09th week of 2010 patent applcation highlights part 10 |
Patent application number | Title | Published |
20100052078 | Multi-Layer Gate Dielectric - A transistor gate dielectric including a first dielectric material having a first dielectric constant and a second dielectric material having a second dielectric constant different from the first dielectric constant. | 2010-03-04 |
20100052079 | SEMICONDUCTOR DEVICES AND FABRICATION PROCESS THEREOF - A semiconductor device has an insulated gate transistor provided with a semiconductor substrate and a gate electrode arranged on the semiconductor substrate via a gate insulating film. The gate electrode includes an electrically-conductive buffer film for preventing any damage, which would occur if a main gate electrode portion were formed directly over the gate insulating film, and the main gate electrode portion formed over the buffer film. A fabrication process for the semiconductor device is also disclosed. | 2010-03-04 |
20100052080 | BIOSENSOR CHIP AND A METHOD OF MANUFACTURING THE SAME - A biosensor chip ( | 2010-03-04 |
20100052081 | A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a structure ( | 2010-03-04 |
20100052082 | MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) PACKAGE AND METHOD FOR FORMING THE MEMS PACKAGE - A micro-electro-mechanical systems (MEMS) package includes a MEMS microphone device. The MEMS microphone device has a first substrate and at least a sensing element on the first substrate wherein a first chamber in the MEMS microphone device is connected to the sensing element. A second substrate is disposed over the MEMS microphone device to provide a second chamber in the second substrate over the sensing element opposite to the first chamber. | 2010-03-04 |
20100052083 | PHOTOCONDUCTIVE DEVICE - A photoconductive device comprising a photoconductive portion for generating carriers by applied excitation light; a resistance portion in contact with the photoconductive portion; a first conductive portion in contact with the resistance portion; and a second conductive portion that is provided so as to have a gap with respect to the first conductive portion and is in contact with the photoconductive portion. | 2010-03-04 |
20100052084 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF - Disclosed are an image sensor employing an annealing process and a manufacturing method thereof. According to the method, in one embodiment, a transistor structure is formed over a semiconductor substrate, a metal interconnection layer is formed over the transistor structure, a protective layer is formed over the metal interconnection layer, a nitride layer is formed over the protective layer, and the semiconductor substrate formed with the nitride layer is subject to a high pressure annealing process. | 2010-03-04 |
20100052085 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF - An image sensor has a large bridge margin from a repulsive force between adjacent micro lenses having different surface properties. The image sensor has a larger bridge margin with a configuration of a stepped portion between two areas, where the first and the second group of micro lenses are formed, over a planarization layer below these two areas. Thus, a zero gap is realized, where no gap between micro lenses exists, and the fill factor of micro lens is maximized. By the realization of the zero gap, interference effects decrease, noise decreases, and fill factor increases, and thus the sensitivity of an image sensor increases, especially the green sensitivity. | 2010-03-04 |
20100052086 | ELECTRONIC DEVICE PACKAGES AND METHODS OF FABRICATING ELECTRONIC DEVICE PACKAGES - Electronic device packages comprise transparent substrates covering an active surface of an optically interactive electronic device. In some embodiments, the optically interactive electronic device is bonded to conductive traces formed directly on the transparent substrate. In other embodiments, a secondary substrate comprising a plurality of conductive traces is disposed between the transparent substrate and the optically interactive electronic device. | 2010-03-04 |
20100052087 | Image Sensor - An image sensor die includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some embodiments, a conformal dielectric coating over the image array area of the front side of the die. The die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. The coating over the image array area, at least, is substantially transparent to visible light, and provides mechanical and chemical protection for underlying structures in and on the image sensor. Also, a package contains such an image sensor die mounted on and electrically connected to a support; and assemblies include such an image sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the image sensor die, packages, and assemblies. | 2010-03-04 |
20100052098 | Semiconductor device having storage electrode and manufacturing method thereof - A semiconductor device includes a first storage electrode, a second storage electrode, a first landing pad, a capacitive insulating film, and a plate electrode. The second storage electrode is arranged above the first storage electrode. The first landing pad is arranged between a top surface of the first storage electrode and a bottom surface of the second storage electrode. The first landing pad connects the first storage electrode and the second storage electrode. The first landing pad has a first landing surface larger than the bottom surface of the second storage electrode. The second storage electrode is placed on the first landing surface. The capacitive insulating film is laminated on the first and second storage electrodes and on an outer circumferential surface of the first landing pad. The plate electrode contacts the capacitive insulating film. | 2010-03-04 |
20100052099 | CAPACITOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - This invention provides a capacitor device with a high dielectric constant material and multiple vertical electrode plates. The capacitor devices can be directly fabricated on a wafer with low temperature processes so as to be integrated with active devices formed on the wafer. This invention also forms vertical conducting lines in the capacitor devices using the through-silicon-via technology to facilitate the three-dimensional stacking of the capacitor devices. | 2010-03-04 |
20100052100 | DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON-ON-INSULATOR (SOI) DEVICES - A semiconductor structure is disclosed. The semiconductor structure includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region. | 2010-03-04 |
20100052101 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor integrated circuit is reduced in size by suppressing lateral extension of an impurity region when impurities in the impurity region are thermally diffused in a semiconductor substrate. A second photoresist is formed on an insulation film. The second photoresist is formed to have second openings K | 2010-03-04 |
20100052102 | SEMICONDUCTOR DEVICE - Emitter contact holes formed under emitter electrodes in a first layer and emitter through holes formed thereon are arranged so as not to overlap each other, and, for each emitter electrode, the multiple emitter contact holes and the multiple emitter through holes are provided so as to be separated from each other. Thereby, the top surface of an emitter electrode in a second layer is influenced by at most only a level difference of each emitter through hole formed in an insulating film having a larger thickness, and thus the flatness of the top surface of the emitter electrode in the second layer is improved. Accordingly, fixation failure of a metal plate can be avoided. | 2010-03-04 |
20100052103 | SILICON WAFER AND METHOD FOR PRODUCING THE SAME - A silicon wafer is produced through the steps of forming a silicon ingot by a CZ method with an interstitial oxygen concentration of not more than 7.0×10 | 2010-03-04 |
20100052104 | METHOD FOR FABRICATING A LOCALLY PASSIVATED GERMANIUM-ON-INSULATOR SUBSTRATE - The invention relates to a method for fabricating a locally passivated germanium-on-insulator substrate wherein, in order to achieve good electron mobility, nitridized regions are provided at localised positions. Nitridizing is achieved using a plasma treatment. The resulting substrates also form part of the invention. | 2010-03-04 |
20100052105 | Free-standing thickness of single crystal material and method having carrier lifetimes - A method of fabricating a thickness of silicon material includes providing a silicon ingot material having a surface region and introducing a plurality of particles having an energy of about 1-5 MeV through the surface region to a depth to define a cleave region and a thickness of detachable material between the cleave region and the surface region. Additionally, the method includes processing the silicon ingot material to free the thickness of detachable material at a vicinity of the cleave region and causing formation of a free-standing thickness of material characterized by a carrier lifetime about 10 microseconds and a thickness ranging from about 20 microns to about 150 microns with a thickness variation of less than about five percent. Furthermore, the method includes treating the free-standing thickness of material using a thermal treatment process to recover the carrier lifetime to about 200 microseconds and greater. | 2010-03-04 |
20100052106 | PACKAGE DEVICE HAVING CRACK ARREST FEATURE AND METHOD OF FORMING - A package device has a package substrate, a semiconductor die on the package substrate, and a molding compound on the package substrate and over the semiconductor die. The semiconductor die has a last passivation layer, an active circuit region in an internal portion of the die, an edge seal region along a periphery of the die, and a structure over the edge seal region extending above the last passivation layer, covered by the molding compound, and comprising a polymer material. The structure may extend at least five microns above the last passivation layer. The structure stops cracks in the molding compound from reaching the active circuit region. The cracks, if not stopped, can reach wire bonds in the active region and cause them to fail. | 2010-03-04 |
20100052107 | VIAS AND METHOD OF MAKING - The invention relates to a method of providing a planar substrate with electrical through connections (vias). The method comprises providing a hole in said substrate and a treatment to render the substrate surface exhibiting a lower wettability than the walls inside the hole. The planar substrate is exposed to a molten material with low resistivity, whereby the molten material is drawn into the hole(s). It also relates to a semiconductor wafer as a starting substrate for electronic packaging applications, comprising low resistivity wafer through connections having closely spaced vias. | 2010-03-04 |
20100052118 | MICRO-LAYERED LEAD FRAME SEMICONDUCTOR PACKAGES - Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a lead frame with a customized array of lands at the bottom of the package. The lands are connected to a series of leads that are located within the perimeter of the lands. The leads can be routed according to the requirements of each specific IC die which they support and therefore can support both a single die and multiple die in the semiconductor package. Such a configuration provides a flexible routing for optimized layout, a maximized package density, and a higher input/output capability with a smaller package size. Other embodiments are also described. | 2010-03-04 |
20100052119 | Molded Ultra Thin Semiconductor Die Packages, Systems Using the Same, and Methods of Making the Same - Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material. | 2010-03-04 |
20100052120 | SEMICONDUCTOR DEVICE HAVING A SUSPENDED ISOLATING INTERCONNECT - A semiconductor device is configured to provide current and voltage isolation inside an integrated circuit package. The semiconductor device includes first and second semiconductor dies, a first isolating block positioned on the first semiconductor die, and a second isolating block positioned on the second semiconductor die. The semiconductor device also includes a first interconnect coil having a plurality of wires connecting the first semiconductor die to the second isolating block, and a second interconnect coil having a plurality of wires connecting the second semiconductor die to the first isolating block. | 2010-03-04 |
20100052121 | SEMICONDUCTOR SYSTEM-IN-A-PACKAGE CONTAINING MICRO-LAYERED LEAD FRAME - Semiconductor packages that contain a system-in-a-package and methods for making such packages are described. The semiconductor packages contain a first semiconductor die resting on a middle of a land pad array, a second die disposed over the first die and resting on routing leads that are connected to the land pad array, a third die resting on the backside of the second die and connected to the land pad array by wire bonds, and a passive device and/or a discrete device resting on device pads. The packages also contain thermal pads which operate as a heat sink. The land pad array is formed from etching the leadframe. The semiconductor packages have a full land pad array with a thin package size while having a system-in-a-package design. Other embodiments are also described. | 2010-03-04 |
20100052122 | WIRE BODNING PACKAGE STRUCTURE - A chip package structure employing a die pad integrated with the ground/voltage pad is provided. The die pad for carrying the chip is split into at least two separate sections for accommodating the ground and the voltage. Due to the design of the die pad, the signal fingers may be extended under the chip to be connected with vias, and thermal/ground vias may be arranged under the die pad for thermal or electrical connections. Through such arrangement, all the fingers are located closer to the die, thus decrease the length of bonding wires and reducing the package dimensions. | 2010-03-04 |
20100052123 | LOW STRESS CAVITY PACKAGE - The present invention relates to methods and arrangements for forming a low stress cavity package. Particular methods may be performed with existing packaging equipment. In one such method, a leadframe laminated with adhesive film is provided. Integrated circuit dice are connected to the leadframe by reflowing solder between bond pads on the active surface of each die and the leadframe. A viscous thermosetting material is dispensed around the periphery of the active surface of each die. The thermosetting material fills gaps between the solder joint connections and the adhesive film. As a result, the thermosetting material, solder joint connections, each integrated circuit die and the adhesive film define and seal a protective cavity between the active surface of the die and the adhesive film. Portions of each die, leads, solder joint connections and adhesive film are encapsulated with a molding material that is prevented from entering the sealed cavity. | 2010-03-04 |
20100052124 | RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND RESIN SEALING TYPE ELECTRONIC DEVICE - The invention provides a resin sealing type electronic device having high reliability by eliminating a solder burr formed when a tie bar is cut. The invention also prevents a welding failure between a lead of the resin sealing type electronic device and an external electrode, and provides a large area for bonding an electronic component to the lead to prevent a connection failure. In the method of manufacturing the resin sealing type semiconductor device of the invention, in a case that a tie bar is cut after a semiconductor die and so on are mounted on a lead frame and these are resin-sealed, the cutting of the tie bar is performed from the side of the lead frame where a lead burr is formed by presswork. Furthermore, in the resin sealing type electronic device of the invention, a die capacitor is bonded to burr formation surfaces of a lead and an island using conductive paste. Since the burr formation surface has a larger surface area than a rounded surface, a large bonding area is obtained. A welding surface of the lead to a control electrode is the rounded surface that is opposite to the burr formation surface. | 2010-03-04 |
20100052125 | RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND LEAD FRAME - The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed. Even when a portion of the outer frame remains on the side surface of the resin package, connection between the connection lead etc and other hanging lead etc are prevented by providing a notch etc in the outer frame between the connection lead etc and the hanging lead etc. | 2010-03-04 |
20100052126 | APPARATUS AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS - Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing. | 2010-03-04 |
20100052127 | FLIP CHIP MLP WITH CONDUCTIVE INK - A flip chip molded leadless package (MLP) with electrical paths printed in conducting ink. The MLP includes a pre-molded leadframe with the electrical paths printed directly thereon. The present invention also provides a method of fabricating the semiconductor package. | 2010-03-04 |
20100052148 | PACKAGE STRUCTURE AND PACKAGE SUBSTRATE - Provided are a package structure and a package substrate, including: a substrate body having a plurality of matrix-arranged electrical contact pads formed on at least one surface thereof, wherein a solder mask layer is formed on said surface and has a plurality of openings for exposing the electrical contact pads, respectively; a first electroless-plated layer disposed on the electrical contact pads, on the walls of the openings and at the peripheries of the openings; and a second electroless-plated layer disposed on the first electroless-plated layer, the first and second electroless-plated layers constituting a recessed electrical connection structure. By forming the even electroless-plated layers on the electrical contact pads. The invention overcomes drawbacks of the prior art, namely breakage of interfaces between solder bumps and electrical contact pads and even damage of the package structure otherwise caused by excessive differences in stress between the solder bumps. | 2010-03-04 |
20100052149 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes: a die pad having a top surface; a plurality of leads arranged around the die pad; a semiconductor chip having a main surface, a back surface, and a plurality of pads formed to the main surface, and having the back surface fixedly adhered in opposing contact with the top surface of the die pad; a plurality of wires electrically connecting the plurality of pads of the semiconductor chip and the plurality of leads, respectively; and a sealing body sealing the semiconductor chip and the plurality of wires. In addition, a plurality of groove portions are formed to a chip-mounting region opposing the back surface of the semiconductor chip in the top surface of the die pad, and an adhesive for fixedly adhering the semiconductor chip to the top surface of the die pad is buried in the plurality of groove portions. | 2010-03-04 |
20100052150 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE SUBSTRATE HAVING CORNER CONTACTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a package substrate with a top substrate side and a bottom substrate side; forming a corner contact in a first corner of the bottom substrate side, the corner contact extending to a substrate edge of the package substrate; mounting an integrated circuit device over the top substrate side; connecting an electrical interconnect between the integrated circuit device and the top substrate side; and forming a package encapsulation over the top substrate side, the integrated circuit device, and the electrical interconnect. | 2010-03-04 |
20100052151 | Ball Grid Array Package Having One or More Stiffeners - Electrically and thermally enhanced die-up ball grid array (BGA) packages are described. A BGA package includes a stiffener, substrate, a silicon die, and solder balls. The die is mounted to the top of the stiffener. The stiffener is mounted to the top of the substrate. A plurality of solder balls are attached to the bottom surface of the substrate. A top surface of the stiffener may be patterned. A second stiffener may be attached to the first stiffener. The substrate may include one, two, four, or other number of metal layers. Conductive vias through a dielectric layer of the substrate may couple the stiffener to solder balls. An opening may be formed through the substrate, exposing a portion of the stiffener. The stiffener may have a down-set portion. A heat slug may be attached to the exposed portion of the stiffener. A locking mechanism may be used to enhance attachment of the heat slug to the stiffener. The heat slug may be directly attached to the die through an opening in the stiffener. | 2010-03-04 |
20100052152 | Semiconductor package transformer - The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front surface and an open part exposing is formed on its upper surface; and a plurality of holes that are formed on the bottom surface of the case. | 2010-03-04 |
20100052153 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin is provided and having a projection-shaped resin portion which projects locally around the lead pin and covers a side surface of a base portion side of the lead pin. The projection-shaped resin portion has a top surface extending from an outer peripheral portion of the lead pin to an outside, and a side surface constituting a non-identical surface to the top surface. | 2010-03-04 |
20100052154 | SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES - A semiconductor-lid structure and method of forming a semiconductor-lid structure includes a semiconductor die, an ultrahigh thermal conductivity lid disposed on the semiconductor die, and a thermal interface layer between said semiconductor die and said ultrahigh thermal conductivity lid. The ultrahigh thermal conductivity lid includes a coupon having at least one uneven surface, a first layer on said at least one uneven surface formed from a process comprising one of sputter coating a highly adhesive metal over said uneven surface and sputtering a metallic seed layer, and a second layer on said first layer formed from a process comprising one of sputtering a metallic diffusion barrier layer over said first layer and electroplating the metallic seed layer with a highly conductive metal. The ultrahigh thermal conductivity lid has a smooth outer surface formed by chemical and/or mechanical processing of the ultrahigh thermal conductivity lid after formation of the second layer. | 2010-03-04 |
20100052155 | METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES AND INJECTION MOLDED PLASTICS FOR CREATING OVER-MOLDED MEMORY CARDS - A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package. | 2010-03-04 |
20100052156 | CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A chip scale package (CSP) structure and the packaging process thereof are described. By using a matrix of interlinked heat sink units compatible with the block substrate, the packaging process can be simplified and a plurality of packages units or chip scale packages with enhanced thermal performance can be obtained after singulation. | 2010-03-04 |
20100052157 | CHANNEL FOR A SEMICONDUCTOR DIE AND METHODS OF FORMATION - In semiconductor die packaging, stereo lithography cures a material around the die such that a channel is defined in the material. The channel exposes a portion of the die surface, and the channel is closed off above the die surface. The same stereo lithography process may also be used to define an opening that exposes a through-silicon via extending from the die surface. An additional or alternative channel may be similarly defined at a side perpendicular to that surface. The die may be stacked with other die, and the stereo lithography process may occur before or after stacking. A heat sink contacting the channel may also be added. | 2010-03-04 |
20100052168 | METAL LINE HAVING A MULTI-LAYERED DIFFUSION LAYER IN A SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A metal line having a multi-layered diffusion layer in a resultant semiconductor device is presented along with corresponding methods of forming the same. The metal line includes an insulation layer, a multi-layered diffusion barrier, and a metal layer. The insulation layer is formed on a semiconductor substrate and has a metal line forming region. The multi-layered diffusion barrier is formed on a surface of the metal line forming region defined in the insulation layer. The diffusion barrier includes a VB | 2010-03-04 |
20100052169 | METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER AND METHOD FOR FORMING THE SAME - An insulation layer is formed on a semiconductor substrate so as to define a metal line forming region. A diffusion barrier having a multi-layered structure of an Mo | 2010-03-04 |
20100052170 | METAL LINE OF SEMICONDUCTOR DEVICE HAVING A DIFFUSION BARRIER AND METHOD FOR FORMING THE SAME - A metal line of a semiconductor device includes an insulation layer formed on a semiconductor substrate. The insulation layer has a metal line forming region. A diffusion barrier is formed on a surface of the metal line forming region of the insulation layer. The diffusion barrier includes a multi-layered structure that includes an MoB | 2010-03-04 |
20100052171 | CU WIRE IN SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF - A Cu wire in a semiconductor device according to the present invention is a Cu wire embedded into wiring gutters or interlayer connective channels formed in an insulating film on a semiconductor substrate and the Cu wire comprises: a barrier layer comprising TaN formed on the wiring gutter side or the interlayer connective channel side; and a wire main body comprising Cu comprising one or more elements selected from the group consisting of Pt, In, Ti, Nb, B, Fe, V, Zr, Hf, Ga, Tl, Ru, Re, and Os in a total content of 0.05 to 3.0 atomic percent. The Cu wire in a semiconductor device according to the present invention is excellent in adhesiveness between the wire main body and the barrier layer. | 2010-03-04 |
20100052172 | METHOD OF FABRICATING COPPER DAMASCENE AND DUAL DAMASCENE INTERCONNECT WIRING - An integrated circuit and a method of manufacturing the integrated circuit, the method including: (a) providing a substrate; (b) forming a copper diffusion barrier layer on the substrate; (c) forming a dielectric layer on a top surface of the copper diffusion barrier layer; (d) forming a copper damascene or dual damascene wire in the dielectric layer, a top surface of the copper damascene or dual damascene wire coplanar with a top surface of the dielectric layer; (e) forming a first capping layer on the top surface of the wire and the top surface of the dielectric layer; (f) after step (e) performing one or more characterization procedures in relation to said integrated circuit; and (g) after step (e) forming a second capping layer on a top surface of the first capping layer. | 2010-03-04 |
20100052173 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A first impurity diffusion layer in a memory cell portion and a second impurity diffusion layer in a peripheral circuit portion are provided in a surface of a semiconductor substrate and having upper faces substantially flush with each other. First and second insulating films are formed to cover the upper faces of the impurity diffusion layers, and having substantially uniform film thicknesses. A first metal plug is formed in the insulating films, and connected to the first impurity diffusion layer. A second metal plug is formed in the first insulating film, to have a lower height than the first metal plug, and is connected to the second impurity diffusion layer. A first metal interconnection is connected to an upper end portion of the first metal plug, and having an upper face embedded in and flush with the second insulating film. A second metal interconnection is connected to an upper end portion of the second metal plug, and having an upper face embedded in and flush with the second insulating film. | 2010-03-04 |
20100052174 | COPPER PAD FOR COPPER WIRE BONDING - An integrated circuit package comprising an integrated circuit that includes transistors coupled to copper interconnect structures. The integrated circuit package also comprises copper pads located on the integrated circuit and directly contacting uppermost ones of the copper interconnect structures. Each of copper pads has a thickness of at least about 2 microns. The integrated circuit package further comprises copper wires pressure-welded directly to the copper pads. | 2010-03-04 |
20100052175 | REDUCING LEAKAGE AND DIELECTRIC BREAKDOWN IN DIELECTRIC MATERIALS OF METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES BY FORMING RECESSES - By recessing metal lines and/or the dielectric material of a metallization layer of sophisticated semiconductor devices, the time to dielectric breakdown may be increased due to reducing electrical fields and diffusion paths at the top of the metal lines. | 2010-03-04 |
20100052176 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a first wiring extending in a first direction and a second wiring extending in a second direction which crosses the first direction and being disposed with a space interposed between the first wiring and the second wiring, and including a tantalum layer, a tantalum nitride layer formed over the tantalum layer, and a metal layer formed over the tantalum nitride layer. | 2010-03-04 |
20100052177 | METHOD FOR MANUFACTURING A CROSSBAR CIRCUIT DEVICE - Method for manufacturing a crossbar circuit on a substrate ( | 2010-03-04 |
20100052208 | METHOD AND APPARATUS FOR PRODUCING PLASTIC CONTAINERS - The invention relates to a method and a device for the production of blow-molded two- or multi-layer containers made of thermoplastic, and a plastic container produced accordingly, having view strips, particularly for storage and for transport of contents. To this end, molten plastic material is deflected in an extrusion head ( | 2010-03-04 |
20100052209 | METHOD OF MANUFACTURING A COMPONENT FOR A VEHICLE INTERIOR - A mold assembly, a method of molding, and a molded component for an interior of a vehicle using two shots of material. The mold assembly includes first and second mold halves cooperating to define a cavity. One of the mold halves includes a retractable core. The second mold half defines a divider for engaging the retractable core, when the retractable core is extended, so as to divide the mold cavity into first and second chambers. Portions of the core cooperate to define a sloped surface on the first shot that aids in inhibiting flash forming as the second shot is introduced into the mold assembly. | 2010-03-04 |
20100052210 | COMPRESSION-MOLDED CLOSURE LINER - A container closer includes a cap and a seal liner coupled to the cap. The cap is configured to mount on a filler neck of a container to mate the seal liner with a brim of the filler neck. | 2010-03-04 |
20100052211 | METHOD FOR MAKING INSERT MOLDED ARTICLE - A method for making an insert molded article, comprises using an insert component definings a hole corresponding in size and location to the mold sprue Molten material is injected into the mold through the channel, to form a molded component and the molded component and the insert component are incorporated into a molded article. | 2010-03-04 |
20100052212 | METHOD OF RESIN SEALING ELECTRONIC PART - A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus. | 2010-03-04 |
20100052213 | Structure of Parts Made From Plural Composite Pieces and Method of Building Those Parts - A pre-mold part is formed by pre-molding the insert with the pre-molded part, and then the pre-molded part is inserted into the over-molded part composed of thermo plastic resin. After applying a heat treatment with the temperature lower than a crystalline melting point of the pre-molded part to the pre-molded part surrounding the insert formed as the composite mold part surrounding the pre-mold part, a firm contact between the insert and the resin surrounding the insert part without no gap at the interface between those parts is obtained. | 2010-03-04 |
20100052214 | Assembly having a component enclosed by a housing, and device and method used in its manufacture - To provide an assembly which is as small as possible which contains a well-protected component and effectively dissipates heat, and to provide a device and a method for use in the rapid manufacture of such an assembly, an assembly includes a component and a housing from which the component is partially separated by narrow casting gaps filled with a casting compound containing a relatively large amount of filler. For the manufacture of such an assembly, a device is used for filling with casting compound and which includes a mounting for securing the assembly in a position which permits air to escape from the casting gaps, which have an external connection during filling. Also there are supply containers and supply lines for the casting compound which open into the casting gaps, and an apparatus for generating pressure. A method which is used to fill narrow casting gaps with casting compound by using such a device. The method involves introducing a casting compound of predetermined viscosity under pressure through the supply lines into the casting gaps, from which the air is displaced. | 2010-03-04 |
20100052215 | Radio Frequency Identification Device for Plastic Container and Method of Manufacture of Same - The subject invention pertains to a method and system for identifying goods contained within a container. In an embodiment, a method of manufacturing a plastic container with an embedded RFID tag is provided. In an embodiment, a system includes a plastic container and plastic substrate, with an RFID tag disposed on the substrate. In an embodiment, the substrate can be embedded in a surface of the plastic container. In a further specific embodiment, the substrate can be a label used for in-mold labeling. Such a label can provide the labeling, or markings, for the container. Labeling the container and embedding an RFID tag during the same injection step can save time and costs. | 2010-03-04 |
20100052216 | NANO IMPRINT LITHOGRAPHY USING AN ELASTIC ROLLER - Imprint lithography devices and methods of lithography are provided. | 2010-03-04 |
20100052217 | IMPRINTING APPARATUS AND ARTICLE MANUFACTURING METHOD - The imprint apparatus presses resin disposed on a substrate and a mold to each other to form a resin pattern on the substrate. The apparatus includes a driving device configured to move the mold and the substrate relatively to apply a pressing force between the mold and the resin, a measuring device configured to measure a position of at least one of the mold and the substrate, a detector configured to detect the pressing force, and a controller configured to control the driving device. The controller is configured to control the driving device using the position as a controlled variable in a first period, and to control the driving device using the pressing force as a controlled variable in a second period after the first period. | 2010-03-04 |
20100052228 | LOAD ABSORBING DEVICE - A load absorbing device or other resilient device, such as a fender, bumper, or rub rail, for protecting an object, such as a dock or boat, from an impact force delivered by another object includes a leaf spring portion connected to the object. The leaf spring portion includes a fixed end and a free end operable to transmit to the object a fraction of the impact force and is designed to collapse upon loading with the impact force to thereby absorb energy that would otherwise be transferred directly to the object. In a preferred embodiment, the leaf spring portion is extruded of a high-strength abrasion-resistant plastic material having a low coefficient of friction, such as ultra high molecular weight polyethylene (UHMWPE). The leaf spring portion may include multiple mounting holes sized to receive mounting fasteners for rigidly connecting the device to the object. | 2010-03-04 |
20100052229 | AUTOMOTIVE MAINTENANCE KNEELING PADS AND METHODS THEREOF - A portable maintenance assistance device in accordance with embodiments of the present invention includes at least one resilient material having one or more side edges between a pair of opposing substantially planar surfaces. The resilient material is substantially resistant to deterioration from exposure to one or more automotive chemicals. | 2010-03-04 |
20100052230 | SPRING DEVICE CAPABLE OF STORING A WINDING FORCE - A spring device includes a tubular seat defining a shaft hole therethrough, a shaft, and a torsion spring. The shaft hole has a positioning hole section and a guiding section. The guiding section has a diameter smaller than that of the positioning hole section. The tubular seat further has a keyway that is in spatial communication with the guiding section of the shaft hole. The shaft has a shaft body and a key. The shaft body is extended through the shaft hole and is movable axially relative to the tubular seat between first and second axial positions. The shaft body is rotatable relative to the tubular seat when the shaft body is at the second axial position so as to accumulate a winding force in the torsion spring. The tubular seat further has a key stop that abuts against the key so that the key is offset from the keyway when the shaft body is at the first axial position. | 2010-03-04 |
20100052231 | COIL SPRING FORMING APPARATUS AND COIL SPRING FORMED THEREBY - A coil spring forming apparatus including a core bar | 2010-03-04 |
20100052232 | FRICTION DEVICE FOR CONTROLLING FORCE, AND A FRICTION DAMPER COMPRISING SUCH A DEVICE - Friction device includes at least two members, one of which is mobile, or potentially mobile, in terms of relative displacement with respect to the other under the action of an external stimulus. The relative displacement is liable to cause the relative displacement of two friction surfaces subjected to pressing forces, so as to convert the external stimulus into a friction force and to thus control the displacement of the mobile or potentially mobile member. The pressing forces are produced by pre-stressing mechanisms and the members are able to act on the effects of the pre-stressing mechanisms so as to use the resultant effect of the relative displacement of the mobile or potentially mobile member to reduce the pressing forces. | 2010-03-04 |
20100052233 | DOUBLE ACTING WORK SUPPORT WITH INTERNAL SEQUENCE CONTROL - A work support comprises a plunger, a transmission member, a first chamber, a second chamber, a third chamber, a clamping mechanism, a plug, and a body. The plunger may be slidably retained within the clamping mechanism, which in turn is firmly held within the transmission member. The transmission member may extend and retract from the body corresponding to a pressure in the first chamber and the second chamber. Extension of the transmission member also extends the plunger such that the plunger may contact and receive a load from a work piece. The third chamber may be located between the outer surface of the clamping mechanism and the inner surface of the transmission member. Increasing pressure in the first chamber while decreasing pressure in the second chamber extends the transmission member and opens the plug which blocks the entry to the third chamber. Pressure in the third chamber closes the gap between the clamping mechanism and the plunger and applies a clamping force to the plunger. | 2010-03-04 |
20100052234 | Key clamping device - A clamping device comprising for clamping a plurality of key styles is provided. The clamping device includes a base block and a clamping block rotatably connected to the base block. The clamping block may include a plurality of sides configured to clamp a key between the clamping block and the base block. A sidewinder key clamp may be connected to the clamping device. The sidewinder key clamp may be capable of clamping a first style of key in a horizontal position and clamping a second style of key in a vertical position. The clamping device may further include a multi-faced block with a plurality sides rotatably connected to the clamping block. Each side of the multi-faced block may have a geometry configured to clamp a key between the multi-faced block and the base block. | 2010-03-04 |
20100052235 | CONVEYING APPARATUS - A conveying apparatus with conveying compartments ( | 2010-03-04 |
20100052236 | FEED DEVICE AND RECORDING DEVICE - Provided is a feed device including: a loading unit in which a plurality of sheet members is loaded in a stacked state; a delivery member which performs a feed operation in a state in which a contact surface thereof is in contact with an uppermost sheet member of the sheet members loaded on the loading unit and delivers the sheet member in a feed direction using the frictional force with the uppermost sheet member as the feeding force; a gate member which is configured to move in a direction to and or from the contact surface of the delivery member and has an inclined surface with which a front end of the sheet member delivered by the delivery member collides with; and a gate energizing member which energizes the gate member in a direction approaching to the contact surface of the delivery member. | 2010-03-04 |
20100052237 | Document handling apparatus - A document handling apparatus ( | 2010-03-04 |
20100052238 | SHEET-FEEDING APPARATUS - A sheet-feeding apparatus having simple structure and capable of single-face/double-face scanning/printing sheets at high sheet-feeding efficiency. The sheet-feeding apparatus includes a sheet-feeding path in which sheets can pass through a scanning module and/or a printing module. The sheet-feeding path includes a first passage, a second passage communicating with the first passage and a subsidiary passage formed between the first and second passages. The sheets are selectively fed into and delivered through the first passage, the second passage or the subsidiary passage to be single-face/double-face scanned/printed. | 2010-03-04 |
20100052239 | DISCHARGE DEVICE AND IMAGE FORMING APPARATUS - A discharge device comprises a discharge roller unit including a first discharge roller and a second discharge roller, and deforming a sheet on which an image is formed, the sheet being deformed such that the sheet is recessed toward one of the rollers when the sheet is fed between the first discharge roller and the second discharge roller. | 2010-03-04 |
20100052240 | Image Forming Apparatus - A pair of conveyor rollers arranged in an image forming apparatus to convey a recording sheet which has been subjected to a fixing process toward outside of a body of the apparatus is configured to be shiftable relative to the body between a first position and a second position. A first holding member is configured to support one of the conveyor rollers in such a manner that a conveyor roller supported by the first holding member is swingable around a pivot located adjacent to a sheet conveyance path upstream of the supported conveyor roller to allow the pair of conveyor rollers to be shifted between the first position and the second position. The first holding member comprises a sheet guide portion which provides a variable-position guideway extending from a position located upstream along the sheet conveyance path toward a peripheral surface of the supported conveyor roller. The sheet guide portion is configured to come to a position suitable to guide the recording sheet toward a nip position at which the pair of conveyor rollers nips the recording sheet at least when the pair of conveyor rollers is shifted to the first position. | 2010-03-04 |
20100052241 | SHEET CONVEYANCE APPARATUS, SHEET PROCESSING APPARATUS, AND IMAGE FORMING APPARATUS - A presser member which abuts on a sheet which passes through a sheet conveyance path, and rotates toward a sheet conveyance direction while being pressed by the sheet is provided rotatably in the sheet conveyance path where the sheet conveyed to a sheet stack portion passes, and a move portion to which this presser member is retracted from the sheet conveyance path is provided. When drawing out a jammed sheet from the sheet conveyance path in a direction reverse in a sheet conveyance direction, a jam recovery door is opened, the move portion is operated in connection with this opening motion, and the presser member is retracted from the sheet conveyance path. | 2010-03-04 |
20100052242 | WARPAGE LEVELING UNIT, WARPAGE LEVELING DEVICE, IMAGE FORMING APPARATUS AND WARPAGE LEVELING PROCESSING PROGRAM - A warpage leveling unit includes a surface roughening member that is provided to oppose to a side end portion of an image carrier which has an endless-belt-shape, is entrained around a plurality of rollers, and carries an image on a surface of the image carrier, wherein the surface roughening member comes into contact with a surface of the side end portion which is warped. | 2010-03-04 |
20100052243 | IMAGE FORMING APPARATUS, METHOD FOR ASSISTING PAPER SHEET SUPPLYING OPERATION AND CONTROL PROGRAM OF THE SAME - Described is an image forming apparatus, which makes it possible to create a vacant tray. The apparatus includes a paper sheet managing section to conduct consecutive operations including: acquiring the residual amount of the paper sheets accommodated in each of plurality paper sheet trays; calculating a total sum of residual amounts of paper sheets having the same attributes; comparing the above-calculated total sum with the maximum accommodating capacity of each of the paper sheet trays currently accommodating the paper sheets concerned; and notifying the operator of the fact that a vacant tray can be made by collecting the paper sheets concerned into a specific paper sheet tray, if there exists such paper sheets and a combination of paper sheet trays that make the total sum of the residual amounts of the paper sheets equal to or smaller than the maximum accommodating capacity of the specific paper sheet tray. | 2010-03-04 |
20100052244 | Recording Sheet Transporting Apparatus and Image Forming Apparatus - A recording sheet transporting apparatus includes a first roller which transports a recording sheet, a first transmitting gear to which a drive force is transmitted from a drive source, a second roller which is movable in a radial direction with respect to the first roller, a second transmitting gear which is engaged with the first transmitting gear and which transmits the driving force to the second roller, a universal joint which connects an end portion of the second roller and one end portion of the second transmitting gear, a bearing member which has a cylindrical surface and rotatably supports the other end portion of the second transmitting gear by the cylindrical surface, and a supporting member which tiltably supports the bearing member in a movement direction of the second roller. | 2010-03-04 |
20100052245 | MEDIA FIXING DEVICE - A media fixing device includes a stationary plate, a bar linking member, a main pressure plate, an elastic member, an auxiliary plate and a pivot rod. The bar linking member is configured for movably connecting the main pressure plate. The elastic member is configured for movably connecting the main pressure plate to the stationary plate. The pivot rod is configured for pivoting the auxiliary plate on the main pressure plate. | 2010-03-04 |
20100052246 | MEDIA SIZE SENSING SYSTEM AND METHOD - A media size sensing system includes independently moveable length and width edge guides, in a media tray, for positioning against orthogonal edges of media sheets. A linearly sliding sensor device is provided, and a single linkage connects the length and width edge guides to the sensor device, the single linkage providing a unique position indication that is a function of both length and width for a range of media sheet sizes. | 2010-03-04 |
20100052247 | SHEET SUPPLY APPARATUS AND IMAGE FORMING APPARATUS - A sheet supply apparatus is provided with a print medium storage device for storing a print medium. The print medium storage device includes a guide member for guiding the print medium thus stored; an engaging portion for engaging the guide member at a specific position; an engaged portion for engaging the engaging portion; an operation portion disposed to be movable for separating the engaging portion from the engaged portion; and an abutting portion for abutting against the operation portion to move the operation portion when the print medium storage device is situated at a first position, and for separating from the operation portion when the print medium storage device is situated at a second position. | 2010-03-04 |
20100052248 | Printing apparatus - A printing apparatus includes: a printing mechanism forming an image on a sheet transferred in a sheet transfer route; a sheet feeding mechanism feeding sheets to the sheet transfer route; a register provided between the sheet feeding mechanism and the printing mechanism on the sheet transfer route so as to position a sheet fed from the sheet feeding mechanism and adjust an obliqueness of the sheet; an edge part detector provided on the sheet transfer route having a detecting section configured between the register and the printing mechanism so as to detect edge parts of a sheet transferred to the printing mechanism by the register, wherein the edge part detector is configured to serve as a multi-feed detector to detect multi-feeding of sheets. | 2010-03-04 |
20100052249 | SHEET FEEDING DEVICE AND DOCUMENT READING DEVICE - An operation of a pickup roller to be performed upon powering on or after paper jam elimination is adjusted according the presence or absence of a document on a document sheet support. When the document is absent on the sheet support, the pickup roller is moved down sufficiently and then moved up by a first distance to assume an upper limit position. When the document is present on the sheet support, the pickup roller is moved up by a second distance which is shorter than the first distance. | 2010-03-04 |
20100052250 | CARRIER DEVICE, INSPECTION APPARATUS HAVING THE SAME, AND INSPECTION SYSTEM - A carrier device performs floating and carrying of a sheet-like member having curling tendency along a carrier path. The carrier device includes a floating air blowing unit that floats and carries the sheet-like member by blowing out air obliquely upward in a carrying direction to the sheet-like member residing on the carrier path via a plurality of blowout holes, a carrier plate that constitutes the carrier path and has the plurality of blowout holes formed therein, and a pressing air blowing unit that faces a carrying start position of the sheet-like member on the carrier plate and blows out air from an upper position relative to the sheet-like member so as to lay the sheet-like member along the carrier plate. | 2010-03-04 |
20100052251 | SHEET GUIDING APPARATUS - A sheet guiding apparatus, including: a supporting member having a supporting surface which supports a sheet; a first electrode provided in the supporting member; an electric field generating portion configured to generate an electric field between the supporting surface and the first electrode; a guide member which is distant from the supporting surface by a predetermined distance in a direction perpendicular to the supporting surface; a moving portion configured to move the sheet supported by the supporting surface by moving at least one of the supporting member and the guide member relatively to each other in a direction parallel to the supporting surface; and an electric field inverting portion configured to invert a direction of the electric field generated by the electric field generating portion, when a leading end portion of the sheet in a direction in which the sheet is moved has reached a vicinity of the guide member. | 2010-03-04 |
20100052252 | Image forming apparatus - An image forming apparatus to form an image on a sheet of recording media includes a discharge port formed in an upper portion of a main body of the image forming apparatus and exposed from above, a discharge portion to which the sheet is discharged, disposed downstream from the discharge port in a direction in which a sheet is discharged, a discharge roller disposed at the discharge port, a facing member disposed facing the discharge roller, forming a discharge nip together with the discharge roller, and a rotatable sheet discharge member. The sheet discharge member is provided in the discharge portion to form a sloped portion continuous with a downstream side of the discharge port in the direction in which the sheet is discharged. Rotation of the sheet discharge member causes a position of the discharge nip to change. | 2010-03-04 |
20100052253 | INTERACTIVE MODULAR TILE SYSTEM - The interactive modular tile system of the invention comprises a plurality of modular interactive tiles ( | 2010-03-04 |
20100052254 | TABLE BASEBALL SET - The table baseball set provides more than 9 figurines (can include coaches) as players for each team, and can be played on a miniature baseball stadium board. Even people with a rough knowledge on baseball can do it easily. Because of its special design and assignments, the layout of the miniature baseball stadium corresponds exactly to the official baseball field. In this game, there are fielders, hits, outs, walks, scores, and some tactics used that nearly all happen in the real baseball game. It is a nice table game, full of interesting, fun and excitement. | 2010-03-04 |
20100052255 | Blackjack tournaments with rules encouraging card counting and broadcasts thereof - Blackjack tournaments are described which provide for rules and practices that facilitate counting of cards by players, such as dealing from a single deck of 52 cards down to the last card in the deck. The proprietor of the tournament limits its exposure to losses by forming a pool of prize money from entrance fees paid by players, sponsorship fees, a limited contribution to the pool of prize money, or combinations thereof. Players play with chips provided by the proprietor of the tournament. The tournament may be captured with one or more video cameras and broadcast over an entertainment network. The broadcast may feature card counting reports, commentary by experts, and a display of the sequence of cards to be dealt to the players and the dealer. | 2010-03-04 |
20100052256 | Ten0 - Ten0 is an entertaining, multi-level card game involving the fundamentals of math. It is inclusive of four operands that are central to the game. The Ten0 also features a Ten0 scale reading and special cards. One of the unique features of this game is that it is an educational game and also a fun game. Playing Ten0 games include providing a deck of cards, dealing cards, forming the deck, placing the deck faced down, and starting the game with the total for all participating players. The players choosing card(s) from his/her hand, calculating and recording with the use of the card(s), drawing a card and shuffling the deck and finishing the game. | 2010-03-04 |
20100052257 | GAME WITH CLUES - A method for playing a game that includes selecting an answer word by a first player. The first player displays a clue word and a non-clue word. One or more other players who view the displayed clue word and non-clue word guess at least one word. A round is ended after another player guesses the answer word, or the other players do not guess the answer word after one or more clue and non-clue words are displayed. The inclusion of the non-clue words increases the complexity of guessing the answer word. For example, the non-clue words can be selected by the first player to create clues for a word that is different from but common to the answer word. | 2010-03-04 |
20100052258 | Spindle Seal With Tangential Flow-Inducing Distribution Ring - An improved cartridge-type bearing seal includes removably connected stator and rotor sections. The stator section supports a distribution ring that divides an internal annular volume into radially outside and inside portions. The ring has a sufficient number of tangentially oriented ducts to permit fluid communication between the outside and inside portions. With this structure, when pressurized purge fluid is supplied to the outside portion, the fluid flows through the ducts, to induce a desired tangential fluid flow within the inside portion. This in turn causes circumferentially uniform fluid pressure in the annular volume that resides between the rotating shaft and the bearing housing, and the pressurized fluid traverses a flow path out of the bearing. This circumferentially uniform fluid pressure, by itself or in combination with a flexible lip, prevents contaminant ingress between the rotating shaft and the bearing housing. Because the structure that creates the tangential fluid flow is part of the removable cartridge, this bearing seal eliminates the need to machine or drill a tangentially oriented passage in the bearing housing. One embodiment adds a secondary ring adjacent the distribution ring, to reduce the need to precision machine the inside dimension of the bearing cap. These structural components render the circumferential purge fluid feature even more readily available, for a wider range of spindles. | 2010-03-04 |
20100052259 | SCARF CUT BACKUP RINGS - A seal assembly is provided for sealing a gap with a high pressure side and a low pressure side between a first component and a second component. The seal assembly can include a primary seal configured to be arranged on the first component and spanning the gap on the high pressure side between the first and second component; and a backup ring configured to be arranged on the first component adjacent the primary seal on the low pressure side. The backup ring includes an inner diameter and a scarf cut slit at an angle that is a function of the inner diameter of the backup ring. | 2010-03-04 |
20100052260 | DEVICE AND METHOD FOR PRODUCING A SEAL - A device is disclosed for producing a seal between a first part and a second part, especially a first housing part and a second housing part. The seal can be produced according to a physical property of an electroactive plastic material which can be modified. A device for receiving an electrical circuit and/or a device including electrical switching device is also disclosed, having at least one first and one second housing part operating as a first part and a second part, with an above-mentioned device. A method is further disclosed for producing a seal between a first part and a second part, especially a first housing part and a second housing part, by way of such a device, a first electrical voltage being applied to create the seal, and a second electrical voltage being applied to lift the seal. | 2010-03-04 |
20100052261 | METALLIC SEAL FOR USE IN HIGHLY-CORROSIVE OIL AND GAS ENVIRONMENTS - A metal seal assembly to seal components in highly corrosive environments, such as a sour well environment. The seal assembly is comprised of a base metal structural component with a softer metal layer applied onto its surface. The purpose of the soft metal layer is to locally deform and, thereby, form a seal against a surface of an opposing component. The base metal structure of the seal may be comprised of a corrosion-resistant alloy. In addition, the soft metal layer may be comprised of a corrosion-resistant alloy, such as a refractory metal like tantalum. | 2010-03-04 |
20100052262 | Sealing device - A sealing device for sealing space between two members concentrically and relatively rotating comprising a core member fixedly fitted into one of the two members, a metal slinger fixedly fitted into the other of the two members, and an elastic seal member fixedly attached to the core member and having a seal lip which elastically and slidably contacts the slinger. The slinger has a slidably contacting treated surface for the seal lip as is processed such a surface-treatment as defined by the following parameters: arithmetic mean roughness Ra in the range from 0.5 μm to 1.5 μm, root-mean-square roughness Rq in the range from 0.6 μm to 2.0 μm, mean surface irregularity interval Sm in the range from 0.05 mm to 0.17 mm and peak count Pc (50%) in the range from 20 to 60. | 2010-03-04 |
20100052263 | ELECTROPLATED RESILIENT SEAL - A seal includes a resilient material and a metallic material electroplated to the resilient material and a method for making an extrusion resistant seal including electroplating a resilient seal material. | 2010-03-04 |
20100052264 | COMPACT RESTRICTIVE SEAL FOR BEARING HOUSINGS - This invention relates to a restrictive seal of the labyrinth type of reduced external size. The invention has an inner deflector which is capable of retaining the lubricating oil within the bearing housing with great efficiency, and a highly accurate system for adjusting and aligning the elements of the labyrinths, ensuring an infinite service life. Because it has very much smaller external dimensions it can be applied as a replacement to the lip seals commonly in use without causing problems to accessory equipment connected to a pump. | 2010-03-04 |
20100052265 | SEAL WITH NON-CONTACT ADJACENT DEFLECTOR RINGS - The invention relates to a seal with non-contact adjacent deflector rings, arranged concentrically to each other, about a common rotation axis, whereby, on a first deflector ring of the deflector rings, at least two axially-adjacent radial lips are embodied an said radial lips are embodied such as not to come into contact with a second deflector ring of the deflector rings and an annular hollow cavity is embodied between two axially-adjacent radial lips and the second deflector ring. | 2010-03-04 |
20100052266 | SEALING DEVICE - To enhance lubricating oil supply function, a sealing device ( | 2010-03-04 |
20100052267 | SEAL ASSEMBLY - A sealing assembly for a shaft includes a sealing component, a first ring, a second ring, and at least one energizer. The first ring is annularly disposed about the shaft, the first ring having at least one first protuberance interfittable with the sealing component. The second ring is annularly disposed about the shaft in facing opposition to the first ring, the second ring having at least one second protuberance interfittable with the sealing component. The at least one energizer energizes the seal component, the at least one energizer being adjacent the at least one first protuberance or the at least one second protuberance. | 2010-03-04 |