12th week of 2014 patent applcation highlights part 18 |
Patent application number | Title | Published |
20140077341 | INTEGRATED CIRCUIT AND SEAL RING - An integrated circuit (IC) and a seal ring thereof are provided. The IC includes a first seal ring. The first seal ring is disposed in the IC. The first seal ring includes at least one stagger structure. The at least one stagger structure includes at least one stagger unit. The at least one stagger unit makes staggered connection with another neighboring stagger unit. | 2014-03-20 |
20140077342 | SEMICONDUCTOR DEVICE HAVING BURIED LAYER AND METHOD FOR FORMING THE SAME - Semiconductor devices having a buried layer and methods for forming the same are disclosed. In an exemplary method, a hard mask layer can be provided on a semiconductor substrate. The hard mask layer can have a plurality of through-openings. A plurality of deep trenches can be formed in the semiconductor substrate using the hard mask layer as a mask. A bottom of each of the plurality of deep trenches in the semiconductor substrate can be doped to form a plurality of heavily-doped regions. One or more of the plurality of heavily-doped regions can be connected to form the buried layer in the semiconductor substrate. There is thus no need to use an epitaxial process to form active regions. In addition, lateral isolation structures can be simultaneously formed in the semiconductor substrate. | 2014-03-20 |
20140077343 | DUMMY WAFER STRUCTURE AND METHOD OF FORMING THE SAME - A dummy wafer structure and a method of forming the same are disclosed. The dummy wafer structure includes: a silicon substrate; a silicon nitride layer over the silicon substrate; and a silicon dioxide layer over the silicon nitride layer. The method includes: a first step of forming a silicon nitride layer over a silicon substrate so as to form a silicon-silicon nitride structure; and a second step of forming a silicon dioxide layer over the silicon-silicon nitride structure obtained in the first step so as to form a silicon-silicon nitride-silicon dioxide structure. Dummy wafers with this special structure are able to avoid deposition rate inconsistency in a polysilicon deposition process and are capable of avoiding conventional dummy wafers' adverse effect on deposit layer thicknesses of process wafers and hence providing the process wafers with deposit layers having a high inter-wafer uniformity. | 2014-03-20 |
20140077344 | Semiconductor Device with Protective Layer Over Exposed Surfaces of Semiconductor Die - A semiconductor wafer has a plurality of first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. A shielding layer is formed between the first and second semiconductor die. An electrical interconnect, such as conductive pillar, bump, or bond wire, is formed between the first and second semiconductor die. A conductive TSV can be formed through the first and second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and electrical interconnect. A heat sink is formed over the second semiconductor die. An interconnect structure, such as a bump, can be formed over the second semiconductor die. A portion of a backside of the first semiconductor die is removed. A protective layer is formed over exposed surfaces of the first semiconductor die. The protective layer covers the exposed backside and sidewalls of the first semiconductor die. | 2014-03-20 |
20140077345 | SEMICONDUCTOR PACKAGE, METHOD AND MOLD FOR PRODUCING SAME, INPUT AND OUTPUT TERMINALS OF SEMICONDUCTOR PACKAGE - A semiconductor package according to the present invention includes: a semiconductor element where a high frequency signal is input or output; a planar lead terminal having an end electrically connected to an input terminal or an output terminal of the semiconductor element; an encapsulation resin for encapsulating the lead terminal and the semiconductor element, the lead terminal having another end exposed from the resin; and a ground enhancing metal body encapsulated in the encapsulation resin, having a first main surface facing the lead terminal and a second main surface exposed from the encapsulation resin, wherein the ground enhancing metal body has a shape with a cross section parallel to the second main surface and having a smaller area than an area of the first main surface. | 2014-03-20 |
20140077346 | METHOD AND SYSTEM FOR PRE-MIGRATION OF METAL IONS IN A SEMICONDUCTOR PACKAGE - Pre-migration of metal ions is achieved in a controlled manner to form a migrated metalover which an inhibitor is applied to prevent further migration. In a semiconductor circuit, pre-migration of metal ions is achieved by exposing a joined metal system to water, oxygen and an electrical field in a controlled manner. Conductors, joined to electrically isolating materials, are exposed to electrical fields in such a manner as to form one or more anodes to corresponding cathodes, thus liberating metal ions. The metal ions are then allowed to migrate in a controlled manner from the anode toward the cathode to form a pre-migrated metal. Finally, an inhibitor is applied on top of the pre-migrated metal to prevent further migration. | 2014-03-20 |
20140077347 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF - The present invention provides a semiconductor device including: a semiconductor chip; a lead frame provided with a recessed portion on at least one of an upper surface or a lower surface thereof, and electrically coupled to the semiconductor chip; and a resin section that molds the semiconductor chip and the lead frame, and is provided with an opening above the recessed portion. By inserting a conductive pin (not shown) into the recessed portion through the opening, a plurality of semiconductor devices can be mechanically and electrically coupled to each other. | 2014-03-20 |
20140077348 | SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME - A lead frame includes a first outer lead portion and a second outer lead portion which is arranged to oppose to the first outer lead portion with an element-mounting region between them. An inner lead portion has first inner leads connected to the first outer leads and second inner leads connected to the second outer leads. At least either the first or second inner leads are routed in the element-mounting region. An insulation resin is filled in the gaps between the inner leads located on the element-mounting region. A semiconductor device is configured with semiconductor elements mounted on both the top and bottom surfaces of the lead frame. | 2014-03-20 |
20140077349 | Thermally Enhanced Package with Lid Heat Spreader - A method and apparatus are provided for manufacturing a lead frame based thermally enhanced package ( | 2014-03-20 |
20140077350 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - Provided is a semiconductor device including a wiring board including a plurality of alternately stacked insulating layers and wiring layers, the wiring layers being connected to each other by via-plugs, a semiconductor chip mounted on the wiring board, a heat-dissipating member that is disposed on a side opposite to the wiring board with the semiconductor chip sandwiched between the wiring board and the heat-dissipating member, and dissipates heat generated in the semiconductor chip, a sealing resin layer that is bonded to the wiring board and the heat-dissipating member between the wiring board and the heat-dissipating member, and seals the semiconductor chip from an outer periphery side, and a heat-conducting material that is bonded to the semiconductor chip and the heat-dissipating member between the semiconductor chip and the heat-dissipating member inside the sealing resin layer and conducts heat generated in the semiconductor chip to the heat-dissipating member. | 2014-03-20 |
20140077351 | MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING - A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second component with the metallic nanoparticles disposed therebetween, and elevating a temperature at least at interfaces of the juxtaposed conductive elements to a joining temperature at which the metallic nanoparticles cause metallurgical joints to form between the juxtaposed conductive elements. The conductive elements of either of or both of the first component and the second component can include substantially rigid posts having top surfaces projecting a height above the surface of the respective component and edge surfaces extending at substantial angles away from the top surfaces thereof. | 2014-03-20 |
20140077352 | Matrix Lid Heatspreader for Flip Chip Package - A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array ( | 2014-03-20 |
20140077353 | HEAT DISSIPATING SUBSTRATE AND SEMICONDUCTOR APPARATUS EQUIPPED WITH HEAT DISSIPATING SUBSTRATE - A heat dissipating substrate is joined to a semiconductor substrate via a solder layer. The heat dissipating substrate includes an electrical insulation layer, and a junction layer that is joined to the solder layer. A surface of the junction layer which is joined to the solder layer has a plurality of protruding portions that are arranged and spaced from each other, and a recess portion partially surrounded by walls of two or more adjacent protruding portions. A straight line that passes through an arbitrary point located in the recess portion flanked by the walls of the two or more adjacent protruding portions passes through at least one protruding portion. | 2014-03-20 |
20140077354 | SEMICONDUCTOR MODULE AND AN INVERTER MOUNTING SAID SEMICONDUCTOR MODULE - A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader. | 2014-03-20 |
20140077355 | THREE-DIMENSIONAL SEMICONDUCTOR PACKAGE DEVICE HAVING ENHANCED SECURITY - A semiconductor package device that includes an integrated circuit device package having a storage circuitry is disclosed. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to (e.g., adjacent to, in, or on) the first surface. The semiconductor package device also includes an integrated circuit device disposed over the second surface, the integrated circuit device including storage circuitry for storing sensitive data. In one or more implementations, the semiconductor package device includes a through-substrate via that furnishes an electrical connection to the integrated circuit package. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the integrated circuit device package. | 2014-03-20 |
20140077356 | Post Passivation Interconnect Structures and Methods for Forming the Same - A device includes a metal pad, a passivation layer overlapping edge portions of the metal pad, and a first polymer layer over the passivation layer. A Post-Passivation-Interconnect (PPI) has a level portion overlying the first polymer layer, and a plug portion that has a top connected to the level portion. The plug portion extends into the first polymer layer. A bottom surface of the plug portion is in contact with a dielectric material. A second polymer layer is overlying the first polymer layer. | 2014-03-20 |
20140077357 | CIRCUIT SUBSTRATE AND PROCESS FOR FABRICATING THE SAME - A circuit substrate includes a dielectric layer and a plurality of conductive structures. The dielectric layer has a plurality of conductive openings, a first surface, and a second surface opposite to the first surface. Each of the conductive openings connects the first surface and the second surface. The conductive openings are respectively filled with the conductive structures. Each of the conductive structures is integrally formed and includes a pad part, a connection part, and a protruding part. Each of the connection parts is connected to the corresponding pad part and the corresponding protruding part. Each of the protruding parts has a curved surface that protrudes from the second surface. A process for fabricating the circuit substrate is also provided. | 2014-03-20 |
20140077358 | Bump Structure and Method of Forming Same - An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal bump on the under bump metallurgy feature, and a substrate trace on a substrate, the substrate trace coupled to the metal bump through a solder joint and intermetallic compounds, a ratio of a first cross sectional area of the intermetallic compounds to a second cross sectional area of the solder joint greater than forty percent. | 2014-03-20 |
20140077359 | Ladder Bump Structures and Methods of Making Same - An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the copper pillar having a tapering curved profile, which has a larger bottom critical dimension (CD) than a top critical dimension (CD) in an embodiment, a metal cap mounted on the copper pillar, and a solder feature mounted on the metal cap. | 2014-03-20 |
20140077360 | Interconnection Structure and Method of Forming Same - An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion. | 2014-03-20 |
20140077361 | Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages - A semiconductor device has a first interconnect structure formed over the carrier. A semiconductor die is disposed over the first interconnect structure after testing the first interconnect structure to be known good. The semiconductor die in a known good die. A vertical interconnect structure, such as a bump or stud bump, is formed over the first interconnect structure. A discrete semiconductor device is disposed over the first interconnect structure or the second interconnect structure. An encapsulant is deposited over the semiconductor die, first interconnect structure, and vertical interconnect structure. A portion of the encapsulant is removed to expose the vertical interconnect structure. A second interconnect structure is formed over the encapsulant and electrically connected to the vertical interconnect structure. The first interconnect structure or the second interconnect structure includes an insulating layer with an embedded glass cloth, glass cross, filler, or fiber. | 2014-03-20 |
20140077362 | Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP - A semiconductor device has a substrate with first and second conductive layers formed over first and second opposing surfaces of the substrate. A plurality of bumps is formed over the substrate. A semiconductor die is mounted to the substrate between the bumps. An encapsulant is deposited over the substrate and semiconductor die. A portion of the bumps extends out from the encapsulant. A portion of the encapsulant is removed to expose the substrate. An interconnect structure is formed over the encapsulant and semiconductor die and electrically coupled to the bumps. A portion of the substrate can be removed to expose the first or second conductive layer. A portion of the substrate can be removed to expose the bumps. The substrate can be removed and a protection layer formed over the encapsulant and semiconductor die. A semiconductor package is disposed over the substrate and electrically connected to the substrate. | 2014-03-20 |
20140077363 | Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in Fo-WLCSP - A semiconductor device has a substrate including first and second conductive layers formed over first and second opposing surfaces of the substrate. A plurality of wire studs or stud bumps is formed over the substrate. A semiconductor die is mounted to the substrate between the wire studs. A first encapsulant is deposited around the semiconductor die. A first interconnect structure is formed over the semiconductor die and first encapsulant. A second encapsulant is deposited over the substrate, semiconductor die, and first interconnect structure. The second encapsulant can be formed over a portion of the semiconductor die and side surface of the substrate. A portion of the second encapsulant is removed to expose the substrate and first interconnect structure. A second interconnect structure is formed over the second encapsulant and first interconnect structure and electrically coupled to the wire studs. A discrete semiconductor device can be formed on the interconnect structure. | 2014-03-20 |
20140077364 | Semiconductor Device and Method of Forming Wire Studs as Vertical Interconnect in FO-WLP - A semiconductor device has a substrate and semiconductor die disposed over a first surface of the substrate. A wire stud is attached to the first surface of the substrate. The wire stud includes a base portion and stem portion. A bonding pad is formed over a second surface of the substrate. An encapsulant is deposited over the substrate, semiconductor die, and wire stud. A portion of the encapsulant is removed by LDA to expose the wire stud. A portion of the encapsulant is removed by LDA to expose the substrate. An interconnect structure is formed over the encapsulant and electrically connected to the wire stud and semiconductor die. A bump is formed over the interconnect structure. A semiconductor package is disposed over the encapsulant and electrically connected to the substrate. A discrete semiconductor device is disposed over the encapsulant and electrically connected to the substrate. | 2014-03-20 |
20140077365 | Metal Bump and Method of Manufacturing Same - An embodiment bump structure includes a contact element formed on a substrate, a passivation layer overlying the substrate, the passivation layer having a passivation opening exposing the contact element a polyimide layer overlying the passivation layer, the polyimide layer having a polyimide opening exposing the contact element an under bump metallurgy (UMB) feature electrically coupled to the contact element, the under bump metallurgy feature having a UBM width, and a copper pillar on the under bump metallurgy feature, a distal end of the copper pillar having a pillar width, the UBM width greater than the pillar width. | 2014-03-20 |
20140077366 | Wafer Level Fan-Out Package With a Fiducial Die - A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling. | 2014-03-20 |
20140077367 | SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS OF MANUFACTURE - A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall. | 2014-03-20 |
20140077368 | REPAIRING ANOMALOUS STIFF PILLAR BUMPS - A system for repairing pillar bumps includes a pillar bump repair device that is adapted to form a plurality of strain-relieving notches in a pillar bump that is positioned above a metallization system of a semiconductor chip. The system further includes a pillar bump support device that is adapted to substantially support the pillar bump while the pillar bump repair device is forming each of the plurality of strain-relieving notches. | 2014-03-20 |
20140077369 | Packaging Devices and Methods - Packaging devices and packaging methods are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming a plurality of through-substrate vias (TSVs) in an interposer substrate. The interposer substrate is recessed or a thickness of the plurality of TSVs is increased to expose portions of the plurality of TSVs. A conductive ball is coupled to the exposed portion of each of the plurality of TSVs. | 2014-03-20 |
20140077370 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device including at least one of the following steps: (1) Forming a lower electrode pattern on/over a substrate. (2) Forming a first interlayer insulating layer on the lower electrode pattern. (3) Forming an upper electrode pattern on the first interlayer insulating layer. (4) Forming a passivation layer on a side of the upper electrode pattern. (5) Forming a second interlayer insulating layer on the upper electrode pattern. (6) Etching the second interlayer insulating layer to form a cavity which exposes the passivation layer. (7) Forming a contact ball in the cavity. | 2014-03-20 |
20140077371 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method of manufacturing a semiconductor device including at least one of the following steps: ( | 2014-03-20 |
20140077372 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Embodiments relate to a method for manufacturing a semiconductor device including at least one of: (1) Forming a lower electrode pattern on/over a substrate. (2) Forming a first interlayer insulating layer on/over the lower electrode pattern. (3) Forming a second interlayer insulating layer over the first interlayer insulating layer to include an intermediate electrode pattern. (4) Forming an upper electrode pattern over the second interlayer insulating layer. (5) Forming a third interlayer insulating layer over the upper electrode pattern. (6) Etching the first to third interlayer insulating layers to form a cavity which exposes a portion of the intermediate electrode pattern. (7) Forming a contact ball in the cavity. | 2014-03-20 |
20140077373 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface. | 2014-03-20 |
20140077374 | Through Via Structure and Method - An apparatus comprises a through via formed in a substrate. The through via is coupled between a first side and a second side of the substrate. The through via comprises a bottom portion adjacent to the second side of the substrate, wherein the bottom portion is formed of a conductive material. The through via further comprises sidewall portions formed of the conductive material and a middle portion formed between the sidewall portions, wherein the middle portion is formed of a dielectric material. | 2014-03-20 |
20140077375 | SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOLID STATE RELAY - This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste. | 2014-03-20 |
20140077376 | SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND METHOD FOR SOLDERING A SEMICONDUCTOR CHIP TO A CARRIER - A semiconductor chip includes a semiconductor body and a chip metallization applied on the semiconductor body. The chip metallization has an underside facing away from the semiconductor body. The chip further includes a layer stack applied to the underside of the chip metallization and having a number N1≧1 or N1≧2 of first partial layers and a number N2≧2 of second partial layers. The first partial layers and the second partial layers are arranged alternately and successively such that at least one of the second partial layers is arranged between the first partial layers of each first pair of the first partial layers and such that at least one of the first partial layers is arranged between the second partial layers of each second pair of the second partial layers. | 2014-03-20 |
20140077377 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, the semiconductor device in the embodiment has an assembly substrate, a semiconductor chip, and a jointing layer. The semiconductor chip is joined to the assembly substrate via the jointing layer. An intervening diffusion barrier layer may be interposed between the chip and jointing layer. The jointing layer is an alloy layer mainly made of any metal selected from Sn, Zn and In or an alloy of Sn, Zn and In, and any metal selected from Cu, Ni, Ag, Cr, Zr, Ti and V or an alloy of any metal selected from Cu, Ni, Ag, Cr, Zr, Ti and V and any metal selected from Sn, Zn and In, where the alloy has a higher melting temperature than that of Sn, Zn and In or an alloy of Sn, Zn and/or In. | 2014-03-20 |
20140077378 | LOW THERMAL STRESS PACKAGE FOR LARGE AREA SEMICONDUCTOR DIES - A low thermal stress package for large area semiconductor dies. The package may include a substrate and at least one pedestal extending from the substrate, wherein the pedestal may have a mounting surface that is smaller than a mounting surface of a semiconductor die that is mounted to the pedestal. The bonded area between the die and the pedestal is therefore reduced relative to conventional semiconductor package substrates, as is the amount of thermal stress sustained by the die during thermal cycling. | 2014-03-20 |
20140077379 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME - One or more embodiments relate to a method for forming a semiconductor structure, comprising: providing a workpiece; forming a dielectric barrier layer over the workpiece; forming an opening through the dielectric barrier layer; forming a seed layer over the dielectric barrier layer and within the dielectric barrier layer opening; and electroplating a first fill layer on the seed layer. | 2014-03-20 |
20140077380 | BIT CELL WITH DOUBLE PATTERNED METAL LAYER STRUCTURES - An approach for providing SRAM bit cells with double patterned metal layer structures is disclosed. Embodiments include: providing, via a first patterning process, a word line structure, a ground line structure, a power line structure, or a combination thereof; and providing, via a second patterning process, a bit line structure proximate the word line structure, the ground line structure, the power line structure, or a combination thereof. Embodiments include: providing a first landing pad as the word line structure, and a second landing pad as the ground line structure; and providing the first landing pad to have a first tip edge and a first side edge, and the second landing pad to have a second tip edge and a second side edge, wherein the first side edge faces the second side edge. | 2014-03-20 |
20140077381 | Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants - A semiconductor device has a first semiconductor die including TSVs mounted to a carrier with a thermally releasable layer. A first encapsulant having a first coefficient of thermal expansion CTE is deposited over the first semiconductor die. The first encapsulant includes an elevated portion in a periphery of the first encapsulant that reduces warpage. A surface of the TSVs is exposed. A second semiconductor die is mounted to the surface of the TSVs and forms a gap between the first and second semiconductor die. A second encapsulant having a second CTE is deposited over the first and second semiconductor die and within the gap. The first CTE is greater than the second CTE. In one embodiment, the first and second encapsulants are formed in a chase mold. An interconnect structure is formed over the first and second semiconductor die. | 2014-03-20 |
20140077382 | SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION - A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package. | 2014-03-20 |
20140077383 | STRUCTURE AND METHOD OF MAKING AN OFFSET-TRENCH CRACKSTOP THAT FORMS AN AIR GAP ADJACENT TO A PASSIVATED METAL CRACKSTOP - A structure and method of making an offset-trench crackstop, which forms an air gap in a passivation layer that is adjacent to a passivated top metal layer of a metal crackstop in an integrated circuit (IC) die. The offset-trench crackstop may expose a portion of a topmost dielectric layer in the crackstop region, not expose a topmost patterned metal layer of the metal crackstop, and may be interposed between the metal crackstop and an active device region. Alternatively, the offset-trench crackstop may expose a portion of the topmost dielectric layer, which separates an outermost metal layer and an innermost metal layer of the metal crackstop, and does not expose any of the topmost patterned metal layer of the metal crackstop, where the innermost metal layer of the metal crackstop is interposed between the offset-trench crackstop in the crackstop region and the active device region of the IC die. | 2014-03-20 |
20140077384 | BIT CELL WITH TRIPLE PATTERNED METAL LAYER STRUCTURES - An approach for providing bit cells with triple patterned metal layer structures is disclosed. Embodiments include: providing, via a first patterning process of a metal layer, a first structure that is a first one of a word line structure, a ground line structure, a power line structure, and a bit line structure; providing, via a second patterning process of the metal layer, a second structure that is different from the first structure and that is a second one of the word line structure, the ground line structure, the power line structure, and the bit line structure; and providing, via a third patterning process of the metal layer, a third structure that is different from the first structure and the second structure, and that is a third one of the word line structure, the ground line structure line, the power line structure, and the bit line structure. | 2014-03-20 |
20140077385 | SEMICONDUCTOR PACKAGE DEVICE HAVING PASSIVE ENERGY COMPONENTS - A semiconductor package device is disclosed that includes a passive energy component integrated therein. In an implementation, the semiconductor package device includes a semiconductor substrate having a first surface and a second surface. The semiconductor substrate includes one or more integrated circuits formed proximal to the first surface. The semiconductor package device also includes a passive energy component positioned over the second surface. The passive energy component is electrically connected to one or more integrated circuits. The semiconductor package device also includes an encapsulation structure disposed over the second surface and at least substantially encapsulates the passive energy component. | 2014-03-20 |
20140077386 | 3D IC and 3D CIS Structure - An embodiment integrated circuit includes a first device supporting a first back end of line layer, the first back end of line layer including a first alignment marker, and a second device including a spin-on glass via and supporting a second back end of line layer, the second back end of line layer including a second alignment marker, the spin-on glass via permitting the second alignment marker to be aligned with the first alignment marker using ultraviolet light. | 2014-03-20 |
20140077387 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: cutting a substrate into a plurality of interposers; disposing the interposers on a carrier, wherein the interposers are spaced from one another by a distance; disposing at least a semiconductor element on each of the interposers; forming an encapsulant to encapsulate the interposers and the semiconductor elements; and removing the carrier. Therefore, by cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers. | 2014-03-20 |
20140077388 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a device chip coupled to an electrode chip. The device chip includes a first device electrode on a first substrate, and the electrode chip includes a first pad electrode extending at least partially through a second substrate. The first pad electrode is electrically connected to the first device electrode and includes spaced conductive sections which serve as a heat dissipating structure to transfer heat received from the device chip and the electrode chip. A method for making a semiconductor device includes using the substrate of the electrode chip as a support during thinning the substrate of the device chip. | 2014-03-20 |
20140077389 | Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package - A semiconductor device has a substrate including a base and a plurality of conductive posts extending from the base. The substrate can be a wafer-shape, panel, or singulated form. The conductive posts can have a circular, rectangular, tapered, or narrowing intermediate shape. A semiconductor die is disposed through an opening in the base between the conductive posts. The semiconductor die extends above the conductive posts or is disposed below the conductive posts. An encapsulant is deposited over the semiconductor die and around the conductive posts. The base and a portion of the encapsulant is removed to electrically isolate the conductive posts. An interconnect structure is formed over the semiconductor die, encapsulant, and conductive posts. An insulating layer is formed over the semiconductor die, encapsulant, and conductive posts. A semiconductor package is disposed over the semiconductor die and electrically connected to the conductive posts. | 2014-03-20 |
20140077390 | ELECTRONIC APPARATUS - An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip. | 2014-03-20 |
20140077391 | SEMICONDUCTOR DEVICE - A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes. | 2014-03-20 |
20140077392 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - The semiconductor device has insulating films | 2014-03-20 |
20140077393 | APPARATUS AND METHOD FOR HIGH DENSITY MULTI-CHIP STRUCTURES - Devices and methods are described including a multi-chip assembly. Embodiments of multi-chip assemblies are provided that uses both lateral connection structures and through chip connection structures. One advantage of this design includes an increased number of possible connections. Another advantage of this design includes shorter distances for interconnection pathways, which improves device performance and speed. | 2014-03-20 |
20140077394 | Wafer Level Embedded Heat Spreader - Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads. | 2014-03-20 |
20140077395 | INTEGRATED CIRCUIT DEVICE - An integrally packaged optronic integrated circuit device including an integrated circuit die containing at least one of a radiation emitter and radiation receiver and having a transparent packaging layer overlying a surface of the die, the transparent packaging layer having an opaque coating adjacent to edges of the layer. | 2014-03-20 |
20140077396 | AIRCRAFT HUMIDIFIER - An aircraft humidifier is engineered as a stand-alone, fully integrated aircraft humidifier that is suitable for providing uniform, non-wetting humidified air disbursed by the aircraft humidifier into ambient air to increase the relative humidity in low humidity environments such as aircraft interiors, including cockpits, cabins, crew rests, cargo holds, and lavatories as well as any other enclosed areas. | 2014-03-20 |
20140077397 | Methods for Improving Liquid Quality in a Reservoir - Liquid treatment systems, components of liquid treatment systems, and methods of treating liquids are disclosed. | 2014-03-20 |
20140077398 | HUMIDIFYING APPARATUS - Humidifying apparatus includes a base housing an impeller and a motor for driving the impeller to generate a first air flow. A nozzle includes an interior passage for receiving the first air flow and an air outlet for emitting the first air flow. The nozzle defines an opening through which air from outside the apparatus is drawn by air emitted from the air outlet. The apparatus is configured to humidify a second air flow, which is emitted from a plurality of second air outlets. The second air flow is humidified with water supplied from a water tank mounted on the base. The water tank has an upwardly curved upper surface. The nozzle is mounted on the apparatus so that the upper surface of the water tank at least partially covers a lower section of an external surface of the nozzle. | 2014-03-20 |
20140077399 | SYSTEMS FOR CARBONATING CUSTOMIZED BEVERAGES - A system for carbonating a personalized beverage may comprise a base container including at least one sidewall defining a liquid storage area, and a carbon dioxide storage member configured to be sealingly coupled to said base container. The system may further comprise a carbon dioxide cartridge configured to selectively release carbon dioxide when engaged with said carbon dioxide storage member, and wherein said carbon dioxide storage member further comprises a pressure regulator configured to, when actuated, release the said carbon dioxide from said carbon dioxide cartridge at a rate configured to carbonate a beverage within said liquid storage over a period of time greater than 6 hours and less than 36 hours. | 2014-03-20 |
20140077400 | Exhaust Gas Flow Mixer - A mixer for mixing an exhaust flow with a fluid injected into an exhaust pipe includes a tubular housing having a reduced size center portion positioned between first and second ends. The housing includes circumferentially spaced apart apertures extending through the center portion. A first mixing element includes a first peripheral portion positioned within one of the apertures and a second peripheral portion positioned within another one of the apertures. A second mixing element includes third and fourth peripheral portions positioned within other apertures of the housing. | 2014-03-20 |
20140077401 | CENTRIFUGAL SELF-PRIMING MIXED AND INVERTED-UMBRELLA SHAPED AERATOR - A centrifugal self-priming mixed and inverted-umbrella shaped aerator is disclosed. A plurality of three-phase mixing tube sets is distributed on a surface of a wheel body ( | 2014-03-20 |
20140077402 | HUMIDIFICATION CELL - A humidification cell of a fuel cell apparatus includes a first outer plate and a second outer plate. A gas chamber, a humidification water chamber, and a water-permeable membrane that separates the two chambers are disposed between the first outer plate and the second outer plate starting from the first outer plate. A first water-permeable support element is disposed between the first outer plate and the membrane. The first support element is made of a woven fabric formed of a plastic. A discharge and an entrainment of liquid water can be prevented during load changes or other non-stationary fuel cell operating states accompanied by a sudden change of gas volume flow in that the plastic is a fluoropolymer or a fluoroplastic. Advantageously, the fluoropolymer or fluoroplastic is formed at least partly, preferably entirely, of an alternating copolymer of ethylene and chlorotrifluorethylene (E-CTFE). | 2014-03-20 |
20140077403 | PROCESS FOR MANUFACTURING COLOURED CERAMIC PARTS BY PIM - A method of manufacturing a master batch for the molding of colored parts, including the steps of: preparing a mixture comprising an inorganic powder, advantageously ceramic, and a dye; submitting the mixture to a spray-drying step to obtain an atomized powder; submitting said atomized powder to a presintering step; mixing the presintered powder with an organic binder, advantageously polymeric, to obtain the master batch. | 2014-03-20 |
20140077404 | METHOD FOR PRODUCING RESIN BOTTLES - The present invention provides a method for producing a resin bottle formed from a preform as a prototype by a blow molding process. The method comprises: a first step of measuring each of weights or wall thicknesses of a plurality of inspection parts set in a body portion of the preform; a second step of comparing each of the weights or the wall thicknesses measured by the first step with a preset set value, and thereby inspecting a difference between each of the weights or the wall thicknesses measured by the first step and the set value for each of the inspection parts; and a third step of adjusting a condition for blow molding in the blow molding process in accordance with an inspection result of each of the inspection parts. | 2014-03-20 |
20140077405 | Manufacturing Device and Manufacturing Method of Polyolefin Microporous Film - Devices and methods of manufacturing a polyolefin microporous film are disclosed. An exemplary device includes a movement mechanism having a constraining means capable of mechanically constraining both widthwise edge parts of the strip-like and film-like microporous film precursor in the drying chamber; a drying means and a liquid seal tank. An exemplary method includes a step for mechanically constraining both widthwise edge parts of the strip-like and film-like microporous film precursor and a step for conveying the foregoing film precursor into the drying chamber. Another exemplary method includes a step for mechanically constraining both widthwise edge parts of the strip-like and film-like microporous film precursor at an entrance side of the drying chamber, a step for commencing extracting of the plasticizer from the film-like microporous film precursor, and a step for conveying the strip-like and film-like microporous film precursor into the drying chamber and for heating the foregoing film precursor. | 2014-03-20 |
20140077406 | INJECTION MOLDING METHOD - An injection molding method comprising: a mold clamping step of clamping a first mold and a second mold to form a mold cavity; a first injection filling step of injecting a foamable molten resin into the mold cavity to fill an interior of the mold cavity with the foamable molten resin, after completion of the mold clamping step; a mold cavity expansion step of expanding the mold cavity by a specified quantity to cause the foamable molten resin to foam, after the start of the first injection filling step; and a second injection filling step of pouring a molten resin or gas into the foamable molten resin within the mold cavity, after the completion of the first injection filling step, and after the start of the mold cavity expansion step. | 2014-03-20 |
20140077407 | METHOD AND DEVICE FOR PRODUCING SLABSTOCK FOAM - The present invention concerns a method for the production of slabstock foam, wherein a vessel which is open on its underside is placed onto the bottom of a foaming box, the vessel is filled with reaction components and subsequently removed. In the utilized vessel its horizontal cross-sectional contour can be described by, starting from a basic body which comprises at least three corners, a protrusion ( | 2014-03-20 |
20140077408 | Method and Device for Producing a Crimped Multifilament Thread - A method and a device for producing a crimped multifilament thread are described. A multiplicity of filaments are extruded by means of a spinning machine, cooled and subsequently treated by a drawing device and a crimping device to form a crimped thread. Before the thread is wound up to form a bobbin, a multiplicity of intertwining knots is produced on the crimped thread by a treatment device. In order to obtain defined patterns of the intertwining knots within the thread, a pulse sequence of compressed air pulses at a predefined frequency is directed at the thread. The treatment device has a controllable blowing means. | 2014-03-20 |
20140077409 | CABLE-SEALING MEMBER AND ITS PRODUCING METHOD - A method for producing a cable-sealing member is disclosed. The method comprises forming a formed rubber including a first plane and a second plane that oppose in a thickness direction and a side plane that bridges a peripheral edge of the first plane and a peripheral edge of the second plane. The method further includes rotating the formed rubber with one axis in the thickness direction as a rotary axis while a holder is applied over the side plane of the formed rubber and, meanwhile, inserting a cutting blade from the first plane into the formed rubber to form a ring-form slit portion and stopping the cutting blade just in front of the second plane, leaving a slit-form ring unbored on one side. | 2014-03-20 |
20140077410 | MANUFACTURING METHOD AND INJECTION MOLDING SYSTEM FOR MULTI-COLOR MOLDED ARTICLE - An injection molding system is configured to produce a multi-color molded article by simultaneously or sequentially injection-molding resins of a plurality of types by means of a plurality of injection molding machines. An insert mold is mounted in a mold of a first injection molding machine and a primary molded article is molded by this injection molding machine. Thereafter, a robot arm takes out the insert mold, along with the primary molded article, from the mold of the injection molding machine and attaches it to a mold of a second injection molding machine. A two-color molded article is injection-molded by the second injection molding machine and removed as a product. | 2014-03-20 |
20140077411 | REINFORCED PROSTHETIC IMPLANT WITH FLEXIBLE SHELL - A fluid-filled soft prosthetic implant having a shell with a reinforced shell wall. The soft prosthetic implant may be for breast reconstruction or augmentation, or to restore the normal appearance of soft tissue in the buttocks, chin, calf, etc. The implants may be reinforced using several methods: reinforcement of the shell wall, non-homogeneous gel-filling, or both. At least a portion of the perimeter region desirably has a shell wall thickness greater than the average shell wall thickness of either the anterior face or the posterior face. The added material at the perimeter region strengthens that area in which a large percentage of implant ruptures occur. The reinforced perimeter also helps prevent the implant from collapsing or folding, which can cause undesirable rippling or wrinkling visible through the patient's skin. The remainder of the shell will desirably have a nominal wall thickness to retain the overall softness and supple feel of the implant. The implant shell may be filled with gels of different gel cohesiveness to counterbalance any reinforced area or to provide added reinforcement. | 2014-03-20 |
20140077412 | Method for Manufacturing Shaped Product with Maintained Isotropy - The present invention provides a method for manufacturing a shaped product constituted by a fiber-reinforced composite material including reinforcing fibers and a thermoplastic resin, the shaped product with maintained isotropy of the fibers to the end thereof even if press-molded under conditions in which charge ratio of a prepreg to a die is low. Specifically, the method includes using a specific prepreg obtained by impregnating the reinforcing fibers with thermoplastic resin, and molding-processing the prepreg under specific conditions. | 2014-03-20 |
20140077413 | AIRFOIL MANUFACTURING SYSTEM - An apparatus and method for shaping an airfoil. A prepreg assembly is positioned relative to a part in a plurality of parts for a tool for the airfoil using a positioning section for a frame. The positioning section is configured to move relative to the tool and a base of the frame and move a number of parts in the plurality of parts for the tool relative to each other. A number of sections in the prepreg assembly are heated. A force is applied to the number of sections in the prepreg assembly that have been heated to conform to the tool to cause the number of sections in the prepreg assembly that have been heated to conform to the tool with a shape for a component of the airfoil. | 2014-03-20 |
20140077414 | GOLF BALL MOLDS AND RELATED SYSTEMS - Golf balls and systems for applying one or more polymer layers to a golf ball construct are disclosed. As but one example of disclosed systems, a method of forming a golf ball construct includes positioning a core or mantle portion of a golf ball in a cavity, opening a valve gate adjacent the cavity to cause viscous polymer to flow through the valve gate, into a short runner and into one or more radial runners that at least partially surround a circumference of the cavity. The polymer layer is allowed to solidify to form a solidified polymer layer, and the golf ball construct is removed from the mold cavity. | 2014-03-20 |
20140077415 | TWISTING APPARATUS - A twisting apparatus is described. The twisting apparatus has a loading device adapted to load a food product inside a casing and a braking device. A filling assembly is adapted to support the casing. An inlet conduit is provided for feeding the food product into the filling assembly. The inlet conduit is structurally separate from the passage duct of the filling assembly and configured to assume at least one first operative position in which the filling assembly is connected to the braking device and the inlet conduit is in fluid communication with said passage duct and a second operative position in which the filling assembly is displaced in a spaced relationship or detached from the braking device. | 2014-03-20 |
20140077416 | INJECTION MOLDING PROCESS - A controller ( | 2014-03-20 |
20140077417 | STANDOFF GENERATING DEVICES AND PROCESSES FOR MAKING SAME - Standoff generating devices, arrays, and processes are disclosed for producing standoffs of various shapes, aspect ratios, and mechanical properties on a receiving surface for production of, e.g., vacuum-insulated glass units (VIGUs). | 2014-03-20 |
20140077418 | Method for Preparing Article Having Uneven Microstructure on Surface Thereof - A method for preparing an article having an uneven microstructure on a surface thereof, including coating a surface of a mold having an uneven microstructure formed from an anodized alumina oxide on a surface with a release treatment solution including a mold release agent that includes one or more kinds of phosphoric ester compound and the pH of the aqueous solution when extracted with 50 mL of water with respect to 1 g of the mold release agent is 3.0 or more; and | 2014-03-20 |
20140077419 | FLUORORESIN COMPOSITE MATERIAL, COOKING UTENSIL, COOKER, ROLLER FOR OA APPARATUS, BELT FOR OA APPARATUS, AND PROCESSES FOR PRODUCING THESE - A fluorocarbon resin composite includes a fluorocarbon resin layer on a base, in which a fluorocarbon resin constituting the fluorocarbon resin layer is crosslinked by electron beam irradiation, and the base has a desired shape obtained by machining. The fluorocarbon resin is composed of a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer, polytetrafluoroethylene, or a mixture of the tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and polytetrafluoroethylene. A fluorocarbon resin composite, cookware, and a roller and a belt for use in office automation equipment are each produced by applying an uncrosslinked fluorocarbon resin on a base, subjecting the fluorocarbon resin to electron beam irradiation in a low-oxygen atmosphere to crosslink the fluorocarbon resin while the temperature of the fluorocarbon resin is maintained at a temperature equal to or higher than the melting point of the fluorocarbon resin, and machining the base into a desired shape. There is also provided methods for producing them. | 2014-03-20 |
20140077420 | UV Curing System and Method For Wind Blade Manufacture And Repair - A UV curing system and method for manufacture and repair of composite parts, such as for use in wind blade manufacture and repair is disclosed. The system and method utilize UV as the single radiation source to cure laminates such as glass fiber reinforced laminates containing a photo initiator. The use of Co naphthenate or phenoxyethyl methacrylate in the curing of thick laminates produces high glass transition and complete curing of thick laminates. The addition of cobalt naphthenate and phenoxyethyl methacrylate shows no significant reduction on the bonding strength. | 2014-03-20 |
20140077421 | ADDITIVE MANUFACTURING CHAMBER WITH REDUCED LOAD - A disclosed additive manufacturing machine includes a fixed platform defining a work surface for supporting fabrication of a part and a housing defining a chamber over the work surface. A material applicator is supported on the housing for depositing material onto the work surface. An energy directing device is also supported on the housing and directs energy within the chamber to form a part. The housing is movable relative to the work surface therefore moves the energy producing device relative to the work surface to maintain a distance between the energy directing device and a surface of the part during fabrication. | 2014-03-20 |
20140077422 | REDUCED BUILD MASS ADDITIVE MANUFACTURING CHAMBER - A disclosed additive manufacturing machine includes a work surface for supporting fabrication of part and a housing defining a chamber over the work surface. A material applicator supported on the housing deposits material onto the work surface and a blocker plate disposed between the material applicator and the work surface for blocking a portion of material deposited by the material applicator. An energy directing device is supported on the housing and directing energy within the chamber to form the part. | 2014-03-20 |
20140077423 | METHOD AND DEVICE FOR INSERTING CORES OF ROVINGS INTO A PRESS - A method for inserting cores of rovings ( | 2014-03-20 |
20140077424 | PLASTIC FORMULATION AND METHOD FOR THE PRODUCTION OF PLASTIC BOTTLES IN A TWO-STAGE STRETCH BLOW-MOLDING PROCESS - An exemplary plastic formulation is disclosed for the production of plastic bottles in a two-stage stretch blow-molding process, and includes at least 60% of HDPE (High Density Polyethylene) having a density of 0.941 g/cm | 2014-03-20 |
20140077425 | POROUS METAL OXIDE AND METAL OXIDE-ORGANIC NANOCOMPOSITES, METHODS OF MAKING AND USES THEREOF - The disclosure provides relates to compositions and methods for water treatment. It also addresses a method for synthesizing TiO | 2014-03-20 |
20140077426 | METHOD OF MANUFACTURING POWDER INJECTION-MOLDED BODY - A method of manufacturing a powder injection-molded body, the method including: mixing at least titanium hydrogen compound (TiHx) powder and a binder to prepare a molding mixture; powder-injecting the molding mixture to form a molded product; degreasing the molded product; and sintering the degreased molded product, wherein in the titanium hydrogen compound, the ratio of hydrogen(H) to titanium(Ti) is greater than 0.45 and less than 1.98. | 2014-03-20 |
20140077427 | TRAVEL CONTROL FOR A GAS SPRING AND GAS SPRING HAVING VERY SHORT TRAVEL MODES - A gas spring capable of having long and short travel modes is described. The gas spring uses liquid in combination with pressurized air to affect the travel length. Unlike conventional gas springs, the gas spring according to the invention may have its travel reduced more than, for example, by 50%. | 2014-03-20 |
20140077428 | BOLT THROUGH HYDRAULIC MOUNT WITH AND WITHOUT A DECOUPLER - A mount having a bolt through configuration couples two components of a vehicle. The mount includes a first elastomeric member that defines a first portion of a first chamber and a second elastomeric member that defines a second portion of the first chamber and defines a second chamber. An inner tube assembly defines an opening for receiving the bolt. The first and the second elastomeric members are bonded to the inner tube assembly. An annular member is disposed between the first and the second chambers. The annular member defines a fluid-track which fluidly couples the first and the second chambers. The mount dampens vibrations at varying amplitudes by pushing fluid between the first and the second chambers via the fluid-track. The mount may also include a decoupler by way of a decoupler ring and decoupler cap to isolate the mount at a predetermined amplitude at varying frequencies. | 2014-03-20 |
20140077429 | SPRING ASSEMBLY AND METHOD - A method of assembling a spring inside of a tube includes providing a coil spring and a tube having a first retaining structure at a first end of the tube. The method includes positioning a rod in the tube. The spring is positioned in the tube, and a second retaining structure is attached to the rod with the spring positioned between the first and second retaining structures. A force is applied to the spring, and the second retaining structure is fixed at a position wherein the spring provides a desired preload. | 2014-03-20 |
20140077430 | BUMPER STOPPER FOR A SHOCK ABSORBER - A shock absorber for a bump stopper includes a plurality of corrugated projection | 2014-03-20 |
20140077431 | System and Method for 2D Workpiece Alignment - A carrier capable of holding one or more workpieces is disclosed. The carrier includes movable projections located along the sides of each cell in the carrier. This carrier, in conjunction with a separate alignment apparatus, aligns each workpiece within its respective cell against several alignment pins, using a multiple step alignment process to guarantee proper positioning of the workpiece in the cell. First, the workpieces are moved toward one side of the cell. Once the workpieces have been aligned against this side, the workpieces are then moved toward an adjacent orthogonal side such that the workpieces are aligned to two sides of the cell. Once aligned, the workpiece is held in place by the projections located along each side of each cell. In addition, the alignment pins are also used to align the associated mask, thereby guaranteeing that the mask is properly aligned to the workpiece. | 2014-03-20 |
20140077432 | WORK HOLDING DEVICE FOR AN ARCHERY BOW - An archery bow holding device that is preferably mounted to a ball joint assembly for attachment to a table top, bench or like surface, and provides a movable mount for the archery bow holding device that holds an archery bow for performing work thereon. The preferred ball joint assembly includes a cylindrical housing that is slotted on opposite sides thereof from a center opening in the housing top and contains a ball that mounts a stem that the archery bow holding device is secured to, with the stem fitted through a slot through the housing top, to tilt between the slots and pivot when the ball in unlocked and, with the ball locked, provides a rigid mount to the archery bow holding device that includes a main beam that is bent to provide a rest for an archery bow limb positioned and clamped there against for an operator to work on. | 2014-03-20 |
20140077433 | Tool for Clamping Using Sides of Workpieces - The invention relates to a tool for clamping using sides of workpieces, in particular to a tool for clamping and processing workpieces like boxes using sides of the box workpieces, belonging to the technical field of tools for clamping used in the processing center to process workpieces. The tool for clamping using sides of workpieces comprises a soleplate, wherein one side of the soleplate is fixed with multiple elastic seats arranged at interval, the elastic seats are provided with vertical V-shaped grooves, the bottom of each vertical V-shaped groove is provided with a rectangle groove, the bottom of the rectangle groove is provided with a threaded hole, a V-shaped pressing block is fitted in the vertical V-shaped groove, a through hole which is coaxial with the threaded hole on the bottom of the rectangle groove is formed on the V-shaped pressing block, and a bolt passes through the through hole on the V-shaped pressing block to fit with the threaded hole on the bottom of the rectangle groove; and, the other side of the soleplate opposite to the elastic seats is provided with multiple V-shaped locating blocks arranged at interval, the gap between each two adjacent elastic seats corresponds to one V-shaped locating block, and each V-shaped locating block is provided with a horizontal V-shaped groove, the opening of which faces the gap between two adjacent elastic seats. | 2014-03-20 |
20140077434 | EDGE STABILIZING SYSTEM AND METHOD FOR COMPOSITE BARREL SEGMENTS - An edge stabilizer for a composite structure includes an elongate edge support segment, defining a geometric shape of an edge of the composite structure, and a connector, configured to attach the edge support segment to the edge of the composite structure. The edge support segment comprises first and second halves configured to attach together around the edge, each half including a shoulder, opposing mating relationship of the shoulders defining a slot for receiving the edge. The edge stabilizer can be part of a system for stabilizing an edge of a composite barrel section. The system can also include a moveable cart, the barrel section being supportable upon the cart. | 2014-03-20 |
20140077435 | Sterilization Base-Tray with Internal Frame and Integrated Latching and Intrument Retention System - The invention relates to product, method and system for materials handling apparatus and more particularly to an integrated design of a vessel for combining sterilization, storage, transport and presentation of dental or surgical instruments or implants using a uniquely designed sterilization base-tray. The simplicity of design and resulting fabrication of a base-tray as a single closed cavity component together with a limited additional number of parts forming the sterilization tray eliminates bacteria colonization as well as lowering manufacturing costs. | 2014-03-20 |
20140077436 | SHEET PROCESSING APPARATUS, IMAGE FORMING SYSTEM, AND METHOD OF ENHANCING FOLDING OF SHEET BUNDLE - A sheet processing apparatus includes: a folding unit that folds a sheet bundle; a pressing unit that presses a fold part of the sheet bundle, which has been folded by the folding unit, in a thickness direction of the sheet bundle to enhance folding of the fold part; and a moving unit that advances and returns the pressing unit in a width direction of the sheet bundle. The pressing unit starts pressing from a predetermined position in the width direction of the sheet bundle during advancing movement, and releases pressing after going past one end of the sheet bundle. The pressing unit starts pressing from the predetermined position during return movement and goes past the other end of the sheet bundle. | 2014-03-20 |
20140077437 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - A sheet processing apparatus in which a sheet bundle including a plurality of sheets discharged onto an intermediate processing tray is received in a receiving portion of a stapler and bound with use of a staple, and a sheet bundle including a plurality of sheets discharged onto the intermediate processing tray is received in a receiving portion of a staple-less binding unit having a gap in the thickness direction of the sheets smaller than that of the receiving portion of the stapler and bound without using a staple, wherein when the stapler performs the binding process, the staple-less binding unit is arranged in a position shifted in a width direction orthogonal to a sheet discharge direction from a region on the intermediate processing tray, through which the sheets discharged by a sheet discharging portion pass. | 2014-03-20 |
20140077438 | PRINTING APPARATUS AND CONTROL METHOD FOR PRINTING APPARATUS - The printing apparatus of the present invention includes a delay mechanism that can transmit, with a delay, the rotational force of a discharge roller to a discharge tray. When the reverse rotation of the discharging roller has been begun, the delay mechanism accumulates the length of the delay, or, when the forward rotation of the discharge roller is performed for a longer period than the accumulated length of the delay, opens the discharge tray. When the feeding of a sheet is not performed during a sheet feeding operation accompanied by the reverse rotation of the discharging roller, the discharging roller is rotated forward to cancel out the length of the delay accumulated in the delay mechanism. | 2014-03-20 |
20140077439 | PRINT-MEDIUM STORING UNIT, PRINT-MEDIUM STORING APPARATUS AND IMAGE FORMING APPARATUS EMPLOYING THE SAME - A print-medium storing unit, a print-medium storing apparatus including the same, and an image forming apparatus including the same which are provided in a power transmission mechanism, print-medium storing apparatus which is installed on a discharge path of a print-medium in an image forming apparatus, includes a plurality of storing units which is arranged with multi-layers, and a controller which controls to drive a feeding unit of another storing unit arranged between the storing unit through which the print-medium is to be discharged and the image forming apparatus, by a driving source of the storing unit through which the print-medium is to be discharged. | 2014-03-20 |
20140077440 | PAPER CONVEYANCE APPARATUS - A paper conveyance apparatus including a conveyance roller module including a pair of a sheet feeding roller and a separation roller opposite to each other across a paper conveyance path, a sound receiving aperture positioned on the same side as one side of the paper conveyance path, the one side including any one of the conveyance roller module, a sound shield positioned on a straight line between a nip portion of the conveyance roller module and the sound receiving aperture, a sound signal generator for generating a sound signal in response to a sound detected through the sound receiving aperture, and a sound jam detector for determining whether a jam has occurred based on the sound signal. | 2014-03-20 |