Class / Patent application number | Description | Number of patent applications / Date published |
324755070 | Cantilever | 18 |
20100277193 | PROBE - A probe of the present invention includes a beam portion cantilevered by a holding portion, and a contact extending perpendicularly to and downward from a free end of the beam portion. An inner cut portion is formed on a fixed end side of the beam portion in a side portion of the contact, and an outer cut portion is formed on a free end side of the beam portion in a side portion of the contact, so that the outer cut portion and the inner cut portion are formed to bend the contact when the contact contacts an electrode of an object to be inspected at a predetermined contact pressure. According to the present invention, in inspection of electrical characteristics of the object to be inspected, suitable contact between the probe and the object to be inspected may be maintained and the durability of the probe may be improved. | 11-04-2010 |
20100283494 | PROBE TILE FOR PROBING SEMICONDUCTOR WAFER - A tile used to hold one or more probes for testing a semiconductor wafer is disclosed. The tile has one or more sites for inserting one or more probes to test the semiconductor wafer. Each site has one or more holes. Each hole is coupled with a slot forming an angle. A probe is inserted into the tile from a top of the tile through the hole and seated on the slot. The probe has a probe tip. The probe top is in contact with the semiconductor wafer at one end of the slot at a bottom of the tile. The probe tip is aligned with an X and Y coordinate of a bond pad on the semiconductor wafer. | 11-11-2010 |
20110187397 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-04-2011 |
20110187398 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 08-04-2011 |
20110285417 | PROBE - Provided is a probe which secures large overdrive and makes strict control of a scrubbing amount. A probe includes a first deforming portion which includes a linkage mechanism formed by a vertically extending vertical probe and a plurality of horizontal beams which extend in a direction perpendicular to the vertical direction, one ends of the horizontal beams being connected to a fixed end and the other ends being connected to the vertical probe, wherein: a vertically extended portion of the vertical probe extending from the horizontal beams forms a second deforming portion which includes a horizontal beam portion extending toward the fixed end from a substantial center of the vertical length of the vertically extended portion; and scrubbing of the vertical probe in the whole operating range of the overdrive can be strictly controlled by causing bending moment to act on the second deforming portion, mainly on the horizontal beam portion, simultaneously with the overdrive applying in a direction in which bending moment applied to the vertical probe of the first deforming portion is offset. | 11-24-2011 |
20120032697 | PROBE FOR TESTING SEMICONDUCTOR DEVICES - A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle between −90 degrees and 90 degrees, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe. One or more additional angular elements may be added to change the energy absorption characteristics of the probe. And, the moment of inertia for the torsion and/or bending elements can by manipulated to achieve the desired probe characteristics. Other features include a various union angle interface edge shapes, pivot cutouts and buffers. | 02-09-2012 |
20120062260 | Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes - Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like. | 03-15-2012 |
20120194211 | OPTICAL DEVICE INSPECTING APPARATUS - To provide an optical device inspecting apparatus which can be set to take many objects at one time more freely compared with conventional apparatuses, and can accurately inspect even an optical device wherein an optical sensor is offset from a microlens. Provided is an optical device inspecting apparatus having a probe card unit and a lens unit. The probe card unit is provided with a main substrate, a guide plate and a probe. The guide plate is provided with a plurality of probe inserting holes. The probe is inserted into the probe inserting hole on the guide plate and fixed. The leading end portion of the probe protruding from the inserting hole has a shape of a cantilever. The lens unit is arranged at the opening on the main substrate, and makes light applied to an inspecting object incline as the light goes further from the optical system. | 08-02-2012 |
20120299612 | ELASTIC MICRO HIGH FREQUENCY PROBE - An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced. | 11-29-2012 |
20120313660 | PROBES WITH OFFSET ARM AND SUSPENSION STRUCTURE - A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration. | 12-13-2012 |
20130082729 | Probe With Cantilevered Beam Having Solid And Hollow Sections - An electrically conductive probe can comprise a post to which a beam structure is attached. The beam structure can comprise a cantilevered portion that extends away from the post to a free end to which a contact structure can be attached. The cantilevered portion of the beam can include both a solid section and a hollow section. Multiple such probes can be used in a test contactor to make electrical connections with an electronic device such as a semiconductor die or dies to be tested. | 04-04-2013 |
20130141131 | SUSPENDED IO TRACE DESIGN FOR SSP CANTILEVER DATA READ / WRITE - A suspended IO trace design for SSP cantilever Read/Write is described. Instead of having the whole I/O trace attached to surface of the cantilever, the cantilever is designed with fish-bone-like support and the I/O traces are anchored to cantilever structures | 06-06-2013 |
20130249584 | HIGH-PRECISION SEMICONDUCTOR DEVICE PROBING APPARATUS AND SYSTEM THEREOF - A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe. | 09-26-2013 |
20140125370 | Image Sensor Testing Probe Card - A probe card for use in testing a wafer and a method of making the probe card include a printed circuit board (PCB) formed with a conductor pattern and a probe head in proximity to the PCB, the probe head defining at least one hole through the probe head, and the probe head being made of an electrically insulating material. At least one conductive pogo pin is disposed respectively in the at least one hole, the pogo pin having a first end electrically connected to the conductor pattern on the PCB. At least one conductive probe pin includes a cantilever portion and a tip portion. The cantilever portion is in contact with and electrically connected to a second end of the pogo pin, and the tip portion is electrically connectable to the wafer to electrically connect the wafer to the conductor pattern on the PCB. The cantilever portion of the probe pin is fixedly attached to the probe head. | 05-08-2014 |
20140167802 | RIGID PROBE WITH COMPLIANT CHARACTERISTICS - A method of probing compliant bumps of a circuit with probes is described. The method includes disposing the probes on a substrate, a base of each of the probes being coupled to the substrate. The method also includes disposing the circuit such that each of the compliant bumps is in contact with the probe tip of a corresponding one of the probes, each probe tip being connected to each base of each probe through a cantilever, and supplying current to the probes to test the circuit. | 06-19-2014 |
20150015291 | CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION - A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively. | 01-15-2015 |
20160139179 | HIGH-FREQUENCY CANTILEVER TYPE PROBE CARD - A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT. | 05-19-2016 |
20180024163 | PROBE MODULE HAVING CANTILEVER MEMS PROBE AND METHOD OF MAKING THE SAME | 01-25-2018 |