13th week of 2016 patent applcation highlights part 65 |
Patent application number | Title | Published |
20160095195 | Plasma Cutting Torch, Nozzle And Shield Cap - A plasma torch assembly, and components thereof, is provided with optimized attributes to allow for improved torch durability add versatility. A torch nozzle is provided having a novel design, including exterior cooling channels running along a length of the nozzle. An improved inner retaining cap assembly is provided which imparts a swirl on shield gas flow. Additionally, a shield cap and outer retainer have optimized geometries to allow the torch to be made narrower to facilitate the cutting of complex 3-D shapes and bevel cuts not attainable with known mechanized plasma torches. | 2016-03-31 |
20160095196 | DETECTING PLASMA ARCS BY MONITORING RF REFLECTED POWER IN A PLASMA PROCESSING CHAMBER - Embodiments of the present disclosure generally relate to methods for detecting unstable plasma in a substrate processing chamber. In one embodiment, the method includes providing a forward power from a power source to the substrate processing chamber through a detection device, splitting the forward power passing through the detection device at a predetermined ratio to obtain a first value of the power to the substrate processing chamber, measuring a reflected power from the substrate processing chamber to obtain a second value of the power from the substrate processing chamber, and directing the power source to turn off the forward power if the second value of the power is different than the first value of the power. | 2016-03-31 |
20160095197 | CIRCUIT BOARD MODULE AND CIRCUIT BOARD STRUCTURE - A circuit board module includes a circuit board structure, a heat generating element, and a cooling element. The circuit board structure has a plate component and a heat conductive component. The heat conductive component has a heat pipe and a resin excluding fiber glass. The heat pipe is disposed in the plate component and not protruding from the plate component. The resin fills a gap between the heat pipe and the plate component, and the resin substantially connects the heat pipe and the plate component without any gap. The heat generating element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the heat generating element is defined as a heat absorbing portion. The cooling element contacts the heat conductive component, and a portion of the heat conductive component adjacent to the cooling element is defined as a heat dissipating portion. | 2016-03-31 |
20160095198 | CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE - Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part. | 2016-03-31 |
20160095199 | CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF - A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component. | 2016-03-31 |
20160095200 | LIGHT EMITTING DIODE (LED) ASSEMBLY AND FLEXIBLE CIRCUIT BOARD WITH IMPROVED THERMAL CONDUCTIVITY - A flexible circuit board includes an electrically insulating top sheet and an electrically insulating bottom sheet. A plurality of conductive traces is positioned between the electrically insulating top and bottom sheets. A first conductive trace has a first contact pad, and a second conductive trace has a second contact pad. The first and second contact pads are exposed through at least one opening in the electrically insulating top sheet, and each of the first and second contact pads are configured to be connected to an LED. A third contact pad is exposed through openings in the electrically insulating top and bottom sheets, with a top surface of the third contact pad configured to be connected to the LED and a bottom surface of the third contact pad configured to be connected to a heat diffusion device. | 2016-03-31 |
20160095201 | CIRCUIT BOARD COMPRISING HEAT TRANSFER STRUCTURE - A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene. | 2016-03-31 |
20160095202 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board includes a first metal layer having a first via hole penetrating through an upper surface of the first metal layer and a lower surface thereof; a plated part provided to a surface of the first via hole; an insulating film provided to a surface of the plated part; and a first via formed by providing a conductive material to at least a portion of a region surrounded by an outer surface of the insulating film. Since the circuit board may implement fineness of the first via while forming the first metal layer to be thicker than the related art, warpage may be decreased and heat dissipation performance may be improved. | 2016-03-31 |
20160095203 | CIRCUIT BOARD - Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape. | 2016-03-31 |
20160095204 | 3D FLEX SOLDERING - In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations. | 2016-03-31 |
20160095205 | DISPLAY DEVICE INCLUDING CURVED DISPLAY PANEL - A display device includes a display panel curved in a direction and a fixing frame having a predetermined curvature, where the fixing frame is configured to support and fix the curved display panel. The curved display panel includes curved first and second display substrates facing each other; and an elastic member on an edge portion of a rear surface of the curved first display substrate and elongated in the direction in which the display panel is curved. The curved first display substrate has a larger radius of curvature than that of the curved second display substrate. | 2016-03-31 |
20160095206 | Display Module Having Different Curvature Design - A display module includes a display panel which includes a substrate and a periphery circuit. The substrate has a display area and a strip region beside the display area. The substrate is bent with respect to an axis to form a curved shape. The maximum value of the curvature of the display area in a direction perpendicular to the axis is a first curvature. The periphery circuit is disposed on the strip region. The strip region in a direction perpendicular to the axis has a second curvature smaller than the first curvature. | 2016-03-31 |
20160095207 | FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers. | 2016-03-31 |
20160095208 | DEVICES AND METHODS TO REDUCE STRESS IN AN ELECTRONIC DEVICE - A device includes a stress relief region between at least two stress domains of a substrate (e.g., of a semiconductor die or other integrated circuit). The stress relief region includes a conductive structure electrically coupling circuitries of the stress domains between which the conductive structure is disposed. | 2016-03-31 |
20160095209 | PANEL LEVEL FABRICATION OF PACKAGE SUBSTRATES WITH INTEGRATED STIFFENERS - Techniques are disclosed for forming a package substrate with integrated stiffener. A panel of package substrates are provided. An adhesion layer is then formed on each package substrate of the panel of package substrates. A panel of stiffeners are then attached to the panel of package substrates by the adhesion layer, each stiffener corresponding to a respective package substrate. The panel of package substrates is then singulated into individual package substrates with integrated stiffeners. The stiffeners on the singulated package substrates include tabs that extend to the edges of the package substrates. | 2016-03-31 |
20160095210 | TRANSPARENT DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - A transparent display panel, and a method of manufacturing the transparent display panel are discussed. The transparent display panel according to one embodiment includes a substrate; a driving element formed in a display pixel area on the substrate; a wiring electrode formed in the display pixel area and connected to the driving element; and a transparent wiring electrode formed in a transmissive area on the substrate, the transparent wiring electrode being extended to connect to the wiring electrode in the display pixel area. | 2016-03-31 |
20160095211 | OPTICAL MODULE, OPTICAL TRANSCEIVER, PRINTED CIRCUIT BOARD, AND FLEXIBLE PRINTED CIRCUIT BOARD - An optical module includes: a first circuit board including a first signal terminal part and a first ground terminal part formed on a front surface; and a second circuit board including a second signal terminal part and a second ground terminal part formed on a back surface. The first circuit board further includes: a first dielectric layer; a first signal wire formed on a front surface of the first dielectric layer; a first ground conductor layer formed on a back surface of the first dielectric layer; and a first through ground conductor passing through the first dielectric layer. The first ground terminal part is formed, in a first region and a second region respectively located on both sides of the first signal terminal part in a first direction, and in a third region prescribed at a location beyond the first signal terminal part in a second direction. | 2016-03-31 |
20160095212 | TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME - The present application relates to a transparent electrode and a method for manufacturing the same. | 2016-03-31 |
20160095213 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor element and a ceramic circuit substrate on which the semiconductor element is mounted. The ceramic circuit substrate includes a ceramic substrate having one surface and the other surface facing each other, a metal circuit board joined to the one surface of the ceramic substrate and electrically connected to the semiconductor element, and a metal heat-dissipation plate joined to the other surface of the ceramic substrate. The metal circuit board is greater in thickness than the metal heat-dissipation plate. A surface of the metal heat-dissipation plate on a side opposite to the ceramic substrate is larger in area than a surface of the metal circuit board on a side opposite to the ceramic substrate. Thereby, a semiconductor device capable of suppressing warpage of the ceramic substrate can be achieved. | 2016-03-31 |
20160095214 | CERAMIC SUBSTRATE - A ceramic substrate includes: a plate-shaped substrate main body made of an insulating ceramic material; and a metallization layer primarily made of a conductive material, and formed over an entire perimeter of a surface of the substrate main body, along an outer edge of the surface. The ceramic substrate further includes: a composite material layer interposed between the substrate main body and the metallization layer, formed along the outer edge, and containing a ceramic material that is the same as the ceramic material of the substrate main body, and a conductive material that is the same as the conductive material of the metallization layer; and electrode pads primarily made of a conductive material, and formed at a position on the surface, inward of the metallization layer and the composite material layer, and spaced apart from the metallization layer and the composite material layer. | 2016-03-31 |
20160095215 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulating layer, and a first conductor layer including a fine wiring pattern and a thick-film wiring pattern. The fine wiring pattern is embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer. The thick-film wiring pattern includes an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer. The embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern. | 2016-03-31 |
20160095216 | CIRCUIT BOARD - A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening. | 2016-03-31 |
20160095217 | WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE - A wiring substrate includes: a substrate body made of ceramic and having a front surface and a rear surface, each having a rectangular shape in a plan view, a plurality of rear surface electrodes formed on the rear surface of the substrate body, a frame-shaped conductive portion provided on the front surface side of the substrate body, and a via conductor penetrating the substrate body and establishing electric connection between the plurality of rear surface electrodes and the frame-shaped conductive portion. A part of the rear surface is exposed between the plurality of rear surface electrodes and each side of the rear surface of the substrate body. On the rear surface of the substrate body, at least one projecting wiring is formed between each of the plurality of rear surface electrodes and each of a corresponding pair of the sides that intersect with each other. | 2016-03-31 |
20160095218 | COMPOSITE WIRING BOARD AND MOUNTING STRUCTURE OF THE SAME - A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder. | 2016-03-31 |
20160095219 | PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE HAVING THE SAME - A printed wiring board includes a main wiring board having a main wiring pattern, and a sub wiring board mounted to the main board and having a sub wiring pattern such that the sub pattern electrically connects first and second electronic components, first conductor pads positioned to connect the first component to the main board and the sub board and having surfaces such that the first component is mounted onto the surfaces of the first pads via solder bumps, and second conductor pads positioned to connect the second component to the main board and the sub board and having surfaces such that the second component is mounted onto the surfaces of the second pads via solder bumps. The first and second pads are formed such that the surfaces of the first and second pads are formed on the same plane and have the same shape and the same size. | 2016-03-31 |
20160095220 | ELECTRONIC PACKAGE DESIGN THAT FACILITATES SHIPPING THE ELECTRONIC PACKAGE - Some example forms relate to an electronic package. The electronic package includes an electronic component and a substrate that includes a front side and a back side. The electronic component is mounted on the front side of the substrate and conductors are mounted on the back side of the substrate. The substrate is warped due to differences in the coefficients of thermal expansion between the electronic component and the substrate. An adhesive is positioned between the conductors on the back side of the substrate and an adhesive film is attached to the adhesive positioned between the conductors on the back side of the substrate. | 2016-03-31 |
20160095221 | INTEGRATION OF ELECTRONIC ELEMENTS ON THE BACKSIDE OF A SEMICONDUCTOR DIE - Systems and methods include a first semiconductor die with a substrate having a first side and a second side opposite to the first side. A first set of electronic elements is integrated on the first side. A second set of electronic elements is integrated on the second side. One or more through-substrate vias through the substrate are used to couple one or more of the first set of electronic elements and one or more of the second set of electronic elements. The through-substrate vias may be through-silicon vias (TSVs) or a through-glass vias (TGVs). The first semiconductor die may be stacked with a second semiconductor die, with the first side or the second side of the first semiconductor die interfacing an active side of the second semiconductor die. | 2016-03-31 |
20160095222 | Chip Substrate Comprising Cavity with Curved Surfaces - A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature. | 2016-03-31 |
20160095223 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes an external electrode on an end surface of a ceramic body to be connected to internal electrodes including a base layer including a sintered metal containing Cu and glass and a Cu plated layer on the base layer. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The Cu metal of the Cu plated layer is present in the base layer to a position of about ⅓ or more of the thickness of the base layer from a surface layer of the external electrode. The metal thickness of the external electrode is about 8.7 μm or more and about 13.9 μm or less. | 2016-03-31 |
20160095224 | APPARATUS AND METHODS RELATED TO CERAMIC DEVICE EMBEDDED IN LAMINATE SUBSTRATE - Apparatus and methods related to ceramic device embedded in laminate substrate. In some embodiments, a laminate substrate can include a plurality of laminate layers, and a ceramic device having a first side and a second side, and embedded at least partially within the plurality of laminate layers. The ceramic device can include a conductive path between the first side and the second side. In some embodiments, such a laminate substrate can be utilized as a packaging substrate for a packaged module such as a radio-frequency (RF) module. | 2016-03-31 |
20160095225 | INDUCTOR SYSTEM FOR MULTI-PHASE POWER MANAGEMENT INTEGRATED CIRCUITS - A semiconductor device includes a first integrated circuit chip, a second integrated circuit chip, a coupled inductor system, and a semiconductor package. The first integrated circuit chip is connected to a substrate and configured to process digital data. The second integrated circuit chip is configured to manage power for the first integrated circuit chip. The coupled inductor system is embedded in the substrate, connected to the second integrated circuit chip, and has a first inductor configured to be magnetically coupled to a second inductor. The semiconductor package is configured to encapsulate the first integrated circuit chip and the second integrated circuit chip. | 2016-03-31 |
20160095226 | Printed Timer Label - A printed timer label including a substrate, a printed battery on the substrate, a printed load resistance configured to control a discharge time of the printed battery, and printed voltage comparison circuitry connected to the printed battery and configured to provide an output signal depending on the output voltage of the printed battery relative to a predetermined threshold value. | 2016-03-31 |
20160095227 | FILLING METHOD OF CONDUCTIVE PASTE AND MANUFACTURING METHOD OF MULTI-LAYER PRINTED CIRCUIT BOARD - A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of from a surface to a midway thereof to forma conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste. | 2016-03-31 |
20160095228 | METHOD FOR MANUFACTURING WIRING STRUCTURE, COPPER DISPLACEMENT PLATING SOLUTION, AND WIRING STRUCTURE - Adhesion of an underlying diffusion barrier metal film and an electroless copper plating film with respect to an insulating film can be improved. A method for manufacturing a wiring structure includes a process of forming the underlying diffusion barrier metal film | 2016-03-31 |
20160095229 | ELECTROPLATED PLASTIC CHASSIS FOR ELECTRONIC DEVICE - In one example an electronic device comprises a controller and a chassis comprising a polymer layer, a first metallic layer deposited on a first side of the polymer layer, and a second metallic layer deposited on a second side of the polymer layer, wherein at least one of the first metallic layer or the second metallic layer comprises an electrically functional integrated structure. Other examples may be described. | 2016-03-31 |
20160095230 | METHOD FOR RECYCLING OF OBSOLETE PRINTED CIRCUIT BOARDS - Processes for recycling printed wire boards using environmentally-friendly compositions, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. | 2016-03-31 |
20160095231 | MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD THEREOF - A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to foam the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided. | 2016-03-31 |
20160095232 | FLEXIBLE DISPLAY AND FLEXIBLE DISPLAY DEVICE - A flexible display ( | 2016-03-31 |
20160095233 | MOTOR CONTROL DEVICE AND ELECTRONIC EQUIPMENT - This disclosure discloses a motor control device configured to control a motor. The motor control device includes a housing including an opening part, a printed circuit board inserted into the housing and extracted from the housing through the opening part and including an engaged part on an edge on one side in an insertion-extraction direction, and an engaging member. The engaging member is disposed on a wall part of the housing on the one side in the insertion-extraction direction. The engaging member engages with the engaged part of the printed circuit board inserted into the housing to regulate movement of the printed circuit board in the insertion-extraction direction. The engaging member is operated toward the one side or another side in the insertion-extraction direction from an outside of the housing to release an engagement with the engaged part. | 2016-03-31 |
20160095234 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING COUPLING MEMBER AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an electronic control apparatus comprises: a PCB configured to electrically control each part of the vehicle and have at least one through-hole in a side; a connector cover includes a connector part electrically connected and coupled with the PCB and a coupling part; a housing configured of a one-piece slot type to receive the PCB inserted in a slide form and provided with at least one housing-hole penetrating through the through-hole of the inserted PCB; and a hollow rivet configured to penetratively fix the PCB to the housing through the through-hole of the PCB and the housing-hole of the housing, wherein the hollow rivet is penetratively inserted into the housing-hole through which the PCB is inserted into the housing and then one end surface of the hollow rivet is physically deformed, such that the PCB adheres to an inside of the housing. | 2016-03-31 |
20160095235 | ELECTRONIC CONTROL APPARATUS FOR VEHICLE USING COUPLING MEMBER AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) configured to electrically control each part of the vehicle and have both sides provided with at least one fixed hole; a connector cover includes a connector part electrically connected and coupled with the PCB and a coupling part; a housing configured of a one-piece slot type and receiving the PCB inserted in a slide form; and at least one coupling member each fastened with at least one fixed hole of the PCB, wherein the PCB is inserted into the housing and the PCB adheres to a bottom side of the housing by the coupling member which is pressed by physically deforming each corresponding surface of the housing corresponding to at least one coupling member. | 2016-03-31 |
20160095236 | SUPPORT FOR ELECTRONIC DEVICE - A support includes a support member including a main body and an extension body extending from the main body; a clamping member coupled to the main body and being movable relative to the main body; and a holding portion defined between the support member and the clamping member and configured to receive the electronic device. The support member and the clamp member are configured to cooperatively clamp the electronic device in the holding portion. | 2016-03-31 |
20160095237 | LOCKING COMPONENT, LOCKING DEVICE AND HOST SECURING AN INTERFACE CARD - A locking component, a locking device and a host comprising the locking device are disclosed. The host comprises a card slot which extends along a second direction for inserting an interface card in a first direction which is substantially perpendicular to the second direction. The locking component includes a locking element and a pivot element. The locking element includes two opposite sliding slots each of which has a first and a second slide portion connecting each other. The locking element is adapted for sliding in the second direction such that the first and second slide portions of each sliding slot maintain a distance. The pivot element is adapted for passing through the sliding slots to be disposed at a host such that the locking element is pivotable about the pivot element. Upon positioning the pivot element at the first slide portions, the locking element is rotatable from an open position to an intermediate position. Upon sliding the locking element along the second direction to move the pivot element from the first slide portions to the second slide portions, the locking element is movable from the intermediate position to a lock position to lock the interface card. | 2016-03-31 |
20160095238 | Security Panel Enclosure and Mounting System - A mountable enclosure can include a base and a door pivotally connected along a vertical axis. The base and door can include electronic component mounting areas, horizontal cable management areas, and vertical cable management areas. A mounting system can include at least one enclosure and at least one bracket, the bracket having a rigid body with first, second, and third parallel surfaces wherein the first and third surfaces are on one plane and the second surface is on a different plane. The bracket can be fastened to the wall and the enclosure can be fastened to the bracket and the wall. Multiple enclosures can be installed in vertical alignment through a method that can require only one installer and the leveling of only the first bracket wherein notches in subsequent brackets are mated with pegs extending from the base of previously installed enclosures. | 2016-03-31 |
20160095239 | SHELL STRUCTURE OF ELECTRICAL DEVICE AND TERMINAL OF LOAD CONTROL SYSTEM HAVING THE SAME - A shell structure of an electrical device includes a first body and a second body. The first body has one or more first lead-out portions, and the second body has one or more second lead-out portions so that electric wires are drawn out. Each of one or more first lead-out portions is formed in the shape of a groove which penetrates a first peripheral wall of the first body and which is opened toward an opening of the first body. Each of the one or more second lead-out portions is formed in the shape of a groove which penetrates a second peripheral wall of the second body and which is opened toward an opening of the second body. The first body and the second body are combined together by allowing the one or more first lead-out portions and the one or more second lead-out portions to overlap with each other. | 2016-03-31 |
20160095240 | ELECTRONIC CARD CONNECTOR AND ELECTRONIC DEVICE USING SAME - An electronic card connector includes a tray, at least one latching member, a push rod and an ejection assembly. The tray defines a defined space for accommodating an electronic card and at least one notch. Each latching member comprises at least one fixing portion fixed to a housing and a bulge. Each bulge receives in one of the at least one notch to detachably engage the tray with the housing. The push rod includes a first hook. The ejection assembly includes a connecting rod having a second hook and an expansion bracket rotatably coupled to the connecting rod and resisting the tray. When the second hook is engaged with the first hook, the tray is engaged with the housing. When the first hook is disengaged from the second hook, the tray is driven to disengage from the housing by an elastic restoring force of the expansion bracket. | 2016-03-31 |
20160095241 | MOBILE ELECTRONIC DEVICE FACEPLATE BORDER AND RELATED METHODS - Presented and described herein are faceplate borders and screen protectors for use on mobile electronic devices. Further presented is a method of attachment for the screen protector described herein and a method of minimizing separation of a screen protector from a mobile electronic device. | 2016-03-31 |
20160095242 | ELECTRONIC DEVICE WITH DUST PROTECTING FUNCTION AND METHOD FOR FABRICATING ELECTRONIC DEVICE WITH DUST PROTECTING FUNCTION - The present invention provides an electronic device with dust protecting function and a method for fabricating the electronic device with dust protecting function. The electronic device comprises: a chamber structure and a first electronic element. The chamber structure comprises: a substrate; and a cap. The cap is connected to the substrate, and has a hole and a protruding part, wherein the protruding part protrudes toward inside of the chamber structure. The first electronic element is disposed in the chamber structure, wherein the protruding part is a block between the first electronic element and the hole of the cap. | 2016-03-31 |
20160095243 | COLLAPSIBLE ENCLOSURE COVER FOR FACILITATING AIR FLOW FOR AN ENCLOSURE - A collapsible enclosure cover for facilitating air flow for an enclosure having a collapsible frame with a first guide rail having a mounting bracket and an elongated member. The collapsible frame also has a second guide rail having a mounting bracket and an elongated member. The collapsible frame also has a plurality of poles extending from the first guide rail to the second guide rail that swivel around the elongated members. The collapsible enclosure cover also has a fabric portion connected to and disposed over the plurality of poles. | 2016-03-31 |
20160095244 | POWER SEMICONDUCTOR MODULE DEVICE - Second fixation portions of a terminal conversion adaptor are fitted into and engaged with engagement portions abutting on first fixation portions of a power semiconductor module. By use of one common fixation screw, each of the fixation portions and each of the second fixation portions are fixed to a cooler. Pin connection type external connection terminals of the power semiconductor module are connected to conversion terminals (which are provided with screw connection portions) of the terminal conversion adaptor so that the pin connection type external connection terminals can be converted into screw connection. Thus, it is possible to provide a conversion adaptor which can convert a connection form of each external connection terminal of a power semiconductor module easily and a power semiconductor module device in which the connection form of the external connection terminal can be converted into a desired connection form by the conversion adaptor. | 2016-03-31 |
20160095245 | ELECTRONIC DEVICE WITH QUICK RELEASING FUNCTION FOR AN INTERFACE CARD - An electronic device with quick releasing function for an interface card includes a base, a connector and a quick releasing mechanism. The base is adapted to hold the interface card. The connector is disposed on the base to electrically connect with the interface card. The quick releasing mechanism is disposed on the base and includes a first constraining component and a second constraining component. The first constraining component is movably disposed on the base and can be shifted between a releasing position and a constraining position. The first constraining component moves to the constraining position to contact against a side of the interface card opposite to the connector. The second constraining component is disposed on the base and located on another side of the first constraining component to contact against the interface card corresponding to the connector. | 2016-03-31 |
20160095246 | MULTIPLE DRIVE SLED IN A STORAGE ARRAY - An apparatus as associated method contemplating a housing and a midplane supported by the housing having a midplane connector. A printed circuit board (PCB) having a PCB connector is selectively connectable to the midplane connector. A plurality of data storage devices are arranged on the printed circuit board in a staggered pattern, each electrically connected to the PCB connector via a respective electrical trace in the PCB. | 2016-03-31 |
20160095247 | RACK MOUNTED EQUIPMENT POWER DISTRIBUTION SYSTEM ENHANCEMENTS - A rack power distribution unit (rPDU) for an electronics equipment rack includes a rPDU body having a front surface, a power inlet cord coupled to the rPDU body, a plurality of power outlets on a surface of the rPDU body in electrical communication with the power inlet cord, and a display including a display body having a right side and a left side and a display screen. The display body is pivotably mounted to the front surface of the rPDU body and configured to pivot about an axis. | 2016-03-31 |
20160095248 | COOLING SYSTEM FOR USE WITH A POWER ELECTRONICS ASSEMBLY AND METHOD OF MANUFACTURING THEREOF - A cooling system for use with a power electronics assembly comprising an array of line-replaceable units is provided. The cooling system includes a first manifold coupled in flow communication with the array of line-replaceable units, and a fluid supply coupled in flow communication with the first manifold. The fluid supply is configured to channel cooling fluid towards the first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously. | 2016-03-31 |
20160095249 | PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE HAVING THE SAME - Disclosed are a printed circuit board and an electronic component package having the printed circuit board, which includes: a base board; a heat-dissipating pad formed on the based board and having an electronic component installed thereon; and a bridging pad formed on the base board between the heat-dissipating pad and a shield can installed on the base board so as to allow heat generated by the electronic component to be transferred from the heat-dissipating pad to the shield can. | 2016-03-31 |
20160095250 | AIRFLOW CONTROL SYSTEM - An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate. | 2016-03-31 |
20160095251 | HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME - The heat dissipation device includes a heat absorbing base and a fan mounted on the heat absorbing base. The heat absorbing base includes a first surface configured for contacting a heat generating element, and a second surface opposite to the first surface. The fan includes a bearing and a rotor pivotally coupled with the bearing. The bearing is mounted on the second surface of the heat absorbing base. | 2016-03-31 |
20160095252 | VERTICAL ELECTRONIC DEVICE WITH CURVED TOP SURFACE DESIGN - A housing for an electronic device is provided that includes a curved top; a vertical front wall; a vertical rear wall; vertical side walls; at least one electronic component in the housing generating heat during operation; and, a thermal management system for dissipating the heat. The thermal management system can include at least one of active and passive components. The thermal management system can include in at least one of the vertical walls or in each of the vertical side walls. | 2016-03-31 |
20160095253 | ENCLOSURE FOR LIQUID SUBMERSION COOLED ELECTRONICS - An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure. | 2016-03-31 |
20160095254 | MANAGING HEAT TRANSFER FOR ELECTRONIC DEVICES - An apparatus for cooling a heat-producing electronic device is disclosed. The apparatus may include a thermally conductive vessel to mate with and contain a working fluid in contact with the heat-producing electronic device. A bottom side of the thermally conductive vessel may include a sealing surface defining an aperture and configured to mate with, and inside a perimeter of, a top surface of the heat-producing electronic device. The thermally conductive vessel may also include an evaporative cavity formed by mating the thermally conductive vessel with the heat-producing electronic device, and having a wall that is the top surface of the heat-producing electronic device and a wall that is an interior surface of the thermally conductive vessel. The thermally conductive vessel may also include a condensing cavity adjoining the evaporative cavity, to receive heat by condensing the working fluid from a vapor state to a liquid state. | 2016-03-31 |
20160095255 | THERMAL PIEZOELECTRIC APPARATUS - An integrated thermal apparatus includes a piezoelectric device and a thermal module which includes a thermal plate contacting a heat source to remove heat from the heat source. The thermal plate has built-in heat sinks for maximizing the surface area for heat dissipation. Each piezoelectric device includes one or more piezoelectric elements. Through the actions of piezoelectric elements, a jet of air and an influx of air are generated to cool the heat sinks. The airflow also cools the surface of heat plate, which acts like a fan mounted on top of the heat source. | 2016-03-31 |
20160095256 | HEAT DISSIPATION MODULE - A heat dissipation module includes a hollow housing, a plurality of heat dissipation fins and heat dissipation liquid. The hollow housing includes a chamber, a side surface, a top surface and a bottom surface opposite to the top surface. The side surface is connected to the top surface and the bottom surface. The heat dissipation fins are disposed on the side surface. The heat dissipation liquid is contained within the chamber, and a specific heat of the heat dissipation liquid is substantially greater than or equal to 1 cal/g° C. | 2016-03-31 |
20160095257 | LOCKING LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction. | 2016-03-31 |
20160095258 | PROTECTIVE LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state. | 2016-03-31 |
20160095259 | LOCKING LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction. | 2016-03-31 |
20160095260 | PROTECTIVE LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state. | 2016-03-31 |
20160095261 | INTERLOCK ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state. | 2016-03-31 |
20160095262 | ELECTRONIC DEVICE - An electronic device includes a group of first cards and a group of second cards, wherein the group of first cards and the group of second cards are arranged orthogonally. An air path extends between a front part and a rear part of a chassis and a fan is positioned on at least one side of the group of second cards. An opening is formed in a second card to connect an air inlet of the fan with the air path extending between the front part and the rear part of the chassis. | 2016-03-31 |
20160095263 | INTERLOCK ASSEMBLY FOR AIR-MOVING ASSEMBLY - Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state. | 2016-03-31 |
20160095264 | Power Module and Power Conversion Apparatus Using Same - A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and conductive plates, wherein the module case includes a heat-radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening that is closed by the heat-radiation member, and wherein a heat-radiation fin unit having a plurality of heat-radiation fins vertically arranged thereon is provided at a center of the heat-radiation member, and a joint portion with the frame body is provided at an peripheral edge of the heat-radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body has a higher rigidity than that of the heat-radiation member. | 2016-03-31 |
20160095265 | ELECTROMAGNETIC WAVE SHIELDING SHEET COMPRISING CARBON COMPOSITE FIBER MANUFACTURED BY ELECTROSPINNING AND METHOD FOR MANUFACTURING SAME - An electromagnetic wave shielding sheet including a carbon composite fiber and manufactured by electrospinning, and a method of manufacturing the same are disclosed. More particularly, an electromagnetic wave shielding sheet includes a carbon composite fiber having a core-shell structure and a resin, and the core-shell structure includes an outer shell including a carbon fiber, and a core including metal nano particles arranged in a length direction of the carbon fiber in the outer shell. The electromagnetic wave shielding sheet includes metal nano particles as electromagnetic wave shielding materials in a carbon fiber, and the oxidation of a metal may be prevented, conductivity in a length direction of the carbon fiber may be secured, and the sheet may be applied to various industrial fields as an electromagnetic shielding material. | 2016-03-31 |
20160095266 | ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING APPARATUS INCLUDING ELECTRICALLY-CONDUCTIVE FOAM - According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate. | 2016-03-31 |
20160095267 | CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME - A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section. | 2016-03-31 |
20160095268 | DISMANTLING DEVICE AND METHOD FOR DISMANTLING BLACKLIGHT UNIT - A dismantling device and a method for dismantling a backlight unit are provided, and the dismantling method includes: placing a liquid crystal module that includes a liquid crystal panel and a backlight unit placed oppositely and connected by a bonding portion onto a supporting table; bringing a line cutting portion that includes two ends and a cutting line therebetween into a gap between the liquid crystal panel and the backlight unit, with at least one of the two ends and the liquid crystal module configured to be movable with respect to each other; and applying a cutting force upon the bonding portion with the line cutting portion along a plane where the bonding portion is located, so as to separate the backlight unit from the liquid crystal panel. This method decreases the force upon the backlight unit to reduce chances of damaging the backlight unit during dismantling the same. | 2016-03-31 |
20160095269 | CHIP REMOVING DEVICE - Embodiments of the invention disclose a chip removing device for facilitating the removal of a chip and reducing an influence on the flexible printed circuit board caused by heat, thereby optimizing the manufacturing process of the LCD panel. The chip removing device comprises: a handle; a heat supply unit mounted at one end of the handle, a detachable chip heating head provided on one side of the heat supply unit away from the handle; and a temperature controller in signal communication with the heat supply unit for controlling a temperature output by the heat supply unit. | 2016-03-31 |
20160095270 | Rhagodia spinescens plant named SAB01 - ‘SAB01’ is a new and distinct variety of | 2016-03-31 |
20160095271 | Phalaenopsis orchid plant named 'Silidream' - A new and distinct | 2016-03-31 |
20160095272 | Phalaenopsis orchid plant named 'IZZY' - A new and distinct | 2016-03-31 |