Class / Patent application number | Description | Number of patent applications / Date published |
156711000 | Temperature change for delamination (e.g., heating during delaminating, etc.) | 48 |
20110146917 | METHOD AND APPARATUS OF DISMANTLING PLASMA DISPLAY DEVICE - A method of dismantling a plasma display device including a plasma display panel unit produced by bonding a plasma display panel to a support member through a bonding member, where the bonding member of the plasma display device unit is heated when the plasma display panel is peeled off from the support member, in a state in which either one of the plasma display panel and the support member is fixed and the other is undergoing an urging force in a direction such that the plasma display panel is peeled off from the support member. | 06-23-2011 |
20120138238 | METHOD FOR DETACHING A SILICON THIN FILM BY MEANS OF SPLITTING, USING TRIPLE IMPLANTATION - In order to detach a silicon thin film from a starting substrate by splitting, a step of implanting species within the starting substrate ( | 06-07-2012 |
20120285627 | Elastomer Bonded Item and Method for Debonding - An item, such as a sputtering target assembly or an electrostatic chuck, comprised of a first substrate; a metallization layer adhered to a surface of the first substrate; a second substrate; and an elastomer layer positioned between the metallization layer and the second substrate. In another embodiment, a debonding layer, such as a solder material, is positioned between the elastomer layer and the second substrate for allowing the item to be disassembled after use by heating the item up to the approximate melting point of the debonding layer. | 11-15-2012 |
20130020031 | METHOD AND APPARATUS FOR DETACHING PLATES JOINED TO EACH OTHER - A workpiece composed of a glass plate and a display panel joined to each other via an adhesive sheet is suction-held on both surfaces thereof by a pair of upper and lower holding members. The glass plate is detached from the display panel through swinging downward one end of the lower holding member around a support shaft provided on the other end side thereof with an entire surface of the glass plate being held in a planar state with a suction surface of the lower holding member. | 01-24-2013 |
20130081764 | HEAT-EXPANDABLE REMOVABLE PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET, AND METHOD OF REMOVING THE SAME - The heat-expandable removable pressure-sensitive adhesive tape of the present invention includes at least a blowing agent-containing pressure-sensitive adhesive layer A, a microparticle-containing viscoelastic substrate B, a peelable or peel-assisting film layer C, and a pressure-sensitive adhesive layer D. A multilayer structure containing at least the peelable or peel-assisting film layer C and the pressure-sensitive adhesive layer D is arranged on at least one side of the blowing agent-containing pressure-sensitive adhesive layer A where the blowing agent-containing pressure-sensitive adhesive layer A is in direct contact with the peelable or peel-assisting film layer C. The peelable or peel-assisting film layer C can be removed from the blowing agent-containing pressure-sensitive adhesive layer A by heat treatment after storage in an atmosphere of 75° C. for 8 weeks. | 04-04-2013 |
20130118692 | METHOD OF DETACHING PLATES - Disclosed is a method for detaching two plates bonded through a double-coated pressure-sensitive adhesive sheet without substantially applying such a force (load) to the plates as to cause large distortion (deformation) leading to fracture or breakage of the plates. The method detaches two plates bonded through a double-coated pressure-sensitive adhesive sheet by applying a force to at least one of the two plates at least in a direction normal to the plate at such a temperature that the double-coated pressure-sensitive adhesive sheet has a storage elastic modulus of 1.0×10 | 05-16-2013 |
20130174985 | PEELING PROCESS OF SUBSTRATE - A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and then illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. After that, the second substrate is peeled off from the first substrate. | 07-11-2013 |
20130233494 | COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD - A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components. | 09-12-2013 |
20130248119 | APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER - A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier. | 09-26-2013 |
20130255888 | System and Method for Removing the Outer Layer of a Layered Article - A system and method for refurbishing or recycling a layered article such as a golf ball is disclosed that includes removing a cover from the article. The system can include a golf ball guide, a golf ball scorer-driver that can score the outer shell of the golf ball while simultaneously advancing it along the golf ball guide, a cover peeler having an orifice with an inner diameter that is less than an outer diameter of the golf ball cover, and a press that can drive the golf ball core through the cover peeler orifice. The method includes inducing at least one weakened region in the outer shell of the golf ball, rupturing the weakened region to create at least one opening in the golf ball outer shell, and forcing a core portion of the golf ball through the opening in the golf ball outer shell. | 10-03-2013 |
20130269879 | PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD - A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate. | 10-17-2013 |
20130319619 | METHOD AND DEVICE FOR PEELING OFF SILICON WAFERS - A device for peeling off silicon wafers, including: a supporting member that is configured to support a board-shaped member to which plural silicon wafers are bonded via an adhesive; a heating unit for heating the board-shaped member; a shifting mechanism that is configured to shift, in a horizontal direction, the supporting member relatively with respect to the heating unit; a peeling-off mechanism that is configured to peel off the silicon wafers one by one; and a container for allowing the silicon wafers, the board-shaped member and the supporting member to soak in a liquid. | 12-05-2013 |
20130327484 | SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM - A method includes: a first step of disposing the superposed substrate at a position where the superposed substrate is not in contact with a first holding unit and a second holding unit in a space between the first holding unit and the second holding unit, and supplying an inert gas into the space; a second step of thereafter relatively moving the first holding unit and the second holding unit in the vertical direction, and holding the processing target substrate by the first holding unit and holding the supporting substrate by the second holding unit; and a third step of thereafter relatively moving the first holding unit and the second holding unit in the horizontal direction while heating the processing target substrate held by the first holding unit and the supporting substrate held by the second holding unit, to separate the processing target substrate and the supporting substrate from each other. | 12-12-2013 |
20140020846 | SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD - A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate. | 01-23-2014 |
20140284000 | SEPARATION APPARATUS, SEPARATION SYSTEM, SEPARATION METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM - A separation apparatus for separating a superposed substrate into a processing target substrate and a supporting substrate, includes: one holding part holding the processing target substrate via a tape; another holding part holding the supporting substrate; and a moving mechanism moving the another holding part in a vertical direction while holding an outer peripheral portion thereof to continuously separate the supporting substrate held by the another holding part from the processing target substrate held by the one holding part starting from an outer peripheral portion toward a central portion of the supporting substrate, wherein the moving mechanism includes: a first moving part holding the another holding part and moving only the outer peripheral portion of the another holding part in the vertical direction; and a second moving part moving the first moving part and the another holding part in the vertical direction. | 09-25-2014 |
20140311680 | LAMINATED BODY AND METHOD FOR SEPARATING LAMINATED BODY - A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member. | 10-23-2014 |
20150020979 | PEELING APPARATUS AND PEELING METHOD - A peeling apparatus for peeling a device substrate from a stacked workpiece obtained by attaching the device substrate through a thermoplastic adhesive to a support substrate. The peeling apparatus includes a first surface plate having a first holding surface for holding the entire surface of the support substrate under suction and a first heating member for heating the first holding surface, a second surface plate having a second holding surface for holding the entire surface of the device substrate under suction and a second heating member for heating the second holding surface, and a moving unit for relatively moving the first surface plate and the second surface plate so that the first holding surface and the second holding surface are relatively moved away from each other in a direction perpendicular to the first holding surface and the second holding surface. | 01-22-2015 |
20150083341 | HEAT DETACHABLE ADHESIVE CONSTRUCTIONS, ARTICLES MADE THEREFROM AND METHOD OF USE THEREOF - An adhesive article includes a first substrate, a first adhesive layer positioned adjacent the first substrate, a second substrate, and a first meltable layer positioned adjacent to the first adhesive layer and the second substrate. The meltable layer has a ring and ball (R&B) softening point of between about 60° C. and about 180° C. | 03-26-2015 |
20150083342 | METHOD FOR THERMAL-SLIDE DEBONDING OF TEMPORARY BONDED SEMICONDUCTOR WAFERS - A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly. | 03-26-2015 |
20150090406 | METHOD FOR DISASSEMBLING PHOTOVOLTAIC MODULE - Provided is a method of disassembling a photovoltaic module. The method includes: applying heat to the photovoltaic module in an oxidizing atmosphere; removing an insulating protective layer wrapping a photovoltaic cell of the photovoltaic module; and obtaining the photovoltaic cell of the photovoltaic module. | 04-02-2015 |
20150346452 | METHODS OF REMOVING COATING MATERIAL FROM OPTICAL FIBERS - A method of removing a tight buffer coating from an optical fiber involves positioning an end section of the optical fiber next to an end of a tube, with at least a portion of the the end section including a primary coating and the tight buffer coating. The tube has an inner diameter greater than an outer diameter of the primary coating and an outer diameter less than an outer diameter of the tight buffer coating. The method also involves applying energy to heat the tight buffer coating, inserting the end section of the optical fiber into the tube so that the tight buffer coating contacts the end of the tube, and advancing the end section of the optical fiber along the tube. The tube removes the tight buffer coating from the primary coating as the end section of the optical fiber is advanced. | 12-03-2015 |
20160046846 | RE-WORKABLE MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITION, METHODS OF USING THE SAME, AND ARTICLES INCLUDING THE SAME - Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes. | 02-18-2016 |
20160053140 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE AND METHOD FOR PEELING PLATES - A double-sided pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer containing an acrylic polymer formed of a component comprising, as an essential monomer component, an alkyl (meth)acrylate having an alkyl group having 9 or less carbon atoms. A shear storage elastic modulus at 23° C. of the pressure-sensitive adhesive layer, which is measured by dynamic viscoelasticity measurement, is 5.0×10 | 02-25-2016 |
20190143497 | CUFF-BLADE ATTACHMENT BUSHING REMOVAL | 05-16-2019 |
156712000 | Electromagnetic radiation applied to work for delamination (e.g., microwave, UV, IR, etc.) | 24 |
20110132549 | LASER LIFT OFF SYSTEMS AND METHODS - Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece. Consistent with at least one embodiment, a laser lift off system and method may be used to provide monolithic lift off of one or more epitaxial layers on a substrate of a semiconductor wafer. | 06-09-2011 |
20110139375 | METHOD AND APPARATUS FOR SEPARATING ADHESIVE TAPE - An adhesive tape joined to a wafer is irradiated with ultraviolet rays via diodes. Simultaneously, a heater heats the adhesive tape to a preset temperature. Consequently, an ultraviolet reaction with the diodes and an infrared reaction with the heater may ensure promotion of a polymerization reaction, which results in cure of an adhesive that is not curable with only ultraviolet rays. As a result, an adhesive force of the adhesion tape may sufficiently be reduced. After ultraviolet irradiation via the diodes and heating with the heater, a separation mechanism separates the adhesive tape from the wafer. Therefore, accurate separation may be realized of the adhesive tape joined to the wafer. | 06-16-2011 |
20120118511 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure. | 05-17-2012 |
20120145331 | METHODS FOR LASER CUTTING ARTICLES FROM ION EXCHANGED GLASS SUBSTRATES - A method of cutting an article ( | 06-14-2012 |
20120318463 | SEPARATION OF LAMINATED SHEETS - There is disclosed a method of separating laminated sheets comprising first and second sheets which are bonded by an adhesive interlayer, the method comprising heating the interlayer to soften it and causing the first and second sheets to be forced apart when the interlayer is softened. | 12-20-2012 |
20130014905 | FILM PEELING APPARATUS AND FILM PEELING METHODAANM NAKAZAWA; YoshiyukiAACI Kyoto-shiAACO JPAAGP NAKAZAWA; Yoshiyuki Kyoto-shi JPAANM MASUHARA; HirofumiAACI Kyoto-shiAACO JPAAGP MASUHARA; Hirofumi Kyoto-shi JPAANM ANDO; KojiAACI Kyoto-shiAACO JPAAGP ANDO; Koji Kyoto-shi JP - An ultrashort pulsed laser beam, the fluence of which on an interface BF is set to be larger than a substrate processing threshold and smaller than a film processing threshold, is irradiated to the interface BF via a thin film F. Thus, in a laser irradiated portion of the interface BF, the substrate W is selectively processed, bonding between the substrate and the thin film F is reduced and the thin film F is peeled. | 01-17-2013 |
20130092326 | METHOD FOR SEPARATING BONDED BODIES USING EXCIMER LIGHT IRRADIATION - Disclosed is a method for separating a bonded body, whereby the bonded body can be separated easily. Specifically disclosed is a method for separating bonded bodies that includes a step that irradiates excimer light with a central wavelength of 1 to 300 nm on to a bonded body that has been formed by using an adhesive composition to bond substrates together, which includes and is formed by one type or two or more types of meth (acrylate) that have one or more (meth)acryloyl groups, and by hardening of said adhesive composition. At least one of the substrates is permeable to the excimer light. | 04-18-2013 |
20130174986 | METHOD FOR DISASSEMBLING BONDED BODY, AND ADHESIVE - Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm | 07-11-2013 |
20130180665 | METHODS FOR LASER CUTTING ARTICLES FROM ION EXCHANGED GLASS SUBSTRATES - A method of cutting an article ( | 07-18-2013 |
20130199732 | METHOD OF STRIPPING MULTIPLE PLIES OF A PRESSURE-SENSITIVE ADHESIVE LAYER, AND A PRESSURE-SENSITIVE ADHESIVE LAYER USED THEREIN - The present invention provides a method of stripping multiple plies of a pressure-sensitive adhesive layer, capable of easily separating and dismantling the joint portion in a short time, without affecting the adherend involved. The stripping method of the present invention strips the multiple plies of a pressure-sensitive adhesive layer, including a pressure-sensitive adhesive body having at least a pressure-sensitive adhesive layer containing heat-expandable fine particles and an adherend, the pressure-sensitive adhesive body and the adherend being laminated on each other, and the multiple plies of a pressure-sensitive adhesive layer contain a coloring matter component, and the pressure-sensitive adhesive body and the adherend are stripped from each other, by irradiating the coloring matter with a laser light beam having a wavelength coinciding with the absorption wavelength of the coloring matter and by expanding the heat-expandable fine particles with the aid of the heat thus generated. | 08-08-2013 |
20130213582 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer. | 08-22-2013 |
20130220554 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member. | 08-29-2013 |
20130276991 | METHOD FOR DISCONNECTING, BY INDUCTION, A MAGNETIC MECHANICAL PART ADHERED TO A MECHANICAL PART - A method for disconnecting a first mechanical part from a second magnetic mechanical part, the first mechanical part being adhered to the second magnetic mechanical part by an adhesive film along a connecting area. In the method, a magnetic field is generated at least within the connecting area so as to generate, by induction, eddy currents in the second magnetic mechanical part, to soften the adhesive film and enable disconnection of the first and second mechanical parts. | 10-24-2013 |
20130299097 | COATED THERMOPLASTIC ARTICLES WITH REMOVABLE COATING - The present disclosure generally describes techniques suitable for use in the construction or recycling of composite materials, such as thermoplastics. A coated thermoplastic article may comprise a thermoplastic portion coupled to a supramolecular polymer interface layer, with a coating layer applied to a surface of the supramolecular polymer interface layer. Application of heat to the coated thermoplastic article may cause the supramolecular polymer interface layer to undergo a phase change, allowing the coating layer to be removed from the thermoplastic portion. Application of force to the coated thermoplastic article may enhance the removal of the coating layer. Embodiments of methods, compositions, articles and/or systems may be disclosed and claimed. | 11-14-2013 |
20140102643 | LASER LIFT OFF SYSTEMS AND METHODS THAT OVERLAP IRRADIATION ZONES TO PROVIDE MULTIPLE PULSES OF LASER IRRADIATION PER LOCATION AT AN INTERFACE BETWEEN LAYERS TO BE SEPARATED - Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material. | 04-17-2014 |
20140138032 | CARRIER SUBSTRATE REMOVING APPARATUS, DISPLAY APPARATUS MANUFACTURING SYSTEM, AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS - A carrier substrate removing apparatus configured to separate a flexible substrate bonded to a carrier substrate includes a carrier substrate holding unit configured to hold the carrier substrate separated from the flexible substrate; an inclined separation unit configured, with the carrier substrate holding unit, to separate the flexible substrate from the carrier substrate and to transport the flexible substrate at an angle; and a transmittance measuring unit configured to measure a transmittance of the separated carrier substrate. | 05-22-2014 |
20140144593 | WAFER DEBONDING USING LONG-WAVELENGTH INFRARED RADIATION ABLATION - Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers that absorb long-wavelength infrared radiation to achieve wafer debonding by infrared radiation ablation. | 05-29-2014 |
20140326416 | METHOD FOR SEPARATING A LAYER FROM A COMPOSITE STRUCTURE - The disclosure relates to a method for separating a layer from a composite structure, the structure comprising a composite stack formed from at least a support substrate, which is partially transparent at a determined wavelength, the layer to be separated and a separation layer interposed between the support substrate and the layer to be separated, the method comprising irradiation of the separation layer through the support substrate by means of incident light ray at the determined wavelength in order to induce weakening or separation by exfoliation of the separation layer, the light ray being inclined so as to form an angle of incidence Θ such that θ>θ | 11-06-2014 |
20150083343 | SUPPORTING MEMBER SEPARATION METHOD AND SUPPORTING MEMBER SEPARATION APPARATUS - A supporting member separation method of separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a support plate in this order, the method including an irradiation step in which irradiation of laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater is performed to the release layer. | 03-26-2015 |
20150299534 | ADHESIVE COMPOSITION, LAMINATE, AND STRIPPING METHOD - An adhesive composition for temporarily attaching a substrate to a support plate which supports the substrate, and includes a thermoplastic resin and a release agent. | 10-22-2015 |
20160013613 | LIFT-OFF METHOD | 01-14-2016 |
20160052252 | PEELING PROCESS OF SUBSTRATE - A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. Thereafter, the second substrate is peeled off from the first substrate. | 02-25-2016 |
20160133497 | MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION - The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer. | 05-12-2016 |
20180022079 | METHOD AND DEVICE FOR DETACHING A SUBSTRATE FROM A SUBSTRATE STACK | 01-25-2018 |