10th week of 2015 patent applcation highlights part 38 |
Patent application number | Title | Published |
20150062746 | IN-SITU LAPPING PLATE MAPPING DEVICE - A device and associated method of use can have at least an object with a work surface that contacts a lapping surface of a tool. Topography of the lapping surface can be mapped in-situ by an adjacent sensor array and the topography stored in a memory. The sensor array may be configured with a plurality of sensors positioned on opposite sides of the object. | 2015-03-05 |
20150062747 | ALIGNING A FIRST ELEMENT COUPLED TO AN ACTUATOR WITH A SECOND ELEMENT OF A MAIN SYSTEM - A control system for aligning a first element coupled to an actuator with a second element of a main system includes a position sensor that measures an absolute position of the first element relative to the main system as a sensor signal, a position error signal-based compensator that generates a second control signal as a function of a position error signal, wherein the position error signal indicates a relative position of the first element as a difference between the actual position of the first element and a target position of the first element relative to the second element, a sensor-based compensator that generates a first control signal as a function of the sensor signal and the second control signal, and an actuator that changes the position of the first element relative to the second element dependent on the first control signal to align the first element with the second element. | 2015-03-05 |
20150062748 | MOTOR POLARITY TESTING OF A DUAL STAGE ACTUATED DISK DRIVE HEAD SUSPENSION - Methods and apparatus concern testing a disk drive suspension. Testing includes moving a first portion of a suspension relative to a second portion. A pair of motors is mounted on the suspension. The testing further includes measuring an electrical signal that is intrinsically produced by the motors, combined in a circuit, in response to the relative movement. The testing further includes identifying a characteristic of the electrical signal and determining whether an orientation of one or both of the motors is reversed relative to an intended motor orientation based on the characteristic of the electrical signal. The testing can determine whether the orientation of both motors matches the intended motor orientation, whether the orientation of one motor is reversed in a same polarity condition, whether the orientations of both motors are reversed in a mutual reverse polarity condition, or whether the suspension has a mechanical or electrical defect. | 2015-03-05 |
20150062749 | ROTATING DEVICE - A rotating device includes a retained assembly including a spherical retained member with a spherical encircled face, and an encircling member that includes an annular end face which encircles the spherical retained member and which extends outwardly in a radial direction, a retainer assembly including a retainer member which includes an encircling face encircling the encircled face and which retains thereinside a part of the spherical retained member, and a facing member that faces the encircling member in an axial direction, the retainer assembly supporting the retained assembly in a freely and relatively rotatable manner, and forming a fluid dynamic bearing mechanism, and a thrust dynamic pressure generating groove formed in at least either one of a surface of the encircling member and a surface of the facing member, which surfaces face with each other in the axial direction. | 2015-03-05 |
20150062750 | ROTATING DEVICE - A rotating device includes a stationary body, a rotating body formed with an opening encircling a rotation axis, a fluid dynamic bearing mechanism which supports the rotating body relative to the stationary body, and which has a portion at one end side fitted in and fixed to the opening, a support portion that protrudes from an outer circumference of the fluid dynamic bearing mechanism to support the rotating body, and an abutting portion provided at the rotating body so as to abut the support portion. The support portion includes a flange protruding outwardly in a radial direction from the outer circumference of the fluid dynamic bearing mechanism, and the abutting portion includes a step that is a recess which is formed along an open end of the opening and into which at least a part of the flange enters. | 2015-03-05 |
20150062751 | MAGNETIC SENSOR HAVING AN EXTENDED PINNED LAYER WITH STITCHED ANTIFERROMAGNETIC PINNING LAYER - A magnetic sensor having a novel pinning structure resulting in a greatly reduced gap spacing. The sensor has a magnetic free layer structure that extends to a first stripe height and a magnetic pinned layer structure that extends to a second stripe height that is longer than the first stripe high. A layer of anti-ferromagnetic material is formed over the pinned layer structure in the region beyond the first stripe height location. In this way, the antiferromagnetic layer is between the pinned layer and the second or upper shield and does not contribute to gap spacing. | 2015-03-05 |
20150062752 | MAGNETIC SENSOR WITH RECESSED AFM SHAPE ENHANCED PINNING AND SOFT MAGNETIC BIAS - A magnetic read sensor having an antiferromagnetic located embedded within a magnetic shield of the sensor so that the antiferromagnetic layer can pin the magnetization of the pinned layer without contributing to read gap thickness. The sensor is configured with a pinned layer having a free layer structure located within an active area of the sensor and a pinned layer that extends beyond the free layer and active area of the sensor. The antiferromagnetic layer can be located outside of the active and exchange coupled with the extended portion of the pinned layer. | 2015-03-05 |
20150062753 | STIFF DISCRETE INSERT ARRAY FOR THERMAL PTR MANAGEMENT WITH DESIRED INDUCED STRESS STATE THAT REDUCES TENDENCY FOR WRITE POLE ERASURE - Embodiments of the present invention generally relate to a magnetic device having a discontinuous array of columns disposed near a magnetic pole. Each column has a length extending perpendicular to an air bearing surface and a width. The length is greater than the width. | 2015-03-05 |
20150062754 | WRITER CORE INCORPORATING THERMAL SENSOR HAVING A TEMPERATURE COEFFICIENT OF RESISTANCE - A writer core of a transducer is configured to interact with a magnetic recording medium and comprises an upper core and a lower core. At least one of the upper and lower cores comprises a return pole having a return shield. The apparatus also comprises a writer pole between the upper and lower cores, and a writer gap defined between the writer pole and the return shield. The apparatus further comprises a sensor element within one of the upper and lower cores that includes the writer gap. The sensor element has a temperature coefficient of resistance and is configured to sense for a change in temperature indicative of one or both of a change in spacing and contact between the transducer and the magnetic recording medium. | 2015-03-05 |
20150062755 | DUAL READER STRUCTURE - Implementations described and claimed herein provide a dual reader wherein a bottom shield is attached to side shields. | 2015-03-05 |
20150062756 | READER STRUCTURE - An apparatus disclosed herein comprises a reader structure having a sensor stack and a bottom shield having a first end and a second end on opposite sides of the bottom shield in a cross-track direction, wherein the first end is formed by intersection of arcs. | 2015-03-05 |
20150062757 | Magnetic Stack with Different Areal Extents on an Air Bearing Surface - A data reader may be configured at least with a magnetic stack that has a first magnetic layer separated from a second magnetic layer by a non-magnetic spacer layer. The first magnetic layer may have an areal extent on an air bearing surface (ABS) that differs from the second magnetic layer while the second magnetic layer can be configured with a first plurality of linear sidewalls that are each angled with respect to a second plurality of linear sidewalls of the first magnetic layer. | 2015-03-05 |
20150062758 | TWO-MOTOR CO-LOCATED GIMBAL-BASED DUAL STAGE ACTUATION DISK DRIVE SUSPENSIONS WITH MOTOR STIFFENERS - Various embodiments concern a dual stage actuation flexure. The dual stage actuation flexure comprises a flexure having a gimbal. The gimbal comprising a pair of spring arms, a tongue between the spring arms, and a pair of linkages respectively connecting the pair of spring arms to the tongue. The dual stage actuation flexure further comprises a pair of motors mounted on the gimbal and a pair of stiffeners respectively mounted on the motors. The dual stage actuation flexure further comprises a slider mounting. Electrical activation of the motors bends the pair of linkages to move the slider mounting about a tracking axis while the stiffeners limit the degree of bending of the motors during the electrical activation. | 2015-03-05 |
20150062759 | CAPPING MATERIALS FOR MAGNETIC READ HEAD SENSOR - Embodiments of the present invention generally relate to a magnetic head having a sensor structure comprising a pinned layer, a spacer layer, a free layer and a capping structure. The free layer has a topmost layer comprising CoB and the capping structure comprises an X layer, where X is an element such as Hf, Zr, Ti, V, Nb, or Ta. | 2015-03-05 |
20150062760 | CONTROLLABLE TEST-PULSE WIDTH AND POSITION FOR SELF-TEST GROUND FAULT CIRCUIT INTERRUPTER - A circuit interrupting device having an auto-monitoring circuit for periodically testing various functions and structures of the device. The auto-monitoring circuit initiates an auto-monitoring routine which, among other things, generates a self-test fault condition and determines whether the detection mechanisms within the device properly detect the self-test fault. A test fault circuit is configured to generate one or more test pulses that cause the self-test fault condition and the test pulses are generated to occur outside of an active region of the fault detection circuit. | 2015-03-05 |
20150062761 | Electrostatic Discharge Protection for Level-Shifter Circuit - A circuit, a multiple power domain circuit, and a method are disclosed. An embodiment is a circuit including an input circuit having a first output and a second output, the input circuit being coupled to a first power supply voltage, and a level-shifting circuit having a first input coupled to the first output of the input circuit and a second input coupled to the second output of the input circuit, the level-shifting circuit being coupled to a second power supply voltage. The circuit further includes a first transistor coupled between a first node of the level-shifting circuit and the second power supply voltage, and a control circuit having an output coupled to a gate of the first transistor, the control circuit being coupled to the second power supply voltage. | 2015-03-05 |
20150062762 | SEMICONDUCTOR DEVICE - Two resistances having different temperature coefficients are connected in series between a plurality of output transistors which are provided in parallel, and the power supply. A difference between these resistance values of the two resistances changes according to a temperature change. The change of the difference in the resistance value is detected as a change of voltage and a control signal is generated. According to the control signal, a protection transistor operates to connect an input node, and an output node or the both of the input node and the output node to the ground. As a result, in case of the extraordinary generation, the current to be supplied to a rear stage is restrained. | 2015-03-05 |
20150062763 | DISCHARGE GAP FILLING COMPOSITION AND ELECTROSTATIC DISCHARGE PROTECTOR - An electrostatic discharge protector including two electrodes for forming a discharge gap, and a discharge gap filling-member including a discharge gap filing composition filed in the discharge gap, the discharge gap filling composition contains metal particles (A) obtainable by metal particles with a hydrolyzed product of a metal alkoxide represented by the following formula (1) and a binder component (C), and the electrostatic discharge protector includes the composition; | 2015-03-05 |
20150062764 | ESD PROTECTION CIRCUIT - The ESD protection circuit includes a detection controlling circuit that is connected between the power supply line and the grounding line, detects a current flowing through the power supply line and outputs a controlling signal responsive to a result of the detection. The ESD protection circuit includes a protecting nMOS transistor connected to the power supply line at a drain thereof and receives the controlling signal at a gate thereof. The ESD protection circuit includes one stage of PN-junction diode connected to a source of the protecting nMOS transistor at an anode thereof and to the grounding line at a cathode thereof. | 2015-03-05 |
20150062765 | RESETTABLE CIRCUIT PROTECTION SYSTEM AND VEHICLE WITH SAME - A resettable circuit protection system for a vehicle includes a power outlet, a resettable circuit protection device, a resettable switch, a control module, and a user interface. The resettable circuit protection device is disposed in power communication with the power outlet, is operable between open and closed positions, and is configured to automatically open in response to an electrical overload condition at the power outlet. The resettable switch is electrically disposed in series with the circuit protection device, and operates between open and closed positions. The control module is disposed in signal communication with the circuit protection device and the switch. The user interface is disposed in signal communication with the control module. When the circuit protection device is open, the control module is responsive to facilitate display of a message at the user interface indicative of the circuit protection device being open, and to facilitate opening of the switch. | 2015-03-05 |
20150062766 | METHOD FOR DETECTING A DEFECTIVE AMPLIFIER IN AN ANALOG SIGNAL CONDITIONING DEVICE OF A SWITCH - A method is disclosed for detecting a defective amplifier. The device includes an electronic tripping unit which respectively carries out a check in order to determine whether the energy through the switch satisfies a condition and trips the switch if the condition has been satisfied; and an analog/digital converter respectively outputting the two differently amplified analog signals as digital values. In an embodiment of the method, a decision is made regarding which of the two digital values is used to check the condition. To detect defective amplifiers in the signal conditioning device of tripping units during ongoing operation, a check is carried out to determine whether at least one of the two digital values is in a predefined range; if so, whether the two digital values each belonging to the same time are in a predefined tolerance range. A fault is signaled if this is not the case. | 2015-03-05 |
20150062767 | POWER DEVICE FOR PREVENTING MALFUNCTION - The protecting relay may include: an input conversion unit configured to receive the analog signal and sample the analog signal according to a pre-set sampling period; a multiplexer configured to selectively output any one of a plurality of signals output from the input conversion unit; a programmable gain amplifier (PGA) configured to set different gain values according to signals output from the multiplexer, and amplify a signal output from the multiplexer with a pre-set gain value; an analog-to-digital converter (ADC) configured to convert an analog signal output from the PGA into a digital signal; and a controller configured to determine whether the analog signal received through the input conversion unit includes a surge signal based on the plurality of sampled data which have been converted into the digital signal, and determine whether to perform a relay function based on the determination results. | 2015-03-05 |
20150062768 | FEEDBACK PROTECTION FROM ADJACENT TERMINAL SHORTS - This relates to detecting unwanted couplings between a protected terminal and an adjacent terminal of an IC controller of a power supply. The voltages across adjacent terminals are monitored. If the voltage difference between the terminals falls below a minimum threshold for greater than a first duration of time, an internal current source injects current into one of the terminals. If, within a second duration of time, the injected current pulls the voltage of the injected terminal to a voltage that causes the voltage difference between the terminals to be above the minimum threshold, it may be determined that a transient fault has occurred and been cleared or falsely detected. If, however, the injected current does not pull the voltage of the injected terminal to a voltage that causes the voltage between the adjacent terminals to be above the minimum threshold, the fault condition is confirmed and switching is disabled. | 2015-03-05 |
20150062769 | COMBINED CIRCUIT BREAKER AND DC POWER SUPPLY APPARATUS, SYSTEMS, AND METHODS - A circuit breaker is configured to provide both AC and DC protected power. The circuit breaker is packaged in a housing that includes a tripping module, a DC power supply, an AC load terminal, and a DC load terminal. The tripping module senses and responds to electrical faults by interrupting power, and the DC power supply converts received AC power to DC power. In some embodiments, the circuit breaker may be configured as a main breaker of a circuit breaker panel, while in other embodiments the circuit breaker may be configured as a branch circuit breaker that occupies a single branch circuit breaker mounting location in a circuit breaker panel. Methods of assembling a circuit breaker are also provided, as are other aspects. | 2015-03-05 |
20150062770 | ENERGY EFFICIENT BI-STABLE PERMANENT MAGNET ACTUATION SYSTEM - Bi-stable permanent magnet actuation is a technique employed to move and magnetically hold an armature in electromechanical devices including some valves, wherein, permanent magnets are employed in a manner that places their magnetic field in a bi-stable state to allow a control coil to divert the permanent magnet's magnetic field in one of two directions within the surrounding magnetic material. Control is established using an actuation system comprising, a power source to deliver the desired level of energy, a voltage conditioner such as a DC/DC converter matched to the power source and electromechanical device, an energy storage device such as a capacitor, an output circuit such as an H-Bridge switching circuit, and a control circuit for controlling delivery of short duration current pulses from the energy storage device through the output circuit to the electromechanical device's control coil. Thus, an energy efficient bi-stable permanent magnet actuation system is produced. | 2015-03-05 |
20150062771 | APPARATUS FOR REMOVING STATIC ELECTRICITY OF FUEL CELL STACK MANUFACTURING DEVICE - An apparatus for removing static electricity of a fuel cell stack manufacturing device, includes a cartridge in which a plurality of Membrane Electrode Assemblies (MEAs) are received, an air nozzle portion disposed in an upper portion of the cartridge and including an air flow channel for air movement, a plurality of nozzle holes defined along an inner side of the air nozzle portion, which faces the MEAs disposed in the cartridge, to communicate with the air flow channel, and an air inlet portion configured to be supplied with ionized air from the outside to deliver the ionized air to the air flow channel of the air nozzle portion. | 2015-03-05 |
20150062772 | Barrier Layer For Electrostatic Chucks - An electrostatic chuck for implanting ions at high temperatures is disclosed. The electrostatic chuck includes an insulating base, with electrically conductive electrodes disposed thereon. A dielectric top layer is disposed on the electrodes. A barrier layer is disposed on the dielectric top layer so as to be between the dielectric top layer and the workpiece. This barrier layer serves to inhibit the migration of particles from the dielectric top layer to the workpiece, which is clamped on the chuck. In some embodiments, a protective layer is applied on top of the barrier layer to prevent abrasion. | 2015-03-05 |
20150062773 | FAST-MOUNTING CAPACITOR - A fast-mounting capacitor is composed of a capacitor ( | 2015-03-05 |
20150062774 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - There are provided a dielectric ceramic composition and a multilayer ceramic capacitor including the same. The dielectric ceramic composition according to embodiments of the present disclosure includes a base powder represented by xSrTiO | 2015-03-05 |
20150062775 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor highly useful in suppressing noise in a mounted state includes a capacitor body of a multilayer ceramic capacitor. The capacitor body integrally has: a capacitive part constituted by multiple internal electrode layers stacked in the height direction via dielectric layers; a top protective part made of a dielectric and positioned on the top side of the top internal electrode layer among the multiple internal electrode layers; and a bottom protective part made of a dielectric and positioned on the bottom side of the bottom internal electrode layer among the multiple internal electrode layers; wherein the thickness Tc of a bottom protective part is greater than the thickness Tb of a top protective part so that the capacitive part is disproportionately positioned in the upper side of the capacitor body in its height direction. | 2015-03-05 |
20150062776 | SUPERCAPACITOR WITH A CORE-SHELL ELECTRODE - A supercapacitor includes a pair of electrodes and an electrolyte. Each electrode has a graphite fiber core, and an activated carbon shell atomically coated on an outer surface of the core. The electrolyte is mounted between the two electrodes and in touch with each shell for electrical connection of the two electrodes. | 2015-03-05 |
20150062777 | High Energy Capacitors Boosted by both Catholyte and Anolyte - An electrical double layer capacitor (EDLC) energy storage device is provided that includes an electrolyte having an anionic catholyte and a cationic anolyte, a positively charged electrode, and a negative charged electrode, where negatively charged oxidized species in the anionic catholyte are electrostatically attracted to the positively charged electrode, where positively charged reduced species in the cationic anolyte are electrostatically attracted to the negatively charged electrode, where self-discharge of the EDLC energy storage device is prevented. | 2015-03-05 |
20150062778 | HIGH-VOLTAGE AND HIGH-CAPACITANCE ACTIVATED CARBON AND CARBON-BASED ELECTRODES - A positive electrode for an energy storage device includes a first activated carbon material comprising pores having a size of ≦1 nm, which provide a combined pore volume of >0.3 cm | 2015-03-05 |
20150062779 | EDLC ELECTRODE AND MANUFACTURING PROCESS THEREOF - A method of forming a carbon-based electrode includes forming a mixture of activated carbon particles, carbon black particles, binder, and an optional liquid, fibrillating the binder to form a fibrillated mixture, and forming a carbon mat from the fibrillated mixture, wherein the mixture, during the forming of the mixture, is maintained at a temperature less than 19° C. The low temperature process facilitates dispersive and distributive mixing of the components of the carbon mat. | 2015-03-05 |
20150062780 | LOW RESISTANCE ULTRACAPACITOR ELECTRODE AND MANUFACTURING METHOD THEREOF - A carbon-based electrode includes activated carbon, carbon black, and a binder. The binder is fluoropolymer having a molecular weight of at least 500,000 and a fluorine content of 40 to 70 wt. %. A method of forming the carbon-based electrode includes providing a binder-less conductive carbon-coated current collector, pre-treating the carbon coating with a sodium napthalenide-based solution, and depositing onto the treated carbon coating a slurry containing activated carbon, carbon black and binder. | 2015-03-05 |
20150062781 | ELECTRIC DOUBLE LAYER CAPACITANCE DEVICE - The present application is directed to electric double layer capacitance (EDLC) devices. In one aspect, the present application is directed to an electrode comprising an activated carbon cryogel having a tunable pore structure wherein: the surface area is at least 1500 m2/g as determined by nitrogen sorption at 77K and BET analysis; and the pore structure comprises a pore volume ranging from about 0.01 cc/g to about 0.25 cc/g for pores having a pore diameter of 0.6 to 1.0 nm. In another aspect, the present application is directed to an Electric Double Layer Capacitor (EDLC) device comprising an activated cryogel. | 2015-03-05 |
20150062782 | ANODE ELECTRODE FOR ALUMINUM ELECTROLYTIC CAPACITOR AND RESPECTIVE PRODUCTION METHOD - An aluminum electrolytic capacitor including an anode electrode, and a method for producing the anode electrode. The method includes providing an aluminum electrolyte including an ionic liquid and an aluminum salt, galvanically deposing an aluminum on an aluminum foil formed from the aluminum electrolyte, and anodically oxidizing a surface of the aluminum foil. The ionic liquid includes a pyrrolidinium cation and a halogenide. The aluminum electrolyte includes 50-70 mol. % of the aluminum salt based on a total substance amount of the ionic liquid and the aluminum salt. The galvanic deposition includes and is based on a deposition temperature ranging from 20° C. to 100° C., a current density ranging from 1 to 100 mA/cm | 2015-03-05 |
20150062783 | Capacitor for High g-Force Applications - An electrolytic capacitor capable of operating at 75 g or greater is provided having a case with a base and a lid, with a wound capacitor element positioned on its side, lengthwise along the bottom of the base and with the underside of the lid pressed against the length of the capacitor element, to frictionally engage the capacitor element. The case is provided with inwardly projecting surfaces, including a bulkhead at one end of the capacitor element and ridges on the lid, which function as barriers to restrict movement of the capacitor element within the case. A compartment is created at one end of the case, to allow space for terminals, which are embedded in a non-conductive support matrix. | 2015-03-05 |
20150062784 | PORTABLE POWER SOURCE - A portable power source includes a main body and a power button. The main body includes a receiving portion. The receiving portion defines a receiving groove and includes a protrusion received in the receiving groove. The protrusion includes a contact switch. The power button includes a button body and a latching arm. The button body pushes the contact switch to turn on/off the portable power source, and the latching arm rebounds the button body away from the contact switch. | 2015-03-05 |
20150062785 | THERMALLY MANAGED LOAD MODULE WITH EMBEDDED CONDUCTORS - A load module for a power module in which the power module includes a housing assembly. The load module includes an epoxy body and a number of elongated conductive strands. Each of the conductive strand are partially disposed in the epoxy body and each of the conductive strands includes a conductive member and a limited insulator. Each of the limited insulators is disposed on selected portions of an associated conductive member. | 2015-03-05 |
20150062786 | FACEPLATE FOR ELECTRICAL SWITCHING APPARATUS PANEL AND ELECTRICAL SWITCHING APPARATUS PANEL INCLUDING SAME - A face plate ( | 2015-03-05 |
20150062787 | MOBILE DEVICE CASE - A protective case for housing a mobile device is provided. The protective case comprises a top shell that seals against a top surface of a device and a bottom shell that cradles the back of the device. The top shell provides a downward extension along its perimeter that fits within a pocket formed around at least a portion of the perimeter of the bottom shell. At least the top shell forms an outward extending protrusion that is gripped by one or more backing elements that slide over the exterior of the bottom shell and extend up around the protrusion to grip the top shell and secure it to the bottom shell. Where upper and lower backing elements are used that meet at a parting line along the outer (exterior) surface of the bottom shell, a locking mechanism may be used to pull the backing elements together and hold them in place. | 2015-03-05 |
20150062788 | RACK-MOUNT SERVER ASSEMBLY WITH CABLE MANAGEMENT APPARATUS - A rack-mount server assembly includes a rack, a server module mounted in the rack, a switch mounted in the rack and above the server module, cables connected between the server module and the switch, and a cable management apparatus. The switch and the server module cooperatively bound a space. The cable management apparatus includes a frame mounted to the rack and covering the space, a sliding member slidably installed in the frame, and an air shield member mounted on an end of the sliding member. The frame defines a through hole aligning with the space for the cables extending through. The sliding member is slid to allow the air shield member to cover or uncover the space. The cables extend through the air shield member in response to the air shield member covering the space. | 2015-03-05 |
20150062789 | SERVER ADAPTER - An adapter ( | 2015-03-05 |
20150062790 | DIGITAL LANYARD FOR SECURING DATA ON PORTABLE DEVICES - A data securing system includes a digital lanyard having a first end portion connected with a first line, having a first connector portion, and a second line having a second connector portion. A second end portion of the digital lanyard includes an electronic data generating device interface. The first connector portion of the first line and the second connector portion of the second line, when in operative connection, form a complete electrical connection between the first end portion and the second end portion. The system further includes an electronic data generating device having an electronic data generating device connector portion configured to operatively connect to the electronic data generating device interface of the second end portion, and an authentication portion of the electronic data generating device provides a capability to authenticate a user to permit the user to obtain access to secured and/or restricted data via the electronic data generating device. | 2015-03-05 |
20150062791 | Absorbent Grip System - Generally, an absorbent grip system including an absorbent element coupled to a grippable body configured for gripping by a gripping element to engage the absorbent element with a contactable surface to absorb or displace fluids or solid substances from the contactable surface. Specifically, an absorbent element coupled to a grippable body configured for gripping by a hand to engage the absorbent element with a skin surface to absorb or displace fluids or solid substances from the skin surface. | 2015-03-05 |
20150062792 | ELECTRONIC DEVICE - An electronic device includes a front panel, a back cover, a stand, and at least one hinge module. The stand is disposed on a surface of the back cover opposite to the front panel and is rotatable relative to the surface. The hinge module disposed between the front panel and the back cover includes a fixing element, a sliding element, a pivot, and a spring strip. The fixing element has a hole, and the fixing element is fixed on the back cover, such that an accommodating space is formed between the fixing element and the back cover. The sliding element having a hook portion is slidably disposed in the accommodating space. The pivot is slidably disposed in the accommodating space. The sliding element is connected to the stand by the pivot. The spring strip is disposed in the accommodating space. The spring strip is deformably fixed on the back cover. | 2015-03-05 |
20150062793 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, and a linking assembly. The first body has a first side and a second side opposite to each other, and a sliding slot located at the first side. The first body and the second body are pivoted to the linking assembly. The second body rotates relative to the first side of the first body to open or close and drives the linking assembly, such that the electronic device stands on a platform with the first side or the second side of the first body. The linking assembly has a supporting block movably coupled to the sliding slot. When the second body rotates to an angle relative to the first side, the supporting block protrudes out of the first side so that the electronic device stands on the platform with the first side. | 2015-03-05 |
20150062794 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first housing and a second housing. The second housing is rotatably attached to the first housing. The second housing includes a first portion and a second portion. The second portion is attached to the first portion and has greater elasticity than the first portion. The second portion comprises a fingerhold. | 2015-03-05 |
20150062795 | ROTATION MODULE WITH LINKED PLUGGING AND UNPLUGGING DESIGN - A rotation module with a linked plugging and unplugging design is applied to a host case for installation and disassembly. The rotation module includes: a housing, for accommodating a data storage unit electrically connected to a cable; a placement assembly, for guiding the housing along a first direction to install or disassemble the housing; a rotation assembly, for rotatably combining the housing and the placement assembly so that the housing is capable of rotating along a second direction; and a linkage assembly, having a first end and a second end, with a plug assembly of the cable assembled to the second end. In response to the housing rotated along the second direction, the second end of the linkage assembly moves in a linked manner along the first direction and enables the plug assembly to plug into or unplug from a slot of a motherboard. | 2015-03-05 |
20150062796 | ELECTRONIC APPARATUS AND COVER STRUCTURE THEREOF - A cover structure for an electronic apparatus is disclosed. The cover structure includes a bezel, a first bracket and a first handle. The bezel includes two long sides, a first lateral side and a second lateral side. The first bracket is fixed on the first lateral side and includes a first protruding portion. The first handle moveably combines with the bezel, and the first handle is moved substantially parallel to each long side of the bezel. The first handle includes a first recess and at least one first fixed portion, and the first protruding portion is disposed in the first recess. The at least one first fixed portion is used for combining with a housing of the electronic apparatus. | 2015-03-05 |
20150062797 | STORAGE EXPANSION SYSTEM - A storage expansion system includes an expansion apparatus and a serial advanced technology attachment dual in-line memory module (SATA DIMM) device. A memory slot, a SATA port, a SATA signal expansion member, and a voltage converter are arranged on the expansion apparatus. The memory slot includes first power pins, first ground pins, and first signal pins connected to the SATA signal expansion member. A first edge connector is arranged on a side of the expansion apparatus. The first edge connector includes second power pins and second ground pins. The first and second power pins are connected to the voltage converter. A second edge connector is arranged on a bottom side of the SATA DIMM device. The second edge connector includes third power pins connected to a control chip and storage chips, third ground pins, and second signal pins connected to the control chip. | 2015-03-05 |
20150062798 | RACK SERVER SLIDE-IN MODULE - A rack server slide-in module for an installation height of one rack unit, with a front face, a rear face, two lateral walls, a base wall, a cover wall and a mounting slot for a dual-slot expansion card, in which either a single-slot or a dual-slot expansion card is received, wherein an air inlet aligned with the mounting slot for the expansion card is provided on the front face of the rack server slide-in module and fans are arranged side by side between the air inlet and the expansion slot for the expansion card, the fans generating an increased flow pressure of the cooling air onto the mounting slot of the expansion card. | 2015-03-05 |
20150062799 | ELECTRONIC DEVICE - An electronic device includes a chassis and a plurality of electronic modules. The chassis includes a front plate, a rear plate, a top plate, two side plates, a bottom plate and a plurality of dividing plates. The electronic modules are set between two adjacent dividing plates. The front plate includes an air inlet defined in a bottom. A first space is defined between a bottom of each dividing plate and the bottom plate. A second space is defined between a top of each dividing plate and the top plate. At least one of the top of the dividing plate and the bottom of the dividing plate is arranged stepped down from the front plate to the rear plate. The airflow flows through the air inlet, the first space, then flows up through the electronic modules, and then flows to the rear plate. | 2015-03-05 |
20150062800 | HARD DRIVE MOUNTING AND SHOCK SYSTEM - A mounting system can be used in a storage device or other electrical device to mount a component, such as a drive, while also providing at least some shock absorption. The mounting system can include a deflection arm, a protrusion and a hole. The protrusion and hole can be configured to engage one another. One of either the hole or the protrusion can be on the deflection arm and the other can be on the component being mounted. The mounting system can also include a locking tab configured to move to a position behind the deflection arm. The locking tab can decrease the amount of deflection that can be experienced by the deflection arm to prevent the component from becoming prematurely dislodged from the mounting system. | 2015-03-05 |
20150062801 | MOUNTING APPARATUS FOR HARD DISK DRIVE AND ELECTRONIC DEVICE WITH THE MOUNTING APPARATUS - A mounting apparatus includes a bracket receiving a hard disk drive (HDD), a transmission mechanism mounted on a side of the bracket, and an operation member. The transmission mechanism includes an installing frame, a first rack, and a second rack. The gear is engaged with the first and second racks. A first end of the operation member is detachably latched to the bracket, while a second end of the operation member is movably connected to the bracket. An abutting piece protrudes out from a rear end of the second rack and abuts against a rear end of the hard disk drive. The operation member is slid rearward, to push the first rack to slide rearward. The first rack drives the gear to rotate, the gear drives the second rack to slide forward, and the abutting piece abuts against the HDD to move the HDD out of the bracket. | 2015-03-05 |
20150062802 | HEAT PIPE ASSEMBLIES - Heat pipe assemblies for Information Handling Systems (IHSs). In some embodiments, an IHS may comprise a motherboard including a Central Processing Unit (CPU); a cooling system coupled to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and a daughterboard coupled to the motherboard and including a Graphics Processing Unit (GPU) coupled to a second side of the heat pipe. In other embodiments, a method may include providing a motherboard including a CPU; coupling a cooling system to the motherboard, the cooling system including a heat pipe, the CPU coupled to a first side of the heat pipe; and coupling a daughterboard to the motherboard, the daughterboard including a GPU coupled to a second side of the heat pipe. | 2015-03-05 |
20150062803 | SERVER - A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid cooling heat exchanger, a circulation line and several fans. The cooling plate is thermally contacted with the heat source. The liquid cooling heat exchanger is located on one side of the motherboard. The liquid cooling heat exchanger is connected with the cooling plate via the circulation line for forming a circulation circuit. The plurality of fans are located next to the liquid cooling heat exchanger. | 2015-03-05 |
20150062804 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust. | 2015-03-05 |
20150062805 | ELECTRONIC DEVICE - An electronic device includes: a fan; a housing configured to houses the fan, the housing including a vent hole configured to introduce outside air, a first air outlet configured to open to a blowing path from the fan, and a second air outlet configured to open at a different position with respect to the blowing path; and an opening and closing member configured to open and close the first air outlet. | 2015-03-05 |
20150062806 | Immersion Server, Immersion Server Drawer, and Rack-Mountable Immersion Server Drawer-Based Cabinet - An information handling system includes: an immersion server drawer (ISD) having: an impervious enclosure which holds a volume of dielectric cooling liquid within/at the enclosure bottom. The ISD is configured with dimensions that enable insertion of liquid-cooled servers within the enclosure bottom. A plurality of liquid-cooled servers can be placed in a side-by-side configuration along one dimension of the ISD, with one or more heat dissipating components of the servers being placed below a surface layer of the cooling liquid. Submerged components of the immersion server are liquid-cooled, while the other heat generating components above the liquid surface are air cooled by rising vapor generated by boiling and vaporization of the cooling liquid. The ISD is placed in an ISD cabinet, which is configured with an upper condenser that allows for multi-phase cooling of the electronic devices placed within the immersion server drawer. The ISD cabinet can be rack-mountable. | 2015-03-05 |
20150062807 | COMPUTING DEVICE COVER - Techniques for modifying forming a top cover and bottom cover of a computing device are described herein. The techniques include a method including forming a bottom cover of a computing device having protrusions, and forming a top cover of the computing device having recesses, the top cover recesses to receive the bottom cover protrusions. | 2015-03-05 |
20150062808 | INFORMATION PROCESSING DEVICE - An information processing device includes a first case, a second case over which the first case is placeable, and a connector including a first rotation part and a second rotation part and configured to couple the first case on the second case, the first rotation part allowing the first case to be rotated about a first axis, the second rotation part allowing the first case to be rotated about a second axis, the second axis being displaced from a central position of the first case in an axial direction of the first axis, wherein when front and back surfaces of the first case are reversed and the first case is placed over the second case, at least part of the first case projects from the second case toward an outer side. | 2015-03-05 |
20150062809 | SHIELD CASE AND ELECTRONIC APPARATUS - A shield case | 2015-03-05 |
20150062810 | CUSHION STRUCTURE AND ELECTRONIC DEVICE - A cushion structure suitable for an electronic device is provided. The cushion structure includes cushions and at least one channel. Each cushion has a first surface and a second surface that are flexible and opposite to each other. Each cushion is combined to a body of the electronic device through its second surface, and the electronic device is placed on and in contact with a platform through the first surfaces of the cushions. The channel is in the body and communicated with the second surfaces. The channel is filled with a fluid that is in contact with the second surfaces of the cushions. When the first surface of at least one of the cushions sustains a force and deforms toward the second surface, the fluid in the channel is compressed to drive the second surfaces of the other cushions to deform toward the first surfaces to support the electronic device. | 2015-03-05 |
20150062811 | ELECTRIC POWER CONVERSION DEVICE FOR VEHICLE AND RAILWAY VEHICLE - An electric power conversion device for a vehicle includes a box body partitioned into a cooling air chamber and a mounting chamber, a heat generation part which is arranged in the inside of the mounting chamber and includes a semiconductor element which performs power conversion, and a heat radiation part mounted on a partition between the cooling air chamber and mounting chamber, and configured to radiate heat generated from the heat generation part, wherein the heat generation part is detachably mounted on the heat radiation part in a state where the heat generation part is arranged on a side opposite to the heat radiation part with the partition sandwiched therebetween, and a heat transfer sheet is provided between the heat generation part and the heat radiation part. | 2015-03-05 |
20150062812 | APPARATUS FOR COOLING INVERTER - An apparatus for cooling inverter is disclosed, whereby an optimum heat radiation effect can be accomplished, because a flow part is divided in response to heat generation amount of an electric element arranged inside a housing to adjust an air flow. | 2015-03-05 |
20150062813 | COOLING DEVICE - A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body. | 2015-03-05 |
20150062814 | IMAGE FORMING APPARATUS - An image forming apparatus includes a main body, an upper-portion device, a substrate, an electronic wire, and a duct. The main body has an upper surface and an insertion hole formed in the upper surface. The upper-portion device is disposed above the main body. The substrate is disposed inside the main body. The electronic wire is inserted into the insertion hole to connect the substrate and the upper-portion device. The duct has an interior space extending from the insertion hole and guides the electronic wire from a rear side of the main body and the upper-portion device into insertion hole. | 2015-03-05 |
20150062815 | COOLING FAN SYSTEM AND COMMUNICATION EQUIPMENT - A cooling fan system includes at least one fan unit including a cooling fan and a controller for controlling the cooling fan, a management unit including a fan control section that controls the controller of the fan unit, and a circuit directly connecting the management unit to the cooling fan so as to allow the cooling fan to be controlled directly by the fan control section. The fan control section includes a malfunction detecting section to detect malfunction of the fan unit and a forced control section that directly controls the cooling fan and carries out a forced control to forcibly rotate the cooling fan at a higher rotational speed than that during normal operation when the malfunction detecting section detects the malfunction of the fan unit. | 2015-03-05 |
20150062816 | ATTENUATION SYSTEMS WITH COOLING FUNCTIONS AND RELATED COMPONENTS AND METHODS - Attenuation systems have cooling components that produce power in response to heat generated by the attenuator. The cooling components can be used to power cooling fans if a primary power source of the fans fails. | 2015-03-05 |
20150062817 | SERVER - A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber. | 2015-03-05 |
20150062818 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first housing and a second housing. The first housing includes a first wall, a second wall opposite to the first wall, and a third wall between the first wall and the second wall. The third wall faces the second housing when the second housing is raised from the first housing. The third wall includes an outmost portion of the third wall in a direction from a fan toward the third wall, a first area obliquely extending between the outmost portion and the first wall and including a first opening, and the second area obliquely extending between the outmost portion and the second wall and including a second opening. | 2015-03-05 |
20150062819 | APPARATUS AND METHODS USING HEAT PIPES FOR LINKING ELECTRONIC ASSEMBLIES THAT UNEQUALLY PRODUCE HEAT - An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner. | 2015-03-05 |
20150062820 | HEAT TRANSFER FOR ELECTRONIC EQUIPMENT - An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit. | 2015-03-05 |
20150062821 | Cooling Structure for Electronic Circuit Board, and Electronic Device Using the Same - The size of an electronic device using a cooling structure for an electronic circuit board is increased when using a heating element with a large amount of heat generation, therefore, a cooling structure for an electronic circuit board according to an exemplary aspect of the present invention includes an evaporator with an evaporation container storing a refrigerant; a condenser condensing and liquefying a vapor-phase refrigerant vaporized in the evaporator and radiating heat; and a pipe connecting the evaporator to the condenser, wherein the evaporator includes a heat receiving area, on one side of the evaporation container, thermally connecting to a heating element disposed on the electronic circuit board, and a plurality of flow path plates, in an area including the heat receiving area, extending in the direction parallel to the electronic circuit board; and a vapor-liquid interface of the refrigerant is positioned above or at the level of a lower end and below an upper end of the heat receiving area in the vertical direction, in the arrangement condition that the drawing direction of the flow path plates is approximately parallel to the vertical direction. | 2015-03-05 |
20150062822 | HEAT-RECEIVER, COOLING UNIT AND ELECTRONIC DEVICE - A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction. | 2015-03-05 |
20150062823 | MOBILE TERMINAL AND MANUFACTURING METHOD FOR HEAT SPREADER MODULE - There is disclosed a mobile terminal including a display panel, a frame comprising a front surface where the display panel is disposed, a rear case coupled to one surface of the frame, to form an electric/electronic control unit there between the frame and the rear case, a heat spreader module provided between the display panel and the frame, wherein the heat spreader module includes a metallic plate in contact with the display panel, a heat spreading material layer disposed on a rear surface of the metallic plate and an adhesive layer disposed between the heat spreading material layer and the metallic plate to bond the metallic plate and the heat spreading material layer with each other. Even when the frame is partially eliminated, the mobile terminal may support the display panel and securing the heat spreading performance simultaneously, using the heat spreader module having a preset rigidity. | 2015-03-05 |
20150062824 | SEMICONDUCTOR DEVICE HAVING THERMOELECTRIC MODULE - A heat spreader is formed on a first semiconductor package and a second semiconductor package adjacent to the first semiconductor package, and first and second thermoelectric modules are included between the first and second semiconductor packages and the heat spreader. The first and second thermoelectric modules are formed to have opposite polarities, and the heat spreader heated by the first thermoelectric module is cooled due to activation of the second thermoelectric module. | 2015-03-05 |
20150062825 | Overmolded substrate-chip arrangement with heat sink - An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate. | 2015-03-05 |
20150062826 | ELECTRONIC DEVICE WITH HEAT DISSIPATION FUNCTION - An electronic device includes a housing defining an opening, a circuit board mounted in the housing, and a cover capable of conducting heat and covering the opening. An element and a hollow partition portion receiving the element are mounted on the circuit board. The cover includes a block formed on an inner surface of the cover. The block enters the partition portion and contacts the element. | 2015-03-05 |
20150062827 | HEAT SINK AND SUBSTRATE UNIT - A heat sink includes: a fixing unit fixed to a heating element; and a heat dissipation unit including a heat dissipation protruding portion and configured to slide with respect to the fixing unit. | 2015-03-05 |
20150062828 | Connector, connector Assembly, and Wireless Communication Module - A connector is provided that is capable of high-speed transmission over a carrier wave of, for example, 30 GHz or higher. The connector includes a housing, a wireless communication module and a first magnet. The housing includes a planar face, and the wireless communication module is disposed in the housing and includes a wireless signal transmission IC and a wireless signal reception IC. The first magnet is disposed along the planar face. | 2015-03-05 |
20150062829 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - There are provided an electronic device module capable of increasing a degree of integration by mounting electronic components on both surfaces of a board, and a manufacturing method thereof. The electronic device module includes a board having mounting electrodes formed on both surfaces thereof, a plurality of electronic devices mounted on the mounting electrodes, a molded portion sealing the electronic devices, at least one connection wire having one end bonded to one surface of the board and the other end exposed to the outside of the molded portion, and an external connection terminal coupled to the other end of the connection wire. | 2015-03-05 |
20150062830 | POWER MODULE - A power module is provided. The power module includes a housing assembly and an electrical assembly. The electrical assembly includes an AC input assembly, a DC input assembly, a number of AC feeder layers, a number of DC feeder layers, a number of AC electrical components and a number of DC electrical components. Each AC feeder layer includes a generally planar body and an embedded conductor. Each DC feeder layer includes a generally planar body and an embedded conductor. Each AC feeder layer conductor is coupled to, and in electrical communication with, said AC input assembly. Each DC feeder layer conductor is coupled to, and in electrical communication with, said DC input assembly. Each AC electrical component is coupled to, and in electrical communication with, an AC feeder layer conductor. And, each DC electrical component is coupled to, and in electrical communication with, a DC feeder layer conductor. | 2015-03-05 |
20150062831 | MOUNT PLATFORM FOR MULTIPLE MILITARY RADIOS - A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting dual AN/VRC-110 radio systems. The platform has a first power supply system that converts 110/220 alternating current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said dual AN/VRC-110 radio systems. | 2015-03-05 |
20150062832 | U FORM-FACTOR INTELLIGENT ELECTRONIC DEVICE (IED) HARDWARE PLATFORM WITH MATCHING OF IED WIRING, FROM A NON U FORM-FACTOR IED HARDWARE PLATFORM USING ADAPTER STRUCTURE - A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment. | 2015-03-05 |
20150062833 | MECHANICAL ASSEMBLY AND METHOD TO PROVIDE FORM-FACTOR AND WIRE ALIKE ADAPTATION OF EXISTING PLATFORM HARDWARE MODULES INTO NEW PRODUCTS - An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing. | 2015-03-05 |
20150062834 | JUMPER MODULE MOUNTING CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY - A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module. | 2015-03-05 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 2015-03-05 |
20150062836 | STACKED PACKAGE OF VOLTAGE REGULATOR AND METHOD FOR FABRICATING THE SAME - The present disclosure relates to a stacked package of a voltage regulator and a method for fabricating the same. The method comprises: providing a first chip and a second chip which are integrated with each other, the first chip and the second chip each having a front surface provided with a plurality of bumps; forming a non-conductive layer and a conductive layer side by side on the back surface of the second chip; providing a first leadframe and a second leadframe each having at least a group of leads, the plurality of bumps on the first chip being electrically coupled to the first leadframe, the plurality of bumps on the second chip being electrically coupled to the second leadframe, and the back surface of the second chip being electrically coupled to a back surface of the first leadframe; the first leadframe being electrically coupled to the second leadframe; the first chip, the second chip, the conductive layer, the non-conductive layer, the bumps, the first leadframe, and the second leadframe forms a stacked package to reduce the footprint of a chip and reducing manufacture cost. | 2015-03-05 |
20150062837 | Lead frame for a premold sensor housing - A lead frame for a premold sensor housing, in which the lead frame includes at least one angled section having essentially no rounding in an area of contact with the premold sensor housing, the area of contact being provided as a positioning area for a sensor element. | 2015-03-05 |
20150062838 | SYSTEM FOR ATTACHING DEVICES TO FLEXIBLE SUBSTRATES - This disclosure is directed to a system for attaching devices to flexible substrates. A device may be coupled to a flexible substrate in a manner that prevents adhesive from contacting conductive ink while the adhesive is harmful. If conductive epoxy is used to anchor conductive pads in the device to the flexible substrate, conductive epoxy may be applied beyond the edge of the device over which conductive ink may be applied to make electrical connections. Holes may also be formed in the flexible substrate allowing conductive epoxy to be exposed on a surface of the flexible substrate opposite to the device location, the conductive ink connections being made on the opposite surface. The conductive ink may also be applied directly to the conductive pads when extended beyond the device's edge. The flexible substrate may be pre-printed with circuit paths, the conductive ink coupling the device to the circuit paths. | 2015-03-05 |
20150062839 | METHOD AND SYSTEM FOR ATTACHING FLEXIBLE CIRCUITS TO A MOUNTING SURFACE - A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device. | 2015-03-05 |
20150062840 | FLEXIBLE ELECTRONIC DEVICE - A flexible electronic device is disclosed, including: a case frame, comprising a plurality of unit case frames space at regular intervals, engaged to move relative to one another, a substrate, disposed in an inner space defined by an interior of the case frame, and electrically coupling a plurality of unit substrates that are spaced at regular intervals using a flexible electrical coupler, a battery pack, disposed in the inner space, including a plurality of unit battery cells at regular intervals using a flexible electrical connection means, the unit battery cells configured to move relative to one another, and a flexible display, coupled to the case frame and positioned so that a display surface of the flexible display is exposed. | 2015-03-05 |
20150062841 | BEZEL STRUCTURE FOR A DISPLAY DEVICE AND DISPLAY DEVICE HAVING THE SAME - A bezel structure for a display device includes a first resin layer capable of being cured by ultraviolet radiation, an ink layer including a non-volatile solvent disposed on the first resin layer, a second resin layer disposed in the ink layer, and an upper structure disposed on the ink layer. The second resin layer prevents an uncured portion of the first resin layer from permeating into a cavity in the ink layer. | 2015-03-05 |
20150062842 | ELEMENT SUBSTRATE, DISPLAY APPARATUS AND MANUFACTURING METHOD OF ELEMENT SUBSTRATE - An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed. | 2015-03-05 |
20150062843 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS - According to one embodiment, a semiconductor device includes a cell portion and a peripheral portion, including: a substrate, a first insulating layer disposed on the substrate, a first conductive layer disposed on the first insulating layer, a second insulating layer disposed on the first conductive layer, and a second conductive layer disposed on the second insulating layer. | 2015-03-05 |
20150062844 | ELECTRONIC DEVICE INCLUDING REMOVABLE COMPONENT - An electronic device is provided, including a mounting plate, a first component and a second component disposed on the mounting plate, a substrate disposed on the mounting plate and having a portion disposed between the first component and the second component, and a third component disposed on the mounting plate and electrically coupled to the substrate. | 2015-03-05 |
20150062845 | ELECTRICAL EQUIPMENT, PRODUCTION METHOD THEREOF AND DESIGN METHOD OF ELECTRICAL EQUIPMENT - Electrical equipment | 2015-03-05 |