conductive layer including first mounting pads such that the first mounting pads are positioned to mount a first electronic component and a second electronic component adjacent to each other on the main wiring board, and a wiring structure body mounted on the main wiring board such that the wiring structure body is positioned in an outermost insulation layer of the insulation layers, the wiring structure body including a second conductive layer which includes second mounting pads such that the second mounting pads are positioned to connect to the first electronic component and the second electronic component mounted on the main wiring board. The first via conductors are formed such that the first via conductors have diameters which increase in a same direction. | 2016-04-14 |
20160105961 | Method for Producing a Printed Circuit, Printed Circuit Obtained by This Method and Electronic Module Comprising Such a Printed Circuit - The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive material insulated from each other by a layer of insulating material, connection holes extending through the layer of insulating material and blocked by one of the layers of electrically conductive material, an area free of conductive material being provided in the other layer of electrically conductive material around the connection holes. The invention also concerns a printed circuit for a chip card produced using this method and a chip card module including such a printed circuit. | 2016-04-14 |
20160105962 | FLEXIBLE SUBSTRATE AND ELECTRONIC APPARATUS EQUIPPED WITH SAME - A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film. The bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed. | 2016-04-14 |
20160105963 | INTERCONNECT TRANSITION APPARATUS - A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof. | 2016-04-14 |
20160105964 | ELECTRIC CIRCUIT AND METHOD OF MANUFACTURE - In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure. | 2016-04-14 |
20160105965 | Method for Manufacturing a Surface Mount Device - A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day. | 2016-04-14 |
20160105966 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity. | 2016-04-14 |
20160105967 | EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME - An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern. | 2016-04-14 |
20160105968 | BIOCOMPATIBLE RIBBON CABLE WITH NARROW FOLDED SECTION - A biocompatible, micro-fabricated ribbon cable is described in which at least one set of conductors diverges laterally into a bypass wing that forms an aperture through the ribbon cable. The bypass wing is folded in a line through the aperture and over a central portion of the ribbon cable, resulting in a ribbon cable with a narrow, stacked region. The narrow region can fit through small incisions in membranes, such as through an incision in a sclera of an eyeball. The ribbon cable can have an integrally-formed electrode array for attaching to a retina of an eyeball and other electronics for sending signals to the electrode array. | 2016-04-14 |
20160105969 | METHOD FOR PRODUCING SOFT MAGNETIC FILM LAMINATE CIRCUIT BOARD - A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of | 2016-04-14 |
20160105970 | FINE LINE 3D NON-PLANAR CONFORMING CIRCUIT - A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed. | 2016-04-14 |
20160105971 | DEPOSITION APPARATUS AND DEPOSITION METHOD USING THE SAME - A deposition apparatus and a deposition method are disclosed. In one aspect, the deposition apparatus includes an electrostatic chuck and a tensile plate attached to and formed over the electrostatic chuck. The deposition apparatus further includes an elevation unit configured to move the tensile plate towards the substrate and a tensile unit configured to apply a tensile force to the tensile plate to expand the tensile plate. | 2016-04-14 |
20160105972 | ELECTRICAL PRODUCT MANUFACTURING METHOD - A method for preventing a molded body made of low melting point resin from being thermally damaged when external connection terminals provided on the molded body and external connection terminals provided on a flexible sheet are joined together via soldering. The method includes arranging the connection terminal of the molded body and the connection terminal of the flexible sheet such that the connection terminals face each other, and an electromagnetic induction heating performing electromagnetic induction heating after the arranging. | 2016-04-14 |
20160105973 | MICRO-FABRICATED GROUP ELECTROPLATING TECHNIQUE - Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes. | 2016-04-14 |
20160105974 | INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A SUBSTRATE - In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described. | 2016-04-14 |
20160105975 | FILLING THROUGH-HOLES - Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper. | 2016-04-14 |
20160105976 | ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a panel, a basic frame, a first frame, a second frame, and a sleeve. Both the first frame and the second frame are located between the panel and the basic frame. An inner space is defined by the panel, the basic frame, the first frame, and the second frame. A first inlet is surrounded by the panel, the first frame, and the basic frame and a second inlet is surrounded by the panel, the second frame, and the basic frame. Both the first inlet and second inlet communicate with the inner space. The sleeve covers outside the first frame and the second frame to shield the first inlet and the second inlet. | 2016-04-14 |
20160105977 | Unit for attaching and distribution of multimedia peripherals - The unit comprises an assembly for clasping-escaping and a receptacle-terminal assembly. The assembly for clasping-escaping includes an L-shape subassembly having a vertical wall provided with backwards projecting, vertically spaced and inverted at 90″ T-beams for connecting the L-shape subassembly to a parallelepipedic open box subassembly of a receptacle-terminal assembly. A bottom plate, located at the lowest part of the vertical wall extends outwardly. A passage above the bottom plate has a base terminating in a pair of serrations. The clasping-escaping includes a flat bar that after folding itself extends into a diverging strip provided with a multitude of serrations for meshing with the pair of serrations when a component is clasped. The parallelepipedic open box subassembly incorporates a plurality of T profile protrusions for connecting with the backwards projecting, vertically spaced and inverted at 90″ T-beams. | 2016-04-14 |
20160105978 | MOUNTING APPARATUS - A mounting apparatus includes an enclosure for mounting a receiving member, a bracket, and a movable member mounted to the enclosure. The receiving member is configured to receive an electronic component. The bracket includes a bracket body movably mounted to the enclosure and an operating member mounted to the bracket body. The movable member includes a movable body and a movable block mounted to the movable body. The movable body is mounted to the bracket body. The operating member is pressed in a first direction toward the enclosure to drive the bracket body to rotate, the movable body moves a second direction away from the enclosure, thereby the movable block can move in a third direction away from the enclosure to push the electronic component and the electronic component can move in the second direction. The third direction is different from the first direction. | 2016-04-14 |
20160105979 | AUTOMATIC LOCKING MECHANISM AND ELECTRONIC DEVICE THEREWITH - An automatic locking mechanism is configured to lock a housing with a latching groove. The automatic locking mechanism includes a bracket and a magnet. An inclined surface is defined on an edge of the magnet. The bracket defines a groove. A restriction member is positioned in the groove configured to restrict the magnet. The housing is locked to the bracket when the magnet is simultaneously received in both the groove and the latching groove via the attraction of the magnet to the housing. The housing is released when the housing is continuously resisted against the inclined surface of the magnet until the magnet is completely received in the groove. In addition, an electronic device with the automatic locking mechanism is disclosed. | 2016-04-14 |
20160105980 | LID BODY, PACKAGE, AND ELECTRONIC APPARATUS - A lid body includes a plate body containing silicon; a protective film disposed on a main surface of the plate body, the protective film protecting the plate body from a joining brazing material; a frame-like hole passing through the protective film, the frame-like hole being provided at an outer periphery of the protective film; and a sealing metallic layer made of metal, disposed so as to fill in the hole. | 2016-04-14 |
20160105981 | FRAMELESS TELECOMMUNICATIONS ENCLOSURE - Telecommunications enclosures are described in this document. In one aspect, a telecommunications enclosure includes side panels having seals and an enclosure top connected, independent of a frame, to top ends of the side panels. The enclosure top has an enclosure top outer end that extends between the side panels and includes a seal. An interior panel is connected, independent of a frame, to side panels and has an interior panel outer end that extends between the side panels. The interior panel is separated from the enclosure top by a first distance and separated by a second distance from bottom ends of the side panels. A removable door is formed to engage the seals when the removable door is secured to the frameless telecommunications enclosure. | 2016-04-14 |
20160105982 | POWER SUPPLY MODULE, PACKAGE FOR THE POWER SUPPLY MODULE, METHOD OF MANUFACTURING THE POWER SUPPLY MODULE AND WIRELESS SENSOR MODULE - A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member. | 2016-04-14 |
20160105983 | Insertable Power Unit with Mounting Contacts for Plugging into a Mother Board - In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board. | 2016-04-14 |
20160105984 | Power Unit with Conductive Slats - In one implementation, a power unit for plugging into a mother board includes a power module situated on a substrate. The substrate is situated on conductive slats, each having an extended end away from the power module. Each of the conductive slats provides a mounting contact of the power unit. Each mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contacts are configured to provide electrical connection between the power module and the mother board. | 2016-04-14 |
20160105985 | OPERATING CONTROL UNIT FOR AN ELECTRICAL APPLIANCE AND ELECTRICAL APPLIANCE - An operating control unit for an electrical appliance with an operating field is mounted on an underside of the operating field. The operating control unit includes a frame body, a flat component carrier being mounted to the frame body from behind and having piezo-active sensor elements, and a back support mounted to a back side of the frame body and enclosing the component carrier. The operating control unit has after pre-assembly two different assembly states. In a pre-mount state the back support is fixed to the frame body enclosing the component support, and some locking means of the frame body are formed as pre-mount locking means and are holding the back support against disassembly. In a final-assembly state the back support is pressed against the frame body with less distance between the two, and final-assembly locking means of the frame body are holding the back support in a closer position than the pre-mount locking means. | 2016-04-14 |
20160105986 | Pluggable Power Cell For An Inverter - In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage. | 2016-04-14 |
20160105987 | SLIDE RAIL INTERLOCKING APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME - An electronic device includes a cabinet, a number of chasses received in the cabinet, a number of first slide rails mounted to the cabinet, a second slide rail mounted to each chasses fitting about the corresponding first slide rail, a rotating member connected to the cabinet, and a resilient member installed between the rotating member and the cabinet. The rotating member includes an abutting bar and a stopper bar opposite to the abutting bar. A front end of each second slide rail forms a first guiding surface. A block protrudes from the front end of each second slide rail. When one of the chasses is pulled out from the cabinet, the first guiding surface abuts against the abutting bar to rotate away from the chasses, the stopper bar is rotated to adjacent to the chasses to latch the blocks of the other chasses, and deforming the resilient member. | 2016-04-14 |
20160105988 | Modular Power Skid Assembled with Different Electrical Cabinets and Components Mounted on the Skid - An integrated platform assembled with different electrical cabinets and components mounted on a framework in order to provide a complete datacenter critical power distribution package. The integrated platform supports the weight of cabinet enclosures and UPSs mounted onto a skeletal framework, which acts as an equipment support structure and a cable routing support system. Main and redundant power supply wiring is routed along the skeletal framework to and between the cabinet enclosures and the UPSs mounted thereon. Electrical connections between the cabinets are internally connected via bus bars as switchgear cabinets. The skeletal framework has top and bottom rails run substantially parallel to each other with cross bars connecting the top and bottom rails and a top horizontal surface to which one or more of the cabinet enclosures are mounted. The skeletal framework and cabinet enclosures are fabricated prior to installation and installed as a monolithic pre-wired pre-assembled integrated platform. | 2016-04-14 |
20160105989 | Adaptive Information Handling System Rack Rail Mount - A rail adjustable mount adjusts a rail to support information handling system chassis with different depths in racks of different depths. The adjustable mount couples to a rack front with a sliding portion extending into the rack interior. The adjustable mount sliding portion slidingly engages a guide of the rail to allow adjustment of the rail relative to the rack so that a rail fits into a rack having a depth that is greater than the length of the rail's housing. A floating portion of the rail supports the rail at the rear of the rack and allows the rail position to float relative to the rear of the rack. A biasing device of the adjustable mount biases the rail towards the front of the rack to aid full extension and retraction of the rail at the rack. | 2016-04-14 |
20160105990 | ELECTRONIC SHELF ASSEMBLY INCORPORATING SPRING LOADED CIRCUIT PACK LATCH RAILS - An electronic shelf assembly configured to selectively receive a circuit pack including a pivotable handle incorporating a retention hook, the electronic shelf assembly including: a shelf assembly housing configured to selectively receive the circuit pack; a support rail coupled to the shelf assembly housing; a latch rail member movably coupled to the support rail and defining a recess configured to selectively receive and retain the retention hook of the pivotable handle of the circuit pack, thereby selectively securing the circuit pack within the shelf assembly housing; and a spring mechanism coupled to the latch rail member and the support rail, wherein the spring mechanism allows for relative movement of the latch rail member with respect to the support rail while biasing the latch rail member towards the support rail, thereby selectively biasing the circuit pack into the shelf assembly housing. | 2016-04-14 |
20160105991 | THERMAL INTERPOSER SUITABLE FOR ELECTRONIC MODULES - A thermal interposer for use in providing a mating interface between a heat sink and an electronic module includes an elongated body portion having two opposing surfaces. On one surface, a plurality of press-fit pegs are defined that extend upwardly and outwardly away from the interposer body portion. On the other, opposing surface, a plurality of contact arms are defined that extend, in cantilevered fashion, downwardly and away from the interposer body portion. The press-fit pins are configured to enter grooves formed in a heat sink in a manner to form intimate, metal to metal, contact while the contact arms are configured to contact the top surface of an electronic module with reliable normal force. | 2016-04-14 |
20160105992 | APPARATUS FOR COOLING AND MOUNTING A CIRCUIT BOARD - An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment. | 2016-04-14 |
20160105993 | Air Deflection System - An air deflection system includes a cabinet, where an air vent is disposed on a side of the cabinet, the air vent is located in a lower part of the side, an air vent is disposed at the top of the cabinet, and the cabinet is provided with a side for cool air to enter; and further includes at least one air deflection cabinet, where an air vent is disposed at the top of the air deflection cabinet, the air-vent-disposed side of the air deflection cabinet clings to the air-vent-disposed side of the cabinet, and the side air vent of the air deflection cabinet is in communication with the side air vent of the cabinet. By means of the air deflection system, bottom warm air is exhausted from the top, which improves efficiency of warm air processing of an equipment room. | 2016-04-14 |
20160105994 | CONTAINER DATA CENTER - A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a control device. The container defines a number of air inlets and a number of air outlets. A number of first shielding plates movably coupled to the container to cover the air inlets and a number of second shielding plates movably coupled to the container to cover the air outlets. The container forms a cooling air channel at one side of the server cabinets and a heat air channel at an opposite side of the server cabinets. The ventilation pipe is communicated between the heat dissipation apparatus and at least one of the air inlets, the ventilation pipe defines a opening communicating with the heating air channel, and a third shielding plate is movably coupled to the ventilation pipe to cover the corresponding through hole. | 2016-04-14 |
20160105995 | COOLING AIR SYSTEM AND SPLASH-WATER PROTECTION ARRANGEMENT FOR A COOLING AIR SYSTEM OF A HOUSING - The disclosure relates to a splash-water protection arrangement for a cooling air system of a housing of an electrical or electronic device having an air box having an air inlet grille and an air outlet opening through which air outlet opening ambient air sucked in at the front side exits the air box. The air inlet grille has a multiplicity of profiled strips that are arranged in at least two planes lying one behind the other in a main air inflow direction, wherein the profiled strips lying within a plane are spaced apart from one another and the profiled strips lying in the various planes overlap laterally. | 2016-04-14 |
20160105996 | FAN HOLDER FOR A FAN, IN PARTICULAR OF A SWITCH CABINET - A fan holder for a fan includes a frame that has an opening through which a gaseous medium flows during operation. The opening forms an accommodating region that is designed to accommodate various replaceable inserts, in particular a filter insert and a flap device, and has at least one retaining device for fastening the particular insert. | 2016-04-14 |
20160105997 | LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT - A liquid cooling system for an electronic component, comprising an exchanger plate having a first wall suitable to be at least partially interfaced to an electronic component to be cooled and a second wall, placed in contact with a cooling liquid, a plurality of heat sink elements, associated to said second wall and influenced by the cooling fluid so as to dissipate heat, wherein the heat sink elements are shaped according to regular patterns that extend parallel to a main extension direction and that comprise a plurality of loops, wherein each loop comprises a continuous curvilinear section that extends cantilevered from a first to a second attachment end fixed to the second wall. Advantageously, the continuous curvilinear section is shaped so that, a first and a second plane being traced perpendicular to the second wall passing respectively through said first and second ends, the continuous curvilinear section extends at least partially outside the space defined between said perpendicular planes. | 2016-04-14 |
20160105998 | Electronic Component Cooling - A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component. | 2016-04-14 |
20160105999 | COOLING DEVICE AND COOLING FIN - A cooling device includes a cooler. The cooler includes a base, a plurality of cooling fins secured to the base, and a heat pipe inserting through the cooling fins. Each cooling fin includes a fin body and a pressed portion extending from the fin body. The fin body includes a hole area, which defines a receiving hole. A portion of the heat pipe extends through the receiving hole; the pressed portion includes at least one guiding portion, which is configured to guide air to flow towards the hole area from the fin body. | 2016-04-14 |
20160106000 | LOW PROFILE HEAT SINK - A heat sink for an electronic component includes a base having a width. The base has a greater thickness at a middle portion along the width than at opposite end portions along the width. A plurality of elongate fins project from an upper surface of the base and extend in directions perpendicular to the upper surface. | 2016-04-14 |
20160106001 | GANGED SHIELDING CAGE WITH THERMAL PASSAGES - A ganged shielding cage with improved heat transfer capabilities is disclosed. The cage has a plurality of module-receiving openings, or bays arranged in serial, widthwise order. Each such opening is separated from an adjacent opening by an intervening wall that defines, at least partially, a continuous passage, extending lengthwise and communicating with the front and rear portions of the cage. This passage permits air flow to occur between adjacent openings of the cages and between adjacent modules held thereby. | 2016-04-14 |
20160106002 | Internal heat-dissipation terminal - The disclosure provides an internal heat-dissipation terminal, wherein the terminal comprises at least one cavity in which heat-storage material is arranged. The cavity is located in an area without a device in the terminal. The technical solution of the disclosure can be applied to substantially enhance the heat storage capability of the terminal. | 2016-04-14 |
20160106003 | AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES - Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed. | 2016-04-14 |
20160106004 | CARBON NANOTUBES DISPOSED ON METAL SUBSTRATES WITH ONE OR MORE CAVITIES - Provided herein are carbon nanotubes disposed on a metal substrate containing one or more cavities, methods of making thereof and uses thereof. In some embodiments, an apparatus is provided which includes carbon nanotubes carbon nanotubes disposed on a metal substrate containing one or more cavities. | 2016-04-14 |
20160106005 | CARBON NANOTUBES AS A THERMAL INTERFACE MATERIAL - Provided herein is an apparatus including a thermal interface material incorporating carbon nanotubes attached to a depression on a heat sink, where the thickness of the thermal interface material is greater than the depth of the depression on the heat sink and methods of making thereof. The thermal interface material may be further attached to a functional device(s) and transfers heat from the device(s) to the heat sink. | 2016-04-14 |
20160106006 | HEAT DISSIPATION DEVICE - Provided is a heat dissipation device. The heat dissipation device includes a thermal conductive plate ( | 2016-04-14 |
20160106007 | THERMAL DUCTING FOR IMPROVED COOLING IN RACK DOMAINS - A thermal ducting rail receives a rack device in a rack chassis. The thermal ducting rail includes air flow guiding elements that enable cooling air from a front face of the rack chassis to be directed to an external side of the thermal ducting rail and from the external side to a rear face of the rack chassis. The thermal ducting rail enables rack devices equipped with side-to-side cooling to receive cooling air in a rack chassis with front-to-back cooling, without extending beyond a unit height occupied by the rack device. | 2016-04-14 |
20160106008 | Air Handling Unit and Method of Operating the Same - An air handling unit, particularly for data center cooling, operates to cool a flow of return air from a conditioned space using a flow of ambient air. The return air is recirculated to the conditioned space as supply air. The flow of ambient air can be adiabatically cooled to a lower temperature to provide additional cooling. A flow of makeup air can be joined with the cooled return air to form the supply air, and can be sourced from the ambient environment directly or from the heated flow of ambient air. | 2016-04-14 |
20160106009 | SYSTEM AND METHOD OF PROVIDING COMPUTER RESOURCES - A data center system can include a mobile support structure; one or more enclosures for removable electronic equipment where the enclosures are housed by the support structure; a cooling system in fluid communication with the enclosures for cooling of the electronic equipment where the cooling system is housed by the support structure; and a power system operably connected to the electronic equipment and the cooling system for supplying power thereto where the power system comprises a generator housed by the support system. Other embodiments are disclosed. | 2016-04-14 |
20160106010 | BOX-TYPE VEHICLE-MOUNTED CONTROL DEVICE - Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. | 2016-04-14 |
20160106011 | ELECTRIC POWER CONVERTER - An electric power converter includes a laminated body, a capacitor, a case, and a pressing member. The laminated body is formed by laminating semiconductor modules and cooling pipes. The pressing member presses the laminated body in a laminating direction of the laminated body. The case has outer wall portions that form an outer shell, and partition wall portions formed in the case and are connected to the outer wall portions. The capacitor has capacitor elements and a sealing member. The sealing member is filled in a capacitor housing space in a state where the capacitor elements are sealed. Pressing force of the pressing member is applied to an interposing partition wall portion interposing between the laminated body and the capacitor among the partition wall portions. A thickness of the interposing partition wall portion is made thinner than any other parts of the outer wall portions. | 2016-04-14 |
20160106012 | MAGNETIC SHIELDING SHEET FOR DIGITIZER AND PORTABLE TERMINAL HAVING SAME - A magnetic field shielding sheet includes: a magnetic field shielding main sheet disposed on the back of the digitizer to thus prevent affecting the digitizer; and a magnetic field shielding sub-sheet laminated in a dual on at least one of four side edges of the magnetic field shielding main sheet, and to prevent affecting the digitizer by the magnesium frame inside the portable terminal, wherein the magnetic field shielding main sheet includes a shielding layer made of a plurality of pieces, a cover layer adhered to one surface of the shielding layer, and a double-sided tape adhered to the other surface of the shielding layer. A magnetic field arising from various components incorporated in a portable terminal device is shielded by the magnetic field shielding main sheet while the magnetic field shielding sub-sheet prevents a digitizer from being affected by a magnesium frame, thereby enhancing performance of the digitizer. | 2016-04-14 |
20160106013 | Hybrid tea rose plant named 'MEIHYALFEU' - A new and distinct Hybrid Tea rose plant is provided that commonly commences blooming early in the season and forms abundantly and substantially continuously attractive ocher double blossoms which display a slight fragrance. The growth habit is semi-erect, and slight vegetation is formed. The vegetation is very dense and bears a glossy aspect on the upper surface that contrasts nicely with the blossom coloration. The disease tolerance is very good particularly with respect to black spot. The plant is well suited for providing attractive ornamentation in parks and gardens. | 2016-04-14 |
20160106014 | Apple tree, 'TCL3' - A new and distinct variety of apple tree is described and which is distinguished as to novelty by producing an attractively colored apple which is ripe for harvesting and shipment on and about the last week of January under the ecological conditions prevailing near Havelock North, New Zealand. | 2016-04-14 |
20160106015 | Grapevine plant named 'Sugrafortysix' - A new and distinct grapevine variety ‘Sugrafortysix’ is characterized in that it produces large, red and ovoid berries and has a large bunch size. The berries of ‘Sugrafortysix’ are firm and very juicy. The new variety ‘Sugrafortysix’ is characterized by an earlier harvest date compared to ‘Scarlet Royal’ (U.S. Plant Pat. No. 16,229). | 2016-04-14 |
20160106016 | Clematisplant named 'YAKU26' - A new and distinct | 2016-04-14 |
20160106017 | Phalaenopsis plant named 'TJ PURPLE QUEEN' - A new and distinct cultivar named ‘TJ PURPLE QUEEN’ is disclosed, characterized by unique flowers which are large white with real purple petals and compact plant habit. The new variety is a | 2016-04-14 |
20160106018 | GERANIUM PLANT NAMED 'MISS HEIDI' - A new and distinct cultivar of | 2016-04-14 |