Class / Patent application number | Description | Number of patent applications / Date published |
156750000 | DELAMINATING MEANS | 74 |
20110192546 | WATER-COLLAPSIBLE Al COMPOSITE MATERIAL, Al FILM AND Al POWDER CONSISTING OF THIS MATERIAL, AND METHODS FOR PREPARATION THEREOF, AS WELL AS COMPONENT MEMBERS FOR CONSTITUTING FILM-FORMING CHAMBERS AND METHOD FOR THE RECOVERY OF FILM-FORMING MATERIALS - In An Al composite material collapsible in the presence of moisture, the external surface of small pieces or powder constructed from a single or a plurality of crystalline grains of Al or an Al alloy is covered with a film of a low melting point metal or alloy selected from the group consisting of In, Sn, combinations of In and Sn, and alloys thereof. The content of the foregoing low melting point metal or alloy ranges from 0.1 to 20% by mass on the basis of the total mass of the composite material. A material obtained by adding a low melting point metal in an amount specified above to, for instance, Al and then fusing and melting the resulting mixture is quenched and solidified within a non-oxidizing atmosphere to thus form an Al composite material. An Al film, an Al spray-coated film and Al powder can be prepared from the foregoing Al composite material. A component member for a film-forming chamber is also provided, which is provided with a water-collapsible Al film on the surface thereof. Film-forming operations are continued over a long period of time using the component member for a film-forming chamber provided with the water-collapsible Al film and then film-forming materials can be recovered from the component member on which the film-forming materials are deposited in a substantial thickness. | 08-11-2011 |
20110198040 | PEELING DEVICE - The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface of the reinforcing sheet facing the substrate side or a surface of the substrate facing the reinforcing sheet side, and in which the one main surface of the laminate is supported by the supporting unit, and at the same time, the position of each of the plurality of rods is controlled by the control device so that the other main surface of the laminate is subjected to bending deformation in sequence from one-end side thereof. | 08-18-2011 |
20120073763 | DEVICE FOR MAINTAINING STERILE INTEGRITY OF CONNECTED FLUID PATHWAYS - A device is provided for ensuring the sterile integrity of two separate fluid pathways during interconnection of the two pathways with a two-part connector assembly. The two-part connector assembly is of the type which comprises a male portion and a female portion, each portion initially having a port covered and protected by a peel-away strip. The device comprises a base assembly, a connector clamp assembly mounted to the base assembly and configured for securing the two-part connector assembly in position for interconnection of the male and female portions, and a strip withdrawal assembly mounted to the base assembly and configured for simultaneous withdrawal of the peel-away strips from the ports of the male and female portions. | 03-29-2012 |
20120125541 | Device Used For Easy Removal Of Labels From Containers - The invention described herein offers a simple, safe, elegant and effective method for the removal of labels from containers. Furthermore, for consumers who are interested in maximizing the effectiveness of their recycling effort, paper labels must be separated from metal cans before submitting for recycling. This device facilitates that removal in a safe and effective manner. | 05-24-2012 |
20130168027 | DEVICE FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE - Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate. | 07-04-2013 |
20130284380 | FEEDER - A feeder capable of transferring and separating an adhesive component on a tap, includes a frame, a separator, and a drive device. The frame has a top portion for supporting the tap. The separator is mounted to the frame to separate the adhesive component from the tap when the tap passes through the separator. The drive device drives the tap to pass through the separator. | 10-31-2013 |
20130292062 | SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING SYSTEM - According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit configured to hold one surface of the substrate and a second holding unit disposed to face the first holding unit and configured to hold one surface of the substrate. Further, the substrate includes a moving mechanism configured to relatively move at least one of the first holding unit and the second holding unit to approach each other and stay spaced apart from each other, and a transfer mechanism configured to hold the one surface of the substrate. In this case, a support of the substrate in the first holding unit, the second holding unit and the transfer mechanism is performed by a Bernoulli chuck. | 11-07-2013 |
20130319621 | TAPE FEEDER AND PARTS MOUNTING DEVICE - On a guide surface | 12-05-2013 |
20140069588 | DELAMINATION SYSTEM - A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station. | 03-13-2014 |
20140076500 | DELAMINATION DEVICE - Provided is a delamination device of delaminating a laminated substrate obtained by bonding a first substrate and a second substrate, the laminated substrate being disposed in an opening of a frame, the opening having a diameter larger than that of the laminated substrate, and the laminated substrate being held by the frame with a non-bonding surface of the first substrate attached to a tape provided in the opening. The delamination device includes: a first holding unit configured to hold the second substrate of the laminated substrate from above; a second holding unit configured to hold the first substrate of the laminated substrate from below through the tape; and a moving mechanism configured to move the first holding unit in a direction away from the second holding unit. | 03-20-2014 |
20140238618 | DIE EJECTOR AND DIE SEPARATION METHOD - A die ejector includes a supporting unit configured to support a bottom surface of a film on which a die may be attached. The supporting unit may have a hole formed at a center thereof. The die ejector may further include a ring-shaped elevating unit in the hole and configured to move along a vertical direction, a driving unit connected to the elevating unit and configured to move the elevating unit along the vertical direction, and a pressure controlling unit connected to the hole and configured to control a pressure of the hole. | 08-28-2014 |
20140367051 | DEVICE AND METHOD FOR REMOVING A PEELABLE SEAL - A container or array of containers that is are sealed with a peelable seal is transported via a conveyor along a processing path toward a desealing station at which an adhesive surface having a width substantially the same as or greater than the width of the seal is pressed against the upper surface of the peelable seal. A collection rod applies a downward pressure on the adhesive surface, pressing it against the seal and keeping the container or container array in position on the conveyor as the plate moves with the conveyor. As the leading edge of the seal passes the collection rod, the adhesive surface is rolled upward, away from the plane of the seal, pulling up on the leading edge of the seal to separate it from the container or container array while the container or container array is held down by the roller. The removed seal is then discarded. | 12-18-2014 |
20150136331 | PEELING SYSTEM - Disclosed is a peeling system which includes a peeling device, a plurality of first cleaning devices, an inversion device, a second cleaning device, and first to third conveyance devices. The peeling device is configured to separate a superimposed substrate into a first substrate and a second substrate. The plurality of first cleaning devices is configured to clean a bonded surface of the first substrate. The inversion device configured to invert front and rear surfaces of the first substrate. The second cleaning device is configured to clean a non-bonded surface of the first substrate. Delivery positions of the first substrate in the plurality of first cleaning devices are arranged in a region where an operation range of the first conveyance device and an operation range of the second conveyance device overlap each other. | 05-21-2015 |
20160192548 | FEEDER - A non-splicing feeder including: multiple sprockets in a conveyance direction that accurately supply components stored in carrier tape to a supply position; a main body; a first sprocket on which first engaging protrusions are formed which is rotatably provided at supply position of main body; a second sprocket on which second engaging protrusions are formed which is rotatably provided on main body at a position on the downstream side in the conveyance direction of carrier tape with respect to first sprocket; wherein a tooth thickness dimension of second engaging protrusion is set to be smaller than a tooth thickness dimension of first engaging protrusion. | 06-30-2016 |
20190148187 | DETAPING MACHINE AND DETAPING METHOD | 05-16-2019 |
156751000 | Delaminating means responsive to feed or shape at delamination | 4 |
20130276992 | FEEDER - A feeder capable of transferring and separating an adhesive component from a tap, includes a frame, a driven capstan device, a separating device, and a drive device. The driven capstan device is mounted to the frame. The separating device is mounted to the frame to separate the adhesive component from the tap. The drive device drives the tap to unwind from the driven capstan and transfer to the separating device to enable the separating device to separate the adhesive component. | 10-24-2013 |
20140060750 | PEELING APPARATUS - A peeling apparatus for peeling labels in rows from a tape-shaped release paper comprises a main body, a peeling mechanism, a driving mechanism and a sensing mechanism. The peeling mechanism locates the release paper and peels the labels in a row from the release paper when being rotating. The sensing mechanism located upon the peeling mechanism and parallel with the peeling mechanism. The labels in a row are orderly arranged from a first position to a second position on the release paper. The sensing mechanism comprises at least two detectors which are perpendicular to the peeling mechanism. When the peeled labels facing the sensing mechanism, either of the at least two detectors detects the peeled labels at the first position or the second position to generate a pause signal. The driving mechanism stops driving the peeling mechanism rotating in response to the pause signal. | 03-06-2014 |
20150344165 | AUTOMATIC LABEL STRIPPING MACHINE - An automatic label stripping machine includes a base, a reel shaft rod, a label stripping unit, a control unit and a sensing unit. Labels can easily be stripped for use and a label reel can conveniently be assembled, replaced and reclaimed by means of the control unit and the sensing unit. In addition, the members of the automatic label stripping machine of this invention can be replaced and repaired conveniently. | 12-03-2015 |
20160093518 | INITIATOR AND METHOD FOR DEBONDING WAFER SUPPORTING SYSTEM - Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer. | 03-31-2016 |
156752000 | Heating or cooling delaminating means (e.g., melting means, freezing means, etc.) | 12 |
20110139376 | METHOD AND APPARATUS FOR REMOVING IMAGE FROM RECORDING MATERIAL, AND IMAGE PEELING MEMBER FOR PEELING IMAGE FROM RECORDING MATERIAL - An image removing method including heating a recording material having thereon an image to a temperature so that the image has a plasticity; pressure-contacting an uppermost stream peeling member with the recording material while the image maintains a plasticity; separating the uppermost stream peeling member from the recording material to transfer at least a portion of the image to the uppermost stream peeling member; and repeating the heating, pressure-contacting and separating steps at least one more time using at least one downstream peeling member, wherein the uppermost stream peeling member has a first outermost layer which does not have a plasticity when being pressure-contacted with the recording material, and at least one of the at least one downstream peeling member has a second outermost layer which has a plasticity when being pressure-contacted with the recording material. | 06-16-2011 |
20110174445 | SEMI-AUTOMATED REWORKABILITY EQUIPMENT FOR DE-BONDING A DISPLAY - A device is disclosed for use with a method for reworking a bonded display (e.g., a LCD) having a substrate (e.g., plate or film) adhesively bonded to a face (e.g., front face) of the LCD. Use of the device provides for efficient and clean removal of the substrate from the display when necessary (e.g., when defect(s) are present) without damage to the display such that the display can subsequently be re-bonded as a component in a device being manufactured. | 07-21-2011 |
20120031566 | Removing and Segregating Components from Printed Circuit Boards - Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed. | 02-09-2012 |
20120080150 | FIXTURES AND METHODS FOR UNBONDING WAFERS BY SHEAR FORCE - Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed. | 04-05-2012 |
20140158306 | DEVICE FOR DETACHING A COVER FROM A BASE - A device for detaching a cover adhesively attached to a base is provided. The device includes a support plate for supporting the base, and a suction plate applying an overall and uniform attracting action to the cover by means of a vacuum. The device further includes a driving unit to pull the suction plate away from the base. The device further includes a heating element to heat and soften adhesive, thereby weakening the adhesive bond between the base and the cover and allowing the release of the cover from the base. | 06-12-2014 |
20140196854 | SEPARATING APPARATUS - A separating apparatus, including a base and a wire, is provided. The base is adapted for carrying an electronic device. The electronic device includes a first substrate, a second substrate, and an adhesive layer. The adhesive layer adheres the first substrate and the second substrate to each other. The wire is configured on the base. A wire diameter of the wire is equal to or greater than a thickness of the adhesive layer. | 07-17-2014 |
20140374032 | ELECTRICALLY DIVISIBLE POLYAMIDE ADHESIVE - A melt adhesive containing 20 to 90 wt % of at least one polyamide having a molecular weight (Mw) from 10,000 to 250,000 g/mol; 1 to 25 wt % of at least one organic or inorganic salt; 0 to 60 wt % of further additives, wherein the adhesive has a softening point from 100° C. to 220° C. Additionally described is a process for reversible adhesive bonding of substrates, wherein the adhesive bond is released under tension after application of an electrical voltage. | 12-25-2014 |
20150101759 | FILM PEELING APPARATUS - A film peeling apparatus that peels a film attached to a substrate includes a chamber, a transfer unit, and first peeling rollers. The transfer unit is disposed in the chamber to transfer the substrate. The first peeling rollers are disposed in the chamber, each of the first peeling rollers includes a first electrostatic chuck to adsorb a first film attached to the substrate. The first peeling rollers roll the adsorbed first film to peel the first film from the substrate. | 04-16-2015 |
20150367501 | Table For Weeding Heat Transfers - The present teachings provide for a weeding table including a table portion, a clamp device, and a heating mechanism. The table portion can include a table member and a work-surface. The clamp device can include a clamp and a cylinder. The clamp can include a base fixedly coupled to the table member and an arm coupled to the base. The arm can be movable relative to the base between a first position and a second position. The cylinder can be coupled to the arm to be translated thereby such that the cylinder is a greater distance from the work-surface when the arm is in the first position than when the arm is in the second position. The cylinder can be rotatable relative to the arm about a longitudinal axis of the cylinder. The heating mechanism can be coupled to the table member and can be configured to heat the work-surface. | 12-24-2015 |
20160167359 | DEBONDERS WITH A RECESS AND A HEATER FOR SEMICONDUCTOR FABRICATION | 06-16-2016 |
156753000 | Electromagnetic radiation delaminating means (e.g., microwave, UV, IR, etc.) | 2 |
20130327485 | DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION BETWEEN A CARRIER AND A WAFER - A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination. | 12-12-2013 |
20160163571 | APPARATUS FOR REMOVING A RING-SHAPED REINFORCEMENT EDGE FROM A GROUND SEMICONDUCTOR WAFER - An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support. | 06-09-2016 |
156754000 | Vibrating delaminating means | 1 |
20150075725 | DEVICE FOR STRIPPING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE - Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. | 03-19-2015 |
156755000 | Differential fluid pressure delaminating means | 12 |
20160167360 | DEBONDERS WITH A RECESS AND A SIDE WALL OPENING FOR SEMICONDUCTOR FABRICATION | 06-16-2016 |
156756000 | Spraying delaminating means (e.g., atomizer, etc. | 3 |
20110297329 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 12-08-2011 |
20110308738 | DIE BONDER, PICKUP METHOD, AND PICKUP DEVICE - An object of the present invention is to provide a pickup device that can securely peel a die or to provide a reliable die bonder or a pickup method using the pickup device. To achieve the object, the present invention is provided with a characteristic that when a die to be peeled out of plural dies (semiconductor chips) applied to a dicing film is thrust up and is peeled from the dicing film, the dicing film in a predetermined part in a circumference of the die is thrust up and a peeling starting point is formed, the dicing film in a part except the predetermined part is thrust up, and the die is peeled from the dicing film. | 12-22-2011 |
156757000 | Air blasting delaminating means) | 1 |
20150114573 | FILM-REMOVING MECHANISM - A film-removing mechanism configured to cooperate with a mechanical arm to remove a protecting film from a workpiece can include a base, a blowing member coupled to the base, and a holding assembly positioned adjacent to the blowing member. The base can be configured to support the workpiece. The blowing member defining an air outlet can be configured to communicate with an external air resource. The holding assembly can include a supporting member positioned adjacent to the base and a driving member coupled to the supporting member. The supporting member can correspond to the air outlet and the driving member can be configured to connect to the external mechanical arm. | 04-30-2015 |
156758000 | Vacuum delaminating means (e.g., vacuum chamber, etc.) | 8 |
20110192547 | CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP - During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape. | 08-11-2011 |
20110277941 | TAPE REMOVAL APPARATUS AND PROCESS - An apparatus and method is provided for removing a selected portion of tape material from backing paper. One embodiment of an apparatus may include a supply reel, at least one cutting member, at least one bending member, and first and second vacuum rollers. The apparatus may further include pinch rollers, scraping members, and scrap bins. The apparatus may allow for the removal of scrap tape material from the backing paper. | 11-17-2011 |
20120145332 | SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE - A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges. | 06-14-2012 |
20120312482 | METHOD AND APPARATUS FOR PEELING ELECTRONIC COMPONENT - A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member. | 12-13-2012 |
20130299098 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 11-14-2013 |
20140060751 | Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up Method - A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion. | 03-06-2014 |
20160005637 | DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS - Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed. | 01-07-2016 |
20160016397 | APPARATUS FOR STRIPPING FLEXIBLE DEVICE - A apparatus for stripping flexible device including: a chassis; a stage; a pick-up device mounted on the chassis through a pivot shaft parallel to a bearing surface, the pick-up device being movable with respect to the stage along a direction perpendicular to a rotation axis of the pivot shaft and parallel with the bearing surface of the stage, and having a surface facing the stage, and having a fixing mechanism configured to fasten a lateral side of the flexible device; an auxiliary device which is mounted on the chassis, an end part of the auxiliary device providing a force to the flexible substrate for its separation from the carrier plate at a separation position between the flexible substrate of the flexible device and the carrier plate when the flexible device is picked up from the carrier plate by the pick-up device; a first driving device mounted on the chassis. | 01-21-2016 |
156759000 | Delaminating roller means | 11 |
20120018099 | Tape Removal Apparatus and Process for Use with an Automated Composite Tape Laying Machine - Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller. | 01-26-2012 |
20140174670 | APPARATUS AND METHOD FOR REMOVING A CMP PAD FROM A PLATEN - A method and apparatus for removing a pad adhesively secured to a platen. The apparatus includes a barrel assembly having a clamp assembly fixedly attached to a perimeter of the barrel assembly; a rotatable handle assembly nested within the barrel assembly; and a ratchet assembly nested between the handle assemble and the barrel assembly the ratchet assembly configured to engage the rotatable handle assembly. | 06-26-2014 |
20140251549 | PEEL-OFF MODULE OF PRINTING DEVICE - A peel-off module of a printing device is provided for peeling off consumables from a consumable tape. The peel-off module is located on a cover of the printing device and comprises at least a main body, a peeling bar, and a peeling roller module. The main body has at least two guiding slots. The peeling bar is connected to the main body for peeling off the consumables from the consumable tape. The peeling roller module is movably assembled to the at least two guiding slots. When an user wants to use the printing device, the peeling roller module is pushed along the at least two guiding slots to a first stop point of the at least two guiding slots and then is pressed down to a second stop point on one of the at least two guiding slots to have the peeling roller module steadily clamping the consumable tape. | 09-11-2014 |
20150367622 | PEELING APPARATUS - A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle. | 12-24-2015 |
20160118286 | APPARATUS OF SEPARATING FLEXIBLE SUBSTRATE FROM GLASS SUBSTRATE AND MANUFACTURING EQUIPMENT THEREOF - An apparatus of separating a flexible substrate from a glass substrate comprises a cylinder-shaped roller; and a control unit connected to the roller configured to control a rotation of the roller so as to separate a flexible substrate from a glass substrate by the rotation of the roller; the roller has a cylinder surface provided with a depressed area thereon, and the depressed area is configured to allow a driver IC on the flexible substrate to be received by the depressed area during the rotation of the roller, thereby preventing the driver IC from being damaged. | 04-28-2016 |
20160159068 | FILM STRIPPING APPARATUS - A film stripping apparatus is provided, belongs to a material film-stripping technical field and can solve the problem that the current film stripping technologies are easy to lead to waste contamination, high cost and limited applicability. The film stripping apparatus includes: at least one film stripping roller of adhesiveness; a feeding mechanism for loading a material from which a film is to be stripped into a feeding side of the film stripping roller; and a driving mechanism for driving the film stripping roller to rotate. The film stripping apparatus is used for stripping off film layers, such as single-sided or double-sided protective films, release films or the like on materials of any raw material, size, thickness and shape, and the film stripping apparatus can be used for optical film materials, printing plates, display panels etc, and is suitable for ultra-thin materials, high precision printing plates and the like precision materials. | 06-09-2016 |
156760000 | Roller pair delaminating means | 5 |
20130056157 | DEVICE FOR REMOVING A PROTECTIVE FILM OFF A SHET - A device for removing a protective film off a sheet such as tickets or the like is described. The device has at least one removal or scraping roll of the protective film and at least one drawing or pulling roll of the sheet opposite the scraping roll and between which the sheet passes. The device also has a base and a roll unit mobile or removable with respect to the base and including the scraping roll and the drawing roll. | 03-07-2013 |
20140048214 | Sole Cover Dispenser Device - The present invention describes a dispenser of protective covers for the sole of a shoe. The sole covers are disposed on a sheet that is placed within the dispenser. The dispenser comprises a series of roller supports that are adapted to position the sheet of solve covers onto an exposed platform. A user steps the exposed platform in order to apply the cover to the user's footwear and remove the sole cover from the sheet. The top of the sole cover includes an adhesive that enables the cover to adhere to the sole of the user's shoe, thereby enabling a user to walk around the house while reducing the likelihood that the user would spread dirt therein. | 02-20-2014 |
20140076501 | FILM PEELING DEVICE - A film peeling device for peeling a film from a substrate including a transfer module configured to transfer the substrate that is arranged in a vertical direction with respect to a bottom surface of the substrate, and a peeling module configured to peel the film from the substrate transferred by the transfer module. | 03-20-2014 |
20150068684 | ROLL-TO-ROLL TRANSFER METHOD OF GRAPHENE, GRAPHENE ROLL PRODUCED BY THE METHOD, AND ROLL-TO-ROLL TRANSFER EQUIPMENT FOR GRAPHENE - The present disclosure relates to a graphene roll-to-roll transfer method, a graphene roll-to-roll transfer apparatus, a graphene roll manufactured by the graphene roll-to-roll transfer method, and uses thereof. | 03-12-2015 |
20180022077 | PEELING APPARATUS | 01-25-2018 |
156761000 | Severing delaminating means (e.g., chisel, etc.) | 6 |
20110253316 | DOUBLE TREAD - Embodiments of the invention are used to provide ways of tire tread molding and retreading with a double tread rubber body having a unitary structure that comprises two treads in order to remove the need for buffing an oxide layer typically associated with tread molding and curing. Embodiments of the double tread molding and retreading methods also remove the need for cementing the cured tread to prevent future oxidation buildup. Once the double tread is cured and cooled, it is cut along the centerline with a double tread separation apparatus to expose a soft non-oxidized inner rubber. The cutting is much less energy intensive when compared to buffing with an expendable wire brush. There is no risk of spots of oxidized rubber being missed as is the case with buffing. There is little or no dust created. | 10-20-2011 |
20130105091 | PAPER STRIPPING MEMBER AND IMAGE FORMING APPARATUS | 05-02-2013 |
20140130987 | FILM STRIPPING MECHANISM - A film stripping mechanism, comprising: a base; a platform disposed on the base and having a substrate to be stripped of film placed thereon; a blade disposed above an upper surface of the platform and capable of contacting the substrate to be stripped of film placed on the platform, the platform and the blade being movable relative to each other so as to strip off a film on the substrate to be stripped of film; an automatic alcohol-spraying module contacting the blade for spraying outwards alcohol and allowing the alcohol to flow toward the substrate to be stripped of film along the blade. The film stripping mechanism can improve the yield rate of film stripping and the stripping efficiency, and reduce breakage rate of the substrates. | 05-15-2014 |
20140196855 | SEPARATING APPARATUS - A separating apparatus for separating a composite substrate into a first substrate and a second substrate previously bonded to each other. The separating apparatus includes a support base having a supporting surface for supporting the composite substrate, a pair of side surface supporting rollers for supporting the peripheral side surface of the composite substrate placed on the supporting surface, and a separating unit for applying a separating force to the boundary between the first substrate and the second substrate constituting the composite substrate supported to the supporting surface of the support base and the side surface supporting rollers, thereby separating the composite substrate into the first substrate and the second substrate. | 07-17-2014 |
156762000 | Cutting delaminating means | 2 |
20120318464 | METHOD AND APPARATUS FOR REMOVING A FILM FROM A SURFACE - A tool and method for removing a film from a surface is provided, wherein the tool can include a frame, a handle operably coupled to the frame, a number of wheels operably coupled to the frame, a cylinder rotatably coupled to the frame, an arm rotatably coupled to the frame, and a number of separating devices operably coupled to the arm. In some embodiments, the wheels can rotate about one or more axes parallel to the surface. The cylinder, which collects the removed film, rotates about an axis that can also be parallel to the surface. The arm can rotate about an axis that can also be parallel to the surface. | 12-20-2012 |
20140096914 | Cartridge and tubular container triming and refinishing apparatus for lnk and label removal and method of use - A device for removing a thin outer layer from the surface of a cartridge or tubular container such as a caulk cartridge for removal of ink, contaminant, adhesive, or printed or stamped label from the outside of the cartridge. The apparatus includes cartridge hopper and a cartridge handling mandrel or plunger which automatically removes a cartridge from the hopper aligning same for insertion of the cartridge axially through the throat of a spinning ring which contains at least one and preferably a plurality of inwardly extending knifes. The spinning knife distal end trims or peels off the label, adhesive, ink, imperfections, or even a thin film from an outer layer of a selected thickness effectively reconditioning the cartridge for reuse to be filled with virgin material or to be used as uncontaminated re-ground material to be sold as scrap. | 04-10-2014 |
156764000 | Delaminating bending means | 6 |
20110214820 | Label separator and label printer incorporating the label separator - A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut. | 09-08-2011 |
20140158307 | SYSTEM AND METHOD FOR IMPROVED EPITAXIAL LIFT OFF - An apparatus, system and method for performing ELO are disclosed. Device assemblies are contemporaneously etched in a stacked arrangement. Each device assembly may be placed in a respective tray, where the trays are overlapped and spaced apart from one another. In this manner, more device assemblies can be etched per unit area compared to conventional systems. Further, by stacking device assemblies during etching, the yield can be improved and/or the cost of the etch tank and associated hardware can be reduced. | 06-12-2014 |
156765000 | Poking delaminating means | 3 |
20110220296 | METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE - A method of peeling a protective tape, includes the steps of mounting a wafer on a stage, the wafer having the protective tape adhered thereto so that the protective tape overlaps only a portion of a notch of the wafer, attaching a peeling adhesive tape to the protective tape, projecting a lift pin from the stage so that the portion of the protective tape which overlaps the notch is raised by a top surface of the lift pin, and with the protective tape raised by the lift pin, pulling the peeling adhesive tape so as to peel the protective tape from the wafer. The top surface of the lift pin has a shape that allows the top surface to raise the portion of the protective tape which overlaps the notch. | 09-15-2011 |
20150083344 | Separation Device and Pickup System - A separation device includes a mount table, projecting portion, and drawing port. The mount table includes a mount surface on which a pressure sensitive adhesive sheet, on which an electronic component is stuck, is mounted. The electronic component is stuck on one surface of the pressure sensitive adhesive sheet, and the mount surface is in contact with the other surface of the pressure sensitive adhesive sheet. The projecting portion is formed on the mount surface and projects toward the pressure sensitive adhesive sheet mounted on the mount surface. The drawing port is open near the projecting portion on the mount surface, and when a negative pressure is applied, draws the pressure sensitive adhesive sheet. | 03-26-2015 |
20160020124 | BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE - A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate. | 01-21-2016 |
156766000 | Corner edge bending delaminating means | 1 |
20110308739 | METHOD AND APPARATUS FOR REMOVING A REVERSIBLY MOUNTED DEVICE WAFER FROM A CARRIER SUBSTRATE - New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided. | 12-22-2011 |
156767000 | Means for delaminating from release surface | 7 |
20120285628 | ELECTRONIC-CIRCUIT-COMPONENT SUPPLYING DEVICE - A plurality of tape feeders are held by a feeder holding device in a state in which component supply portions of the respective tape feeders are arranged in a plurality of rows each extending along a plurality of straight lines parallel to each other in one plane. Each of the plurality of tape feeders is separable into first portions and second portions, the first portions include: a reel holding portion configured to hold a reel on which a taped component is wound; the component supply portion; a taped-component guide portion configured to guide, to the component supply portion, the taped component drawn from the reel, the second portions respectively including taped-component feeding devices each for feeding the taped component to the component supply portion. | 11-15-2012 |
20140041809 | Plug Plate Dispensing Assemblies - In one embodiment, a plug plate dispensing assembly can include a first riser, a second riser, an apex cross member, a lower cross member, a central cross member, and a drive roller. The apex cross member, the lower cross member, and the central cross member can be coupled to the first riser and the second riser, and can extend from the first riser to the second riser. When the sheet stock is fed between the lower cross member and the apex cross member, over the apex cross member, and between the apex cross member and the central cross member, and when the sheet stock is frictionally engaged with the drive roller, rotation of the drive roller can cause one or more of the plurality of plug plates to at least partially detach from the sheet stock as the sheet stock passes over the apex cross member. | 02-13-2014 |
20140060752 | PEELING APPARATUS - A peeling apparatus for peeling labels from a tape-shaped release paper comprises a main body, a peeling mechanism and a driving mechanism. The release paper comprises a free end without labels. The label comprises an information surface and an adhesive surface opposite to the information surface. The peeling mechanism comprises a first roller, a second roller above the first roller, and a peeling member. The main body comprises a first cantilever. The first roller sleeved on the first cantilever fixes the release paper. The second roller fixes the free end. When being rotating by the driving mechanism, the release paper moves along a first direction and turns to move along a second direction after passing the peeling mechanism. The first direction forms an angle with the second direction. Each of the labels is partly peeled from the release paper by the peeling member and the adhesive surface is upward. | 03-06-2014 |
20140174671 | APPARATUS FOR STRIPPING RELEASE PAPER FROM WORKPIECE - An apparatus configured for stripping a release paper from a workpiece, including a base defining a through hole, a pushing mechanism mounted on the base adjacent to the through hole; and a stripping mechanism mounted on the base. The stripping mechanism includes a bracket mounted on the base, a driving member mounted on the base away from the pushing mechanism and abutting the through hole, a pushing member connected to the driving member towards the through hole, and an suction assembly including an suction driving member fixedly-connected to the bracket and an suction member connected to the suction driving member. The driving member enables the pushing member to extend into the through hole for clamping the release paper between the pushing member and the pushing mechanism, and the suction member is capacity of sucking and moving the workpiece. | 06-26-2014 |
20150047788 | AUTOMATIC TAPE SETTING APPARATUS - A component package tape is transported to a pitch feed mechanism section by a tape transport device and is held in a first tape holding section by a tape holding releasing device. Furthermore, a top tape adhered to a carrier tape that is transported to the pitch feed mechanism section is peeled from the carrier tape by a top tape peeling section while being clamped at a leading end section, is transferred to a top tape delivery mechanism section, and is held in a second tape holding section by the tape holding releasing device. | 02-19-2015 |
20150129139 | UNLOADING MECHANISM - A unloading mechanism for removing workpieces from a transporting film can include a loading assembly and a unloading assembly coupled to the loading assembly. The loading assembly can include a base, a first driving member and an absorbent member. The base can include a base body, a first guiding member slidably extending through the base body, and a plurality of pushing members coupled to the base body. The first driving member can be coupled to the base body. The absorbent member can be coupled to the first guiding member. The absorbent member can define a plurality of receiving holes, and the pushing members can be received in the receiving holes. The unloading assembly can include a second driving member coupled to the first driving member, and a stopping member coupled to the second driving member adjacent to the absorbent member. | 05-14-2015 |
20150136332 | DEVICE FOR FEEDING SELF-ADHESIVE OR "PRESSURE SENSITIVE" LABELS TO A LABELLING MACHINE | 05-21-2015 |