14th week of 2013 patent applcation highlights part 24 |
Patent application number | Title | Published |
20130083490 | ELECTRONIC SYSTEM FOR WAVE SOLDERING - An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces. | 2013-04-04 |
20130083491 | Electronic Devices With Cover Layers Mounted to Displays - An electronic device may be provided with a display cover layer mounted to the device using an adhesive bond with a display. The display may be a flexible display. The flexible display may include Organic Light Emitting Diode display technology. The display may be mounted to a rigid support structure. The rigid support structure may be mounted to a device housing member. Mounting the display cover layer to the display may eliminate the need to mount the display cover layer to the device housing and may allow active display pixels to be visible under the display cover layer closer to the device housing than in conventional devices. Providing the electronic device with active display pixels closer to the device housing may reduce the need for an inactive border around the display and may improve the aesthetic appeal of the electronic device. | 2013-04-04 |
20130083492 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A power module package includes: a substrate having a stepped portion and a non-stepped portion; a power circuit unit electrically connected to a circuit wiring provided in the stepped portion; a control circuit unit electrically connected to a circuit wiring provided in the non-stepped portion; and a molding unit molded on the substrate to seal the power circuit unit while exposing the circuit wiring of the non-stepped portion. Therefore, it is possible to improve thermal characteristics of the power module package, implement high reliability between the power circuit unit and the control circuit unit, improve design freedom of the power module package, and implement miniaturization of products. | 2013-04-04 |
20130083493 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50% is 0.5 μm or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 μm or less. | 2013-04-04 |
20130083494 | THREE-DIMENSIONAL ELECTRONICS PACKAGING - Solutions for providing stackable electronics packaging are provided. In some embodiments, electronic components are accommodated in the cavity of a printed circuit board (PCB) or printed circuit assembly (PCA), or co-accommodated in adjoining cavities of adjacent, stacked PCAs or PCBs. The cavities allow for closer stacking of the PCAs or PCBs. In some embodiments, a PCA comprises an encapsulant conformally layered over a PCB with electronic components mounted on top and bottom. Power and/or signal channels are routed through the encapsulant to the top and/or bottom layers. The encapsulated PCAs may be stacked. In various embodiments, stackable PCAs are modular, facilitating customization. | 2013-04-04 |
20130083495 | TUNER MODULE - There is provided a tuner module used for a television (TV) or a set top box, and more particularly, to a tuner module having a significantly reduce size. The tuner module includes: a tuner including a circuit board having at least one electronic component mounted thereon, and a cover coupled to the circuit board and having an opened bottom portion so as to allow the circuit board to be received therein; and a main board having the tuner mounted on one surface thereof, wherein the main board includes a ground pad formed thereon to correspond to a position in which the tuner is mounted. | 2013-04-04 |
20130083496 | Flexible Electronic Devices - Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery. A flexible printed circuit may include flexible and rigid portions or openings that allow some rigid portions to flex with respect to other rigid portions. | 2013-04-04 |
20130083497 | INTEGRATED CIRCUIT BOARD AND DISPLAY SYSTEM - An integrated circuit board includes a substrate, a plurality of electronic components and at least one antenna. The substrate has a central area and two edge areas, wherein the central area is between the two edge areas. The electronic components are disposed on the central area. The antenna is disposed on at least one of the two edge areas, wherein there is predetermined distance between the antenna and the electronic components. | 2013-04-04 |
20130083498 | Device and Method for a Signal Shield - Disclosed herein is a radio frequency shield device that includes, an outer cover having one or more displacement protrusions extending from an outer cover bottom surface and one or more cover fasteners, an inner cover positioned inside the outer cover, wherein at least a portion of the inner cover is deflected downward by the displacement protrusions, and a plurality of fence walls having one or more fence fasteners for interlocking with the cover fasteners, wherein the inner cover is positioned at least partially over the fence walls to form at least one of a primary seal and secondary seal. | 2013-04-04 |
20130083499 | CIRCUIT BOARD UNIT, CARTRIDGE, AND MANUFACTURING METHOD THEREOF - A circuit board unit which is attached to the cartridge includes a circuit board on which an electronic component is mounted, a first member having a surface opposing the circuit board, and a second member which is bonded to a region of the surface of the first member which region is different from the region of the surface opposing the circuit board. The circuit board is not fixed to the first member and the second member and is retained between the first member and the second member with gaps extending in an orthogonal direction orthogonal to the surface and in a surface direction in parallel to the surface. | 2013-04-04 |
20130083500 | INTERFEROMETRIC COLOR MARKING - Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black. | 2013-04-04 |
20130083501 | METHOD FOR SOLDERING A CAP TO A SUPPORT LAYER - One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder. | 2013-04-04 |
20130083502 | PACKAGE SUBSTRATE - A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface. | 2013-04-04 |
20130083503 | PACKAGING SUBSTRATE HAVING A HOLDER, METHOD OF FABRICATING THE PACKAGING SUBSTRATE, PACKAGE STRUCTURE HAVING A HOLDER, AND METHOD OF FABRICATING THE PACKAGE STRUCTURE - A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided. | 2013-04-04 |
20130083504 | ELECTRONIC DEVICE - An electronic device includes: a first plate; a wiring board arranged on the first plate and configured to have a plurality of first terminals on a surface opposite to a surface facing the first plate; an electronic component arranged above the wiring board and configured to have a plurality of second terminals on a surface facing the wiring board; a connecting unit arranged between the wiring board and the electronic component and configured to electrically couple the first terminals and the second terminals; a second plate arranged on the electronic component; a fixing unit arranged in an area outside of an area where the electronic component is placed and configured to pressurize the first plate and the second plate; and a pressing unit arranged below the area where the electronic component is placed and configured to press the wiring board toward the electronic component. | 2013-04-04 |
20130083505 | WIRING BOARD, CONNECTOR AND ELECTRONIC APPARATUS - Disclosed herein is a wiring board including: a differential-line pair including two lines for transmitting differential signals; and two connection pads each electrically connected to one of the two lines pertaining to one of the differential-line pairs, wherein a plurality of the differential-line pairs are laid out side by side; a plurality of the connection pads are provided to form a plurality of columns; and on each of the columns of the connection pads, any two the connection pads electrically connected to the lines pertaining to the same differential-line pair are provided at locations adjacent to each other on the same one of the columns. | 2013-04-04 |
20130083506 | MULTI-LAYER TRANSPARENT STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS - Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices). | 2013-04-04 |
20130083507 | Display Holder Assembly - A device holder assembly is disclosed for securing an electronic device to a stable surface. In one embodiment, the device holder assembly comprises a base component and a device component. The device component is movable between a disengaged position in which the base component and the device component are not in contact with one another, and an engaged position in which a mating protuberance of the base component cooperates with an axial aperture formed by the device component. | 2013-04-04 |
20130083508 | HAND ILLUMINATING APPARATUS - A hand illuminating apparatus is described. According to one implementation of the present invention, the hand illuminating apparatus includes a hand which is driven to rotate by a hand spindle. A light source is provided in a position below the hand spindle. A first optical guiding section is provided to guide light from the light source from a lower edge to an upper edge of the hand spindle. A second optical guiding section, in which a plurality of optical waveguides are formed on the hand, is provided to guide light which exits from the first optical guiding section from a base to a tip of the hand. | 2013-04-04 |
20130083509 | IMAGE GENERATING DEVICE WITH IMPROVED ILLUMINATION EFFICIENCY - An image generating device includes a first light source, a light conversion element, and an image generating element. The first light source is for generating light with a first wavelength. The light conversion element is disposed on a light path of the light with the first wavelength. The light conversion element includes a first quantum dot layer for converting light with wavelengths under a second wavelength to light with the second wavelength, and a second quantum dot layer for converting light with wavelengths under a third wavelength to light with the third wavelength. The first wavelength is smaller than the second wavelength, and the second wavelength is smaller than the third wavelength. The image generating element is for generating images according to light transmitted from the light conversion element. | 2013-04-04 |
20130083510 | LIGHTING DEVICE - A lighting device may be provided that includes: a light emitting device; and an optical exciter which is disposed over the light emitting device and emits light excited by the light emitted from the light emitting device, wherein the optical exciter includes at least one of a yellow fluorescent material, a green fluorescent material and a red fluorescent material, wherein the optical exciter moves over the light emitting device, and wherein a color temperature of the light emitted from the optical exciter varies according to the movement of the optical exciter. | 2013-04-04 |
20130083511 | LUMINAIRE - A luminaire capable of contacting a lamp device to a luminaire main body is provided. | 2013-04-04 |
20130083512 | BACKLIGHT UNIT AND DISPLAY DEVICE HAVING THE SAME - A backlight unit includes a panel guide mold that comprises a plurality of first mold units and a plurality of second mold units; a bottom cover including a plurality of first sidewalls and a plurality of second sidewalls; and a light supply unit disposed between the panel guide mold and the bottom cover, wherein the plurality of second sidewalls are offset in an outward direction relative to the plurality of first side walls to form an alternating, step-like structure, where the second sidewall protrudes, the second mold unit is recessed, wherein each of the plurality of first sidewalls is inserted and coupled to a corresponding one of the plurality of first mold units offset in an outward direction, and wherein each of the plurality of second sidewalls offset in an outward direction receives and is coupled to a corresponding one of the plurality of second mold units | 2013-04-04 |
20130083513 | LIGHT SOURCE UNIT, BACKLIGHT UNIT, AND FLAT PANEL DISPLAY DEVICE - A light source unit ( | 2013-04-04 |
20130083514 | LIGHTING ASSEMBLY FOR CEILING BOARD - The present invention discloses a ceiling, in particular to a ceiling board with modularized composite LED lamps. The ceiling comprises a light bar ( | 2013-04-04 |
20130083515 | LED LAMP - An LED lamp includes a lamp shell, a lamp holder comprising a power module received in the lamp shell, an LED module received in the lamp shell and electrically connected to the power module, and a heat sink mounted on the LED module. The heat sink includes a fin set having a plurality of fins stacked together. The fin set thermally connects the LED module and the power module. The fin set defines a central chamber to receive the power module therein. | 2013-04-04 |
20130083516 | HIGH-POWER OPTICAL ELEMENT STREET LAMP USING THERMOCOUPLE - A high power optical element streetlamp using a thermocouple includes a body unit, a lamp head unit, and a power supply unit fixed to the body unit. The lamp head unit includes a circuit board connected to the power supply unit, at least one optical element installed on the lower surface of the circuit board, a molding, and a heat dissipation plate installed on the upper end of the circuit board and including a plurality of heat dissipation fins to dissipate heat generated and transmitted from the at least one optical element and the circuit board. The thermocouple is arranged in the shape of a checkerboard on the surfaces of the heat dissipation fins and converts dissipated heat into thermoelectromotive force, and forming junctions where two kinds of metals having different thermal conductivities intersect to generate thermoelectric current is formed on the heat dissipation plate. | 2013-04-04 |
20130083517 | Over Door Hanger With Light - Provided is an illuminated decorative item adapted to be suspended from a dwelling closure, including a hanger bracket that has an upper hook portion for placement over the top of the dwelling closure, a lower support portion and an elongated suspension arm extending there between. A support arm with an attached battery-powered light emitting device extends from the upper hook portion for providing illumination for decorative item which may hang from the lower support portion. | 2013-04-04 |
20130083518 | LIGHT SYSTEM FOR RETROFIT AND OTHER APPLICATIONS - An exemplary embodiment of a light system includes a plurality of elongated light modules each comprising a plurality of separate light emitting diodes (LEDs), at least one adjustable length bracket structure configured to fix each LED module in position within the box light housing, each bracket structure comprising a first, module engaging end for engaging an end of the LED module, a second, support wall engaging end for engaging against a wall of the box light housing structure, and a length adjustment mechanism for adjusting the distance between the first bracket end and the second bracket end. In an exemplary embodiment, the length adjustment mechanism includes a turnbuckle mechanism. | 2013-04-04 |
20130083519 | Display Apparatus, Electrical Appliance and Display Method - A display apparatus for an electric hob may have a colored, such as reddish-brown, hob plate, which may be composed of glass ceramic and have an inhomogeneous transmission profile for light with high transmission in the region of wavelengths of greater than 700 nm and with low transmission in the region below 700 nm. The display apparatus may have one light source with a defined output spectrum. The color locus of the light source may be shifted to the left starting from white and have a blue tinge. This configuration may provide a display that is visible or that correspondingly lights up as a substantially white illuminated display through the colored cover. | 2013-04-04 |
20130083520 | Light Fixture With Multiple LEDS and Synthetic Jet Thermal Management System - A light source ( | 2013-04-04 |
20130083521 | OPTICAL LENS, LIGHT-EMITTING DIODE OPTICAL COMPONENT AND LIGHT-EMITTING DIODE ROAD LAMP - The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode road lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface. The bottom surface includes an elongate recess concave to the spherical surface and formed with an inner surface corresponding to the spherical surface and two vertical side surfaces adjacent to the inner surface. The inner surface of the elongate recess includes a similar Gaussian distribution curve provided on a section parallel to the vertical side surfaces. A focus is contained in a center of the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area. | 2013-04-04 |
20130083522 | Light Fixture Using Light Emitting Diodes - A lighting fixture with a unique modular design is described. The said lighting fixture is comprised of a thermally conductive structure that provides the heat sinking and mounting surfaces for the light emitting diodes, the power supply(s), and the lens optics. The lens optics are designed in such a way as to accommodate a variety of warehouse aisle geometries or cavity ratios. | 2013-04-04 |
20130083523 | REAR ILLUMINATED PANEL - A rear illuminated panel includes a base member having first and second opposing sides and a pair of guide grooves formed on the first side of the base member. The panel further includes a translucent thermoplastic sheet of material having rubber channel strips on opposing longitudinal sides of the sheet of material. The sheet of material is disposed within the guide grooves of the base member such that channel strips prevent vibration of the sheet of material within the guide grooves. The panel still further includes an LED strip having a plurality of LEDs and disposed within a cavity formed by the base member and the sheet of material, wherein light from the LEDs illuminates the sheet of material. The second opposing side of the base panel is adapted to be fastened to a structure. Exemplary suitable structures include a locking rail and an index light. | 2013-04-04 |
20130083524 | MOISTURE PROTECTED ILLUMINATED LIGHT STRIP - The present invention provides an illumination device having a frame with an upper surface and a pair of opposing walls extending upward from lateral sides of the upper surface, a printed circuit board with a plurality of light emitting diodes that is secured to the upper surface of the device's frame, and an encapsulating material that substantially surrounds the printed circuit board to prevent the printed circuit board from being exposed to moisture and other elements. | 2013-04-04 |
20130083525 | LIGHT EMITTING DIODE LIGHTING MODULE - A light emitting diode (LED) lighting module is provided including an LED array, and at least one of a diffusing portion and a reflecting portion. The LED array, equipped with at least one LED, may include a side wall which surrounds the at least one LED . The diffusing portion may be detachably coupled to the LED array and may include a diffusion plate which diffuses light emitted from the at least one LED The reflecting portion may be detachably coupled to one of the LED array and the diffusing portion and may reflect light emitted from the at least one LED. The LED array may be selectively coupled with the diffusing portion, the reflecting portion, or both the diffusing portion and the reflecting portion. | 2013-04-04 |
20130083526 | LIGHT-EMITTING DEVICE AND PRODUCTION METHOD FOR SYNTHETIC RESIN GLOBE FOR SAID LIGHT-EMITTING DEVICE - A synthetic resin globe for a light-emitting device is produced by molding an intermediate product with an injection molding die, softening the intermediate product in a heating apparatus, expanding it with compressed air in a die to form a globe shape, transferring a concavo-convex shape formed in a core of the injection molding die to form a concavo-convex shape on an inner wall of the intermediate product, so that the concavo-convex shape can be easily formed into a desired shape in a lower part of an inner wall of the globe. | 2013-04-04 |
20130083527 | LAMP WITH DETACHABLE LIGHT SOURCE SUPPORTER - A lamp includes a lamp holder, a supporting board and a plurality of light sources. The lamp holder has a holding surface for holding the supporting board. The supporting board has a fixing portion, a first supporting portion and a second supporting portion. The fixing portion is fixed on the holding surface. The first and second supporting portions are adjacent to each other. The first supporting portion has a first supporting surface. The second supporting portion has a second supporting surface oblique to the first supporting surface. The plurality of light sources is arranged respectively on the first and second supporting surfaces. | 2013-04-04 |
20130083528 | WATER-PROOF AND DUST-PROOF MEMBRANE ASSEMBLY AND APPARATUS USING THE SAME - A water-proof and dust-proof membrane assembly which has a satisfactory water-proof property, dust-proof property, sound transmission capability and air permeability, as well as excellent supporting intensity and pressure resistance is provided. A water-proof and dust-proof membrane assembly having a body and a supporting member, in which the body is an asymmetric porous structure in the form of membrane having a first surface and a second surface, the supporting member is composed of a polymeric material, includes a first contact surface and a second contact surface and the porosity (second porosity) of the supporting member is larger than the first porosity, i.e. 10% to 99.9%, and the first surface of the body and the first contact surface of the supporting body are bonded is provided. | 2013-04-04 |
20130083529 | METHOD, APPARATUS AND SYSTEM FOR CONNECTING A LIGHT EMITTING DIODE LIGHT FIXTURE TO A MAINS POWER CONDUCTOR - A method, apparatus and system for connecting a light fixture having a light emitting diode (LED) lighting element to a mains power conductor in an electrical junction box is disclosed. The apparatus includes a support configured to attach to the electrical junction box and an electrical converter operable to receive electrical power from the mains power conductor and to generate an output power suitable for powering the LED lighting element. The apparatus also includes an output connector disposed on the support and in electrical connection with the electrical converter for receiving the output power, the output connector being operable to receive a connector of the light fixture for powering the LED lighting element, the output connector being oriented to receive the connector of the light fixture when the support is attached to the electrical junction box. | 2013-04-04 |
20130083530 | ILLUMINATION DEVICE - An illumination device includes a housing defining a hole therethrogh; a plurality of light sources each is a light emitting diode is disposed in the housing; a lamp seat is securely positioned at one side of the housing. The lamp seat comprises a protrusion configured to receive electronic elements therein. The protrusion of the lamp seat is inserted into the hole of the housing. | 2013-04-04 |
20130083531 | LED LAMP WITH CHANGEABLE LIGHT INTENSITY - An LED lamp includes a first LED light module and a second LED light module. The first LED light module includes a frame, a beam mounted on the frame, a plurality of LEDs mounted on the frame and a cover fixed to the frame to cover the LEDs. The second LED light module includes a housing, a base mounted on the housing and an LED fixed to the housing. The base of the first LED light module defines two grooves. The base of the second LED light module forms two posts. The two posts can be locked in the two grooves to mount the first LED light module with the second LED light module and complete the electrical connection between the first and second LED light modules. | 2013-04-04 |
20130083532 | ALTERNATING CURRENT LIGHT-EMITTING DEVICE - An alternating current light-emitting diode (AC LED) device. In one embodiment, the AC LED device includes a primary light-emitting module and a secondary light-emitting module. Each of the primary light-emitting module and the secondary light-emitting module comprises a plurality of light-emitting diodes (LEDs). The secondary light-emitting module is disposed adjacent to the primary light-emitting module. A light-emitting area of each LED in the secondary light-emitting module is smaller than a light-emitting area of each LED in the primary light-emitting module. | 2013-04-04 |
20130083533 | High Intensity LED Replacement of Incandescent Lamps - A method of forming a light bulb core, and a light bulb or lamp incorporating the core. The method includes forming a heat sink having at least six working facets located equally on opposite sides of a central plane, and then mounting a light source on each of the working facets. The light sources are mounted on circuit boards, each circuit board corresponding to a respective one of the working facets. The boards are then applied to respective working facets. The bulb is composed of a screw base, an external heat sink mounted in the screw base, and the light bulb core mounted in and extending from the external heat sink. The light source comprises a plurality of light emitting diodes. | 2013-04-04 |
20130083534 | LIGHT-EMITTING DIODE LAMP - A light-emitting diode lamp includes a lamp shield and light-emitting diode modules mounted in the lamp shield. The lamp shield includes two side bars spaced from each other. The light-emitting diode modules are located between the two side bars and arranged side by side along lengthwise direction of the side bars. Each of the light-emitting diode modules is rotatably mounted on the two side bars. | 2013-04-04 |
20130083535 | APPARATUS AND METHOD FOR THERMAL DISSIPATION IN A LIGHT - A device for producing light may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of the PCBs may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof. | 2013-04-04 |
20130083536 | Optical Window in Wear Assembly - In one aspect of the present invention, a degradation assembly comprises a superhard material configured to degrade a formation. At least one light transparent window is disposed within the superhard material. An energy source and/or energy receiver is disposed behind the at least one light transparent window. | 2013-04-04 |
20130083537 | ACOUSTICALLY TRANSPARENT LUMINAIRE LENS FOR MEDIA ASSEMBLIES - A media assembly is provided with a housing having an opening. A light source is oriented in the housing for conveying light from the opening. A speaker assembly is oriented in the housing for conveying acoustic vibrations from the opening. A lens covers the opening. The lens has a plurality of openings for permitting light and acoustic vibrations to pass therethrough. | 2013-04-04 |
20130083538 | LED LAMP - An LED lamp includes a housing having a front end side formed into a cup shape and a rear end to which a cap is fixed, the cup-shaped portion having an inner peripheral surface formed with a reflection layer and an open end, a cap fixed to the rear end of the housing, an LED chip fixed to a bottom of the cup-shaped portion, a lighting circuit incorporated in the housing to supply electric power to the LED chip, the lighting circuit and the cap being electrically connected to each other, and a hood which is mounted to the open end of the cup-shaped portion so as to be movable forward and rearward in a direction of an imaginary center line of the cup-shaped portion. | 2013-04-04 |
20130083539 | Luminaire for Indoor Horticulture - A reflector hood for a luminaire having a lamp in an upper portion thereof and first and second air flow ducts formed in first and second opposite sides of said reflector hood for ventilation. First and second secondary reflecting panels are respectively disposed within the hood over and spaced a predetermined distance from each first and second air flow duct such that light emitted by the lamp is reflected from said reflecting panels instead of passing through the first and second air flow ducts. | 2013-04-04 |
20130083540 | POLYMER FILM AND ITS APPLICATION IN A LIGHTING ASSEMBLY - Present embodiments provide for a polymer film with a reflective ratio equal to or above about 80%, comprising a white polyimide layer and a white adhesive layer disposed on a surface of the white polyimide layer The white adhesive layer including an adhesive agent and a white filler distributed in the adhesive agent. Present embodiments also provide for a lighting assembly that comprises a substrate, a lighting component disposed on the substrate, and a reflective surface formed by the polymer film. | 2013-04-04 |
20130083541 | OPTICAL LENS, LIGHT-EMITTING DIODE OPTICAL COMPONENT AND LIGHT-EMITTING DIODE ILLUMINATION LAMP - The invention is related to an optical lens, a light-emitting diode optical component and a light-emitting diode illumination lamp. The optical lens formed as a semi-spherical shape includes an uplifting spherical surface and a bottom surface corresponding to the spherical surface, and the bottom surface includes an inward space concave to the spherical surface and formed with a free surface corresponding to the spherical surface. The free surface is axially-symmetrical formed as rotational molding with respect to an axis connected from the focus to a center point of the spherical surface, to form the free surface with a similar Gaussian distribution curve provided on a section vertically cut from the spherical surface to the bottom surface. A light-emitting diode is disposed below the focus of the optical lens. The special outline structure of the optical lens can provide a uniform luminance distribution on an illuminating area. | 2013-04-04 |
20130083542 | Spotlight - The invention relates to a spotlight, in particular for at least partially illuminating a stage, wherein the spotlight comprises
| 2013-04-04 |
20130083543 | DOUBLE REFLECTING STRUCTURE - A double reflecting structure may include a first reflecting portion reflecting light that may be emitted from a light source, and a second reflecting portion formed on one side of the first reflecting portion to reflect again the light that may be reflected by the first reflecting portion. | 2013-04-04 |
20130083544 | LIGHT DIFFUSION FILM FOR LED LIGHTING - Provided is a light diffusion film for LED lighting that achieves a balance between concealment and light-utilization efficiency. The light diffusion film for LED lighting includes a sheet of substrate, an internal scattering layer and a surface shaping layer. The internal scattering layer contains a binder and particles; the mean particle diameter A of the particles is from 0.5 μm to 5.0 μm; the refractive index difference between the particles and the binder is from more than 0 to 0.15; and the content of the particles is from 10 parts by mass to 120 parts by mass with respect to 100 parts by mass of the binder. | 2013-04-04 |
20130083545 | ILLUMINATION DEVICE INCORPORATING PIN AND TAB FOR ELECTRICAL CONNECTION - An illumination device includes a cap, a holder fixed to the cap, a housing fixed to the holder, a driving module received in the housing, a light source mounted on the housing and a cover secured on the housing and covering the light source. The cap includes an electrically conductive column and an electrical contact tip. The contact tip is electrically insulative from the column The driving module includes a plate, a plurality of electronic components mounted on the plate, two upper pins extending upwardly from the plate, a lower pin extending downwardly from the plate and a tab extending laterally from the plate. The upper pins extend through the housing into the light source to electrically connect with the light source. The lower pin and the tab separably contact the contact tip and the column, respectively. | 2013-04-04 |
20130083546 | LIGHT SOURCE COOLING DEVICE AND COOLING METHOD THEREOF - A light source cooling device includes a light source module, an inner casing, an outer casing, and a plurality of spacers. The inner casing encloses an accommodation space for accommodating the light source module. The outer casing surrounds the inner casing and has a gap included between an inner wall of the inner casing and the outer casing, wherein the inner casing and the outer casing are made of materials with different thermal conductivity coefficients. The inner wall of the inner casing, an outer wall of the outer casing, and the spacers together form a plurality of heat-dissipating passages. The inner wall absorbs the heat generated by the light source module and generates a temperature gradient between the inner wall and the outer wall, which assists in creating thermal convection to exhaust the heat. | 2013-04-04 |
20130083547 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a lamp seat for connecting the LED bulb to an external power source, a rotatable member rotatably connected to the lamp seat, two holders fixed to the rotatable member and a lamp head pivotally connecting with the holders. The rotatable member is rotatable around a first axis. The lamp head is rotatable around a second axis. The second axis is unparallel to the first axis. Thus, an illumination angle of the lamp head can be adjusted with respect to the lamp seat along two planes. An LED module is attached to the lamp head. | 2013-04-04 |
20130083548 | LIGHT HEAD AND LAMP USING THE SAME AND ASSEMBLING METHOD OF LIGHT HEAD - A light head, a lamp using the light head, and an assembling method of the light head are provided. The lamp includes the light head, a circuit board, a light source, and a light cover. The circuit board is disposed on the light head and electrically connected to the light source. The light cover is assembled to the light head. The circuit board and the light source are located in the light cover. The light head includes a first assembling element, a second assembling element, first pins, and a second pin. The first assembling element has an axial direction and a radial direction. The second and first assembling elements are telescoped and are coaxial. The first pins pass through the first assembling element along the axial direction, and the second pin passes through the first and second assembling elements along the radial direction. | 2013-04-04 |
20130083549 | LED LIGHTING DEVICE AND LED LUMINAIRE - According to one embodiment, the device main body includes a main body portion, a protruding portion, and a heat conducting portion. The main body portion has an opening on one end side and has a wall portion on the other end side that is opposite to the opening side. The protruding portion protrudes from the wall portion and an inside thereof continues into the main body portion. The heat conducting portion has one end side thereof protruding from the wall portion toward the opening and has the other end side thereof connected to the protruding portion in a way that enables heat conduction. The light emitting unit is connected to the one end side of the heat conducting portion in a way that enables heat conduction. The lighting unit is housed inside the device main body and a portion of the lighting circuit component is arranged inside the protruding portion. | 2013-04-04 |
20130083550 | VEHICULAR LAMP - A vehicular lamp includes: a lamp body having an opening portion; an outer cover that closes the opening portion and that, together with the lamp body, forms a lamp chamber between the outer cover and the lamp body; a light emission portion disposed within the lamp chamber; a vapor deposition sheet that is disposed within the lamp chamber and that covers the lamp body with at least a portion of the light emission portion exposed; and an engaging portion that at least one of the outer cover and the lamp body has and that is capable of engaging with the vapor deposition sheet and holding the vapor deposition sheet in a shape that substantially conforms to the outer cover or the lamp body. | 2013-04-04 |
20130083551 | INNER LENS FOR VEHICLE LIGHT AND VEHICLE LIGHT INCLUDING THE SAME - An inner lens for use in a vehicle light can be configured to sufficiently enhance aesthetic features, decorative features, unpredictable features, etc., without adversely affecting the formation of the main light distribution. The inner lens can include a main body portion having a main surface that faces towards the reflecting surface of the reflector, and a plurality of independent convex projections formed on the main surface of the main body portion at an area corresponding to the reflecting surface. The light emitted from the light source and that reaches the projections can enter the projections and the main body portion and then be reflected and/or refracted by the projections and the main body portion so as to be directed to a direction diagonally forward of the vehicle light as light that does not contribute to the formation of the main light distribution. | 2013-04-04 |
20130083552 | EXTERNAL REAR-VIEW MIRROR ASSEMBLY HAVING A HOUSING COMPRISING A CIRCUIT BOARD SUPPORTING A PLURALITY OF LIGHT EMITTING DIODES - External rear-view mirror assembly comprising a housing ( | 2013-04-04 |
20130083553 | VEHICLE LIGHTING UNIT - A vehicle lighting unit can include a first lens and a second lens disposed below the first lens, and a first semiconductor light-emitting device disposed substantially at a vehicle rear-side focal point of the first lens. Light emitted from the first semiconductor light-emitting device in a narrow angle direction can be incident on the first lens. A first reflector can be disposed diagonally forward and downward with respect to the first semiconductor light-emitting device such that light emitted from the first semiconductor light-emitting device in a wide angle direction is incident thereon and reflected diagonally rearward and downward. The light emitted in the narrow angle direction and incident on the first lens having a luminous intensity higher than the light emitted in the wide angle direction. A second reflector can be disposed diagonally rearward and downward with respect to the first reflector. | 2013-04-04 |
20130083554 | LIGHTING DEVICES AND METHODS FOR PROVIDING COLLIMATED DAYLIGHT AND AUXILIARY LIGHT - Lighting devices and methods for providing collimated daylight and auxiliary light are disclosed. Some embodiments disclosed herein provide a daylighting apparatus including a tube having a sidewall with a reflective interior surface, one or more auxiliary light sources, and a collimator. In some embodiments, the tube is disposed between a transparent cover positioned to receive daylight and a diffuser positioned inside a target area of a building. In certain embodiments, the tube is configured to direct at least a portion of the daylight transmitted through the transparent cover and/or at least a portion of generated auxiliary light towards the collimator and the diffuser. | 2013-04-04 |
20130083555 | LIGHTUNG MODULE AND ILLUMINANT DECICE HAVING THE SAME - A lighting module includes an illuminant unit, a light guide pillar and a first reflecting member. The illuminant unit has an optical axis and includes at least a LED. The light guide pillar includes a base and a light guide part, the LED disposed on the base, the light guide pillar is extended from the base along the optical axis and an end of the light guide pillar has a top surface. The top surface is concave toward the base and is continuous. The first reflecting member is disposed on the top surface. Wherein a partial light emitted by the illuminant unit is travelling to the first reflecting member through the light guide pillar, the first reflecting member reflects the partial light such that the partial light emits from the light guide part. | 2013-04-04 |
20130083556 | COMPUTER BEZEL WITH LIGHT-GUIDE STRUCTURE - A computer bezel includes a bezel body, a light source, a light-guide structure, and a button element. The bezel body defines a mounting opening. The light-guide structure includes a guiding portion and a lighting portion. The lighting portion includes a circular lighting body with a receiving opening. The circular lighting body is located in the mounting opening. The guiding portion includes a bottom surface and an inclined surface. An acute angle is defined between the bottom surface and the inclined surface. The inclined surface is connected to the circular lighting body via a first guiding surface. The button element includes a button body located in the receiving opening. When the button body is pressed, the guiding portion receives a plurality of light beams emitted from the light source via the bottom surface and guides the light beams to the circular lighting body of the lighting portion. | 2013-04-04 |
20130083557 | BACKLIGHT MODULE STRUCTURE - A backlight module comprises a frame, a light source, an optical film and a light blocking element or a light reducing element. The frame has at least one recess formed on a sidewall thereof. The light source is disposed in the frame and located on one side thereof. The optical film is disposed in the frame and has at least one protrusion portion corresponding to the recess. The light blocking element or the light reducing element is disposed corresponding to the recess. By utilizing the light blocking element or the light reducing element, the light emitting from the light source can be block from leaking through the recess or the amount of the emitting light being reflected by a bezel of the frame can be reduced, whereby the amount of light leaking though the recess can be reduced. | 2013-04-04 |
20130083558 | DUAL LIGHT PIPE BRACKET - A handheld computing device includes a screen to receive input from and provide graphical output to a user, a housing engaging a peripheral portion of the screen, a light source, at least one light guide to receive incident light from the light source and direct the incident light to the screen to illuminate a portion of the screen, and a light guide bracket to engage the housing and the at least one light guide, the light guide bracket maintaining a position and orientation of the light guide relative to the light source. | 2013-04-04 |
20130083559 | DETACHABLE LIGHT EMITTING DEVICE USING LIGHT EMITTING DIODE MODULES - The present invention relates to a detachable light emitting device using light emitting diode modules, and the detachable light emitting device comprises: a body casing, in which a front frame is mounted on the front thereof, and in which one or a plurality of detachable parts is or are installed on an upper side or a lower side of the body casing; radiation stands which are vertically erected on both left and right sides inside the body casing, and have front cutting grooves; light guide plate stands which are vertically inserted and coupled in the front cutting grooves of each of the radiation stands, respectively, and in which side mounting grooves are formed on each one side thereof; LED module mounting stands which are vertically inserted and coupled in the side mounting grooves of each of the light guide plate stands, respectively, and in which LED mounting grooves are vertically formed on each one side thereof; LED modules, in which printed circuit boards having a plurality of LEDs thereon are vertically inserted and coupled in the LED mounting grooves of each of the LED module mounting stands, respectively; light guide plates which show surface emission effects when the LEDs of the LED modules are adjacent thereto; and a front plate which is installed on the front side inside the body casing, wherein various characters or drawings, photos and the like are printed thereon. | 2013-04-04 |
20130083560 | POWER SUPPLY DEVICE - A power supply device including a rectifying unit, a supplying unit, a controlling unit, a conversion unit and a detection unit is disclosed. The rectifying unit processes an alternating current (AC) voltage to generate a direct current (DC) voltage. The supplying unit generates an operation voltage according to an input voltage. The controlling unit receives the operation voltage and generating an enabling signal. The conversion unit transforms the DC voltage to generate an auxiliary voltage according to the enabling signal. The auxiliary voltage is not equal to the operation voltage. The detection unit detects the auxiliary voltage. When the auxiliary voltage is generated, the detection unit de-activates the supplying unit to stop generating the operation voltage. | 2013-04-04 |
20130083561 | INTEGRATED SWITCHING POWER SUPPLY DEVICE AND ELECTRIC APPARATUS - An integrated switching power supply device includes a series-connected body, a driving control element, and external terminals. In the series-connected body, a switching element, a constant current element, and a diode are connected in series. The driving control element controls to drive the constant current element. The external terminals include first to seventh external terminals. The first and second external terminals are connected to main terminals of elements of the series-connected body. The third external terminal is connected to a connection point of main terminals of the switching element or the constant current element and a main terminal of the diode. The fourth external terminal is connected to a control terminal of the switching element. The fifth external terminal supplies electric power to the driving control element. The sixth external terminal inputs reference potential. The seventh external terminal inputs a signal to the driving control element. | 2013-04-04 |
20130083562 | POWER SUPPLY, POWER MANAGEMENT DEVICE APPLIED TO A POWER SUPPLY, AND METHOD FOR PERFORMING BROWN-OUT PROTECTION AND OVERHEAT PROTECTION OF A POWER MANAGEMENT DEVICE - A power supply can provide brown-out protection and overheat protection. The power supply includes a rectifier, a transformer, and a power management device. The rectifier is used for receiving an alternating current voltage. The alternating current voltage has a voltage cycle. The transformer coupled to the rectifier has an inductor coupled to a switch for supplying an output voltage. The power management device is used for controlling the switch to make the inductor save power or release power. The power management device has a multi-functional pin coupled to the rectifier for receiving a detection voltage corresponding to a positive half cycle of the alternating current voltage. The multi-functional pin is also coupled to a thermistor for receiving an overheat protection signal. | 2013-04-04 |
20130083563 | SYSTEM AND METHODS FOR HIGH POWER DC/DC CONVERTER - A voltage conversion system and methods are disclosed. Phase-shift modulation signals are generated and interleaved to provide interleaved phase-shift modulation signals. A plurality of voltage converters are controlled using the interleaved phase-shift modulation signals to convert an input electrical current at an input voltage to an output electrical current at an output voltage. | 2013-04-04 |
20130083564 | RESONANT POWER CONVERSION APPARATUS - A resonant power conversion apparatus including a transformer-based resonant converter and first and second switch control units is provided. The transformer-based resonant converter includes a primary switch circuit and a secondary output circuit configured to provide an output voltage to a load. The first switch control unit is configured to control an ON/OFF operation of the primary switch circuit in response to a status of the load. The second switch control unit is configured to determine whether to activate or inactivate the first switch control unit. When the status of the load is the light-loading or the no-loading, the first switch control unit intermittently controls the ON/OFF operation of the primary switch circuit, and meanwhile, the first switch control unit is inactivated during the primary switch circuit is disabled, so as to substantially reduce the light-loading or no-loading loss of the resonant power conversion apparatus. | 2013-04-04 |
20130083565 | ON TIME SAMPLING PREVENTION - An example controller for a power converter includes a feedback sampling circuit, drive logic and a false sampling prevention circuit. The feedback sampling circuit is coupled to sample a feedback signal received from a terminal of the controller and to generate a sample signal representative of a value of the feedback signal. The drive logic is coupled to the feedback sampling circuit and coupled to control the power switch to regulate an output of the power converter in response to the sample signal. The false sampling prevention circuit is coupled to receive a sampling complete signal that indicates when the sampling of the feedback signal is complete. The false sampling prevention circuit is further coupled to the drive logic to extend the off time of the power switch until the sampling complete signal indicates that the sampling of the feedback signal by the feedback sampling circuit is complete. | 2013-04-04 |
20130083566 | MULTI-STAGE SAMPLING CIRCUIT FOR A POWER CONVERTER CONTROLLER - An example controller for a power converter includes a track and hold circuit, a sample and hold circuit, and drive logic. The track and hold circuit receives a signal from a terminal of the controller that is representative of an output voltage of the power converter. The track and hold circuit includes a first capacitor that provides a first voltage that tracks the signal and then holds the first voltage. The sample and hold circuit samples the first voltage when the first voltage is held on the first capacitor. The sample and hold circuit includes a second capacitor coupled to hold a second voltage representative of the first voltage after a sample period, where the second capacitor has a capacitance value larger than that of the first capacitor. The drive logic controls the first switch to regulate an output of the power converter in response to the second voltage. | 2013-04-04 |
20130083567 | COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A compound semiconductor device includes an electron transit layer having a first polarity, a p-type cap layer which is formed above the electron transit layer and has a second polarity, and an n-type cap layer which is formed on the p-type cap layer and has the first polarity. The n-type cap layer includes portions having different thicknesses. | 2013-04-04 |
20130083568 | COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - An HEMT includes, on an SiC substrate, a compound semiconductor layer, a silicon nitride (SiN) protective film having an opening and covering the compound semiconductor layer, and a gate electrode formed on the compound semiconductor layer so as to plug the opening. In the protective film, a projecting portion projecting from a side surface of the opening is formed at a lower layer portion | 2013-04-04 |
20130083569 | MANUFACTURING METHOD OF COMPOUND SEMICONDUCTOR DEVICE - A passivation film is formed on a compound semiconductor layered structure, an electrode formation scheduled position for the passivation film is thinned by dry etching, a thinned portion of the passivation film is penetrated by wet etching to form an opening, and a gate electrode is formed on the passivation film so as to embed this opening by an electrode material. | 2013-04-04 |
20130083570 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a first element structure that includes a charge supply layer of first polarity; a charge channel layer of second polarity, the charge channel layer being formed above the charge supply layer and including a recess portion; and a first electrode formed in the recess portion above the charge channel layer. | 2013-04-04 |
20130083571 | THREE-PHASE RECTIFICATION MODULE, THE SYSTEM THEREOF AND HARMONIC SUPPRESSION METHOD - A three-phase rectification module, the system thereof and harmonic suppression method are provided. The module includes a LCL filter unit, a three-phase uni-directional rectification unit coupled to the LCL filter unit, and a rectifier control unit for controlling power factor of three-phase AC power source and DC output voltage of the three-phase uni-directional rectification unit. A commutation diode is serially connected on the bridge-arm of each set of uni-directional rectification branch which is included in the three-phase uni-directional rectification unit, making it function as current uni-direction. Herein, the power factor of the three-phase AC power source is matched with the parameters of the LCL filter unit, such that the absolute value of the phase difference between AC input voltage and current of the three-phase uni-directional rectification unit is close or equal to a preset threshold. | 2013-04-04 |
20130083572 | PROTECTION FOR INADVERTENT MISSING FEEDBACK VOLTAGE SIGNAL - Methods and apparatuses are disclosed for providing improved feedback sampling in a primary-side regulated power converter. A test sample may be taken prior to the default feedback sample. The voltage of the test sample may be compared to the voltage of the default feedback sample to determine if the voltage difference between the two samples exceeds a threshold. If the default sample is lower than the test sample by more than the threshold, the default sample may be flagged as being a potential false sample. If more than a set number of potentially false samples are obtained, the power converter may enter an auto-restart mode. | 2013-04-04 |
20130083573 | REGULATOR AND HIGH VOLTAGE GENERATOR - A regulator includes a current path unit coupled between an input terminal and a ground terminal and including a first current determination unit coupled between the input terminal and a control node and configured to supply the high voltage to the control node so that a first or second current path is selected depending on a voltage of the control node, and a second current determination unit coupled between the control node and the ground terminal and configured to control the voltage of the control node depending on an input voltage, a voltage supply unit configured to supply the high voltage to an output terminal depending on the voltage of the control node, a voltage division unit configured to create a division voltage, and an amplification unit configured to amplify a difference between the division voltage and a first reference voltage. | 2013-04-04 |
20130083574 | DUAL-INPUT NINE-PHASE AUTOTRANSFORMER FOR ELECTRIC AIRCRAFT AC-DC CONVERTER - A dual-input nine-phase autotransformer converts first and second three-phase AC inputs to a nine-phase AC output. The autotransformer includes input terminals for connection to a first three-phase AC input and a second three-phase AC input smaller than the first three-phase AC input. The autotransformer includes a first plurality of coils, a second plurality, and a third plurality of coils wound on respective phase legs of the autotransformer. The autotransformer includes a plurality of output terminals for providing a plurality of AC output voltages, and a plurality of internal terminals for connecting the first, second, and third plurality of coils in a configuration that provides a 40° phase shift in the AC outputs provided by the dual-input nine-phase autotransformer. | 2013-04-04 |
20130083575 | MULTIPHASE POWER CONVERTERS HAVING SHARED MAGNETIC CORE SECTIONS - A multiphase power converter includes a plurality of subconverters and a control circuit. Each subconverter has an input circuit, an output circuit, and a magnetic core coupling the input circuit to the output circuit. The magnetic core of at least one of the plurality of subconverters has a core section that is shared by the magnetic core of another one of the plurality of subconverters. The control circuit is configured to operate the input circuits of the plurality of subconverters with different phases. The magnetic cores may be cores of a transformer, a coupled inductor, etc. | 2013-04-04 |
20130083576 | POWER SEMICONDUCTOR SWITCH SERIES CIRCUIT AND CONTROL METHOD THEREOF - The present disclosure provides a power semiconductor switch series circuit. The power semiconductor switch series circuit includes a plurality of series modules and a system control module. Each series module has a power semiconductor switch; a drive module for driving each power semiconductor switch to be turned on or turned off; a short-circuit detection unit for outputting at least one detection signal; an equalizer circuit; a comparison module for comparing the detection signal with a predetermined threshold, and outputting a short-circuit signal when the detection signal exceeds the predetermined threshold; and a soft turn-off module for receiving the short-circuit signal and outputting a second control signal. The system control module receives the short-circuit signal and outputs a first control signal. | 2013-04-04 |
20130083577 | OFFLINE LOW VOLTAGE DC OUTPUT CIRCUIT WITH INTEGRATED FULL BRIDGE RECTIFIERS - The present disclosure discloses an offline low voltage DC output circuit with integrated full bridge rectifiers. The offline low voltage DC output circuit comprises two depletion high voltage pass transistors and a bridge rectifier, wherein most of the voltage is dropped across the pass transistor device. In one embodiment, the offline low voltage DC output circuit further comprises a ballast resistor to minimize substrate injection. | 2013-04-04 |
20130083578 | PRIMARY SIDE PFC DRIVER WITH DIMMING CAPABILITY - A primary side PFC driver circuit is disclosed that includes a switch control circuit for commanding a switch to allow an inductor coupled to an output load (e.g., LEDs) to transfer energy provided by an input voltage source. The switch control circuit provides two signals for commanding the switch. A first signal having a first frequency, with a duty cycle in proportion to the input voltage amplitude, commands the switch to allow the average input current to be proportional to the input voltage amplitude. A second signal having a second frequency higher than the first frequency pulses the output load with substantially constant current pulses based on a value of the first signal (e.g., while the first signal is high). The current pulses produce a substantially constant current in the output load. | 2013-04-04 |
20130083579 | PRE-BIASED SAMPLING FILTER - Methods and apparatuses are disclosed for sampling a feedback signal representative of an output of a power converter using a pre-biased filter capacitor. The pre-biased filter capacitor provides accurate sampling of the feedback signal during various load conditions. The pre-biased filter may be pre-charged to a pre-bias voltage that is below the regulated voltage of the feedback signal to reduce the amount of time required to charge the pre-biased filter capacitor to the regulated voltage of the feedback signal. | 2013-04-04 |
20130083580 | SWITCHING POWER SUPPLY DEVICE, AND INVERTER, CONVERTER, AIR CONDITIONER, SOLAR POWER CONTROLLER, AND AUTOMOBILE EMPLOYING SAME - The switching power supply device is provided with a high-withstand voltage first transistor, a first electrode of which being connected to a first node; a low-withstand voltage second transistor, a first electrode of which being connected to a second electrode of the first transistor, and a second electrode of which being connected to a second node; and a drive circuit. Each of the first and second transistors has a parasitic diode connected in the forward direction between the second and first electrodes. The drive circuit, in a case where electrical current is to flow from the first node to the second node, turns on the first and second transistors, and, in a case where electrical current is to flow from the second node to the first node, turns on the first transistor, and turns off the second transistor. | 2013-04-04 |
20130083581 | NEAREST NEIGHBOR SERIAL CONTENT ADDRESSABLE MEMORY - A digital design and technique may be used to implement a Manhattan Nearest Neighbor content addressable memory function by augmenting a serial content addressable memory design with additional memory and counters for bit serially accumulating in parallel and subsequently comparing in parallel all the Manhattan distances between a serially inputted vector and all corresponding vectors resident in the CAM. Other distance measures, besides a Manhattan distance, may optionally be used in conjunction with similar techniques and designs. | 2013-04-04 |
20130083582 | STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region. | 2013-04-04 |
20130083583 | STUB MINIMIZATION FOR MULTI-DIE WIREBOND ASSEMBLIES WITH PARALLEL WINDOWS - A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements. | 2013-04-04 |
20130083584 | STUB MINIMIZATION WITH TERMINAL GRIDS OFFSET FROM CENTER OF PACKAGE - A microelectronic package includes a microelectronic element having memory storage array function overlying a first surface of a substrate, the microelectronic element having a plurality of contacts aligned with an aperture in the substrate. First terminals which are configured to carry all address signals transferred to the package can be exposed within a first region of a second substrate surface, the first region disposed between the aperture and a peripheral edge of the substrate. The first terminals may be configured to carry all command signals, bank address signals and command signals transferred to the package, the command signals being write enable, row address strobe, and column address strobe. | 2013-04-04 |
20130083585 | MEMORY DEVICE INTERFACE METHODS, APPARATUS, AND SYSTEMS - Apparatus and systems for memory system are provided. In an example, a memory system can include a plurality of memory dice and an interface chip. The memory dice can include a first memory die including a memory array coupled to through wafer interconnects (TWIs) and a second memory die, wherein the first memory die is stacked over the second memory die. In an example, the interface chip can be coupled to the TWIs and configured to provide memory commands to selected memory addresses within the plurality of memory dice. In an example, the interface chip can be configured to perform DRAM sequencing. | 2013-04-04 |
20130083586 | INTEGRATED CIRCUIT WITH A SELF-PROGRAMMED IDENTIFICATION KEY - A structure for storing a native binary code in an integrated circuit, including an array of planar MIM capacitors above an insulating layer formed above a copper metallization network, wherein at least one metallization portion is present under each MIM capacitor. The size of the portion(s) is selected so that from 25 to 75% of the MIM capacitors have a breakdown voltage smaller by at least 10% than that of the other MIM capacitors. | 2013-04-04 |
20130083587 | SEMICONDUCTOR DEVICE AND STRUCTURE - An Integrated device comprising a first monocrystalline layer comprising logic circuit regions and a second monocrystalline layer comprising memory regions constructed above first monocrystalline layer, wherein the memory regions comprise second transistors, wherein said second transistors comprise drain and source that are horizontally oriented with respect to the second monocrystalline layer, and a multiplicity of vias through the second monocrystalline layer providing connections between the memory regions and the logic circuit regions, wherein at least one of the multiplicity of vias have a radius of less than 100 nm. | 2013-04-04 |
20130083588 | MEMORY ELEMENT AND SIGNAL PROCESSING CIRCUIT - In a memory element including a pair of inverters, a capacitor which holds data, and a switching element which controls accumulating and releasing of electric charge of the capacitor are provided. For example, one electrode of the capacitor is connected to a first node, which is an input or output terminal of one of the pair of inverters, and the other electrode of the capacitor is connected to one electrode the switching element. The other electrode of the switching element is connected to a second node, which is the output or input terminal of the one of the pair of inverters. With such a connection structure, the absolute value of the potential difference between the first node and the second node at the time of data restoring can be large enough, whereby errors at the time of data restoring can be reduced. | 2013-04-04 |
20130083589 | NOVEL SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device, including: a first semiconductor layer including first transistors, wherein the first transistors are interconnected by at least one metal layer including aluminum or copper; and a second mono-crystallized semiconductor layer including second transistors and overlaying the at least one metal layer, wherein the at least one metal layer is in-between the first semiconductor layer and the second mono-crystallized semiconductor layer, wherein the second mono-crystallized semiconductor layer is less than 100 nm in thickness, and wherein the second transistors include horizontally oriented transistors. | 2013-04-04 |